JP2006121067A5 - - Google Patents
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- Publication number
- JP2006121067A5 JP2006121067A5 JP2005290364A JP2005290364A JP2006121067A5 JP 2006121067 A5 JP2006121067 A5 JP 2006121067A5 JP 2005290364 A JP2005290364 A JP 2005290364A JP 2005290364 A JP2005290364 A JP 2005290364A JP 2006121067 A5 JP2006121067 A5 JP 2006121067A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US61537004P | 2004-10-01 | 2004-10-01 | |
US11/239,967 US7692316B2 (en) | 2004-10-01 | 2005-09-30 | Audio amplifier assembly |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006121067A JP2006121067A (ja) | 2006-05-11 |
JP2006121067A5 true JP2006121067A5 (ja) | 2008-12-18 |
Family
ID=36205467
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005290364A Pending JP2006121067A (ja) | 2004-10-01 | 2005-10-03 | 可聴周波数増幅器アッセンブリ |
Country Status (2)
Country | Link |
---|---|
US (1) | US7692316B2 (ja) |
JP (1) | JP2006121067A (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7569927B2 (en) * | 2005-09-21 | 2009-08-04 | Microsemi Corporation | RF power transistor package |
US20070215997A1 (en) * | 2006-03-17 | 2007-09-20 | Martin Standing | Chip-scale package |
DE102007007142B4 (de) * | 2007-02-09 | 2008-11-13 | Infineon Technologies Ag | Nutzen, Halbleiterbauteil sowie Verfahren zu deren Herstellung |
US7880280B2 (en) * | 2007-02-16 | 2011-02-01 | Infineon Technologies Ag | Electronic component and method for manufacturing an electronic component |
US8710665B2 (en) | 2008-10-06 | 2014-04-29 | Infineon Technologies Ag | Electronic component, a semiconductor wafer and a method for producing an electronic component |
US9728868B1 (en) | 2010-05-05 | 2017-08-08 | Cree Fayetteville, Inc. | Apparatus having self healing liquid phase power connects and method thereof |
DE102014205958A1 (de) * | 2014-03-31 | 2015-10-01 | Lemförder Electronic GmbH | Halbleiterschaltelementanordnung und Steuergeräteinrichtung für ein Fahrzeug |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08124685A (ja) | 1994-10-26 | 1996-05-17 | Matsushita Electric Works Ltd | 電力増幅回路 |
EP1142442A2 (en) | 1999-01-07 | 2001-10-10 | Sarnoff Corporation | Hearing aid with large diaphragm microphone element including a printed circuit board |
US6624522B2 (en) * | 2000-04-04 | 2003-09-23 | International Rectifier Corporation | Chip scale surface mounted device and process of manufacture |
JP4085563B2 (ja) | 2000-08-24 | 2008-05-14 | 富士電機ホールディングス株式会社 | パワー半導体モジュールの製造方法 |
US6545533B2 (en) * | 2000-12-18 | 2003-04-08 | Texas Instruments Incorporated | Class D audio speaker amplifier circuit with pseudo noise modulation |
US7119447B2 (en) * | 2001-03-28 | 2006-10-10 | International Rectifier Corporation | Direct fet device for high frequency application |
JP4235417B2 (ja) | 2002-08-30 | 2009-03-11 | 岡谷電機産業株式会社 | 表面実装型電子部品及びその製造方法 |
US6841865B2 (en) | 2002-11-22 | 2005-01-11 | International Rectifier Corporation | Semiconductor device having clips for connecting to external elements |
US7095099B2 (en) * | 2003-11-12 | 2006-08-22 | International Rectifier Corporation | Low profile package having multiple die |
-
2005
- 2005-09-30 US US11/239,967 patent/US7692316B2/en not_active Expired - Fee Related
- 2005-10-03 JP JP2005290364A patent/JP2006121067A/ja active Pending
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