JP2006118993A - Noncontact temperature sensor, and output regulation method therefor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a noncontact temperature sensor reduced in a size and the number of part items, and an output regulation method therefor. <P>SOLUTION: In this noncontact temperature sensor 100 of the present invention, an upper case part 130 formed with an incident hole 132a is provided separatedly from a lower case part 140 attached with a resin film 150, and a thermistor 152A is provided in an incident hole corresponding portion 153 of the resin film 150. A relative position between the upper case part 130 and the lower case part 140 is thereby regulatable when the upper case part 130 is combined with the lower case part 140, or after the upper case part 130 is combined with the lower case part 140, and an output from the thermistor 152a is thereby regulatable. That is, the size and the number of part items are reduced since the output is regulated without using a shielding part such as a screw, in the noncontact temperature sensor 100. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a non-contact temperature sensor that detects the temperature of an object to be detected in a non-contact manner and an output adjustment method thereof.

  In a toner fixing device used for a plain paper copier (PPC) or the like, a method of fixing toner by heat and pressure of a heating roller is widely used. Since the temperature of the heating roller greatly affects the image quality, it is necessary to control the temperature. Conventionally, a contact temperature sensor attached directly to the surface of the heating roller has been used for this temperature control. However, the contact temperature sensor has a problem that the heating roller is damaged and the image quality is deteriorated.

Therefore, a non-contact type temperature sensor that is not brought into contact with the heating roller is disclosed in Patent Document 1 below. The non-contact temperature sensor disclosed in this document is in close contact with a holding body having a cylindrical light guide that guides infrared light incident from the opening and the other end opening of the light guide of the holding body. An attached resin film, and an infrared detection thermal element and a temperature compensation thermal element arranged on one surface of the resin film are provided. Moreover, a screw (shielding portion) is inserted from the outside of a screw hole provided in the wall of the light guide portion, and a part of infrared rays passing through the light guide portion is blocked by this screw. Therefore, by adjusting the position of the screw, it is possible to adjust the output of the infrared detecting thermal element.
JP 2002-156284 A

  However, the conventional non-contact temperature sensor described above has the following problems. That is, the non-contact temperature sensor is desired to be smaller in particular in terms of heat capacity. However, when the above-described screw hole is provided in the wall of the light guide unit, the height is not less than the diameter of the screw. In addition, a thickness sufficient to form a screw groove is also required, and as a result, a large light guide is required. Moreover, since it is necessary to make the opening large in consideration of the amount blocked by the screw, it is difficult to reduce the size of the light guide. In addition, since screws are required separately from the case, the number of parts is increased.

  Accordingly, the present invention has been made to solve the above-described problems, and an object of the present invention is to provide a non-contact temperature sensor and an output adjustment method thereof that are reduced in size and reduced in the number of parts.

  The non-contact temperature sensor according to the present invention includes a first case member having an incident hole into which infrared rays are incident from one end side, and a second case member disposed on the other end side of the incident hole of the first case member. A case member, a base member that is disposed between the first case member and the second case member, is attached to the second case member, and performs thermal conversion of infrared rays that are incident from an incident hole; It is provided with the 1st heat sensitive element which is provided in the incident hole corresponding part of a substrate exposed by a hole, and senses the amount of heat of infrared rays thermally converted by the substrate.

  In this non-contact temperature sensor, the first case member in which the incident hole is formed and the second case member to which the base is attached are separated from each other. The thermal element is provided. Therefore, when combining the first case member and the second case member, or after combining the first case member and the second case member, the relative position between the incident hole and the first thermal element is determined. Can be adjusted. When the relative position between the incident hole and the first thermal element is changed in this way, the detection level of the amount of heat detected by the first thermal element changes, so that the output of the first thermal element can be adjusted. is there. That is, in this non-contact temperature sensor, the output can be adjusted without using a shielding part such as a screw, so that downsizing and a reduction in the number of parts can be realized.

  Further, at least one of the first case member and the second case member may be provided with a guide portion that restricts relative movement between the first case member and the second case member in a predetermined direction. preferable. In this case, it is possible to adjust the relative position between the incident hole and the first thermal element only by moving one of the first case member and the second case member in the direction restricted by the guide portion. Therefore, adjustment work becomes easy.

  Moreover, it is preferable that at least one of the first case member and the second case member is provided with a grip portion for gripping the other case member. In this case, detachment between the first case member and the second case member is prevented.

  The non-contact temperature sensor according to the present invention is arranged in a case in which an incident hole for receiving infrared rays is formed and in the case so that the position of the incident hole can be adjusted with respect to the incident hole, and performs thermal conversion of infrared rays incident from the incident hole. And a first heat-sensitive element that is provided in a portion corresponding to the incident hole of the substrate exposed by the incident hole and senses the amount of infrared heat converted by the substrate.

  In this non-contact temperature sensor, the base is disposed in a case in which an incident hole is formed so that the position of the base can be adjusted, and a first thermosensitive element is provided at a portion corresponding to the incident hole of the base. Therefore, when the base is placed in the case, the relative position between the incident hole and the first thermal element can be adjusted by adjusting the placement position. When the relative position between the incident hole and the first thermal element is changed in this way, the detection level of the amount of heat detected by the first thermal element changes, so that the output of the first thermal element can be adjusted. is there. That is, in this non-contact temperature sensor, the output can be adjusted without using a shielding part such as a screw, so that downsizing and a reduction in the number of parts can be realized.

  In addition, it is preferable that the base is provided with a second heat sensitive element that senses the amount of heat obtained by removing the amount of infrared heat converted by the base from the amount of heat sensed by the first heat sensitive element. In this case, it is possible to detect only the amount of heat caused by the infrared light incident from the incident hole from the differential output between the first and second thermal elements.

  The output adjustment method of the non-contact temperature sensor according to the present invention includes a case in which an incident hole for receiving infrared rays is formed, a base body that is disposed in the case and performs thermal conversion of infrared rays that are incident from the incident holes, A non-contact temperature sensor output adjustment method comprising a first thermal element that is provided in a portion corresponding to an incident hole of a base exposed by a hole and senses the amount of heat of infrared rays thermally converted by the base. It is characterized by adjusting the output of the non-contact temperature sensor by adjusting the relative position of the first thermosensitive element with respect to the incident hole when disposed inside.

  In this non-contact temperature sensor output adjustment method, the relative position between the incident hole and the first thermal element can be adjusted by adjusting the arrangement position when the substrate is arranged in the case. When the relative position between the incident hole and the first thermal element is changed in this way, the detection level of the amount of heat detected by the first thermal element changes, so that the output of the first thermal element can be adjusted. is there.

  ADVANTAGE OF THE INVENTION According to this invention, the non-contact temperature sensor by which size reduction and reduction of the number of parts were achieved, and its output adjustment method are provided.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, embodiments that are considered to be best for implementing a non-contact temperature sensor according to the invention will be described in detail with reference to the accompanying drawings. In addition, the same code | symbol is attached | subjected about the same or equivalent element, and the description is abbreviate | omitted when description overlaps.

The non-contact temperature sensor according to the embodiment of the present invention detects the temperature of a detection object by infrared rays emitted from the detection object, and is mainly used for temperature detection of a fixing roller of a PPC or an air conditioner. The
(First embodiment)

  A non-contact temperature sensor according to a first embodiment of the present invention will be described with reference to FIGS. Here, FIG. 1 is a plan view of the non-contact temperature sensor according to the first embodiment of the present invention, FIG. 2 is a sectional view taken along the line II-II of the non-contact temperature sensor shown in FIG. 1, and FIG. (A) left side view and (b) right side view of the contact temperature sensor, FIG. 4 is a front view of the non-contact temperature sensor shown in FIG. 1, and FIG. 5 is a bottom view of the non-contact temperature sensor shown in FIG. FIG. 6 is a partially cutaway view showing the internal structure of the non-contact temperature sensor shown in FIG.

  As shown in FIG. 1, the non-contact temperature sensor 100 according to the first embodiment includes a sensor main body 110, a detection circuit 170, and three electric wires W1 that transmit signals from the sensor main body 110 to the detection circuit 170. , W2, W3.

  As shown in FIG. 2, the sensor main body 110 includes a case 120, a resin film (base body) 150 disposed in the case 120, and a film attachment portion 160 that attaches the resin film 150 to the case 120. ing.

  First, the case 120 will be described.

  The case 120 includes an upper case portion (first case member) 130 and a lower case portion (second case member) 140. Both the upper case part 130 and the lower case part 140 are made of aluminum.

  The upper case portion 130 includes a rectangular flat plate-shaped top plate portion 132, a pair of side plate portions (guide portions) 134 erected at right angles in the same direction from the edges of the long sides of the top plate portion 132, and the pair of side plates. It consists of four claw parts (gripping parts) 136 bent at right angles so as to approach each other from two corresponding top regions 134a of the part 134, and is formed by bending a single plate.

  In the central region of the top plate portion 132, a long hole (incident hole) 132 a having a substantially rectangular cross section for introducing infrared rays into the case 120 from one end side (outer surface 133 a side) is a longitudinal direction of the top plate portion 132. It is penetrated along. An installation hole 132c having a circular cross section is formed at one end 132b in the longitudinal direction of the top plate part 132. The installation hole 132c incorporates the non-contact temperature sensor 100 in an apparatus (for example, a copying machine). Used when screwing. The pair of side plate portions 134 are provided over the entire length of the long side of the top plate portion 132, and have the same height.

  The lower case part 140 includes a rectangular flat plate-shaped bottom plate part 142, a pair of side plate parts 144 standing upright from the edges of the long sides of the bottom plate part 142 in the same direction, and edges of the short sides of the bottom plate part 142. The side plate portion 144 is composed of a pair of side plate portions 146 erected at right angles in the same direction as the upper case portion 130 and is formed by bending a single plate.

  The bottom plate portion 142 has a rectangular flat plate shape, the length thereof is shorter than the top plate portion 132 of the upper case portion 130, and the width thereof is slightly shorter than the width of the top plate portion 132. Further, the side plate portion 144 and the side plate portion 146 have substantially the same height, and the side plate portion 134 of the upper case portion 130 has substantially the same height. A U-shaped notch 146a for drawing the above-described electric wires W1, W2, and W3 into the case 120 is formed on one side plate portion 146.

  The upper case part 130 and the lower case part 140 are such that the side plates 134, 144, 146 stand up to face each other, and the pair of side plate parts 144 of the lower case part 140 are paired with the pair of side plate parts 134 of the upper case part 130. It is attached so as to be sandwiched between. Thereby, the top plate portion 132 of the upper case portion 130 and the bottom plate portion 142 of the lower case portion 140 are parallel to each other, and the other end side (the inner surface 133b side) of the incident hole 132a formed in the top plate portion 132 is the bottom plate portion. 142.

  Here, since the separation distance D1 of the side plate part 134 of the upper case part 130 is substantially the same as the width D2 of the lower case part 140 (see FIG. 3A), the upper case part 130 is replaced with the lower case part 140. Is attached, the lower case part 140 is gripped by the side plate part 134 of the upper case part 130, and the direction of relative movement between the upper case part 130 and the lower case part 140 is determined by the top plate part 132 (or the bottom plate part 142). In the longitudinal direction (X direction in FIG. 1).

  That is, when the lower case part 140 and the upper case part 130 are joined, the upper case part 130 is slidable in the X direction with respect to the lower case part 140 as indicated by a two-dot chain line in FIGS. It is in a state. Then, by sliding the upper case portion 130, the position of the incident hole 132a with respect to the resin film 150 is positioned so as to match a desired output level, which will be described later, and then the lower case is formed by the claw portion 136 of the upper case portion 130. The portion 140 is caulked and fixed. As described above, by providing the claw portion 136 on the side plate portion 134 of the upper case portion 130, the lower case portion 140 is fixed by caulking, and the lower case portion 140 is reliably prevented from falling off from the upper case portion 130. Is done. The upper case part 130 and the lower case part 140 may be fixed not only by caulking, but also by adhesive fixing, screwing, resin fixing, welding, or the like.

  Moreover, it is preferable that the aluminum plate used when producing the upper case part 130 and the lower case part 140 is a rolled sheet having a thickness of 1.2 mm or less (preferably 0.6 mm or less). By using such a thin plate, the processability and responsiveness can be improved and the size and weight can be reduced.

  Next, the film attachment portion 160 will be described with reference to FIGS.

  As shown in FIG. 6, a film attachment portion 160 made of polyphenylene sulfide (PPS) is installed on the bottom plate portion 142 of the lower case portion 140. The film mounting portion 160 has a plate shape with a substantially constant thickness, has an annular cross section whose outer shape is substantially rectangular, and its installation region extends over substantially the entire area of the bottom plate portion 142. However, the film attachment portion 160 and the side plate portions 144 and 146 of the lower case portion 140 are separated by a predetermined distance and are in a thermally insulated state.

  The hole 160 a inside the film attachment portion 160 has a substantially rectangular cross-sectional shape and has a wider cross-sectional area than the incident hole 132 a of the upper case portion 130. Therefore, when the upper case portion 130 and the lower case portion 140 are combined, the film attachment portion 160 can be disposed at a position that cannot be seen from the incident hole 132 a of the upper case portion 130. Furthermore, the film attachment portion 160 is provided with a screw receiving portion 160b at each edge corresponding to the corner of the hole 160a having a square cross section. Each screw receiving portion 160b is erected in a direction toward the upper case portion 130 (Z direction in FIG. 2).

  The constituent material of the film attachment portion 160 may be, for example, PET (polyethylene terephthalate) or ceramic other than PPS.

  Next, the resin film 150 will be described with reference to FIGS. 2 and 6.

  The resin film 150 has substantially the same outer shape as the above-described film attachment portion 160, and the covering region also covers substantially the entire area of the bottom plate portion 142. The resin film 150 is supported by the four screw receiving portions 160 b of the film attaching portion 160 and is fixed to the film attaching portion 160 by the screw receiving portions 160 b and the screws 162.

  The resin film 150 is made of polyimide and has good infrared absorption characteristics. A predetermined wiring pattern including two thermistors (laminated chip NTC thermistors) 152A and 152B is formed on the lower surface (surface on the lower case 140 side) 150a of the resin film 150. Of the two thermistors 152A and 152B, the thermistor (first thermal element) 152A is an element for sensing the amount of heat of the resin film 150 that has generated heat by absorbing the infrared rays of the detection target. It is disposed inside the film region 151 exposed from the incident hole 132a. On the other hand, the thermistor (second thermosensitive element) 152B is an element for sensing the amount of heat inside the case 120, and is disposed outside the film region 151 exposed from the incident hole 132a of the upper case portion 130. The wiring pattern at both ends of the thermistor 152A is provided with a pair of meandering portions 154A and 154B for improving the detection characteristics of the thermistor 152A. The thermistors 152A and 152B preferably have a small heat capacity from the viewpoint of response speed, and have a 0603 shape (0.6 mm × 0.3 mm × 0.3 mm) or 0402 shape (0.4 mm × 0.2 mm × 0.2 mm). ) Is preferred.

  The wiring pattern formed on the resin film 150 has three external connection terminals T1, T2, and T3, which correspond to the terminals T1, T2, and T3 and the terminals T1, T2, and T3. The electric wires W1, W2, and W3 are soldered. Moreover, as shown in FIG. 7, each electric wire W1, W2, W3 is connected to the predetermined terminal of the detection circuit 170, and the circuit of the non-contact temperature sensor 100 provided with the temperature compensation function is comprised. Here, FIG. 7 is a diagram showing a wiring circuit diagram of the non-contact temperature sensor 100 including the wiring pattern of the resin film 150. As shown in FIG. 7, the detection circuit 170 includes an MPU, a ROM, an AD converter, an electronic component, and the like, and performs highly accurate temperature detection from a differential output between the thermistor 152A and the thermistor 152B. That is, the amount of heat in the case excluding the amount of heat converted by the resin film 150 is sensed by the thermistor 152B away from the film region 151, thereby detecting only the amount of heat caused by the infrared rays incident from the incident hole 132a. Can do.

  The constituent material of the resin film 150 is preferably polyimide from the viewpoint of easy wiring pattern production and heat resistance, but may be PPS or nylon.

  Next, an output adjustment method in the non-contact temperature sensor 100 described above will be described.

As described above, when the lower case portion 140 and the upper case portion 130 are joined, the upper case portion 130 is slidable in the X direction with respect to the lower case portion 140. At this time, the inventors have newly found that the output of the thermistor 152A can be changed by sliding the upper case portion 130 by a predetermined length. That is, as shown in Table 1 and FIG. 17 below, when the thermistor 152A is located at the center position of the incident hole corresponding portion 153 of the resin film 150 and when it is located away from the center position, the output is different. I got the knowledge.

  Here, Table 1 uses an incident hole 132a (and incident hole corresponding portion 153) having a length in the X direction of 8 mm, and the thermistor 152A is shifted from the center position by a predetermined length to the left and right along the X direction. It is the table | surface which showed the result of having measured the differential output of the thermistor 152A and the thermistor 152B in each position (P1, P2, P3, P4, P5) twice. The graph shown in FIG. 17 is a graph showing the differential output and the deviation between the differential outputs when the thermistor 152A is at each position. The horizontal axis is the distance (mm) from the center, and the vertical axis is the differential. Output (V).

  From the above result, the thermistor 152A is slid by a predetermined length, the incident hole corresponding portion 153 of the resin film 150 is moved, and the relative position of the thermistor 152A in the incident hole corresponding portion 153 is changed. It can be seen that the differential output between 152A and the thermistor 152B can be adjusted. As described above, the differential output is changed by changing the relative position of the thermistor 152A because the heat generated there is away from the center position of the incident hole corresponding portion 153 of the resin film 150. It is presumed that the thermistor 152A transmitted to parts other than the corresponding part 153 and located at such a position has a low sensing level.

  Note that the timing of sliding the upper case portion 130 is not limited to the time when the upper case portion 130 and the lower case portion 140 are joined. Timing can be selected.

  As described in detail above, in the non-contact temperature sensor 100 according to the first embodiment, when the upper case portion 130 and the lower case portion 140 are combined, or the upper case portion 130 and the lower case portion 140 are combined. Since the relative position between the incident hole 132a and the thermistor 152A can be adjusted after the combination, it can be made smaller than the conventional non-contact temperature sensor that requires a shielding part such as a screw, and the number of parts can be reduced. Realized.

  Further, the non-contact temperature sensor 100 is installed so that the top plate portion 132 of the upper case portion 130 faces the detected body so that infrared rays from the detected body enter the incident hole 132a when used. Therefore, a part of the infrared rays that have not entered the incident hole 132a out of the infrared rays from the detection target are thermally converted in the top plate portion 132 of the upper case portion 130, and the top plate portion 132 generates heat. The heat generated by the heat generated by the top plate portion 132 increases as the amount of heat increases, the side plate portion 134 of the upper case portion 130, the side plate portions 144 and 146 of the lower case portion 140, the bottom plate portion 142, the film mounting portion 160, the resin. It is transmitted in order of film 150. That is, in this non-contact temperature sensor 100, heat transfer from the top plate portion 132 of the upper case portion 130 to the resin film 150 wraps around to the film mounting portion 160 provided on the bottom plate portion 142 of the lower case portion 140. It is carried out.

  On the other hand, in the conventional non-contact temperature sensor, since the resin film provided with the heat sensitive element is in close contact with the holding body that is a member facing the detected body, the heat generated by the heat generated by the holding body is retained by the holding body. Is transmitted directly to the resin film. In other words, the non-contact temperature sensor 100 according to the first embodiment is configured such that when heat is transferred from the case member (that is, the upper case portion 130) facing the detected body to the resin film 150, the detour route passes through the film attachment portion 160. Therefore, the heat transfer path is significantly extended as compared with the conventional non-contact temperature sensor.

  That is, in the non-contact temperature sensor 100 according to the first embodiment, the heat transfer path from the upper case part 130 to the resin film 150 is extended as compared with the conventional non-contact temperature sensor, so that the upper case part The heat generated at 130 is not easily transmitted to the resin film 150. Thereby, improvement in detection accuracy of the thermistor 152A arranged on the resin film 150 is realized.

  Further, since the resin film 150 is not installed directly on the bottom plate part 142 of the lower case part 140 but is installed via the film attachment part 160, the bottom plate part 142 and the resin film 150 are separated from each other. The heat generated at 130 is not easily transmitted by the resin film 150. Further, since the resin film 150 is supported by the screw receiving portion 160b protruding from the film mounting portion 160, the cross-sectional area of the heat transfer path from the bottom plate portion 142 to the resin film 150 is reduced. The heat transfer is suppressed more effectively.

  In the non-contact temperature sensor 100, since the upper case portion 130 and the lower case portion 140 are separate bodies, the continuity in heat conduction is reduced, and transmission from the upper case portion 130 to the lower case portion 140 is reduced. Heat is more effectively suppressed.

  Moreover, in the non-contact temperature sensor 100, since the lower case part 140 and the film attachment part 160 are separate bodies, the continuity in heat conduction is reduced, so heat transfer from the bottom plate part 142 to the resin film 150 is prevented. It is suppressed more effectively. In particular, since the above-described PPS film mounting portion 160 has a lower thermal conductivity than aluminum constituting the case 120, heat transfer from the bottom plate portion 142 to the resin film 150 is effectively suppressed.

Furthermore, the case of the conventional non-contact temperature sensor is often manufactured by Al die casting, but the case 120 of the non-contact temperature sensor 100 according to the first embodiment is manufactured by press molding (bending, drawing, punching). Therefore, it is easier to manufacture than the conventional non-contact temperature sensor, and the weight can be easily reduced.
(Second Embodiment)

  Next, a non-contact temperature sensor according to the second embodiment will be described with reference to FIGS. As shown in FIGS. 8 and 9, the non-contact temperature sensor 200 according to the second embodiment of the present invention includes the non-contact temperature sensor 100 according to the first embodiment described above and the incident hole 132 a of the upper case portion 130. The difference is that a light guide unit 202 is provided at the edge.

  That is, in the non-contact temperature sensor 200, the tubular light guide unit 202 is erected along the edge of the incident hole 132 a of the upper case unit 130. The light guide portion 202 is formed by drawing, and extends from the top plate portion 132a of the upper case portion 130 to the outside of the case 120 in a direction orthogonal to the top plate portion 132a (Z direction in FIG. 8). Yes. Further, the inner side surface 202a of the light guide unit 202 is subjected to black body processing, and infrared rays are absorbed by the inner side surface 202a subjected to black body processing, thereby suppressing reflection of infrared rays on the inner side surface 202a. It has been. Specifically, the infrared reflectance of the inner side surface 202a is reduced by applying plastic, rubber, or the like to the inner side surface 202a or performing heat treatment under a predetermined condition.

  In the non-contact temperature sensor 200 provided with such a light guide unit 202, the same effect as that of the non-contact temperature sensor 100 described above can be obtained, and a substantial amount corresponding to the height of the light guide unit 202 can be obtained. In addition, since the incident hole 132a can be brought close to the detected object, the directivity of the detected object in the infrared detection is improved. Further, by performing black body processing on the inner side surface 202a of the light guide unit 202, as shown in FIG. 9, the infrared ray β case 120 greatly deviates from the extending direction of the light guide unit 202 (Z direction in FIG. 9). Can be prevented, and infrared rays α along the extending direction of the light guide portion 202 can be selectively made incident into the case 120. Thereby, the directivity in the infrared detection of the detected object is improved as compared with the case where the black body process is not performed on the inner side surface 202a of the light guide unit 202.

  Furthermore, since the light guide unit 202 is formed by drawing, it is easier to manufacture and can be easily reduced in weight compared to a non-contact temperature sensor manufactured by conventional Al die casting.

Here, in the built-in device in which the non-contact temperature sensor 200 is installed, heat convection due to the detected object occurs. It is known that when this convective heat hits the resin film 150 in the case 120, the output of the thermistor 152A on the resin film 150 is disturbed. However, as the non-contact temperature sensor 200 covers the periphery of the incident hole 132a with the light guide portion 202 having a certain height, the intrusion of the convective heat into the case 120 is suppressed. Therefore, in this non-contact temperature sensor 200, the disturbance of the output of the thermistor 152A is significantly suppressed.
(Third embodiment)

  Next, the non-contact temperature sensor which concerns on 3rd Embodiment is demonstrated, referring FIG.10 and FIG.11. As shown in FIGS. 10 and 11, the non-contact temperature sensor 300 according to the third embodiment of the present invention includes the non-contact temperature sensor 100 according to the first embodiment and the incident hole 132 a of the upper case portion 130. The difference is that a light guide section 302 is provided at the edge.

  That is, in the non-contact temperature sensor 300, the tubular light guide unit 302 is erected along the edge of the incident hole 132 a of the upper case unit 130. The light guide portion 302 extends from the top plate portion 132a of the upper case portion 130 toward the inside of the case 120 in a direction orthogonal to the top plate portion 132a (the Z direction in FIG. 8). It is formed by drawing. In addition, the inner side surface 302a of the light guide unit 302 is also subjected to black body processing in the same manner as the light guide unit 202 according to the second embodiment.

  In the non-contact temperature sensor 300 provided with such a light guide unit 302, the same effect as that of the non-contact temperature sensor 100 described above can be obtained, and in addition, infrared light from the detection target can be obtained by the light guide unit 302. The film region 151 that receives the light is limited to approximately the same extent as the opening region of the incident hole 132a. Thereby, in the non-contact temperature sensor 300, since heat conversion can be effectively performed around the thermistor 152A, the detection accuracy is improved. In addition, by performing black body processing on the inner side surface 302a of the light guide unit 302, the directivity of the detected object in infrared detection is improved as in the non-contact temperature sensor 200 according to the second embodiment.

Furthermore, since the light guide unit 302 is formed by drawing, it is easier to manufacture and can be lighter than a non-contact temperature sensor manufactured by conventional Al die casting.
(Fourth embodiment)

  Next, a non-contact temperature sensor according to the fourth embodiment will be described with reference to FIGS. As shown in FIGS. 12 to 14, the non-contact temperature sensor 400 according to the fourth embodiment of the present invention includes a lower case instead of the non-contact temperature sensor 200 according to the second embodiment described above and the film mounting portion 160. The difference is that a film mounting portion 460 that is integral with the portion 140 is provided.

  That is, in the non-contact temperature sensor 400, the bottom plate portion 142 of the lower case portion 140 is provided with four columnar film attachment portions 460 that extend in a direction orthogonal to the bottom plate portion 142 (Z direction). A screw receiving portion 460b similar to the screw receiving portion 160b according to the first to third embodiments described above is provided on the upper portion of the film mounting portion 460. The film mounting portion is formed by the screw receiving portion 460b and the screw 162. The resin film 150 is fixed to the portion 460. These film attachment portions 460 are also arranged at positions that cannot be seen from the incident holes 132 a of the upper case portion 130, similarly to the film attachment portions 160.

In the non-contact temperature sensor 400 provided with such a film mounting portion 460 that is integral with the lower case portion 140, the same effect as the above-described non-contact temperature sensor 200 can be obtained, and the number of parts can be reduced. Is planned.
(Fifth embodiment)

  Next, a non-contact temperature sensor according to the fifth embodiment will be described with reference to FIG. FIG. 15 is an enlarged view of a main part of a non-contact temperature sensor 500 according to the fifth embodiment of the present invention. The non-contact temperature sensor 500 according to the fifth embodiment is different from the non-contact temperature sensor 100 according to the first embodiment in how the resin film 150 is attached to the film attachment portion 160.

  That is, as shown in FIG. 15, the screw receiving hole 460 c of the screw receiving portion 460 b is a long hole extending in the X direction, which is the direction of relative movement between the upper case portion 130 and the lower case portion 140. In the non-contact temperature sensor 500 having such a screw receiving portion 460b, when the resin film 150 is placed on the screw receiving portion 460b and screwed, the incident hole corresponding portion 153 of the resin film 150 and the thermistor 152A The relative position can be adjusted. That is, the resin film 150 is placed on the screw receiving portion 460b, the resin film 150 is slid and positioned by a predetermined length, and then the resin film 150 is fixed with the screws 162. Thus, even when the relative position between the incident hole corresponding portion 153 and the thermistor 152A is adjusted, the output of the thermistor 152A can be adjusted as in the above-described embodiment.

  Further, as shown in FIG. 16, a screw hole group 460d arranged in the X direction, which is the direction of relative movement between the upper case portion 130 and the lower case portion 140, is formed in the screw receiving portion 460b instead of the elongated hole. Even in the non-contact temperature sensor 600, when the resin film 150 is placed on the screw receiving portion 460b and screwed, similarly to the non-contact temperature sensor 500, the incident hole corresponding portion 153 of the resin film 150 and The output of the thermistor 152A can be adjusted by adjusting the relative position with the thermistor 152A. That is, in the non-contact temperature sensors 500 and 600 according to the fifth embodiment, the relative position between the incident hole 132a and the thermistor 152A can be adjusted without using a shield such as a screw. It can be made smaller than the contact temperature sensor, and the number of parts can be reduced.

  In the non-contact temperature sensor 500 and the non-contact temperature sensor 600 described above, the case 120 does not necessarily have to be composed of two objects, the upper case part 130 and the lower case part 140. A case in which the upper case portion 130 and the lower case portion 140 are integrated can also be used.

  The present invention is not limited to the above embodiment, and various modifications are possible. For example, the direction of relative movement between the upper case portion 130 and the lower case portion 140 is not limited to the longitudinal direction (X direction in FIG. 1) of the top plate portion 132 (or bottom plate portion 142), but the top plate portion 132 (or bottom plate). Part 142) may be in the thickness direction (Z direction in FIG. 1). In addition to the structure that regulates the moving direction by the surface and the surface, like the side plate part of the upper case part that guides the side plate part of the lower case part, the guide part has a known structure such as a structure having protrusions and guide grooves. The guide structure can be changed as appropriate. Furthermore, although the non-contact temperature sensor in which the guide part and the grip part are provided only in the upper case part is shown, the mode in which the guide part and the grip part are provided only in the lower case part, and the upper case part and the lower case The aspect provided in both of the part may be sufficient. Lower case part Upper case part In addition, an energy ray reflective film such as an infrared reflective film that reflects infrared rays is interposed between the bottom plate part of the lower case part and the resin film, so that the resin film absorbs infrared rays more efficiently. It is also possible.

It is a top view of the non-contact temperature sensor concerning a 1st embodiment of the present invention. It is the II-II sectional view taken on the line of the non-contact temperature sensor shown in FIG. It is (a) left side view and (b) right side view of the non-contact temperature sensor shown in FIG. It is a front view of the non-contact temperature sensor shown in FIG. It is a bottom view of the non-contact temperature sensor shown in FIG. FIG. 2 is a partial cutaway view showing an internal structure of the non-contact temperature sensor shown in FIG. 1. It is the figure which showed the wiring circuit diagram of the non-contact temperature sensor containing the wiring pattern of a resin film. It is a top view of the non-contact temperature sensor concerning a 2nd embodiment of the present invention. It is the IX-IX sectional view taken on the line of the non-contact temperature sensor shown in FIG. It is a top view of the non-contact temperature sensor concerning a 3rd embodiment of the present invention. It is the XI-XI sectional view taken on the line of the non-contact temperature sensor shown in FIG. It is a top view of the non-contact temperature sensor concerning a 4th embodiment of the present invention. It is the XIII-XIII sectional view taken on the line of the non-contact temperature sensor shown in FIG. FIG. 13 is a partial cutaway view showing an internal structure of the non-contact temperature sensor shown in FIG. 12. It is a principal part enlarged view of the non-contact temperature sensor which concerns on 5th Embodiment of this invention. It is the principal part enlarged view which showed the modification of the non-contact temperature sensor shown in FIG. It is the graph which showed the deviation of a differential output and a differential output when a thermistor exists in each position.

Explanation of symbols

  100, 200, 300, 400, 500, 600 ... non-contact temperature sensor, 110 ... sensor body, 120 ... case, 130 ... upper case, 132 ... top plate, 132a ... incident hole, 140 ... lower case, 142 ... bottom plate part, 150 ... resin film, 152A, 152B ... thermistor, 153 ... incident hole corresponding part, 160, 460 ... film mounting part, 202, 302 ... light guide part.

Claims (6)

A first case member having an incident hole through which infrared rays are incident from one end side;
A second case member disposed on the other end side of the incident hole of the first case member;
A base that is disposed between the first case member and the second case member, is attached to the second case member, and performs thermal conversion of infrared rays incident from the incident hole;
A non-contact temperature sensor comprising: a first thermosensitive element that is provided at a portion corresponding to the incident hole of the base exposed by the incident hole and senses the amount of heat of the infrared light that is thermally converted by the base.   At least one of the first case member and the second case member is provided with a guide portion that restricts relative movement between the first case member and the second case member in a predetermined direction. The non-contact temperature sensor according to claim 1.   The non-contact temperature sensor according to claim 1 or 2, wherein a grip portion for gripping the other case member is provided on at least one of the first case member and the second case member. A case in which an incident hole for receiving infrared rays is formed;
In the case, the base is disposed so as to be position-adjustable with respect to the incident hole, and performs thermal conversion of infrared rays incident from the incident hole;
A non-contact temperature sensor comprising: a first thermosensitive element that is provided at a portion corresponding to the incident hole of the base exposed by the incident hole and senses the amount of heat of the infrared light that is thermally converted by the base.   6. The second heat sensitive element according to claim 1, wherein the base is provided with a second heat sensitive element that senses a heat amount obtained by excluding a heat amount of infrared light converted by the base from a heat amount sensed by the first heat sensitive element. The non-contact temperature sensor as described in any one of Claims. Corresponding to the incident hole of the base that is formed in the case formed with an incident hole for receiving infrared rays, the base that is arranged in the case and performs thermal conversion of the infrared light that is incident from the incident hole, and is exposed by the incident hole A non-contact temperature sensor output adjustment method comprising: a first thermal element that is provided in a portion and senses the amount of heat of the infrared rays that is thermally converted by the base body;
A non-contact temperature sensor output adjustment method for adjusting an output of the non-contact temperature sensor by adjusting a relative position of the first thermosensitive element with respect to the incident hole when the base is disposed in the case.

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