JP4483521B2 - Non-contact temperature sensor - Google Patents

Description

  The present invention relates to a non-contact temperature sensor that detects the temperature of an object to be detected in a non-contact manner.

  In a toner fixing device used for a plain paper copier (PPC) or the like, a method of fixing toner by heat and pressure of a heating roller is widely used. Since the temperature of the heating roller greatly affects the image quality, it is necessary to control the temperature. Conventionally, a contact temperature sensor attached directly to the surface of the heating roller has been used for this temperature control. However, the contact temperature sensor has a problem that the heating roller is damaged and the image quality is deteriorated.

Therefore, a non-contact type temperature sensor that is not brought into contact with the heating roller is disclosed in Patent Document 1 below. The non-contact temperature sensor disclosed in this document is attached so as to be in close contact with a holding body having a light guide for guiding infrared light incident from the opening and the other end opening of the light guide of the holding body. A resin film, an infrared detecting thermal element and a temperature compensating thermal element arranged on one surface of the resin film are provided.
JP 2002-156284 A

  However, the conventional non-contact temperature sensor described above has the following problems. That is, when the holding body facing the heating roller absorbs part of infrared rays emitted from the heating roller, when the holding body generates heat, the heat is transmitted to the resin film attached in close contact with the holding body. . Due to the heat conduction from the holder to the resin film, the detection accuracy of the thermosensitive element disposed on the resin film is significantly reduced.

  Therefore, the present invention has been made to solve the above-described problems, and an object thereof is to provide a non-contact temperature sensor in which detection accuracy is improved.

  The non-contact temperature sensor according to the present invention is arranged on the other end side of the incident hole of the first case part in which the incident hole into which infrared rays are incident from one end side is formed, and the first case part. The first case of the incident hole facing surface portion is disposed between the second case portion having the incident hole facing surface portion that faces the first hole and the incident hole facing surface portion of the first case portion and the second case portion. And a base that performs thermal conversion of infrared rays incident from an incident hole, and a first thermal element that is provided on the base and senses the amount of heat of infrared rays converted by the base. To do.

  When this non-contact temperature sensor is used, one end side of the incident hole formed in the first case portion is directed to the detection object. Therefore, the first case portion absorbs infrared rays and generates heat. Here, the base body provided with the first thermosensitive element is attached not to the first case portion but to the incident hole facing surface portion of the second case portion. Therefore, the heat of the first case portion is not directly transmitted to the base body. Therefore, in the non-contact temperature sensor according to the present invention, the influence of the heat on the first thermal element is suppressed compared to the conventional non-contact temperature sensor in which the heat generated in the first case portion is directly transmitted to the base. As a result, the detection accuracy is improved as compared with the conventional non-contact temperature sensor.

  Moreover, it is preferable that the base body is attached to the incident hole facing surface portion via a base body holding portion that protrudes from the incident hole facing surface portion toward the incident hole side. In this case, since the base body and the incident hole facing surface part are separated by the base body holding part, even if the heat generated in the first case part is transferred to the base body holding part via the second case part. Heat transfer from the incident hole facing surface portion to the substrate can be effectively suppressed. Furthermore, since the second case part and the base body holding part are integrated, the number of parts can be reduced.

  Moreover, it is preferable that the base body is attached to the incident hole facing surface portion via the base body holder. In this case, since the substrate and the incident hole facing surface portion are separated from each other by the substrate holder, the heat generated in the first case portion is incident even if it is transmitted to the substrate through the second case portion. Heat transfer from the hole facing surface portion to the substrate can be effectively suppressed. Furthermore, since the second case portion and the substrate holder are separate, the continuity in heat conduction is reduced, so heat transfer from the incident hole facing surface portion to the substrate can be more effectively suppressed.

  Moreover, it is preferable that the base body holder has a thermal conductivity lower than that of the second case portion. In this case, heat transfer from the incident hole facing surface portion to the base can be suppressed more effectively.

  In addition, it is preferable to further include a substantially tubular light guide portion erected along the edge on one end side of the incident hole. In this case, the directivity in infrared detection of the non-contact temperature sensor is improved.

  In addition, it is preferable to further include a substantially tubular light guide portion erected along the edge on the other end side of the incident hole. In this case, the accuracy of detection is improved by the light guide.

  In addition, it is preferable that the base is provided with a second heat sensitive element that senses the amount of heat obtained by removing the amount of infrared heat converted by the base from the amount of heat sensed by the first heat sensitive element. In this case, it is possible to detect only the amount of heat caused by the infrared light incident from the incident hole from the differential output between the first and second thermal elements.

  Moreover, it is preferable that a 1st case part and a 2nd case part are separate bodies. In this case, since the continuity in heat conduction from the first case part to the second case part is lower than in the case where the first case part and the second case part are integrated, the first case part Heat transfer from the case part to the second case part is suppressed.

  According to the present invention, a non-contact temperature sensor with improved detection accuracy is provided.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, embodiments that are considered to be best for implementing a non-contact temperature sensor according to the invention will be described in detail with reference to the accompanying drawings. In addition, the same code | symbol is attached | subjected about the same or equivalent element, and the description is abbreviate | omitted when description overlaps.

The non-contact temperature sensor according to the embodiment of the present invention detects the temperature of a detection object by infrared rays emitted from the detection object, and is mainly used for temperature detection of a fixing roller of a PPC or an air conditioner. The
(First embodiment)

  A non-contact temperature sensor according to a first embodiment of the present invention will be described with reference to FIGS. Here, FIG. 1 is a plan view of the non-contact temperature sensor according to the first embodiment of the present invention, FIG. 2 is a sectional view taken along the line II-II of the non-contact temperature sensor shown in FIG. 1, and FIG. (A) left side view and (b) right side view of the contact temperature sensor, FIG. 4 is a front view of the non-contact temperature sensor shown in FIG. 1, and FIG. 5 is a bottom view of the non-contact temperature sensor shown in FIG. FIG. 6 is a partially cutaway view showing the internal structure of the non-contact temperature sensor shown in FIG.

  As shown in FIG. 1, the non-contact temperature sensor 100 according to the first embodiment includes a sensor main body 110, a detection circuit 170, and three electric wires W1 that transmit signals from the sensor main body 110 to the detection circuit 170. , W2, W3.

  As shown in FIG. 2, the sensor main body 110 includes a case 120, a resin film (base body) 150 disposed in the case 120, and a film attachment portion (base body holder) for attaching the resin film 150 to the case 120. 160.

  First, the case 120 will be described.

  The case 120 includes an upper case part (first case part) 130 and a lower case part (second case part) 140. Both the upper case part 130 and the lower case part 140 are made of aluminum.

  The upper case portion 130 includes a rectangular plate-shaped top plate portion 132, a pair of side plate portions 134 erected at right angles in the same direction from the edges of the long sides of the top plate portion 132, and two of the pair of side plate portions 134. It consists of four claw portions 136 bent at right angles so as to approach each other from the corresponding top region 134a of the set, and is formed by bending a single plate.

  In the central region of the top plate portion 132, a long hole (incident hole) 132 a having a substantially rectangular cross section for introducing infrared rays into the case 120 from one end side (outer surface 133 a side) is a longitudinal direction of the top plate portion 132. It is penetrated along. An installation hole 132c having a circular cross section is formed at one end 132b in the longitudinal direction of the top plate part 132. The installation hole 132c incorporates the non-contact temperature sensor 100 in an apparatus (for example, a copying machine). Used when screwing. The pair of side plate portions 134 are provided over the entire length of the long side of the top plate portion 132, and have the same height.

  The lower case part 140 includes a rectangular flat plate bottom plate part (incident hole facing surface part) 142, a pair of side plate parts 144 erected at right angles in the same direction from the edges of the long sides of the bottom plate part 142, and the bottom plate part 142. It is composed of a pair of side plate portions 146 erected perpendicularly from the edge of each short side in the same direction as the side plate portion 144, and is formed by bending a single plate like the upper case portion 130.

  The bottom plate portion 142 has a rectangular flat plate shape, the length thereof is shorter than the top plate portion 132 of the upper case portion 130, and the width thereof is slightly shorter than the width of the top plate portion 132. Further, the side plate portion 144 and the side plate portion 146 have substantially the same height, and the side plate portion 134 of the upper case portion 130 has substantially the same height. A U-shaped notch 146a for drawing the above-described electric wires W1, W2, and W3 into the case 120 is formed on one side plate portion 146.

  The upper case part 130 and the lower case part 140 are such that the side plates 134, 144, 146 stand up to face each other, and the pair of side plate parts 144 of the lower case part 140 are paired with the pair of side plate parts 134 of the upper case part 130. It is attached so as to be sandwiched between. Thereby, the top plate portion 132 of the upper case portion 130 and the bottom plate portion 142 of the lower case portion 140 are parallel to each other, and the other end side (the inner surface 133b side) of the incident hole 132a formed in the top plate portion 132 is the bottom plate portion. 142. By attaching in this way, the direction of relative movement between the upper case portion 130 and the lower case portion 140 is limited to the longitudinal direction (X direction in FIG. 1) of the top plate portion 132 (or the bottom plate portion 142).

  Since the separation distance D1 of the side plate part 134 of the upper case part 130 is substantially the same as the width D2 of the lower case part 140 (see FIG. 3A), the upper case part 130 is attached to the lower case part 140. The lower case part 140 is gripped by the side plate part 134 of the upper case part 130. And the lower case part 140 is caulked and fixed by the claw part 136 of the upper case part 130. As described above, by providing the claw portion 136 on the side plate portion 134 of the upper case portion 130, the lower case portion 140 is fixed by caulking, and the lower case portion 140 is reliably prevented from falling off from the upper case portion 130. Is done. The upper case part 130 and the lower case part 140 may be fixed not only by caulking, but also by adhesive fixing, screwing, resin fixing, welding, or the like.

  Moreover, it is preferable that the aluminum plate used when producing the upper case part 130 and the lower case part 140 is a rolled sheet having a thickness of 1.2 mm or less (preferably 0.6 mm or less). By using such a thin plate, the processability and responsiveness can be improved and the size and weight can be reduced.

  Next, the film attachment portion 160 will be described with reference to FIGS.

  As shown in FIG. 6, a film attachment portion 160 made of polyphenylene sulfide (PPS) is installed on the bottom plate portion 142 of the lower case portion 140. The film mounting portion 160 has a plate shape with a substantially constant thickness, has an annular cross section whose outer shape is substantially rectangular, and its installation region extends over substantially the entire area of the bottom plate portion 142. However, the film attachment portion 160 and the side plate portions 144 and 146 of the lower case portion 140 are separated by a predetermined distance and are in a thermally insulated state.

  The hole 160 a inside the film attachment portion 160 has a substantially rectangular cross-sectional shape and has a wider cross-sectional area than the incident hole 132 a of the upper case portion 130. Therefore, when the upper case portion 130 and the lower case portion 140 are combined, the film attachment portion 160 can be disposed at a position that cannot be seen from the incident hole 132 a of the upper case portion 130. Furthermore, the film attachment portion 160 is provided with a screw receiving portion 160b at each edge corresponding to the corner of the hole 160a having a square cross section. Each screw receiving portion 160b is erected in a direction toward the upper case portion 130 (Z direction in FIG. 2).

  The constituent material of the film attachment portion 160 may be, for example, PET (polyethylene terephthalate) or ceramic other than PPS.

  Next, the resin film 150 will be described with reference to FIGS. 2 and 6.

  The resin film 150 has substantially the same outer shape as the above-described film attachment portion 160, and the covering region also covers substantially the entire area of the bottom plate portion 142. The resin film 150 is supported by the four screw receiving portions 160 b of the film attaching portion 160 and is fixed to the film attaching portion 160 by the screw receiving portions 160 b and the screws 162.

  The resin film 150 is made of polyimide and has good infrared absorption characteristics. A predetermined wiring pattern including two thermistors (laminated chip NTC thermistors) 152A and 152B is formed on the lower surface (surface on the lower case 140 side) 150a of the resin film 150. Of the two thermistors 152A and 152B, the thermistor (first thermal element) 152A is an element for sensing the amount of heat of the resin film 150 that has generated heat by absorbing the infrared rays of the detection target. It is disposed inside the film region 151 exposed from the incident hole 132a. On the other hand, the thermistor (second thermosensitive element) 152B is an element for sensing the amount of heat inside the case 120, and is disposed outside the film region 151 exposed from the incident hole 132a of the upper case portion 130. The wiring pattern at both ends of the thermistor 152A is provided with a pair of meandering portions 154A and 154B for improving the detection characteristics of the thermistor 152A. The thermistors 152A and 152B preferably have a small heat capacity from the viewpoint of response speed, and have a 0603 shape (0.6 mm × 0.3 mm × 0.3 mm) or 0402 shape (0.4 mm × 0.2 mm × 0.2 mm). ) Is preferred.

  The wiring pattern formed on the resin film 150 has three external connection terminals T1, T2, and T3, which correspond to the terminals T1, T2, and T3 and the terminals T1, T2, and T3. The electric wires W1, W2, and W3 are soldered. Moreover, as shown in FIG. 7, each electric wire W1, W2, W3 is connected to the predetermined terminal of the detection circuit 170, and the circuit of the non-contact temperature sensor 100 provided with the temperature compensation function is comprised. Here, FIG. 7 is a diagram showing a wiring circuit diagram of the non-contact temperature sensor 100 including the wiring pattern of the resin film 150. As shown in FIG. 7, the detection circuit 170 includes an MPU, a ROM, an AD converter, an electronic component, and the like, and performs highly accurate temperature detection from a differential output between the thermistor 152A and the thermistor 152B. That is, the amount of heat in the case excluding the amount of heat converted by the resin film 150 is sensed by the thermistor 152B away from the film region 151, thereby detecting only the amount of heat caused by the infrared rays incident from the incident hole 132a. Can do.

  The constituent material of the resin film 150 is preferably polyimide from the viewpoint of easy wiring pattern production and heat resistance, but may be PPS or nylon.

  Next, heat conduction during use of the non-contact temperature sensor 100 will be described with reference to FIGS. 2 and 3.

  The non-contact temperature sensor 100 is installed so that the top plate portion 132 of the upper case portion 130 faces the detected body so that infrared rays from the detected body enter the incident hole 132a when used. Therefore, a part of the infrared rays that have not entered the incident hole 132a out of the infrared rays from the detection target are thermally converted in the top plate portion 132 of the upper case portion 130, and the top plate portion 132 generates heat. The heat generated by the heat generated by the top plate portion 132 increases as the amount of heat increases, the side plate portion 134 of the upper case portion 130, the side plate portions 144 and 146 of the lower case portion 140, the bottom plate portion 142, the film mounting portion 160, the resin. It is transmitted in order of film 150. That is, in this non-contact temperature sensor 100, heat transfer from the top plate portion 132 of the upper case portion 130 to the resin film 150 wraps around to the film mounting portion 160 provided on the bottom plate portion 142 of the lower case portion 140. It is carried out.

  On the other hand, in the conventional non-contact temperature sensor, since the resin film provided with the heat sensitive element is in close contact with the holding body that is a member facing the detected body, the heat generated by the heat generated by the holding body is retained by the holding body. Is transmitted directly to the resin film. In other words, the non-contact temperature sensor 100 according to the first embodiment is configured such that when heat is transferred from the case member (that is, the upper case portion 130) facing the detected body to the resin film 150, the detour route passes through the film attachment portion 160. Therefore, the heat transfer path is significantly extended as compared with the conventional non-contact temperature sensor.

  As described in detail above, in the non-contact temperature sensor 100 according to the first embodiment, the heat transfer path from the upper case portion 130 to the resin film 150 is extended as compared with the conventional non-contact temperature sensor. As a result, heat generation in the upper case portion 130 is difficult to be transmitted to the resin film 150. Thereby, improvement in detection accuracy of the thermistor 152A arranged on the resin film 150 is realized.

  Further, since the resin film 150 is not installed directly on the bottom plate part 142 of the lower case part 140 but is installed via the film attachment part 160, the bottom plate part 142 and the resin film 150 are separated from each other. The heat generated at 130 is not easily transmitted by the resin film 150. Further, since the resin film 150 is supported by the screw receiving portion 160b protruding from the film mounting portion 160, the cross-sectional area of the heat transfer path from the bottom plate portion 142 to the resin film 150 is reduced. The heat transfer is suppressed more effectively.

  In the non-contact temperature sensor 100, since the upper case portion 130 and the lower case portion 140 are separate bodies, the continuity in heat conduction is reduced, and transmission from the upper case portion 130 to the lower case portion 140 is reduced. Heat is more effectively suppressed.

  Moreover, in the non-contact temperature sensor 100, since the lower case part 140 and the film attachment part 160 are separate bodies, the continuity in heat conduction is reduced, so heat transfer from the bottom plate part 142 to the resin film 150 is prevented. It is suppressed more effectively. In particular, since the above-described PPS film mounting portion 160 has a lower thermal conductivity than aluminum constituting the case 120, heat transfer from the bottom plate portion 142 to the resin film 150 is effectively suppressed.

Furthermore, the case of the conventional non-contact temperature sensor is often manufactured by Al die casting, but the case 120 of the non-contact temperature sensor 100 according to the first embodiment is manufactured by press molding (bending, drawing, punching). Therefore, it is easier to manufacture than the conventional non-contact temperature sensor, and the weight can be easily reduced.
(Second Embodiment)

  Next, a non-contact temperature sensor according to the second embodiment will be described with reference to FIGS. As shown in FIGS. 8 and 9, the non-contact temperature sensor 200 according to the second embodiment of the present invention includes the non-contact temperature sensor 100 according to the first embodiment described above and the incident hole 132 a of the upper case portion 130. The difference is that a light guide unit 202 is provided at the edge.

  That is, in the non-contact temperature sensor 200, the tubular light guide unit 202 is erected along the edge of the incident hole 132 a of the upper case unit 130. The light guide portion 202 is formed by drawing, and extends from the top plate portion 132a of the upper case portion 130 to the outside of the case 120 in a direction orthogonal to the top plate portion 132a (Z direction in FIG. 8). Yes. Further, the inner side surface 202a of the light guide unit 202 is subjected to black body processing, and infrared rays are absorbed by the inner side surface 202a subjected to black body processing, thereby suppressing reflection of infrared rays on the inner side surface 202a. It has been. Specifically, the infrared reflectance of the inner side surface 202a is reduced by applying plastic, rubber, or the like to the inner side surface 202a or performing heat treatment under a predetermined condition.

  In the non-contact temperature sensor 200 provided with such a light guide unit 202, the same effect as that of the non-contact temperature sensor 100 described above can be obtained, and a substantial amount corresponding to the height of the light guide unit 202 can be obtained. In addition, since the incident hole 132a can be brought close to the detected object, the directivity of the detected object in the infrared detection is improved. Further, by performing black body processing on the inner side surface 202a of the light guide unit 202, as shown in FIG. 9, the infrared ray β case 120 greatly deviates from the extending direction of the light guide unit 202 (Z direction in FIG. 9). Can be prevented, and infrared rays α along the extending direction of the light guide portion 202 can be selectively made incident into the case 120. Thereby, the directivity in the infrared detection of the detected object is improved as compared with the case where the black body process is not performed on the inner side surface 202a of the light guide unit 202.

  Furthermore, since the light guide unit 202 is formed by drawing, it is easier to manufacture and can be easily reduced in weight compared to a non-contact temperature sensor manufactured by conventional Al die casting.

Here, in the built-in device in which the non-contact temperature sensor 200 is installed, heat convection due to the detected object occurs. It is known that when the convective heat hits the resin film 150 in the case 120, the output of the thermistor 152A on the resin film 150 is disturbed. However, as the non-contact temperature sensor 200 covers the periphery of the incident hole 132a with the light guide portion 202 having a certain height, the intrusion of the convective heat into the case 120 is suppressed. Therefore, in this non-contact temperature sensor 200, the disturbance of the output of the thermistor 152A is significantly suppressed.
(Third embodiment)

  Next, the non-contact temperature sensor which concerns on 3rd Embodiment is demonstrated, referring FIG.10 and FIG.11. As shown in FIGS. 10 and 11, the non-contact temperature sensor 300 according to the third embodiment of the present invention includes the non-contact temperature sensor 100 according to the first embodiment and the incident hole 132 a of the upper case portion 130. The difference is that a light guide section 302 is provided at the edge.

  That is, in the non-contact temperature sensor 300, the tubular light guide unit 302 is erected along the edge of the incident hole 132 a of the upper case unit 130. The light guide portion 302 extends from the top plate portion 132a of the upper case portion 130 toward the inside of the case 120 in a direction orthogonal to the top plate portion 132a (the Z direction in FIG. 8). It is formed by drawing. In addition, the inner side surface 302a of the light guide unit 302 is also subjected to black body processing in the same manner as the light guide unit 202 according to the second embodiment.

  In the non-contact temperature sensor 300 provided with such a light guide unit 302, the same effect as that of the non-contact temperature sensor 100 described above can be obtained, and in addition, infrared light from the detection target can be obtained by the light guide unit 302. The film region 151 that receives the light is limited to approximately the same extent as the opening region of the incident hole 132a. Thereby, in the non-contact temperature sensor 300, since heat conversion can be effectively performed around the thermistor 152A, the detection accuracy is improved. In addition, by performing black body processing on the inner side surface 302a of the light guide unit 302, the directivity of the detected object in infrared detection is improved as in the non-contact temperature sensor 200 according to the second embodiment.

Furthermore, since the light guide unit 302 is formed by drawing, it is easier to manufacture and can be lighter than a non-contact temperature sensor manufactured by conventional Al die casting.
(Fourth embodiment)

  Next, a non-contact temperature sensor according to the fourth embodiment will be described with reference to FIGS. As shown in FIGS. 12 to 14, the non-contact temperature sensor 400 according to the fourth embodiment of the present invention includes a lower case instead of the non-contact temperature sensor 200 according to the second embodiment described above and the film mounting portion 160. The difference is that a film attachment portion (base holding portion) 460 that is integral with the portion 140 is provided.

  That is, in the non-contact temperature sensor 400, the bottom plate portion 142 of the lower case portion 140 is provided with four columnar film attachment portions 460 that extend in a direction orthogonal to the bottom plate portion 142 (Z direction). A screw receiving portion 460b similar to the screw receiving portion 160b according to the first to third embodiments described above is provided on the upper portion of the film mounting portion 460. The film mounting portion is formed by the screw receiving portion 460b and the screw 162. The resin film 150 is fixed to the portion 460. These film attachment portions 460 are also arranged at positions that cannot be seen from the incident holes 132 a of the upper case portion 130, similarly to the film attachment portions 160.

  In the non-contact temperature sensor 400 provided with such a film mounting portion 460 that is integral with the lower case portion 140, the same effect as the above-described non-contact temperature sensor 200 can be obtained, and the number of parts can be reduced. Is planned.

  The present invention is not limited to the above embodiment, and various modifications are possible. For example, the fixing method of the upper case portion and the lower case portion is not limited to caulking, and may be a fixing method such as adhesion, screwing, resin fixing, or welding. Moreover, the upper case part and the lower case part do not necessarily need to be separate bodies, and may be integrated. Further, an energy ray reflecting film such as an infrared reflecting film that reflects infrared rays is interposed between the bottom plate portion of the lower case portion and the resin film, so that the resin film can absorb infrared rays more efficiently.

It is a top view of the non-contact temperature sensor concerning a 1st embodiment of the present invention. It is the II-II sectional view taken on the line of the non-contact temperature sensor shown in FIG. It is (a) left side view and (b) right side view of the non-contact temperature sensor shown in FIG. It is a front view of the non-contact temperature sensor shown in FIG. It is a bottom view of the non-contact temperature sensor shown in FIG. FIG. 2 is a partial cutaway view showing an internal structure of the non-contact temperature sensor shown in FIG. 1. It is the figure which showed the wiring circuit diagram of the non-contact temperature sensor containing the wiring pattern of a resin film. It is a top view of the non-contact temperature sensor concerning a 2nd embodiment of the present invention. It is the IX-IX sectional view taken on the line of the non-contact temperature sensor shown in FIG. It is a top view of the non-contact temperature sensor concerning a 3rd embodiment of the present invention. It is the XI-XI sectional view taken on the line of the non-contact temperature sensor shown in FIG. It is a top view of the non-contact temperature sensor concerning a 4th embodiment of the present invention. It is the XIII-XIII sectional view taken on the line of the non-contact temperature sensor shown in FIG. FIG. 13 is a partial cutaway view showing an internal structure of the non-contact temperature sensor shown in FIG. 12.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 100,200,300,400 ... Non-contact temperature sensor, 110 ... Sensor main-body part, 120 ... Case, 130 ... Upper case part, 132 ... Top plate part, 132a ... Incident hole, 140 ... Lower case part, 142 ... Bottom plate part 150 ... Resin film, 152A, 152B ... Thermistor, 160, 460 ... Film mounting part, 202, 302 ... Light guide part.

Claims (7)

A first case part having an incident hole through which infrared rays are incident from one end side;
A second case part disposed on the other end side of the incident hole of the first case part and having an incident hole facing surface part facing the incident hole;
The first case portion and the second case portion are disposed between the incident hole facing surface portion and attached to the first case portion side of the incident hole facing surface portion, and are incident from the incident hole. A base that performs thermal conversion of infrared rays,
A first thermosensitive element that is provided on the base and senses the amount of heat of the infrared rays converted by the base ;
At least one of the first case part and the second case part has a side plate part extending to the side facing each other,
The non-contact temperature sensor , wherein the base body is attached to the incident hole facing surface portion via a base body holding portion that is separated from the side plate portion by a predetermined distance and protrudes from the incident hole facing surface portion toward the incident hole side . A first case part having an incident hole through which infrared rays are incident from one end side;
A second case part disposed on the other end side of the incident hole of the first case part and having an incident hole facing surface part facing the incident hole;
The first case portion and the second case portion are disposed between the incident hole facing surface portion and attached to the first case portion side of the incident hole facing surface portion, and are incident from the incident hole. A base that performs thermal conversion of infrared rays,
A first thermosensitive element that is provided on the base and senses the amount of heat of the infrared rays converted by the base ;
At least one of the first case part and the second case part has a side plate part extending to the side facing each other,
The non-contact temperature sensor , wherein the base body is attached to the incident hole facing surface portion via a base body holder that is separated from the side plate portion by a predetermined distance and protrudes from the incident hole facing surface portion to the incident hole side . The non-contact temperature sensor according to claim 2 , wherein the base body holder has a thermal conductivity lower than that of the second case part. The non-contact temperature sensor according to any one of claims 1 to 3 , further comprising a substantially tubular light guide portion erected along an edge on one end side of the incident hole. The non-contact temperature sensor according to any one of claims 1 to 3 , further comprising a substantially tubular light guide portion erected along an edge on the other end side of the incident hole. Said substrate is a heat said first heat sensitive element senses, the second heat sensitive element for sensing the amount of heat the substrate excluding the amount of heat of infrared rays heat conversion is provided, according to claim 1 to 5 The non-contact temperature sensor as described in any one of Claims. Wherein the first case portion is a second case part and is separate, non-contact temperature sensor according to any one of claims 1-6.

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