CN102667430A - Non-contact temperature sensor - Google Patents
Non-contact temperature sensor Download PDFInfo
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- CN102667430A CN102667430A CN2010800570683A CN201080057068A CN102667430A CN 102667430 A CN102667430 A CN 102667430A CN 2010800570683 A CN2010800570683 A CN 2010800570683A CN 201080057068 A CN201080057068 A CN 201080057068A CN 102667430 A CN102667430 A CN 102667430A
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- 238000001514 detection method Methods 0.000 claims abstract description 58
- 230000035945 sensitivity Effects 0.000 claims abstract description 52
- 230000001105 regulatory effect Effects 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 6
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 238000004381 surface treatment Methods 0.000 claims description 3
- 230000004888 barrier function Effects 0.000 claims description 2
- 239000010408 film Substances 0.000 description 21
- 239000011347 resin Substances 0.000 description 15
- 229920005989 resin Polymers 0.000 description 15
- 238000000034 method Methods 0.000 description 10
- 230000005855 radiation Effects 0.000 description 7
- 230000000007 visual effect Effects 0.000 description 7
- 230000000694 effects Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 230000003595 spectral effect Effects 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 239000006096 absorbing agent Substances 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- RKTYLMNFRDHKIL-UHFFFAOYSA-N copper;5,10,15,20-tetraphenylporphyrin-22,24-diide Chemical compound [Cu+2].C1=CC(C(=C2C=CC([N-]2)=C(C=2C=CC=CC=2)C=2C=CC(N=2)=C(C=2C=CC=CC=2)C2=CC=C3[N-]2)C=2C=CC=CC=2)=NC1=C3C1=CC=CC=C1 RKTYLMNFRDHKIL-UHFFFAOYSA-N 0.000 description 2
- 238000003306 harvesting Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000005055 memory storage Effects 0.000 description 2
- 230000008447 perception Effects 0.000 description 2
- 238000009331 sowing Methods 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000001143 conditioned effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000001023 inorganic pigment Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/04—Casings
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/0265—Handheld, portable
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/06—Arrangements for eliminating effects of disturbing radiation; Arrangements for compensating changes in sensitivity
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/06—Arrangements for eliminating effects of disturbing radiation; Arrangements for compensating changes in sensitivity
- G01J5/064—Ambient temperature sensor; Housing temperature sensor; Constructional details thereof
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/08—Optical arrangements
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/08—Optical arrangements
- G01J5/0831—Masks; Aperture plates; Spatial light modulators
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/08—Optical arrangements
- G01J5/084—Adjustable or slidable
- G01J5/0843—Manually adjustable
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- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Radiation Pyrometers (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
Abstract
Disclosed is a non-contact temperature sensor which comprises a casing (14) having a top panel portion (34) constituting a shielding surface (34a) that shields infrared rays and a light guiding portion (40) that is formed by opening a part of the top panel portion (34) and that guides infrared rays into the casing. The non-contact temperature sensor further comprises a flexible printed circuit board (12) having a thermo-sensitive element (20a) for infrared detection and a thermo-sensitive element (20b) for temperature compensation and a sensitivity adjusting member (18) having an infrared shielding portion (18b) and capable of adjusting the position of the infrared shielding portion (18b) with respect to that of the thermo-sensitive element (20a) for infrared detection. The infrared shielding portion (18b) is positioned so as to face the thermo-sensitive element (20a) for infrared detection within an inner region of an open region (42) of the light guiding portion (40) except for an end portion in the moving directions of the sensitivity adjusting member (18). The sensitivity of the thermo-sensitive element (20a) for infrared detection can be adjusted by adjusting the position of the infrared shielding portion (18b) while the viewing angle of the thermo-sensitive element (20a) for infrared detection and the open area of the open region (42) are fixed.
Description
Technical field
The present invention relates to a kind of non-contact temperature sensor, it has infrared detection and uses temperature-sensing element with temperature-sensing element and temperature compensation, detects infrared ray and measures temperature.
Background technology
Measure the temperature sensor of the temperature of determinand with contact, contact portion is easy to wearing and tearing generally speaking, the thermal capacity generation error at measurment of the sensible heat element that contact with determinand itself.And, when determinand is rotated action etc., be difficult to mounting temperature sensor.Therefore, the demand of wieldy non-contact temperature sensor strengthens.
As with the non-contact detecting method of temperature, use following mode: with the infrared ray absorbing bulk absorption and convert energy into, the temperature of infrared absorber self risen converts electric signal into the temperature-sensing element detection with the infrared ray of determinand radiation.In recent years, proposed to make up infrared detection improves the precision of temperature measuring with temperature-sensing element with temperature-sensing element and temperature compensation non-contact temperature sensor.
As this non-contact temperature sensor; For example shown in patent documentation 1; Have following infrared detector: infrared detection with temperature-sensing element and temperature compensation with temperature-sensing element respectively adherence be fixed on two resin films, this resin film is moved on the framework of the thermal conductivity with regulation and is housed in framework inside.In these two temperature-sensing elements, infrared detection is configured in the open area of the light guide section that is provided with on the framework with temperature-sensing element, and temperature compensation is blocked on the ultrared position with the block surface that temperature-sensing element is configured in through framework.
And shown in patent documentation 2, infrared detection is installed on the resin film with temperature-sensing element with temperature-sensing element and temperature compensation, and this resin film is housed in framework inside.In these two temperature-sensing elements, infrared detection is configured in the open area of the light guide section that is provided with on the framework with temperature-sensing element, and temperature compensation is configured in by the framework wall with temperature-sensing element and surrounds and the spatial portion that is blocked.Further, as regulating, be provided with the parts that block of the peristome area of regulating light guide section from the unit of the infrared ray amount of light guide section incident.Blocking parts is from the outstanding to the inside so variable jut of screw of the internal face of light guide section.
Patent documentation 3 discloses a kind of non-contact temperature sensor, and it has: lower casing portion, support the film installation portion that resin film is installed; Last housing department has the top plate portion of the peristome that stops up lower casing portion and makes a part of opening ultrared of this top plate portion go into perforation; The 1st sensible heat element, what be installed in that above-mentioned from the resin film go into that perforation exposes goes into perforation counterpart, the ultrared heat of perception; The 2nd sensible heat element is installed on the part of being stopped up by above-mentioned top plate portion on the resin film, and the heat of perception enclosure is through regulating above-mentioned go into perforation and above-mentioned the 1st sensible heat relative positions, the adjusting that can export.As regulating above-mentioned structure of going into perforation and the 1st sensible heat relative positions, put down in writing following method: housing department is staggered and move into the method for the relative position of perforation; Resin film is staggered and the method for mobile the 1st sensible heat relative positions.
Patent documentation 4 discloses a kind of current collection member sensor device; Space between the detection faces of the lid of the peristome that covers current collection element resettlement section and current collection element is provided with shutter; The slide handle that use forms in the lid outside, the slip shutter is regulated the light harvesting zone.In order to stop up the tetragonal peristome of current collection element resettlement section, shutter extends internally respectively to each limit from the peristome periphery, makes the area continuous variable in ultrared light harvesting zone.
Patent documentation 5 discloses a kind of illuminance transducer, with the sensitive surface opposed position of sensor element on dispose shadow shield, receiving luminous sensitivity through changing the area of sowing discord distance or shadow shield each other, regulating.
Patent documentation 6 discloses a kind of ligthing paraphernalia, and it has lightproof unit, and this lightproof unit changes illuminance transducer and to the relative position of the little opening of this illuminance transducer incident light, can carry out the adjusting of the sensing range of illuminance transducer.As the example of this lightproof unit, put down in writing following formation: will have the moving sheet of the 2nd little opening of size below the little opening, removable aperture position ground is provided with between illuminance transducer and little opening.
Patent documentation 7 discloses a kind of ultrared light accepting part and has divided the infrared ray sensor through the bridge formation structure formation of regulation, in the ultrared lid surface film forming of accepting from the detected object radiation infrared reflection film that blocks ultrared incident is arranged.
The prior art document
Patent documentation
Patent documentation 1: japanese kokai publication hei 7-260579 communique
Patent documentation 2: TOHKEMY 2002-156284 communique
Patent documentation 3: TOHKEMY 2006-118993 communique
Patent documentation 4: japanese kokai publication hei 8-327447 communique
Patent documentation 5: japanese kokai publication hei 9-15044 communique
Patent documentation 6: TOHKEMY 2001-243828 communique
Patent documentation 7: japanese kokai publication hei 10-318829 communique
Summary of the invention
The problem that invention will solve
There is following problem in the infrared detector of patent documentation 1: because of the deviation of the physical dimension of framework etc. produces error in temperature detection, the yield rate when sensor is made is relatively poor.This framework but then, produces deviation to a certain degree in physical dimension through cast metal material and therefore a large amount of production can make cheap, efficiently.Even the influence of this deviation also can't be ignored during with the less deviation in a collection of, for example, when the peristome area of the light guide section of framework, when the peristome height dimension has deviation, ultrared amount of incident change and detected temperatures produces than mistake.Further, except the deviation of the physical dimension of framework, the deviation of the sectional area of the physical dimension of temperature-sensing element, the thickness of resin film, conductive pattern etc. also is to make detected temperatures produce the major reason of error.Consequently, the product that error is big is had to discarded as substandard products.
The infrared temperature sensor of patent documentation 2 can be proofreaied and correct the error of the detected temperatures as above-mentioned by each product through the overhang of the so variable jut of set screw.But have following problem: if regulate the overhang of variable jut, peristome area change then, contour shape, the detected object area that therefore can accept ultrared sensing range change, because of product different, but ultrared sensing range is different.
The non-contact temperature sensor of patent documentation 3, on regulating housing department go into perforation and the 1st sensible heat relative positions the time, observe from the 1st sensible heat element, the contour shape of the peristome of light guide section does not change.But, become the direction skew in the space of object, can't make the ultrared detection visual field certain.Therefore; When carrying out above-mentioned adjusting; This temperature sensor is being installed under the state of this mounting object product, with specific object position or scope during as sensing range, because of the visual field of temperature sensor towards changing according to each sensor; Thereby the detected object scope changes by each sensor, the situation of required sensing range occurs departing from.Further; When going into perforation and the 1st sensible heat relative positions when changing, go into perforation and the 2nd sensible heat relative positions changes too, therefore especially under the situation of small-sized non-contact temperature sensor; Temperature compensation characteristic possibly significantly change, and must regulate temperature compensation characteristic once more.
The current collection member sensor device of patent documentation 4 only through regulating the elongation of the shutter that extends internally from the peristome periphery, makes the contour shape of peristome and aperture area change energetically.Therefore there is following problem: detect field-of-view angle and aperture area and change, can't keep certain through adjusting.If this adjustment structure is used for temperature sensor, then the field-of-view angle difference of each sensor and detected object scope are greatly different.
The illuminance transducer of patent documentation 5; Regulate the distance of sowing discord of sensor element opposite each other and shadow shield, therefore the profile from the observed visual field of detecting element does not change, but shadow shield is the closer to element; The angle of the shading scope that field-of-view angle is inboard is just big more; The shading scope also becomes greatly, so the area of the photo detection area in the visual field not necessarily, thereby the subject area that sensor element detects when causing regulating at every turn is more different.And it is the zone at the center, the visual field that needs most of shading generally speaking, can't be applicable to the sensitivity correction of non-contact temperature sensor.
Lightproof unit in the ligthing paraphernalia of patent documentation 6; When illuminance transducer is observed, the contour shape equivalent variations of the 2nd little opening of moving sheet, but the same with the non-contact temperature sensor of patent documentation 3; The direction in the ultrared detection visual field is unfixing, the detected object range.
The infrared ray sensor of patent documentation 7 discloses in the ultrared lid surface film forming of accepting from the radiation of detected object thing has the situation of the infrared reflection film that blocks infrared ray incident, but can't regulate ultrared amount of incident, incident scope.
The present invention makes in view of the aforementioned technical background, and its purpose is to provide a kind of non-contact temperature sensor, and it is the error of Tc detection easily after assembling, can and detect field-of-view angle with the detected object scope and keep certain.
The means that are used to deal with problems
The present invention is a kind of non-contact temperature sensor; Have infrared detection and use temperature-sensing element with temperature-sensing element and temperature compensation; Wherein, This non-contact temperature sensor has: framework is provided with and forms the top plate portion block ultrared block surface and a part of opening of above-mentioned top plate portion is imported ultrared light guide section to inside; Circuit substrate is equipped with above-mentioned infrared detection overleaf and uses temperature-sensing element with the compensation of temperature-sensing element and said temperature on the conductive pattern of side, make face side and above-mentioned top plate portion opposed and be housed in the above-mentioned framework; And sensitivity adjusting parts; Has the infrared ray occlusion part between foregoing circuit substrate and above-mentioned light guide section; Be arranged to regulate above-mentioned infrared ray occlusion part with respect to the position of above-mentioned infrared detection with temperature-sensing element; Above-mentioned infrared detection is configured on the open area opposed position with the above-mentioned light guide section of above-mentioned framework with temperature-sensing element; Said temperature compensation with temperature-sensing element be configured in above-mentioned block surface opposed position on; The above-mentioned infrared ray occlusion part of above-mentioned sensitivity adjusting parts in the above-mentioned open area of above-mentioned light guide section, arranged opposite in the inside region except the end of the moving direction of above-mentioned sensitivity adjusting parts; Block certain arbitrarily area portions of above-mentioned open area; This non-contact temperature sensor is arranged to: can pass through to regulate above-mentioned infrared ray occlusion part with respect to the position of above-mentioned infrared detection with temperature-sensing element, and under field-of-view angle certain and aperture area above-mentioned open area the certain state of above-mentioned infrared detection with temperature-sensing element, regulate the sensitivity of above-mentioned infrared detection with temperature-sensing element.
Above-mentioned infrared ray occlusion part is configured to the above-mentioned open area of its length direction and crosscut above-mentioned light guide section vertical with respect to self moving direction, to block infrared ray.
The above-mentioned light guide section of above-mentioned framework forms elliptical shape, and above-mentioned infrared ray occlusion part is arranged to and can in the scope except circular-arc of two ends of above-mentioned open area, be moved.It is flexible printed wiring board with the foregoing circuit substrate that temperature-sensing element and said temperature compensate with temperature-sensing element that above-mentioned infrared detection is installed.Above-mentioned infrared detection is the thermistor with identical characteristics with temperature-sensing element and said temperature compensation with temperature-sensing element.
Between the above-mentioned top plate portion of above-mentioned flexible printed wiring board and above-mentioned framework, dispose dividing plate, aforementioned barriers is used between above-mentioned flexible printed wiring board and above-mentioned top plate portion and above-mentioned light guide section, guaranteeing the space that above-mentioned sensitivity adjusting parts can slide.
The surface treatment with smears etc. of the mirror process that infrared reflection uses or the reflection of electromagnetic wave of using infrared spectral range has been implemented on the surface of above-mentioned infrared ray occlusion part.Further, above-mentioned sensitivity adjusting parts are provided with and can use handle from the movable adjusting of above-mentioned framework peripheral operation.
The effect of invention
According to non-contact temperature sensor of the present invention; After in production process, having assembled each parts; In the confirming operation test, regulate the sensitivity adjusting parts, and can easily carry out the correction of sensitivity, can the temperature detecting precision of each product be suppressed within the specific limits.In the open area of light guide section in certain position and its contour shape and aperture area keep certain and make can accepting under the certain situation of ultrared detection field-of-view angle; The sensitivity that can Tc detects, therefore can be under the situation that does not change the temperature detection object range deviation of correcting sensitivity.Therefore,, also can the detected object scope of temperature sensor be kept certain, can keep stabilized quality more even temperature sensor is being installed under the situation of mounting object product.
Further, through between flexible printed wiring board and top plate portion, dividing plate being set, can easily guarantee to be used between the smooth proper air of sliding of sensitivity adjusting parts.The structure of non-contact temperature sensor of the present invention only is in the structure of existing non-contact temperature sensor, to have appended slim sensitivity adjusting parts, so profile can not become big.
The infrared ray occlusion part of sensitivity adjusting parts is implemented the processing of infrared reflection, prevent that the sensitivity adjusting parts from absorbing infrared ray, thereby can further improve the effect of the sensitivity correction of infrared ray occlusion part.Movable adjusting is set on the sensitivity adjusting parts makes it be projected into the outside this structure of framework with handle, also can not make frame structure become complicated and realization easily.
Description of drawings
Fig. 1 is the partial cross section stereographic map of expression as the non-contact temperature sensor of an embodiment of the invention.
Fig. 2 is the stereographic map of the sensitivity adjusting parts of this embodiment of expression.
Fig. 3 is the longitdinal cross-section diagram of the length direction of this embodiment.
Fig. 4 is the vertical view of the non-contact temperature sensor of this embodiment.
Fig. 5 is the circuit block diagram of structure that the system for detecting temperature of this embodiment has been used in expression.
Fig. 6 is the chart of relation of position and detected temperatures of the infrared ray occlusion part of this embodiment of expression.
Reference numeral
10 non-contact temperature sensors;
12 flexible printed wiring boards;
14 frameworks;
16 leads;
18 sensitivity adjusting parts;
The 18a holding member;
18b infrared ray occlusion part;
The 18c variable adjustment is used handle;
The 20a infrared detection is used temperature-sensing element;
Temperature-sensing element is used in the 20b temperature compensation;
22 housing parts;
24 lid parts;
34 top plate portions;
The 34a block surface;
40 light guide sections;
42 open areas;
44 dividing plates;
46 system for detecting temperature;
49,50 reference resistances.
Embodiment
Below, according to accompanying drawing an embodiment of the invention are described.The non-contact temperature sensor 10 of this embodiment is following sensing module: accept from the infrared ray of determinand radiation, use infrared detection to use temperature-sensing element 20a and temperature compensation to use temperature-sensing element 20b that the energy conversion that this infrared ray had is electric signal.As shown in Figure 1, non-contact temperature sensor 10 has: flexible printed wiring board 12, accommodate flexible printed wiring board 12 framework 14, electric signal is fetched into the outside lead 16 of framework 14, the sensitivity adjusting parts 18 of slidingtype from flexible printed wiring board 12.Further, not shown infrared detection is installed and uses temperature-sensing element 20b on flexible printed wiring board 12 with temperature-sensing element 20a, temperature compensation.
Flexible printed wiring board 12 is made up of resin film, and this resin film plays the effect of the ultrared infrared absorber that absorbs the determinand radiation.The profile of resin film is rectangle roughly, is formed with the conductive pattern that not shown electric wiring is used on the surface.For the thermo-responsive with respect to the infrared ray absorbing quantitative changeization is become well, the thin film that the preferred thermal capacity of the thickness of resin film is little wherein, is considered the easy property of the processing in the assembling procedure etc., has selected the film about thickness 20 μ m.The starting material of resin film use the heat proof material as the polyimide, are suitable for that the infrared detection of following surface installation type is carried out scolding tin with temperature-sensing element 20a and temperature compensation with temperature-sensing element 20b and install.Further, in order to improve the ultrared receptivity of this resin film, also can use the macromolecular material that is dispersed with carbon black or inorganic pigment.
Infrared detection is corresponding environment temperature and element that the circuit impedance of self changes with temperature-sensing element 20a and temperature compensation with temperature-sensing element 20b, uses the element of a pair of identical characteristic.At this, use corresponding self temperature variation and the thermal sensing element of resistance change is the NTC thermal sensing element with negative temperature characterisitic.Each temperature- sensing element 20a, 20b use the short surface installation type element of terminal length, and set under the state that is installed to flexible printed wiring board 12, and the thermal of the temperature-sensitive of temperature- sensing element 20a, 20b part and flexible printed wiring board 12 becomes tight.
As shown in Figure 1, lid part 24 has: smooth roughly rectangular top plate portion 34; The front wall portion 36 that uprightly is provided with down from a minor face of top plate portion 34; Grow the side wall portion 38 that the limit uprightly is provided with down from the pair of right and left of top plate portion 26; The light guide section 40 that uprightly is provided with up from the middle body of top plate portion 34.The face of the upside of top plate portion 34 is the ultrared block surface 34a that block the determinand radiation.Near the root of light guide section 40 top plate portion 34 is provided with the sliding eye 34b of rectangle, and the movable adjusting of following sensitivity adjusting parts 18 protrudes in this sliding eye 34b with handle 18c.The size in the space of the inboard that is surrounded by top plate portion 34, front wall portion 36 and side wall portion 38 is the size that can accommodate with the covering shell part 22 whole modes from the top.Light guide section 40 is provided with from the periphery of the open area 42 that near the slotted hole shape central authorities of top plate portion 34 forms is upright, forms the cylindrical body of the through hole with elliptical shape, and is integrally formed from top plate portion 34.The internal face of light guide section 40 has been implemented to absorb the electromagnetic coating of infrared spectral range.To block surface 34a, also can implement the coated that the reflection of electromagnetic wave of infrared spectral range is used as the outside surface of top plate portion 34.
In the lid part 24, stick on 4 places of face of the inboard of top plate portion 34 with the dividing plate 44 of the basic equal thickness of thickness of following sensitivity adjusting parts 18.The position that is pasted with dividing plate 44 is, when accommodating housing parts 22 in the lid part 24, with the position of the pair of right and left upper surface 32a butt of housing parts 22.
The inner structure of the non-contact temperature sensor 10 of assembled state then, is described with reference to Fig. 1, Fig. 3 and Fig. 4.Like Fig. 1, shown in Figure 3; 2 temperature-sensing element 20a that flexible printed wiring board 12 is configured to installed, 20b down and lead 16 towards rear wall parts 30 1 sides of housing parts 22, and the end clips of pair of long edges side is held between a pair of upper surface 32a of housing parts 22 and sets up.Be pasted with dividing plate 44 on the edges at two ends of flexible printed wiring board 12.Therefore, as shown in Figure 3, the inside part of flexible printed wiring board 12 is configured in the position of having left the thickness of dividing plate 44 from the faces downwards of the inboard of top plate portion 34, in the thickness space of dividing plate 44, contains sensitivity adjusting parts 18.
Accommodate under the state in the framework 14 at flexible printed wiring board 12 and sensitivity adjusting parts 18; Infrared detection is configured in the central authorities of infrared ray through the open area 42 of light guide section 40 incidents with sensible heat element 20a, and temperature compensation is configured in infrared ray by the below of the top plate portion 34 of shading with temperature-sensing element 20b.The movable adjusting of sensitivity adjusting parts 18 is outstanding to the top from the sliding eye 34b of upper plate portion 34 with handle 18c.
The housing parts 22 of framework 14 and lid part 24 on the face of the inboard of upper plate portion 34, the upper surface 30a of butt rear wall parts 30 and the upper surface 32b of side wall portion 32, fixing through not shown screw etc.Near the 30a of the upper surface of rear wall parts 30, be provided with 3 through hole 30b, the lead 16 that is connected with flexible printed wiring board 12 is pulled out to the outside of framework 14 through this through hole 30b.
As shown in Figure 4, the non-contact temperature sensor 10 of assembling exposes the infrared ray occlusion part 18b of sensitivity adjusting with parts 18 from the open area 42 in the light guide section 40.Through making variable adjustment handle 18c horizontally slipping in accompanying drawing in sliding eye 34b, can make the position of infrared ray occlusion part 18b variable in the scope of X1 ~ X2.The mobile of sensitivity adjusting parts 18 is between flexible printed wiring board 12 and top plate portion 23, to have guaranteed suitable space because of the existence of dividing plate 44, therefore can not damage flexible printed wiring board 12 and slip successfully.Dividing plate 44 is effective when the thickness of the maintaining part 18a of sensitivity adjusting parts 18 and infrared ray occlusion part 18b is thicker, if but the thinner thickness of above-mentioned each parts and do not produce obstacle to sliding then can not be provided with dividing plate 44.
Then, with reference to the temperature sensing circuit 46 of Fig. 5 explanation as the actuating circuit of non-contact temperature sensor 10.Noncontact temperature sensing circuit 46 is connected with the infrared detection temperature-sensing element 20a of non-contact temperature sensor 10 and the series circuit of reference resistance 49 at the two ends of direct supply 48, take out infrared detection temperature-sensing element 20a voltage and as voltage signal Va.Equally, be connected with the series circuit of the temperature compensation of non-contact temperature sensor 10 at the two ends of direct supply 48 with temperature-sensing element 20b and reference resistance 50, take out temperature compensation with the voltage of temperature-sensing element 20b as voltage signal Vb.This reference resistance 49,50 uses each other, and resistance value equates and little, the high-precision resistance of temperature dependency.
The voltage signal Va of simulation, Vb convert voltage signal Va (d), the Vb (d) of numeral into through analog/digital converter 52, and are sent to microcomputer 54.Microcomputer 54 use the relation of the expression voltage signal that leaves in the memory storage 56 and temperature the property list data, reach voltage signal Va (d), Vb (d); The calculation process of stipulating; According to the difference of 2 voltage signals, obtain the temperature information of determinand.
The action of non-contact temperature sensor 10 and system for detecting temperature 46 then, is described.Not during incident infrared, the temperature of flexible printed wiring board 12 is the same from light guide section 40, and therefore the resistance value of 2 temperature- sensing element 20a, 20b equates that circuit reaches balance, so voltage signal Va, Vb become equal, difference (Vb-Va) vanishing.
When the temperature variation of environment for use, peripheral atmosphere,, infrared ray do not change even not inciding the resistance value of 10,2 temperature-sensing element 20a of non-contact temperature sensor, 20b with being equal to each other yet.But, owing to the resistance value of 2 temperature- sensing element 20a, 20b equally increases, therefore keep equilibrium state, difference (Vb-Va) keeps zero, suitably carries out temperature compensation.
The infrared ray of determinand radiation is from light guide section 40 incidents and during the partially absorbing in opposite directions of the open area 42 of infrared ray quilt and flexible printed wiring board 12; Because of the thermal energy infrared detection of this part temperature variation, the resistance change of self with temperature-sensing element 20a.So, above-mentioned equilibrium state is broken, and produces the difference (Vb-Va) of 2 voltage signals.Microcomputer according to the difference of voltage signal Va (d), Vb (d), and,, convert through being recorded in the property list data in the memory storage 56 in advance as the voltage signal Vb (d) of temperature compensation information, calculate the surface temperature of determinand.
Then, offset correction in production process or the delivery test operation of this non-contact temperature sensor 10, sensitivity is described.At first, for example use non-contact temperature sensor 10 to detect the known temperature that blackbody furnaces etc. have the determinand of certain emissivity, judge through temperature sensing circuit 46 and handle the specification whether temperature detection result that is obtained satisfies regulation.When not satisfying specification, operate mobile is regulated and is used handle 18c, makes the position changeable of infrared ray occlusion part 18b, changes and regulates with the voltage signal Va of the output of temperature-sensing element 20a as infrared detection.
In this embodiment, as shown in Figure 4, infrared ray occlusion part 18b be arranged to make infrared ray occlusion part 18b except variable in the scope of the X1 ~ X2 of open area 42 as the position in the inside region circular-arc of the end of moving direction.Part with the flexible printed wiring board 12 on the infrared ray occlusion part 18b opposite that has been conditioned the position can't absorb infrared ray, so the relation of the position of infrared ray occlusion part 18b and detected temperatures is for example shown in the chart of Fig. 6.If infrared ray occlusion part 18b is configured in as near the central portion Xo of infrared detection with the position of temperature-sensing element 20a; Then being delivered to infrared detection from flexible printed wiring board 12 is suppressed with the heat of temperature-sensing element 20a; The variation of its resistance value diminishes, and can reduce the sensitivity of infrared detection with temperature-sensing element 20a of equal valuely.Use temperature-sensing element 20a if make the position of infrared ray occlusion part 18b leave infrared detection, then can improve the sensitivity of infrared detection of equal valuely with temperature-sensing element 20a.The control method of sensitivity is, makes the position of infrared ray occlusion part 18b mobile slightly, and the temperature detection result of calculating when system for detecting temperature 46 stops when satisfying the specification of regulation, to sliding eye 34b part coating adhesive etc. and fixedly infrared ray occlusion part 18b.By this method, can the sensitivity adjusting of each product of non-contact temperature sensor 10 be become to bring in the certain limit.
As stated; Non-contact temperature sensor 10 has made up each parts in production process after; In confirming operation test, the position of the infrared ray occlusion part 18b through regulating sensitivity adjusting parts 18, the sensitivity that comes Tc easily to detect; Eliminate the influence of the deviations such as physical dimension of each parts, the temperature detecting precision of each product is set within the specific limits.Further, in this bearing calibration, the contour shape of the open area 42 in the light guide section 40 and aperture area and visual field direction do not change, and therefore can make the field-of-view angle of detection and the aperture area of above-mentioned open area keep certain.Infrared ray occlusion part 18b is positioned at the direction with respect to its moving direction approximate vertical; And dispose and block infrared ray with the mode of the open area 42 in the crosscut light guide section 40; Because of this structure; When in the scope of X1 ~ X2, changing the position, voltage signal Va changes reposefully, is easy to carry out the position adjustments of infrared ray occlusion part 18b.
Further, through the infrared ray occlusion part 18b of sensitivity adjusting parts 18 being implemented the surface treatment of infrared reflection, can improve the sensitivity correction effect of infrared ray occlusion part 18b.
The structure of non-contact temperature sensor 10 only makes the structure of existing non-contact temperature sensor has been appended slim sensitivity adjusting parts 18, so profile can not become big.Sensitivity adjusting parts 18 are provided with movable adjusting make it be projected into the outside of framework 14 with handle 18c from sliding eye 34b, through this structure, also can uncomplicated ground, easily realize the structure of framework 14.Through between the top plate portion 34 of flexible printed wiring board 12 and lid part 24, dividing plate 44 being set, can easily guarantee between sensitivity adjusting parts 18 smooth proper air of sliding.
In addition, non-contact temperature sensor of the present invention is not limited to above-mentioned embodiment, the shape of the open area in the light guide section also two ends be the slotted hole, rectangle, square etc. of semicircle shape.For the shape of sensitivity adjusting with the infrared ray occlusion part of parts; As long as the intensity of variation of the voltage signal Va when blocking certain arbitrarily area portions of open area and changing its position is suitable, just can freely set according to the form of the purposes of sensor, determinand.Dividing plate also can by with the integrally formed projection of the face of the inboard of lid part, be arranged on the separator unit that the projection etc. on the surface of flexible printed wiring board forms and substitute.The circuit components such as reference resistance that are connected with 2 temperature-sensing elements and constitute bridge diagram also can be installed to the flexible printed wiring board of non-contact temperature sensor.
Claims (8)
1. a non-contact temperature sensor has infrared detection and uses temperature-sensing element with temperature-sensing element and temperature compensation, wherein,
This non-contact temperature sensor has:
Framework is provided with and forms the top plate portion block ultrared block surface and a part of opening of above-mentioned top plate portion is imported ultrared light guide section to inside;
Circuit substrate is equipped with above-mentioned infrared detection overleaf and uses temperature-sensing element with temperature-sensing element and said temperature compensation on the conductive pattern of side, make face side and above-mentioned top plate portion be housed in the above-mentioned framework in opposite directions; And
The sensitivity adjusting parts have the infrared ray occlusion part between foregoing circuit substrate and above-mentioned light guide section, are arranged to regulate above-mentioned infrared ray occlusion part with respect to the position of above-mentioned infrared detection with temperature-sensing element,
Above-mentioned infrared detection is configured on the open area opposed position with the above-mentioned light guide section of above-mentioned framework with temperature-sensing element, the said temperature compensation with temperature-sensing element be configured in above-mentioned block surface opposed position on,
The above-mentioned infrared ray occlusion part of above-mentioned sensitivity adjusting parts in the above-mentioned open area of above-mentioned light guide section, arranged opposite in the inside region except the end of the moving direction of above-mentioned sensitivity adjusting parts; Block certain arbitrarily area portions of above-mentioned open area
This non-contact temperature sensor is arranged to: can be through regulating above-mentioned infrared ray occlusion part with respect to the position of above-mentioned infrared detection with temperature-sensing element; And under field-of-view angle certain and aperture area above-mentioned open area the certain state of above-mentioned infrared detection, regulate of the sensitivity of above-mentioned infrared detection with temperature-sensing element with temperature-sensing element.
2. non-contact temperature sensor according to claim 1, wherein,
Above-mentioned infrared ray occlusion part is configured to the above-mentioned open area of its length direction and crosscut above-mentioned light guide section vertical with respect to self moving direction, to block infrared ray.
3. non-contact temperature sensor according to claim 2, wherein,
The above-mentioned light guide section of above-mentioned framework forms elliptical shape, and above-mentioned infrared ray occlusion part is arranged to and can in the scope except circular-arc of two ends of above-mentioned open area, be moved.
4. non-contact temperature sensor according to claim 1, wherein,
It is flexible printed wiring board with the foregoing circuit substrate that temperature-sensing element and said temperature compensate with temperature-sensing element that above-mentioned infrared detection is installed.
5. non-contact temperature sensor according to claim 4, wherein,
Above-mentioned infrared detection is the thermistor with identical characteristics with temperature-sensing element and said temperature compensation with temperature-sensing element.
6. non-contact temperature sensor according to claim 4, wherein,
Between the above-mentioned top plate portion of above-mentioned flexible printed wiring board and above-mentioned framework, dispose dividing plate, aforementioned barriers is used between above-mentioned flexible printed wiring board and above-mentioned top plate portion and above-mentioned light guide section, guaranteeing the space that above-mentioned sensitivity adjusting parts can slide.
7. non-contact temperature sensor according to claim 1, wherein,
The surface of above-mentioned infrared ray occlusion part has been implemented the electromagnetic surface treatment in reflected infrared zone.
8. non-contact temperature sensor according to claim 1, wherein,
Above-mentioned sensitivity adjusting parts are provided with and can use handle from the movable adjusting of the peripheral operation of above-mentioned framework.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010-002490 | 2010-01-08 | ||
| JP2010002490A JP4567806B1 (en) | 2010-01-08 | 2010-01-08 | Non-contact temperature sensor |
| PCT/JP2010/063098 WO2011083593A1 (en) | 2010-01-08 | 2010-08-03 | Non-contact temperature sensor |
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| CN102667430A true CN102667430A (en) | 2012-09-12 |
| CN102667430B CN102667430B (en) | 2014-11-26 |
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| CN201080057068.3A Active CN102667430B (en) | 2010-01-08 | 2010-08-03 | Non-contact temperature sensor |
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|---|---|
| JP (1) | JP4567806B1 (en) |
| KR (1) | KR101709943B1 (en) |
| CN (1) | CN102667430B (en) |
| WO (1) | WO2011083593A1 (en) |
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| CN104048763A (en) * | 2013-03-13 | 2014-09-17 | 凯尔西-海耶斯公司 | Lobed aperture radiant sensor |
| CN107615024A (en) * | 2015-05-27 | 2018-01-19 | 浜松光子学株式会社 | Barricade and measure device |
| CN107615025A (en) * | 2015-05-27 | 2018-01-19 | 浜松光子学株式会社 | Barricade and measure device |
| CN109073469A (en) * | 2016-06-13 | 2018-12-21 | 株式会社芝浦电子 | Infrared temperature sensor |
| CN109416283A (en) * | 2017-06-06 | 2019-03-01 | 株式会社芝浦电子 | Infrared temperature sensor and its manufacturing method |
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| JP5514071B2 (en) * | 2010-10-29 | 2014-06-04 | Ｔｄｋ株式会社 | Temperature sensor |
| WO2013065091A1 (en) * | 2011-11-04 | 2013-05-10 | 株式会社芝浦電子 | Infrared temperature sensor and fuser using same |
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| KR20150103944A (en) * | 2014-03-04 | 2015-09-14 | (주)파트론 | Electronic device having contactless temperature sensor and contactless temperature sensor module |
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| JP6354465B2 (en) * | 2014-09-01 | 2018-07-11 | 三菱マテリアル株式会社 | Infrared sensor and method for adjusting sensitivity of infrared sensor |
| US10533898B2 (en) | 2016-12-20 | 2020-01-14 | Shibaura Electronics Co., Ltd. | Infrared temperature sensor |
| JP6991716B2 (en) | 2017-01-20 | 2022-01-12 | キヤノン株式会社 | Sensor unit and image forming device |
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Also Published As
| Publication number | Publication date |
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| KR101709943B1 (en) | 2017-02-24 |
| JP4567806B1 (en) | 2010-10-20 |
| KR20120120152A (en) | 2012-11-01 |
| CN102667430B (en) | 2014-11-26 |
| JP2011141216A (en) | 2011-07-21 |
| WO2011083593A1 (en) | 2011-07-14 |
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