CN103675020B - Electronic package emissivity detection system - Google Patents
Electronic package emissivity detection system Download PDFInfo
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- CN103675020B CN103675020B CN201310704365.8A CN201310704365A CN103675020B CN 103675020 B CN103675020 B CN 103675020B CN 201310704365 A CN201310704365 A CN 201310704365A CN 103675020 B CN103675020 B CN 103675020B
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- electronic package
- thermostat
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Abstract
The invention discloses a kind of electronic package emissivity detection system, comprise thermoregulating system and thermal imaging system, described thermoregulating system comprises the control temperature unit of the thermostat for electronic package and external environment being isolated and the temperature that regulates described electronic package based on air thermal convection, described thermostat is provided with infrared acquisition window, described thermal imaging system is used for the infrared energy by described infrared acquisition window detector electronics.Implement system of the present invention, by thermostat, electronic package and external environment are isolated, the temperature regulating the electronic package be made up of various material and components and parts based on air thermal convection is used for by control temperature unit, and infrared acquisition window is set on thermostat, realize the temperature of each ingredient of electronic package described in accuracy controlling, simultaneously to multiple material synchro measure, the degree of accuracy of gained emissivity can be improved.
Description
Technical field
The present invention relates to emissivity measurement technical field, particularly relate to a kind of electronic package emissivity detection system.
Background technology
Electronic package emissivity refers to the infrared emittance (emissivity e=0 ~ 1.0) of component internal component surface, detector electronics emissivity is to coordinate infrared thermal imagery method, with accurate detection electronic package internal component working temperature, and then support its thermal performance evaluation and reliability evaluation.When therefore adopting infrared method detection electronic package infrared energy accounting temperature, the emissivity e of its inner various components and parts must be obtained.
But, the method of influence factor is measured in the emissivity measurement method provided at present and correction, mainly for the emissivity measurement of single uniform solid, liquids and gases, and need to support the use black matrix to contrast as standard signal source, or use thermopair directly to measure testee and obtain actual temperature, these methods are not all suitable for the electronic package emissivity be made up of various material and components and parts and detect, simultaneously to multiple material emissivity synchro measure, electronic package working temperature cannot be realized and quantitatively detects.
Summary of the invention
Based on this, be necessary simultaneously to multiple material emissivity synchro measure in electronic package, the problem that cannot realize the quantitative measurment of electronic package working temperature, a kind of electronic package emissivity detection system to be provided for existing emissivity measurement technology.
A kind of electronic package emissivity detection system, comprise thermoregulating system and thermal imaging system, described thermoregulating system comprises the control temperature unit of the thermostat for electronic package and external environment being isolated and the temperature that regulates described electronic package based on air thermal convection, described thermostat is provided with infrared acquisition window, described thermal imaging system is used for the infrared energy by described infrared acquisition window detector electronics.
Above-mentioned electronic package emissivity detection system, by thermostat, electronic package and external environment are isolated, the temperature regulating the electronic package be made up of various material and components and parts based on air thermal convection is used for by control temperature unit, and infrared acquisition window is set on thermostat, realize the temperature of each ingredient of electronic package described in accuracy controlling, simultaneously to the synchronous Infrared survey of multiple material, the degree of accuracy of gained emissivity can be improved.
Accompanying drawing explanation
Fig. 1 is the structural representation of electronic package emissivity detection system first embodiment of the present invention;
Fig. 2 is the transmittance graph figure of infrared acquisition window in Fig. 1;
Fig. 3 is the structural representation of electronic package emissivity detection system second embodiment of the present invention;
Fig. 4 is the structural representation of electronic package emissivity detection system the 3rd embodiment of the present invention.
Embodiment
Refer to Fig. 1, Fig. 1 is the structural representation of electronic package emissivity detection system first embodiment of the present invention.
The described electronic package emissivity detection system of present embodiment comprises thermoregulating system 100 and thermal imaging system 200, thermoregulating system 100 comprises thermostat 110 and control temperature unit 120, thermostat 110 is for isolating electronic package and external environment, control temperature unit 120 is for regulating the temperature of described electronic package based on air thermal convection, thermostat 110 is provided with infrared acquisition window 300, thermal imaging system 200 is for the infrared energy by infrared acquisition window 300 detector electronics.
Above-mentioned electronic package emissivity detection system, by thermostat, electronic package and external environment are isolated, the temperature regulating the electronic package be made up of various material and components and parts based on air thermal convection is used for by control temperature unit, and infrared acquisition window is set on thermostat, realize the temperature of each ingredient of electronic package described in accuracy controlling, simultaneously to multiple material emissivity synchro measure, the degree of accuracy of surveyed emissivity can be improved.
Wherein, for electronic package, be preferably that volume is less than in all kinds of electronic package such as hydrid integrated circuit, electronic module of 200mm × 200mm × 50mm any one, also can be used for discrete device, described electronic package is High Density Packaging and complicated encapsulating structure electronic package.
For thermoregulating system 100, preferably, to High Density Packaging and complicated encapsulating structure electronic package in a non-operative state (before emissivity test) carry out bulk temperature control.
In one embodiment, thermoregulating system 100 also comprises sample stage, and it is inner that sample stage is arranged on thermostat 110, for carrying electronic package.
Sample stage in the present embodiment preferably, is controllable sample stage, comprises three grades of locking metallic support pin, in x, y, z three directional trims and pinning, can adjust sample stage height and horizontal level according to electronic package size.
Further, sample stage can be placed the sample that volume is less than 200mm × 220mm × 80mm.
For thermostat 110, be preferably constant temperature oven, inside dimension is preferably: wide 230mm, long by 250, high 113mm.Thermostat 110 can also be usual other thermostats electronic package and external environment can isolated, prevent its temperature to be affected by the external environment in this area.
For control temperature unit 120, preferably, air convection is adopted to carry out heat transmission, to ensure the homogeneity of thermostat 110 internal temperature, set temperature probe before and after sample stage, control temperature unit 120 receives temp probe institute detection of temperature data, and carries out real-time temperature control according to described temperature data.
In one embodiment, control temperature unit 120 for by the internal temperature control of thermostat 110 between 50 degrees Celsius to 125 degrees Celsius.
Further, can realize the accurate Based Intelligent Control of 50 DEG C ~ 125 DEG C of temperature ranges, the emissivity meeting electronic package working temperature typical scope detects, and temperature-controlled precision is ± 1 DEG C, temperature fluctuation is ± 0.1 DEG C.
For thermal imaging system 200, preferably be arranged on thermostat 110 outside, comprise infrared thermal imagery probe, also can be connected with thermal imagery treatment facility, by the technological means that those skilled in the art are usual, the infrared energy of detection is scaled the emissivity of tested electronic package.
For infrared acquisition window 300, preferably, its width and length can be 10mm.Above tested electronic package sample, designing wide-aperture infrared acquisition window 300, for meeting the detection of large size electro sub-component, realizing the infrared energy detecting 6 μm ~ 13 mum wavelength scopes while temperature control through infrared acquisition window 300.
Further, the infrared glass of infrared acquisition window 300 can select the barium fluoride (BaF of 3mm thickness
2), can meet the infrared acquisition of 2 ~ 13 μm of scopes, transmissivity is up to 90%, is applicable to the wavelength detection scope of thermal imaging system.The infrared glass of infrared acquisition window 300 is barium fluoride (BaF
2) time transmittance graph see Fig. 2.
In one embodiment, electronic package emissivity detection system described in present embodiment, further comprise reflected temperature compensation system, for being placed on the surface of described electronic package, thermal imaging system 200 detects the infrared energy of described reflected temperature compensation system by infrared acquisition window 300.
The reflected temperature compensation system of the present embodiment, for compensating the Ambient temperature of electronic package, before the conversion of the emissivity infrared energy of detection being scaled tested electronic package, the infrared energy of described reflected temperature compensation system is eliminated from the infrared energy of electronic package, converse the emissivity of electronic package again, the impact of ambient temperature on electronic package emissivity measurement can be eliminated, realize the compensation of electronic package internal component to Ambient temperature.
Wherein, described reflected temperature compensation system comprises Si big circular slice test board, PCB covers copper test board, writing thick-film line Al
2o
3at least two kinds in the Cu test board of ceramic test plate, surface oxidation, ganoid Al test board and wrinkle aluminium foil test board.The test board that wrinkle aluminium foil and wrinkle tinfoil paper combine can also be used.
Further, described electronic package emissivity detection system also can comprise interference blanking unit, for the infrared energy preventing thermostat 100 grade except electronic package from reflecting, the probe of thermal imaging system 200 is entered by infrared acquisition window 300, in case affect the result of detection of thermal imaging system 200 pairs of electronic packages, improve the degree of accuracy of emissivity further.
When electronic package emissivity detection system of the present invention is based on the temperature of air thermal convection conditional electronic assembly, environment temperature is eliminated on the impact of electronic package emissivity by reflected temperature compensation system, and by infrared energy that interference blanking unit prevents thermostat 100 grade except electronic package from reflecting, the probe of thermal imaging system 200 is entered by infrared acquisition window 300, when the infrared energy of electronic package is scaled the emissivity of electronic package, can convert according to following principle:
According to Stefan-Boltzmann law, non-black-body law model is R
obj=e
0σ T
obj 4if the infrared energy R of non-black-body can be detected
objwith temperature T
obj, then the infrared emittance e of non-black-body can be calculated according to this formula
0.Electronic package is made up of, if therefore detect the infrared energy R of the various components and parts of component internal multiple components and parts (multiple non-black-body material)
objwith temperature T
obj, then the emissivity e of each components and parts can be calculated
0.
Under atmospheric environment, the infrared energy R of tested electronic package self
obj(T
obj): R
obj=e
oσ T
obj 4, then, and emissivity e
0for:
But when not eliminating environmental impact, the infrared energy R that thermal imaging system detection receives comprises three aspects:
R＝R
obj(T
obj)+R
ref(T
ref)+R
atm(T
atm)
R
obj(T
obj)＝R-R
ref(T
ref)-R
atm(T
atm)（2）
Wherein, R
obj(T
obj), R
ref(T
ref), R
atm(T
atm) be respectively the infrared energy of electronic package self, electronic package to radiation energy, the atmosphere radiation energy of Ambient.T
obj---electronic package surface temperature, K; T
ref---electronic package Ambient temperature, K; T
atm---atmospheric temperature, K; σ is Stefan-Boltzmann constant, σ=5.670 × 10
-8w/ (m
2.K
4).
When thermal imaging system short distance is measured, atmosphere radiation energy R can be ignored
atm(T
atm) impact, then (2) formula is rewritten as:
R
obj(T
obj)＝R-R
ref(T
ref)（3）
After adopting Ambient temperature compensation, obtain R
ref(T
ref) data, then (3) substitute into (1) formula, then electronic package emissivity e
0for:
By (4) formula, as long as detect tested electronic package temperature T
obj, electronic package radiation energy R at this temperature and the inner each components and parts material of electronic package be to the radiation energy R of Ambient
ref(T
ref), then (4) formula can be utilized to calculate and to obtain each components and parts emissivity e of electronic package
0.
But, under atmospheric environment room temperature condition (about 25 DEG C), high relative humidity environment, the infrared energy R precision that thermal imaging system 200 detects electronic package is poor, and electronic material emissivity e
0change with temperature T, need the emissivity e of detector electronics under (50 DEG C ~ 125 DEG C) condition
0.
Therefore, need to carry out intensification and temperature control to electronic package, accurately detect its temperature T
objwith electronic package infrared energy R at this temperature
obj(T
obj).The thermostat of (50 DEG C ~ 125 DEG C) temperature environment that this needs design one suitable, is placed in one electronic package, carries out infrared acquisition in outside.So, at detection electronic package infrared energy R
obj(T
obj) time, if thermostat madial wall is vertical stratification, then electronic package internal component is owing to installing the problem of angle and orientation, is easy to the heat radiation of thermostat madial wall to reflex to probe, forms extra Infrared jamming R in detecting
x, therefore need to arrange interference blanking unit in thermostat, effectively eliminate R
xinfrared jamming.
Therefore, under (50 DEG C ~ 125 DEG C) controlled temperature conditions, electronic package emissivity e is measured
0, need carry out effective temperature control to the electronic package of complicated encapsulating structure and detect its temperature T
obj, eliminating the Infrared jamming R of thermostat
xafter, detection and compensate for electronic assembly are to the reflection energy R of external environment condition
ref(T
ref), detect eventually through (4) formula Computing Principle and obtain electronic package emissivity e
0.
Refer to Fig. 3, Fig. 3 is the structural representation of electronic package emissivity detection system second embodiment of the present invention.
The electronic package emissivity detection system of present embodiment and the difference of the first embodiment are: control temperature unit 120 comprises air regulating channel, centrifugal blower and well heater 121, described air regulating channel comprises passage 122, air intake vent and air outlet, between the inwall that passage 122 is arranged on thermostat 110 and outer wall, air intake vent and air outlet are separately positioned in two opposed inner walls of thermostat 110, well heater 121 is arranged in passage 122, and centrifugal blower is arranged between well heater 121 and air outlet.
The electronic package emissivity detection system of present embodiment, accurately can control the temperature of electronic package by above-mentioned control temperature unit, improve the degree of accuracy of the emissivity of gained electronic package.
Wherein, the outer wall of thermostat 110 is electric galvanized steel plain sheet, inwall is fill the tank wall that poly-glass wool forms thermofin between mirror face stainless steel plate, inside and outside wall, and upper inside is trial target placement space, inner lower is air regulating channel (air regulating channel is made up of passage and package board).
Preferably, the thermal imagery treatment facility be connected with thermal imaging system 200 is personal computer 500.
Preferably, centrifugal blower can comprise blower fan 123 and motor 124.
Preferably, the sample stage in thermostat 110 is 130.
Refer to Fig. 4, Fig. 4 is the structural representation of electronic package emissivity detection system the 3rd embodiment of the present invention.
The electronic package emissivity detection system of present embodiment and the difference of the first and second embodiments are: the inwall of thermostat 110 is also provided with polishing reflective metals baffle plate 400, for being reflected away by infrared acquisition window 300 by the infrared light in thermostat 110.
The electronic package emissivity detection system of present embodiment, reflecting away the infrared heat energy of thermostat internal reflection from infrared acquisition window 300 by being arranged on the polishing reflecting plate on thermostat inwall, can prevent it from affecting the result of detection of thermal imaging system.
Preferably, polishing reflective metals baffle plate 400 is 40 degree to 60 degree relative to the inclination angle scope of the normal (straight line of plane belonging to vertical infrared acquisition window 300) of infrared acquisition window 300, angle can be adjusted, by the infrared heat energy R of the overwhelming majority of thermostat 110 internal reflection according to tested electrical component size size
xreflect away from infrared acquisition window 300 and, the probe entering thermal imaging system can not be reflected, effectively eliminate madial wall infrared radiation and electronic package infrared external reflection to the direct interference of infrared acquisition.
In other embodiments, also the inwall of thermostat 110 can be set to polishing reflective metals baffle plate, for being reflected away by described infrared acquisition window by the infrared light in described thermostat.Avoid the direct interference that the radiation of thermostat 110 internal material detects emissivity.
Be below electronic package emissivity detection system of the present invention, the workflow of the emissivity of detection electronic package:
Step 1, electronic package sample breaks a seal, and exposes the internal component and functional material that need to detect.
Step 2, eliminates Infrared jamming R
x, for eliminating Infrared jamming in step 4, step 5, step 6 measuring process.According to electronic package size dimension, adjustment sample stage and interference blanking unit, eliminate the Infrared jamming R of thermostat
x.Suitable adjustment sample stage height, and aim at infrared window placement electronic package, polishing metal baffle plate is set at suitable angle (40 ° ~ 60 °), makes the heat radiation of polishing metal baffle plate through after infrared acquisition window, directly do not enter infrared probe, eliminate Infrared jamming R
x.
Step 3, reads electronic package actual temperature T
obj, foundation as a comparison, for step 6 detect infrared temperature (T '
obj=T
obj) contrast.By control temperature unit, a certain temperature T is set
a(range of choices T
a=50 DEG C ~ 125 DEG C), until electronic package monitor temperature T
objequal set temperature T
a, i.e. T
obj=T
a, namely read and confirm electronic package actual temperature T
obj.
Step 4, measures apparent temperature T
fi, to Ambient energy R
ref(T
ref) compensate, for one of basic data that step 6 emissivity input value calculates.Arrange electronic material reflection measurement plate (reflected temperature compensation system) respectively, test electronic package is to the reflection energy R of thermostat external environment condition
ref(T
ref).According to the material characteristics of tested electronic package internal component, by 6 kinds of exemplary electronic material reflects test boards, select corresponding test board to be placed in electronic package surface respectively and test.First, carry out apparent temperature measurement with thermal imaging system, emissivity e=1.00 is set, respectively temperature sensing is carried out to selected test board, namely obtain the apparent temperature T of n components and parts
f1, T
f2, T
fi..., T
fn.Then, carry out Ambient temperature compensation, by the apparent temperature T of n components and parts of actual measurement
f1, T
f2, T
fi..., T
fn, respectively as thermal imaging system apparent temperature input parameter, achieve the Ambient energy R of an electronic package n components and parts
ref(T
ref): R
ref1, R
ref2..., R
refi..., R
refncompensation.
Step 5, measures infrared radiation gross energy R, for the basic data two that step 6 emissivity input value calculates.Through infrared window, detected the infrared radiation gross energy R of n components and parts respectively by thermal imaging system
1, R
2... R
i..., R
n.
Step 6, detection infrared temperature T '
obj, for step 7 infrared temperature T '
objwith actual temperature T
objcontrast.The detection of electronic package infrared temperature is carried out by this detection system thermal imaging system.
Step 7, detects and determines electronic package emissivity e
0.R is eliminated by step 2 and step 4
x, R
ref(T
ref) impact after, according to step 3 detect obtain T
obj, step 4 detect obtain R
ref(T
ref): R
ref1, R
ref2..., R
refi..., R
refn, step 5 detect obtain R
1, R
2... R
i..., R
n, estimate n components and parts emissivity e respectively by (4) formula
1, e
2..., e
i..., e
n, as thermal imagery detection emissivity initial input parameter, in conjunction with detection data T '
objwith T
objbetween difference carry out respectively input adjustment, until the infrared test temperature of n components and parts equals the actual temperature of electronic package in thermostat, i.e. T '
obj(T
j1, T
j2..., T
ji..., T
jn)=T
objtime, determine that emissivity input adjusted value is the detected value of electronic package emissivity: e
0(e
1, e
2..., e
i..., e
n).
The above embodiment only have expressed several embodiment of the present invention, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be as the criterion with claims.
Claims (9)
1. an electronic package emissivity detection system, it is characterized in that, comprise thermoregulating system and thermal imaging system, described thermoregulating system comprises the control temperature unit of the thermostat for electronic package and external environment being isolated and the temperature that regulates described electronic package based on air thermal convection, described thermostat is provided with infrared acquisition window, described thermal imaging system is used for the infrared energy by described infrared acquisition window detector electronics, also comprise reflected temperature compensation system, for being placed on the surface of described electronic package, described thermal imaging system detects the infrared energy of described reflected temperature compensation system by described infrared acquisition window.
2. electronic package emissivity detection system according to claim 1, it is characterized in that, described thermoregulating system also comprises sample stage, and described sample stage is arranged in described thermostat, for carrying described electronic package.
3. electronic package emissivity detection system according to claim 1, is characterized in that, described control temperature unit is used for the internal temperature control of described thermostat between 50 degrees Celsius to 125 degrees Celsius.
4. electronic package emissivity detection system according to claim 1, it is characterized in that, described control temperature unit comprises air regulating channel, centrifugal blower and well heater, described air regulating channel comprises passage, air intake vent and air outlet, described channel setting is between the inwall and outer wall of described thermostat, described air intake vent and described air outlet are separately positioned in two opposed inner walls of described thermostat, described well heater is arranged in described passage, and described centrifugal blower is arranged between described well heater and described air outlet.
5. electronic package emissivity detection system according to claim 1, is characterized in that, the inwall of described thermostat is also provided with polishing reflective metals baffle plate, for being reflected away by described infrared acquisition window by the infrared light in described thermostat.
6. electronic package emissivity detection system according to claim 5, is characterized in that, described polishing reflective metals baffle plate is 40 degree to 60 degree relative to the inclination angle scope of the normal of described infrared acquisition window.
7. electronic package emissivity detection system according to claim 1, is characterized in that, the inwall of described thermostat is polishing reflective metals baffle plate, for being reflected away by described infrared acquisition window by the infrared light in described thermostat.
8. electronic package emissivity detection system according to claim 1, is characterized in that, width and the length of described infrared acquisition window are 10mm.
9. electronic package emissivity detection system according to claim 1, is characterized in that, described reflected temperature compensation system comprises Si big circular slice test board, PCB covers copper test board, writing thick-film line Al
2o
3at least two kinds in the Cu test board of ceramic test plate, surface oxidation, ganoid Al test board and wrinkle aluminium foil test board.
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| CN105547496B (en) * | 2016-02-02 | 2018-10-26 | 中国计量学院 | Minimum temperature resolving power testing device and its test method |
| CN107085008A (en) * | 2017-05-08 | 2017-08-22 | 深圳市时维智能装备有限公司 | A kind of method for exciting solid body heat radiation characteristic and identification servicing unit |
| CN112817349B (en) * | 2020-12-31 | 2022-05-17 | 河北高达电子科技有限公司 | Black body temperature control method |
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