CN103674265B - High-density packages electronic building brick emissivity detection method - Google Patents
High-density packages electronic building brick emissivity detection method Download PDFInfo
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Abstract
The invention discloses high-density packages electronic building brick emissivity detection method, comprising: temperature control casing is carried out to temperature control, make described electronic building brick temperature stabilization in preset value; Obtain the reflection apparent temperature of each tested components and parts; By the reflection apparent temperature of each tested components and parts that obtain, as the Ambient temperature-compensating to each tested components and parts; Adjust respectively the emissivity of each tested components and parts, survey the temperature of described each tested components and parts; The adjusted value of emissivity is as the detected value of each tested components and parts emissivity when the temperature of each tested components and parts equals described preset value. The present invention adopts infrared thermal imagery detection mode and reflected temperature Compensating Control, apparent temperature and actual temperature to each tested components and parts of electronic building brick inside are effectively surveyed, by tested components and parts reflected temperature compensation, realize detection and the correction of all tested components and parts emissivity, the electronic building brick emissivity that solves High Density Packaging and complicated encapsulating structure detects a difficult problem.
Description
Technical field
The present invention relates to electronic building brick emissivity detection technique field, relate in particular to a kind of high-density packages electronicsAssembly emissivity detection method.
Background technology
High-density packages electronic building brick emissivity refers to the infrared emittance (transmitting on component internal components and parts surfaceRate e=0～1.0), the object of revising electronic building brick emissivity is in order to coordinate infrared thermal imagery method accurate detection highDensity encapsulation of electronic components internal component operating temperature, and then support its hot property evaluation and reliability evaluation.Therefore, while adopting infrared thermal imagery method to survey electronic building brick infrared energy accounting temperature, must obtain it and truly send outPenetrate rate e. How the emissivity of the inner High Density Integration components and parts of Measurement accuracy high-density packages electronic building brick, fullThe high-resolution temperature survey requirement of foot is the key of accurate detection high-density packages electronic building brick operating temperaturePlace.
The method of influence factor is measured in the emissivity measurement method providing at present and correction, is mainly for singleThe emissivity measurement of solid, liquids and gases uniformly, and need to support the use black matrix as standard signalSource contrast, or use thermocouple directly to measure testee to obtain actual temperature, these methods are all inapplicableDetect in the electronic building brick emissivity being formed by various materials and components and parts. In GJB standard, givenEmissivity is determined method, is the coating (about e=0.98) that adopts spraying Proximate blackbody, to ensure electronic deviceSlin emissivity is unified, for electronic building brick, adopts spraying method, after depollution sample also can cause outwardThe difficulty of the continuous location of losing efficacy; And in JEDEC standard, given heat conduction temperature control detects emissivity method,Cannot realize the electronic building brick of irregular packing forms. Therefore, to high by multiple material and various components and partsThe high-density packages electronic building brick that density assembles, because its encapsulating structure complexity, measurement temperature accuracy are wantedAsk high, how to detect effectively easily its emissivity, realize temperature Measurement accuracy, become a difficult problem. OrderFront common way is not suitable for the electricity by various materials and various components and parts High Density Packaging and high-density packagesSub-component.
Summary of the invention
Based on this, the invention provides a kind of high-density packages electronic building brick emissivity detection method.
A kind of high-density packages electronic building brick emissivity detection method, comprises the following steps:
The electronic building brick that cavity sealing cap is opened is placed in temperature control casing, wherein, and the quilt in described electronic building brickSurveying components and parts exposes by the described cavity sealing cap of opening; Keeping described electronic building brick is off working state; RightTemperature control casing carries out temperature control, makes described electronic building brick temperature stabilization in preset value;
According to the material behavior of each tested components and parts in described electronic building brick, select corresponding electronic material anti-Penetrate test board, and be placed in the surface of described electronic building brick; Utilize infrared probe to aim on described temperature control casingInfrared window, focuses on described electronic material reflection measurement plate; To described electronic material reflection measurement plateCarry out temperature sensing, obtain the reflection apparent temperature of each tested components and parts;
By the reflection apparent temperature of each tested components and parts that obtain, as the environment to each tested components and partsReflected temperature compensation;
After described Ambient temperature-compensating is set, remove described electronic material reflection measurement plate; Adjust respectivelyThe emissivity of whole each tested components and parts, the temperature of each tested components and parts described in surveying;
In the time that the temperature of each tested components and parts that detect equals described preset value, stop described adjustment, andDetected value using the adjusted value of current each tested components and parts emissivity as each tested components and parts emissivity.
Compared with general technology, electronic building brick emissivity detection method of the present invention has provided a kind of for based on skyThe electronic building brick emissivity detection method of gas thermal convection current temperature control technique and the compensation of multidrop environment reflected temperature, passes throughAdopt high accuracy air thermal convection current temperature control technique, to High Density Packaging and complicated encapsulating structure electronic building brick non-Under duty, carry out bulk temperature control, realize tested electronic building brick temperature controlled known with cordless.On this basis, adopt infrared thermal imagery detection mode and reflected temperature Compensating Control, in electronic building brickApparent temperature and the actual temperature of each tested components and parts of portion are effectively surveyed, and reflect by tested components and partsTemperature-compensating, realizes detection and the correction of all tested components and parts emissivity, solves High Density Packaging and complexityThe electronic building brick emissivity of encapsulating structure detects a difficult problem. The inventive method appropriate products scope is wide, it is each to solvePlant the emissivity measurement of product.
Brief description of the drawings
Fig. 1 is the schematic flow sheet of high-density packages electronic building brick emissivity detection method of the present invention.
Detailed description of the invention
For further setting forth the technological means that the present invention takes and the effect obtaining, below in conjunction with accompanying drawing andPreferred embodiment, to technical scheme of the present invention, knows and complete description.
Referring to Fig. 1, is the schematic flow sheet of high-density packages electronic building brick emissivity detection method of the present invention.
High-density packages electronic building brick emissivity detection method of the present invention, comprises the following steps:
The electronic building brick that S101 opens cavity sealing cap is placed in temperature control casing, wherein, and in described electronic building brickTested components and parts expose by the described cavity sealing cap opened; Keeping described electronic building brick is off working state;Temperature control casing is carried out to temperature control, make described electronic building brick temperature stabilization in preset value;
S102, according to the material behavior of each tested components and parts in described electronic building brick, selects corresponding electronics materialExpect reflection measurement plate, and be placed in the surface of described electronic building brick; Utilize infrared probe to aim at described temperature control casingOn infrared window, described electronic material reflection measurement plate is focused on; Described electronic material reflection is surveyedTest plate (panel) carries out temperature sensing, obtains the reflection apparent temperature of each tested components and parts;
S103 is the reflection apparent temperature of each tested components and parts that obtain, as to each tested components and partsAmbient temperature-compensating;
After S104 arranges described Ambient temperature-compensating, remove described electronic material reflection measurement plate; PointDo not adjust the emissivity of each tested components and parts, survey the temperature of described each tested components and parts;
S105, in the time that the temperature of each tested components and parts that detect equals described preset value, stops described adjustment,And detection using the adjusted value of current each tested components and parts emissivity as each tested components and parts emissivityValue.
According to Stefan-Boltzmann law, the law model while considering non-black-body is R=e σ T4If, knownExternal radiation energy R and temperature T that non-black-body is red, can calculate according to this formula the infrared emittance e of non-black-body.The present invention adopts IR thermal imaging inspection method, and the electronic building brick of known temperature is carried out to infrared energy RoAnd temperatureToSurvey, calculate the each emissivity e of electronic building brick according to formula (1)oAs thermal imaging system emissivity input parameter, whenThermal imaging system detecting temperature TREqual electronic building brick actual temperature ToTime (TR＝To), the transmitting of corresponding calculatingRate value eoFor the equivalent emissivity of electronic building brick.
Because thermal imaging system is surveyed three parts that the effective radiant energy R receiving is formula (2): electronic building brick certainlyBody radiant energy Robj, the radiant energy R of electronic building brick to Ambientref, atmospheric radiation energy Ratm. Due to detectionDistance is very short, can ignore atmosphere infra-red radiation RatmImpact obtains formula (3); With formula (1) calculating emissivity eoTime, be environmental radiation R in cancelling (2)refOn the impact of infrared measurement of temperature, the present invention adopts reflected temperature to mendRepay technology, eliminate the additional effect of ambient temperature to electronic building brick emissivity measurement, with the formula after compensating(4) radiant energy RobjSubstitution formula (1), calculates and obtains out the each components and parts emissivity of electronic building brick more accurately.
Tested electronic building brick infrared energy: Robj＝eoσTobj 4（1）
The infrared energy that thermal imaging system is surveyed:
R＝Robj(Tobj)+Rref(Tref)+Ratm(Tatm)（2）
When short distance is measured, ignore atmospheric radiation impact:
R＝Robj(Tobj)+Rref(Tref)（3）
After Ambient temperature-compensating:
Robj＝R-Rref（4）
In formula:
Robj、Rref、Ratm---radiant energy to Ambient of electronic building brick infrared energy, electronic building brick,Atmospheric radiation energy, R is the infrared integrated radiant emittance that thermal imaging system is surveyed;
Tobj---electronic package surface temperature, K;
Tref---electronic building brick Ambient temperature, K;
Tatm---atmospheric temperature, K.
Electronic building brick emissivity based on air thermal convection current temperature control and multiple spot reflected temperature compensation control detects skillArt. Wherein, adopt casing intelligent temperature control technology to carry out thermal convection current temperature control to measured object, testee is existedUnder free convection environment, in the more than 20 DEG C steady temperature higher than environment temperature, survey to meet infrared thermal imageryRequirement; Adopt large visual field infrared acquisition window design technology, realize the multiple tested components and parts of electronic building brickCarry out infrared acquisition simultaneously; Adopt the anti-of multidrop environment reflected temperature analytical technology and 6 kinds of exemplary electronic materialsPenetrate temperature test plate, realize the compensation to multiple tested components and parts reflected temperature; Temperature control casing madial wall adopts40 °～50 ° adjustable designs, to ensure inwall infra-red radiation R2Directly see through detection window to external radiation, do not enterEnter infrared probe R1Interference Detection.
As one of them embodiment, the step of the corresponding electronic material reflection measurement of described selection plate, comprisesFollowing steps:
According to the material behavior of each tested components and parts in described high-density packages electronic building brick, select respectively 6Plant electronic material reflection measurement plate, and be placed in the surface of described electronic building brick; Wherein, 6 kinds of electronic material reflectionsTest board comprises Si great garden sheet, PCB copper-clad plate, Al2O3The Cu plate of conduction band substrate, surface oxidation, surfaceSmooth Al plate, wrinkle tinfoil paper/wrinkle aluminium foil.
The reflected temperature test board of 6 kinds of exemplary electronic materials, comprising: Si garden built-in testing plate, cover copper PCB surveyTest plate (panel), Al2O3Conduction band substrate test board, surface oxidation Cu test board, smooth surface Al test board, wrinkle tinPaper tinsel/wrinkle aluminium foil test board etc.
Preferably, detect emissivity system and temperature regulating device, can comprise: 1. temperature control casing; 2. intelligence controlTemperature system; 3. large scale infrared glass detection window; 4. infrared thermal imagery probe; 5. tested electronic building brick.
As one of them embodiment, described temperature control casing has following architectural feature: outer wall is electric zinc-platedSteel plate, inwall is mirror face stainless steel plate, fills the tank wall of poly-mineral wool formation thermal insulation layer between inside and outside wall. InstituteState temperature control casing and have following architectural feature: upper inside is trial target placement space, inner lower is airRegulate passage.
Evenly controlled for realizing high-density packages electronic building brick temperature, patent of the present invention has adopted intelligent temperature control skillArt and casing temperature regulating device carry out thermal convection current temperature control to measured object, make the free convection of testee in casingUnder environment in even steady temperature state. Intelligent casing temperature regulating device disclosed by the invention, its composition characteristicComprise: temperature control casing and provide≤200 × 220 × 80mm sample placement space and sample stage; Input defeatedAir outlet intelligent temperature control heating system; Cross-ventilation heat circulating system; Electronic building brick electric power supply control system. ItsArchitectural feature comprises: outer wall is that electric galvanized steel plain sheet, inwall are to fill between mirror face stainless steel plate, inside and outside wallPoly-mineral wool forms the tank wall of thermal insulation layer; Upper inside is that trial target placement space, inner lower are air adjustmentJoint passage (air regulating channel is made up of centrifugal blower and passage and package board, and heater regulates channel interior)Inner space;
As one of them embodiment, described temperature control casing has following architectural feature: described temperature control casingChamber door has infrared glass detection window, detects for electronic building brick emissivity. Described infrared glass detecting windowThe diameter of mouth is 10mm.
Chamber door has designed the large scale infrared glass detection window that diameter is 10mm, launches for electronic building brickRate detects.
As one of them embodiment, the inwall of described temperature control casing be designed to 40 °～50 ° adjustable.
For avoiding measured object by cabinet wall infra-red radiation R1Reflex to probe R2, the standard of disturbing emissivity to detectReally property, temperature-controlled box inwall be designed to 40 °～50 ° adjustable, make the infra-red radiation of casing self by infrared glassThe direct transmission of glass window is gone out, and the reflection interference infrared probe of avoiding sample detects.
In step S101, electronic building brick (inoperative) heats up and controls: electronic building brick cavity sealing cap is opened,Expose dut temperature components and parts, be placed in the sample stage of temperature control device case, close upper box lid, keep the non-work of assemblyMake state; Adjust temperature-controlling system and select temperature conditions, select a certain temperature T of 50 DEG C～125 DEG CA; Pass throughIntelligent temperature control system regulating and controlling temperature, until electronic building brick temperature equals TAAnd stable.
As one of them embodiment, described, temperature control casing is carried out to temperature control, make described electronic building brickTemperature stabilization is in the step of preset value, and described preset value is a temperature value of 50 DEG C～125 DEG C.
Above-mentioned way is closing to reality service condition more, is easy to promote.
In step S102, electronic building brick reflection apparent temperature is measured: tested according to electronic building brick inside nComponents and parts material behavior, 6 kinds of exemplary electronic material reflection measurement plates selecting respectively the present invention to provide, are placed inMUT module under test surface, infrared probe is aimed at temperature regulating device infrared window, and test board is focused on; To surveySystem emissivity parameter is set to e=1.00, adjusts thermal imaging system atmospheric temperature, humidity, infrared window saturating simultaneouslyPenetrate after the parameters such as rate, respectively test board is carried out to temperature sensing, be i.e. the corresponding reflection table that obtains n components and partsSee temperature TF1,TF2,…,TFi,…,TFn。
As one of them embodiment, described step of described electronic material reflection measurement plate being carried out to temperature sensingSuddenly, comprise the following steps:
Detection system emissivity parameter is set to 1, adjusts atmospheric temperature, humidity and the infrared window of thermal imaging systemTransmissivity, carries out temperature sensing to test board respectively, and correspondence is obtained the apparent temperature of reflection of each tested components and partsDegree.
Above-mentioned way can get the reflection apparent temperature of each tested components and parts exactly, and is easy to realize,Cost is lower.
In step S103, electronic building brick Ambient temperature-compensating: by the reflection of n components and parts of actual measurementApparent temperature TF1,TF2,…,TFi,…,TFn, input respectively thermal imaging system as reflected temperature parameters, as rightThe Ambient temperature-compensating of an electronic building brick n components and parts.
As one of them embodiment, described by the reflection apparent temperature of each tested components and parts that obtain, doFor the step of the Ambient temperature-compensating to each tested components and parts, comprise the following steps:
By the reflection apparent temperature of each tested components and parts that obtain, input respectively thermal imaging system as reflected temperatureParameters, as the Ambient temperature-compensating to each tested components and parts.
Above-mentioned way is easy to realize, and cost is lower.
In step S104, electronic building brick actual temperature is surveyed: arrange after Ambient temperature, remove reflectionTest board, the temperature T of n components and parts of detection electronic building brickJ1,TJ2,…,TJi,…,TJn, tested to n respectivelyThe emissivity e of components and parts1,e2,…,ei,…,enAdjust, until the detecting temperature of n components and partsTJ1,TJ2,…,TJi,…,TJnEqual actual temperature T in temperature-controlled boxA。
In step S105, electronic building brick emissivity is determined: according to TJ1,TJ2,…,TJi,…,TJn＝TATime send outPenetrate rate ei(i=1 ..., n) adjust parameter, be defined as the detected value of electronic building brick n components and parts emissivity.
The present invention adopts thermal convection current temperature control technique and multiple spot reflected temperature Compensating Control, realizes electronics groupThe detection of part emissivity, is applicable to the electronic building brick of the complicated encapsulating structures of various high density, and the inventive method is suitableWide by product scope, can to solve various products emissivity measurement. The detection temperature regulating device of the inventive method,Madial wall adopts 40 °～50 ° adjustable project organizations, reduces to greatest extent sample to casing infrared external reflectionThe interference bringing, the space of temperature regulating device reaches simultaneously: W230 × D250 × H113, sample temperature control scope reachesTo 50～125 DEG C, temperature-controlled precision reaches ± 1 DEG C, and temperature fluctuation reaches ± and 0.1 DEG C, can more accurately surveyWhen amount emissivity, more accurately control electronic building brick temperature; The multiple spot reflected temperature of the inventive method is mended simultaneouslyRepay control technology, designed and developed the reflected temperature test board of 6 kinds of exemplary electronic materials, comprise Si great garden sheet,PCB copper-clad plate, Al2O3The Cu plate of conduction band substrate, surface oxidation, ganoid Al plate, wrinkle tinfoil paper/Zou's aluminium foils etc., covered the typical material of electronic building brick main components, reflected well these materialsReflection characteristic, can effectively eliminate the impact that electronic building brick brings Ambient and reflected temperature is mendedRepay.
Compared with general technology, high-density packages electronic building brick emissivity detection method of the present invention has provided oneDetect for the electronic building brick emissivity based on air thermal convection current temperature control technique and the temperature-compensating of pointwise AmbientMethod, by adopting high accuracy air thermal convection current temperature control technique, to High Density Packaging and complicated encapsulating structure electricitySub-component carries out bulk temperature control under off working state, realizes tested electronic building brick temperature with noncontact sideFormula is controlled known. On this basis, adopt infrared thermal imagery detection mode and reflected temperature Compensating Control,Apparent temperature and actual temperature to each tested components and parts of electronic building brick inside are effectively surveyed, by quiltSurvey the compensation of components and parts reflected temperature, realize detection and the correction of all tested components and parts emissivity, solve highly denseThe electronic building brick emissivity of degree assembling and complicated encapsulating structure detects a difficult problem. The inventive method appropriate products scopeExtensively, can solve the emissivity measurement of various products.
The preferred embodiment that provides emissivity test and the operating temperature test of a microwave components below, enters oneThe operating process of step explanation the technology of the present invention and the beneficial effect bringing.
Certain microwave components is the electronic building brick of high reliable communication system support, now need to be to microwave components inside 6The temperature of individual key components normal operating conditions is surveyed. First need to detect this 6 key componentsesSlin emissivity, then carry out temperature sensing.
The step of the concrete implementation and operation of the present embodiment is as follows:
Step 1, the control of microwave components (inoperative) environment temperature.
The microwave components of opening after cap is placed in the temperature regulating device that model is IREMISSI-I to A face unit courtUpper towards infrared probe, in off working state, by " temperature control panel " set temperature TA=50 DEG C, temperature control dressPut and start Intelligent heating in case, until the temperature inside the box stable after, now microwave components temperature TJWith the temperature inside the boxTABalance.
Step 2, microwave components reflection apparent temperature is measured.
(T after microwave components temperature stabilizationJ=TA), set input parameter emissivity e=1.00 by thermal imaging system,Select 3 kinds of test board: Al by temperature regulating device " selection of reflection measurement plate " regulation and control respectively2O3Conduction band substrate (withCrown cap/pottery envelope amplifier material approaches), the Cu plate (approaching with oscillator sheathing material) of surface oxidation,Wrinkle aluminium foil (connects with plastic packaging amplifier 1, plastic packaging frequency synthesizer, chip resistor 4 and chip resistor 5 materialsClosely), infrared probe reflects apparent temperature and measures after respectively test board being focused on, and detects microwave components 6The apparent temperature T of individual main componentsF1,TF2,…,TF6。
Step 3, electronic building brick actual temperature is measured.
Complete after the measurement of test board reflected temperature, control " selection of reflection measurement plate " and regain reflecting plate, probeAgain microwave components is focused on, set respectively thermal imaging system reflected temperature parameter TF1,TF2,…,TF6, and respectivelyAdjust thermal imaging system emissivity respective value e1,e2,…,e6, electronic building brick is carried out to temperature survey, constantly adjust eachPenetrate rate eiInput value, equals electronic building brick actual temperature (T until thermal imaging system is measured temperatureJ1,TJ2,…,TJ6=TA）。
Step 4, determines electronic building brick emissivity.
By step 3, measure electronic building brick inoperative temperature, work as TJ1,TJ2,…,TJ6=TATime, corresponding thermal imageryInstrument emissivity adjustment input value is the emissivity e of 6 main components1,e2,…,e6, in table 1.
The emissivity e measured value of 6 main components of table 1 microwave components
| Sequence number | Title material | Radiance e |
| 1 | Plastic packaging amplifier 1 | 0.95 |
| 2 | Oscillator shell | 0.60 |
| 3 | Plastic packaging frequency synthesizer | 0.95 |
| 4 | Chip resistor 4 | 0.95 |
| 5 | Chip resistor 5 | 0.95 |
| 6 | Crown cap/pottery envelope amplifier | 0.90 |
Step 5, electronic building brick operating temperature is measured.
According to the emissivity value of 6 main components of table 1 electronic building brick, divide as thermal imaging system emissivity parameterNot Shu Ru, make electronic building brick in microwave duty, survey its Temperature Distribution and 6 under working and room temperature stateIndividual main components surface temperature, result is as follows.
Microwave components, A face unit, when in running order: cavity side table Tc=28 DEG C, environment temperature Ta=23DEG C; Device surface temperature T: 30.1 DEG C of amplifiers, 27.5 DEG C, oscillator shell, 31.1 DEG C of frequency synthesizers, electricityHinder 30.6 DEG C (two resistance are 30.6 DEG C), 31.2 DEG C, amplifier.
The present invention is the emissivity of the each components and parts of direct-detection electronic building brick and assembled material quickly and easily,And then further its operating temperature is carried out to quantitative detection, solved prior art cannot be to High Density Packaging andThe difficult problem that complicated encapsulating structure electronic building brick emissivity and operating temperature detect. Electronic building brick emissivity is to supportThe most important parameter of its temperature survey, by accurate detection emissivity parameter, not only can solve electronicsThe quantitative detection that assembly operating temperature is measured, can also further enter electronic building brick according to temperature measurement resultThe design of row Quantitative Reliability evaluation and optimization, is also the significant data of its integrated equipment system reliability design,Become an important foundation of support system Engineering Reliability.
The present invention, with high accuracy air thermal convection current technology, carries out bulk temperature control to electronic building brick, realizes electricitySub-component temperature is controlled known with cordless, has avoided the direct detection contact of thermocouple; Be applicable to eachThe emissivity of planting high-density package structure electronic building brick detects, and has solved complicated encapsulating structure electronic component productThe difficult problem that temperature quantitatively detects; Cross-ventilation temperature regulating device, madial wall adopts 40 °～50 ° adjustable project organizations,Ensured madial wall infra-red radiation directly by infrared window to external radiation, and do not inject infrared probe disturb visitSurvey result, reduced to greatest extent casing radiation and sample reflection to the impact of surveying; The present invention's operationEasy, quick, applied widely, can be used for electronic building brick, the mixing of volume in 200 × 200 × 80mmThe various electronic building bricks such as integrated circuit, discrete device and device; Temperature regulating device can realize 50 DEG C～125The accurate control of DEG C temperature range, the emissivity that meets electronic building brick exemplary operation temperature range detects.
The above embodiment has only expressed several embodiment of the present invention, and it describes comparatively concrete and detailed,But can not therefore be interpreted as the restriction to the scope of the claims of the present invention. It should be pointed out that for this areaThose of ordinary skill, without departing from the inventive concept of the premise, can also make some distortion andImprove, these all belong to protection scope of the present invention. Therefore, the protection domain of patent of the present invention should be with appendedClaim is as the criterion.
Claims (10)
1. a high-density packages electronic building brick emissivity detection method, is characterized in that, comprises the following steps:
The electronic building brick that cavity sealing cap is opened is placed in temperature control casing, wherein, and the quilt in described electronic building brickSurveying components and parts exposes by the described cavity sealing cap of opening; Keeping described electronic building brick is off working state; RightTemperature control casing carries out temperature control, makes described electronic building brick temperature stabilization in preset value;
According to the material behavior of each tested components and parts in described electronic building brick, select corresponding electronic material anti-Penetrate test board, and be placed in the surface of described electronic building brick; Utilize infrared probe to aim on described temperature control casingInfrared window, focuses on described electronic material reflection measurement plate; To described electronic material reflection measurement plateCarry out temperature sensing, obtain the reflection apparent temperature of each tested components and parts;
By the reflection apparent temperature of each tested components and parts that obtain, as the environment to each tested components and partsReflected temperature compensation;
After described Ambient temperature-compensating is set, remove described electronic material reflection measurement plate; Adjust respectivelyThe emissivity of whole each tested components and parts, the temperature of each tested components and parts described in surveying;
In the time that the temperature of each tested components and parts that detect equals described preset value, stop described adjustment, andDetected value using the adjusted value of current each tested components and parts emissivity as each tested components and parts emissivity.
2. high-density packages electronic building brick emissivity detection method according to claim 1, its feature existsIn, described, temperature control casing is carried out to temperature control, make described electronic building brick temperature stabilization in the step of preset valueIn rapid, described preset value is a temperature value of 50 DEG C～125 DEG C.
3. high-density packages electronic building brick emissivity detection method according to claim 1, its feature existsIn, the step of the corresponding electronic material reflection measurement of described selection plate, comprises the following steps:
According to the material behavior of each tested components and parts in described electronic building brick, select respectively 6 kinds of electronic materialsReflection measurement plate, and be placed in the surface of described electronic building brick; Wherein, 6 kinds of electronic material reflection measurement plates compriseSi great garden sheet, PCB copper-clad plate, Al2O3The Cu plate of conduction band substrate, surface oxidation, ganoid AlPlate, wrinkle tinfoil paper/wrinkle aluminium foil.
4. high-density packages electronic building brick emissivity detection method according to claim 1, its feature existsIn, described step of described electronic material reflection measurement plate being carried out to temperature sensing, comprises the following steps:
Detection system emissivity parameter is set to 1, adjusts atmospheric temperature, humidity and the infrared window of thermal imaging systemTransmissivity, carries out temperature sensing to test board respectively, and correspondence is obtained the apparent temperature of reflection of each tested components and partsDegree.
5. high-density packages electronic building brick emissivity detection method according to claim 1, its feature existsIn, described by the reflection apparent temperature of each tested components and parts that obtain, as to each tested components and partsThe step of Ambient temperature-compensating, comprises the following steps:
By the reflection apparent temperature of each tested components and parts that obtain, input respectively thermal imaging system as reflected temperatureParameters, as the Ambient temperature-compensating to each tested components and parts.
6. high-density packages electronic building brick emissivity detection method according to claim 1, its feature existsIn, described temperature control casing has following architectural feature: outer wall is electric galvanized steel plain sheet, and inwall is that minute surface is stainlessSteel plate, fills the tank wall that gathers mineral wool formation thermal insulation layer between inside and outside wall.
7. high-density packages electronic building brick emissivity detection method according to claim 1, its feature existsIn, described temperature control casing has following architectural feature: upper inside is trial target placement space, inner lowerFor air regulating channel.
8. high-density packages electronic building brick emissivity detection method according to claim 1, its feature existsIn, described temperature control casing has following architectural feature: described infrared window is infrared glass detection window, instituteState on the chamber door that infrared glass detection window is positioned at described temperature control casing, detect for electronic building brick emissivity.
9. high-density packages electronic building brick emissivity detection method according to claim 8, its feature existsIn, the diameter of described infrared glass detection window is 10mm.
10. high-density packages electronic building brick emissivity detection method according to claim 1, its featureBe, the inwall of described temperature control casing be designed to 40 °～50 ° adjustable.
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