JP2006103177A - Vacuum laminating apparatus and vacuum laminating method - Google Patents

Vacuum laminating apparatus and vacuum laminating method Download PDF

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JP2006103177A
JP2006103177A JP2004293498A JP2004293498A JP2006103177A JP 2006103177 A JP2006103177 A JP 2006103177A JP 2004293498 A JP2004293498 A JP 2004293498A JP 2004293498 A JP2004293498 A JP 2004293498A JP 2006103177 A JP2006103177 A JP 2006103177A
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laminate
vacuum
board
film body
vacuum chamber
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Motonori Chikasawa
源憲 近沢
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Meiki Seisakusho KK
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Meiki Seisakusho KK
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<P>PROBLEM TO BE SOLVED: To laminate and form a variety of laminates fed from a preceding process by a pressurizing film body of a vacuum laminating apparatus without producing a defective product. <P>SOLUTION: An upper platen 12 and a lower platen 13 opposed to each other are, respectively, provided with pressurizing film bodies 18 and 29, and a vacuum chamber 14 is formed between the upper platen 12 and the lower platen 13. The pressurizing film body 18 is bulged to the lower platen 13, or the pressurizing film body 29 is bulged to the upper platen in accordance to a variety of laminates such as a laminate C or a laminate D to be pressurized, and thereby only one face of the upper face or the lower face of the laminate C or the laminate D is selectively pressurized. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、積層物を重ねた積層体を真空室内において加圧膜体を用いて加圧することにより積層成形する真空積層装置および真空積層方法に関するものである。   The present invention relates to a vacuum laminating apparatus and a vacuum laminating method for laminating and forming a laminated body in which laminates are stacked using a pressurized film body in a vacuum chamber.

従来、積層物を重ねた積層体を真空室内にて加圧膜体を用いて加圧して積層成形する真空積層装置および真空積層方法は公知である。特許文献1に示されるように、真空積層装置の加圧膜体は、上盤か下盤のいずれか一方の盤に取付けられ、他方の盤に向けて膨出させることにより積層体を加圧するものが最も一般的である。また特許文献2に示されるように、真空積層装置の上盤と下盤の両方に積層体を加圧する加圧膜体が設けられたものも公知である。特許文献2においては、積層体を下盤の加圧膜体により上盤に向けて加圧した後、上盤の加圧膜体により下盤に向けて加圧して積層体の両面を加圧することが記載されている。   Conventionally, a vacuum laminating apparatus and a vacuum laminating method are known in which a laminated body in which a laminate is stacked is pressurized using a pressure film body in a vacuum chamber and laminated. As shown in Patent Document 1, the pressurizing film body of the vacuum laminating apparatus is attached to one of the upper board and the lower board, and pressurizes the laminated body by bulging toward the other board. Things are the most common. Moreover, as shown in Patent Document 2, a device in which a pressure film body that pressurizes the stacked body is provided on both the upper and lower panels of the vacuum stacking apparatus is also known. In Patent Document 2, the laminated body is pressurized toward the upper board by the pressure film body of the lower board, and then is pressed toward the lower board by the pressure film body of the upper board to press both sides of the laminated body. It is described.

しかし前記特許文献1、特許文献2のものは、いずれも真空積層装置により、前工程から送られる種々の積層体に積層成形を行うことや、その際に加圧する面を考慮に入れることは想定されていない。前工程から送られる種々の積層体を一台の真空積層装置により積層成形を行うことは、製造ラインのコストダウンの点でメリットが大きいが次のような問題があった。すなわち前工程における積層物の重ね方によって、上面からのみの加圧が必要で下面から加圧すると不良品となる積層体と、反対に下面からのみの加圧が必要で上面から加圧すると不良品となる積層体の両方が、真空積層装置に送られてくる。しかし従来の真空積層装置ではそれに対応して積層成形することができなかった。その点について図5、図6により更に説明すると、図5の例のように、外形形状(或いは面積)が小さい積層物aが上側に、それより外形形状(或いは面積)が大きくかつガラス板等の脆性体からなる積層物bが下側に重ねられた状態の積層体cを真空積層装置で積層成形する場合、前記積層物bに近接する下盤の側から加圧膜体dによる加圧を行うと、前記積層物bの端部付近b1が割れたり変形するという問題があった。また図6の例のように、孔等の空隙がある積層物eが下側に、薄い樹脂板等の比較的強度の低い積層物fが上側に重ねられた積層体gを真空積層装置で積層成形する場合には、上盤の側から加圧膜体hによる加圧を行うと、上側の積層物fの一部f1が変形して窪んでしまうという問題があった。このような問題の対処方法として真空積層装置の前工程において積層体cまたは積層体gを上下反転させる装置を設けることも考えられるが、別途反転装置を設ける必要がありコストアップに繋がり、積層物同士のズレを防止する手段も考慮する必要があるので問題があった。   However, both of Patent Document 1 and Patent Document 2 are assumed to be subjected to lamination molding on various laminates sent from the previous process by a vacuum laminating apparatus and to take into account the surface to be pressurized at that time. It has not been. Performing lamination molding of various laminates sent from the previous process with a single vacuum lamination apparatus has great advantages in terms of cost reduction of the production line, but has the following problems. In other words, depending on how the laminates are stacked in the previous process, it is necessary to apply pressure only from the top surface, and when pressed from the bottom surface, it becomes a defective product. Both the non-defective laminates are sent to the vacuum laminator. However, the conventional vacuum laminating apparatus could not be laminated correspondingly. This point will be further described with reference to FIGS. 5 and 6. As in the example of FIG. 5, the laminate a having a small outer shape (or area) is on the upper side, the outer shape (or area) is larger, and a glass plate or the like. When a laminate c in a state where a laminate b made of a brittle body is stacked on the lower side is formed by a vacuum laminator, pressurization by a pressurized film body d from the side of the lower plate adjacent to the laminate b When performing, there existed a problem that the edge part vicinity b1 of the said laminated body b cracked or deform | transformed. Further, as in the example of FIG. 6, a laminate g in which a laminate e having a gap such as a hole is laminated on the lower side and a laminate f having a relatively low strength such as a thin resin plate is laminated on the upper side is obtained by a vacuum laminating apparatus. In the case of laminate molding, there has been a problem that when pressurization is performed from the upper board side by the pressurizing film body h, a part f1 of the upper laminate f is deformed and recessed. As a method for coping with such a problem, it is conceivable to provide a device that vertically inverts the laminated body c or the laminated body g in the pre-process of the vacuum laminating device. There is a problem because it is necessary to consider means for preventing the mutual displacement.

特開平8−132531号公報(請求項1、図1)Japanese Patent Laid-Open No. 8-132531 (Claim 1, FIG. 1) 特開平10−641号公報(0030、0031、図3、図4)Japanese Patent Laid-Open No. 10-641 (0030, 0031, FIG. 3, FIG. 4)

本発明では上記の問題を鑑みて、前工程から送られる種々の積層体に不良品を発生させることなく加圧膜体により加圧して積層成形することのできる真空積層装置および真空積層方法を提供することを目的とする。また種々の積層体を積層成形する際に、各積層体のための専用の真空積層装置や、積層体を反転させる装置等を必要とせず、コストダウンを図ることのできる真空積層装置および真空積層方法を提供することを目的とする。   In view of the above problems, the present invention provides a vacuum laminating apparatus and a vacuum laminating method that can be laminated and molded by pressing with a pressure film body without causing defective products in various laminated bodies sent from the previous step. The purpose is to do. In addition, when laminating various laminates, a vacuum laminator and a vacuum laminate that do not require a dedicated vacuum laminator for each laminate, a device that inverts the laminate, etc., and can reduce costs. It aims to provide a method.

本発明の請求項1に記載の真空積層装置は、相対向する上盤と下盤のそれぞれに加圧膜体が設けられ、上盤と下盤の間に真空室を形成して、一方の盤の加圧膜体を他方の盤に向けて膨出させることにより積層体を加圧する真空積層装置において、加圧される種々の積層体に対応して、上下いずれか一方の盤に設けられた加圧膜体を他方の盤に向けて膨出させて、積層体をいずれか一方の面からのみ選択的に加圧することを特徴とする。   In the vacuum laminating apparatus according to claim 1 of the present invention, a pressure film body is provided on each of the upper and lower boards facing each other, and a vacuum chamber is formed between the upper board and the lower board. In a vacuum laminating apparatus that pressurizes the laminated body by expanding the pressurized film body of the board toward the other board, it is provided on either the upper or lower board corresponding to the various laminated bodies to be pressurized. The pressed film body is swelled toward the other board, and the laminate is selectively pressurized only from one of the surfaces.

本発明の請求項2に記載の真空積層装置は、請求項1において、真空積層装置の積層体の搬入口および搬出口には真空室形成部材が配設され、真空室形成部材は積層体の加圧に用いられる加圧膜体と同じ盤の側に選択的に保持されることを特徴とする。   The vacuum laminating apparatus according to claim 2 of the present invention is the vacuum laminating apparatus according to claim 1, wherein a vacuum chamber forming member is disposed at a carry-in port and a carry-out port of the laminated body of the vacuum laminating device. It is characterized in that it is selectively held on the same board side as the pressurizing film used for pressurization.

本発明の請求項3に記載の真空積層方法は、相対向する上盤と下盤のそれぞれに加圧膜体が設けられ、上盤と下盤の間に真空室を形成して、一方の盤の加圧膜体を他方の盤に向けて膨出させることにより積層体を加圧する真空積層方法において、加圧される種々の積層体に対応して、上下いずれか一方の盤に設けられた加圧膜体を他方の盤に向けて膨出させて、積層体を一方の面からのみ選択的に加圧することを特徴とする。   In the vacuum lamination method according to claim 3 of the present invention, a pressure film body is provided on each of the opposing upper and lower boards, and a vacuum chamber is formed between the upper and lower boards, In the vacuum lamination method of pressurizing the laminated body by bulging the pressurized film body of the board toward the other board, it is provided on either the upper or lower board corresponding to the various laminated bodies to be pressurized. The pressed film body is expanded toward the other board, and the laminate is selectively pressurized only from one surface.

本発明の請求項4に記載の真空積層方法は、請求項3において、積層体は外形形状が小さい積層物とそれより外形形状が大きくかつガラス板等の脆性体からなる積層物とを重ねた積層体であり、外形形状が小さい積層物に近接する加圧膜体を他方の盤に向けて膨出させて、積層体を外形形状が小さい積層物の側からのみ加圧することを特徴とする。   The vacuum lamination method according to claim 4 of the present invention is the method according to claim 3, wherein the laminate is formed by stacking a laminate having a small outer shape and a laminate having a larger outer shape and made of a brittle body such as a glass plate. A pressurizing film body close to a laminate having a small outer shape is swelled toward the other board, and the laminate is pressurized only from the side of the laminate having a small outer shape. .

本発明の真空積層装置および真空積層方法は、相対向する上盤と下盤のそれぞれに加圧膜体が設けられ、上盤と下盤の間に真空室を形成して、一方の盤の加圧膜体を他方の盤に向けて膨出させることにより積層体を加圧する真空積層装置において、加圧される種々の積層体に対応して、上下いずれか一方の盤に設けられた加圧膜体を他方の盤に向けて膨出させて、積層体をいずれか一方の面からのみ選択的に加圧するようにしたので、前工程から送られる種々の積層体に不良品を発生させることなく積層成形することができる。   In the vacuum laminating apparatus and the vacuum laminating method of the present invention, a pressure film body is provided on each of the opposing upper and lower boards, a vacuum chamber is formed between the upper and lower boards, In a vacuum laminating apparatus that pressurizes the laminated body by causing the pressurized film body to bulge out toward the other board, it is applied to the upper and lower boards corresponding to the various laminated bodies to be pressurized. The pressure film body is swelled toward the other board so that the laminated body is selectively pressurized only from either side, so that defective products are generated in various laminated bodies sent from the previous process. And can be laminated without any problems.

本発明の実施形態について図1ないし図4を参照して説明する。図1は、本実施形態の真空積層装置において、外形形状が大きい積層物が下側に重ねられた積層体が真空積層装置に搬入された状態を示す断面図である。図2は、図1の状態で搬入された積層体が上盤に設けられた加圧膜体により下盤に向けて加圧されている状態を示す断面図である。図3は、本実施形態の真空積層装置において、外形形状が大きい積層物が上側に重ねられた積層体が真空積層装置に搬入された状態を示す断面図である。図4は、図3の状態で搬入された積層体が下盤に設けられた加圧膜体により上盤に向けて加圧されている状態を示す断面図である。なお図1ないし図4において、同一符号は同一部分かまたは相当部分を示す。   An embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a cross-sectional view illustrating a state in which a stacked body in which a stacked body having a large outer shape is stacked on the lower side is carried into the vacuum stacking apparatus in the vacuum stacking apparatus of the present embodiment. FIG. 2 is a cross-sectional view showing a state in which the laminated body carried in in the state of FIG. 1 is pressurized toward the lower board by the pressurizing film body provided on the upper board. FIG. 3 is a cross-sectional view showing a state in which a stacked body in which a stacked body having a large outer shape is stacked on the upper side is carried into the vacuum stacking apparatus in the vacuum stacking apparatus of the present embodiment. FIG. 4 is a cross-sectional view showing a state in which the stacked body loaded in the state of FIG. 3 is pressed toward the upper board by the pressurizing film body provided on the lower board. 1 to 4, the same reference numerals indicate the same or corresponding parts.

図1、図2により真空積層装置11の概略を説明すると、真空積層装置11には相対向して上盤12と下盤13が設けられ、下盤13が上盤12に向けて移動されることにより内部に平面視矩形の真空室14が形成されるようになっている。上盤12について説明すると、上盤12の下面の略中央には凹部15が形成されている。前記凹部15には、裏面にヒータ等の加熱手段を有し下面が平面からなるプレート板16と、該プレート板16の裏面に重ねて配設された断熱板17が取付けられている。そして上盤12の下面の略全面には、前記プレート板16等を前記真空室14から隔離するように加圧膜体18が取付けられている。加圧膜体18は伸縮性、可撓性、弾性、および耐熱性を有する素材(一例としてシリコンゴム)からなり、上盤12の周辺部下面12aに複数のボルト19により固定されている。また上盤12の周辺部下面12aにはOリング20が配設され、上盤12と加圧膜体18との間をシールしている。また上盤12の内部にはエア流路21が設けられており、前記エア流路21の一方は前記凹部15に開口され、他方には図示しないバキューム装置および圧縮空気供給装置に接続されている。   An outline of the vacuum laminating apparatus 11 will be described with reference to FIGS. 1 and 2. The vacuum laminating apparatus 11 is provided with an upper board 12 and a lower board 13 facing each other, and the lower board 13 is moved toward the upper board 12. As a result, a vacuum chamber 14 having a rectangular shape in plan view is formed inside. The upper board 12 will be described. A recess 15 is formed in the approximate center of the lower surface of the upper board 12. A plate plate 16 having a heating means such as a heater on the back surface and having a flat bottom surface and a heat insulating plate 17 disposed on the back surface of the plate plate 16 are attached to the recess 15. A pressure film 18 is attached to substantially the entire lower surface of the upper board 12 so as to isolate the plate plate 16 and the like from the vacuum chamber 14. The pressurizing film body 18 is made of a material having elasticity, flexibility, elasticity, and heat resistance (for example, silicon rubber), and is fixed to the lower surface 12 a of the peripheral portion of the upper panel 12 by a plurality of bolts 19. An O-ring 20 is disposed on the lower surface 12 a of the peripheral portion of the upper plate 12 to seal between the upper plate 12 and the pressurizing film body 18. Further, an air flow path 21 is provided inside the upper board 12, and one of the air flow paths 21 is opened in the recess 15, and the other is connected to a vacuum device and a compressed air supply device (not shown). .

また上盤12の一側と他側は真空室14内部で積層成形される積層体Cの搬入口22aと搬出口23aとなっている。そして上盤12の一側と他側の外部側面には、それぞれシリンダ24がロッド24aを下向けに固着され、前記ロッド24aにより、所定板厚の真空室形成部材25が保持可能となっている。更に詳しくは、真空室形成部材25の外寄り中央には前記ロッド24aの直径よりも孔径の大きい貫通孔25aが上下方向に貫通形成されている。そして前記貫通孔25aには前記ロッド24aが挿通可能に設けられ、ロッド24aの先端に着脱自在に設けられたダブルナット24bにより、ロッド24aから真空室形成部材25が脱落しないように保持可能となっている。そして前記シリンダ24のロッド24aを収縮することにより真空室形成部材25を、加圧膜体18を介して上盤12の周辺部下面12aに押付け可能になっている。また真空室形成部材25の内部にはエア流路25bが設けられ、エア流路25bの一方は、真空室14側に向けて開口されている。またエア流路25bの他方は、真空積層装置11の外部の図示しないバキューム装置に接続されるとともに外界に開放可能となっている。   Further, one side and the other side of the upper board 12 serve as a carry-in port 22a and a carry-out port 23a of the laminate C that is laminated and formed inside the vacuum chamber 14. A cylinder 24 is fixed to the outer side of one side and the other side of the upper plate 12 with the rod 24a facing downward, and the vacuum chamber forming member 25 having a predetermined plate thickness can be held by the rod 24a. . More specifically, a through hole 25a having a hole diameter larger than the diameter of the rod 24a is formed in the vertical direction in the center on the outer side of the vacuum chamber forming member 25. The rod 24a can be inserted into the through hole 25a, and the vacuum chamber forming member 25 can be held from the rod 24a by a double nut 24b detachably provided at the tip of the rod 24a. ing. By contracting the rod 24a of the cylinder 24, the vacuum chamber forming member 25 can be pressed against the peripheral lower surface 12a of the upper board 12 through the pressurizing film body 18. Further, an air flow path 25b is provided inside the vacuum chamber forming member 25, and one of the air flow paths 25b is opened toward the vacuum chamber 14 side. The other side of the air flow path 25b is connected to a vacuum device (not shown) outside the vacuum laminating device 11 and can be opened to the outside.

次に下盤13について説明すると、下盤13は上盤12とほぼ同じ構造をしている。下盤13の平面視略中央には凹部26が形成され、前記凹部26には裏面にヒータ等の加熱手段を有し上面が平面からなるプレート板27と、該プレート板27の裏面に断熱板28が配設されている。また下盤13の上面の略全面には、前記プレート板27等を覆うように加圧膜体29が取付けられている。加圧膜体29はシリコンゴムからなり、下盤13の周辺部上面13aに複数のボルト30により固定されている。また下盤13の周辺部上面13aにはOリング31が配設され、下盤13と加圧膜体29との間をシールしている。また下盤13の内部にはエア流路32が設けられており、前記エア流路32の一方は前記凹部26に開口され、他方には図示しないバキューム装置および圧縮空気供給装置に接続されている。   Next, the lower board 13 will be described. The lower board 13 has substantially the same structure as the upper board 12. A recess 26 is formed in the center of the lower plate 13 in a plan view. The recess 26 has a heating plate such as a heater on the back surface and a plate plate 27 having a flat top surface, and a heat insulating plate on the back surface of the plate plate 27. 28 is disposed. A pressure film body 29 is attached to substantially the entire upper surface of the lower board 13 so as to cover the plate plate 27 and the like. The pressurizing film body 29 is made of silicon rubber, and is fixed to the upper surface 13 a of the peripheral portion of the lower board 13 by a plurality of bolts 30. An O-ring 31 is disposed on the upper surface 13 a of the peripheral portion of the lower plate 13 to seal between the lower plate 13 and the pressurizing film body 29. In addition, an air flow path 32 is provided inside the lower board 13, and one of the air flow paths 32 is opened in the recess 26, and the other is connected to a vacuum device and a compressed air supply device (not shown). .

また下盤13の一側と他側についても積層体Cの搬入口22aと搬出口23aとなっている。そして下盤13の一側と他側の外部側面には、それぞれシリンダ33がロッド33aを上向けに固着されている。そして前記真空室形成部材25は、上盤12と同様の構造の下盤13に設けられたシリンダ33のロッド33aおよびナット33bによって下盤13の側にも保持されることが可能となっている。そして所定板厚(一例として20mm程度)の真空室形成部材25を上盤12と下盤13の間に1個のみ設けることにより、真空室形成部材25の内部に所定以上の径のエア流路25bを設けることができ、場合によってはOリング20,31やキャリアフィルムFを高温に晒さないための冷却媒体流路を形成することも可能である。それに対して特許文献2のように真空室形成部材を上盤と下盤に分割して取付けた場合、それぞれの真空室形成部材は、所定以上の径のエア流路を設けるための板厚の確保が困難になる。   Further, the one side and the other side of the lower board 13 are also a carry-in port 22a and a carry-out port 23a of the laminated body C. Cylinders 33 are fixed to the outer side of one side and the other side of the lower board 13 with the rod 33a facing upward. The vacuum chamber forming member 25 can be held also on the lower plate 13 side by the rod 33a and the nut 33b of the cylinder 33 provided on the lower plate 13 having the same structure as the upper plate 12. . Then, by providing only one vacuum chamber forming member 25 having a predetermined plate thickness (for example, about 20 mm) between the upper plate 12 and the lower plate 13, an air flow path having a predetermined diameter or more in the vacuum chamber forming member 25. 25b can be provided, and in some cases, it is possible to form a cooling medium flow path for preventing the O-rings 20, 31 and the carrier film F from being exposed to high temperatures. On the other hand, when the vacuum chamber forming member is divided and attached to the upper and lower panels as in Patent Document 2, each vacuum chamber forming member has a plate thickness for providing an air flow path having a predetermined diameter or more. It becomes difficult to secure.

なお真空積層装置の真空室形成部材は、本発明に必須のものではなく上盤と下盤とが直接当接されることにより真空室が形成されるものでもよい。また真空室形成部材を設ける場合、真空室形成部材は、真空室の周囲に形成される枠体、或いは搬入口と搬出口のみに設けられる部材のいずれでもよい。更に上盤と下盤は互いに固定的に設けられ、真空室形成部材が移動して真空室を形成するものでもよい。また真空積層装置の加熱手段は抵抗加熱板や熱媒体等の他の手段であってもよい。更に上盤および下盤に冷却媒体流路を配設し、上盤および下盤の昇熱を防止するとともに、プレート板を介して積層体を冷却したり、Oリングやキャリアフィルムが高温に晒されるのを防止するようにしてもよい。   The vacuum chamber forming member of the vacuum laminating apparatus is not essential for the present invention, and the vacuum chamber may be formed by directly contacting the upper board and the lower board. When the vacuum chamber forming member is provided, the vacuum chamber forming member may be either a frame formed around the vacuum chamber or a member provided only at the carry-in port and the carry-out port. Furthermore, the upper board and the lower board may be fixedly provided to each other, and the vacuum chamber forming member may be moved to form a vacuum chamber. Further, the heating means of the vacuum laminating apparatus may be other means such as a resistance heating plate or a heat medium. Furthermore, a cooling medium flow path is provided on the upper and lower boards to prevent the upper and lower boards from rising in temperature, the laminate is cooled via the plate plate, and the O-ring and carrier film are exposed to high temperatures. May be prevented.

次に本実施形態の真空積層装置11を用いた真空積層方法について説明する。本実施形態では外形形状が小さい積層物Aとして太陽電池セル、充填材、裏面板等と、それより外形形状が大きい積層物Bとしてガラス板とを重ねた太陽電池用の積層体Cまたは積層体Dの積層成形を行う場合について説明する。積層体としては、他に液晶パネル等のガラス板など、割れやすい脆性体を用いたものについて本発明の効果は大きい。しかし図6に示されるように積層物が樹脂板等であっても、比較的強度の低い積層物であり、変形防止のため加圧される側の面が一方の面に限定されるものや、加圧する方向により溶融樹脂の流動に影響を受けるものについてもその対象となる。   Next, a vacuum lamination method using the vacuum lamination apparatus 11 of this embodiment will be described. In this embodiment, a laminate C or a laminate for a solar cell in which a solar cell, a filler, a back plate and the like are stacked as a laminate A having a small outer shape and a glass plate is stacked as a laminate B having a larger outer shape. The case where the lamination molding of D is performed will be described. As the laminate, the effect of the present invention is great for those using brittle bodies that are easily broken such as glass plates such as liquid crystal panels. However, even if the laminate is a resin plate or the like as shown in FIG. 6, it is a laminate with relatively low strength, and the surface to be pressed to prevent deformation is limited to one surface. Those that are affected by the flow of the molten resin depending on the direction of pressurization are also subject to this.

図1、図2に示される例は、外形形状が小さい積層物Aが上側に、それより外形形状が大きい積層物Bが下側に重ねられた状態の積層体Cを、真空積層装置11により積層成形する例である。なおこの例では真空室形成部材25は、上盤12のシリンダ24により上盤12側に保持されており、前記積層体Cは、上盤12に保持された真空室形成部材25の下面と下盤13の周辺部上面13aに設けられた加圧膜体29の上面の間に形成された搬入口22aからキャリアフィルムFにより搬入されることになる。そして積層体Cが真空積層装置11の略中央に搬入されると、キャリアフィルムFの移動が停止される。   In the example shown in FIG. 1 and FIG. 2, a laminate C in a state in which a laminate A having a small outer shape is placed on the upper side and a laminate B having a larger outer shape is placed on the lower side is It is an example of laminate molding. In this example, the vacuum chamber forming member 25 is held on the upper plate 12 side by the cylinder 24 of the upper plate 12, and the laminated body C is disposed on the lower surface and the lower surface of the vacuum chamber forming member 25 held on the upper plate 12. It is carried in by the carrier film F from the carry-in port 22a formed between the upper surfaces of the pressurizing film bodies 29 provided on the peripheral upper surface 13a of the board 13. And if the laminated body C is carried in to the approximate center of the vacuum laminating apparatus 11, the movement of the carrier film F will be stopped.

次に下盤13を上昇させて、真空室形成部材25の下面と下盤13の周辺部上面13aに位置する加圧膜体29の上面を当接させ、上盤12と下盤13の間に真空室14を形成する。そして図示しないバキューム装置を作動させ、エア流路25bを介して、加圧膜体18、加圧膜体29、および真空室形成部材25に囲まれた空間に形成された真空室14内部の空気を吸引し、真空状態(厳密には減圧状態)とする。その際同時に、上盤12および下盤13のエア流路21,32を介しても空気を吸引しており、上盤12および下盤13の加圧膜体18,29は、プレート板16,27にそれぞれ密着したままの状態を保っている。またキャリアフィルムFは、所定板厚を有する真空室形成部材25の下面により押えられ挟持されているから、積層体Cは下盤13のプレート板27上の加圧膜体29に近接した状態を保っている。よって加圧膜体18による加圧時に積層体Cがプレート板27上の加圧膜体29に向けて押付けられてもキャリアフィルムFが無理に下向きに引っ張られることがない。   Next, the lower board 13 is raised so that the lower surface of the vacuum chamber forming member 25 and the upper surface of the pressure film body 29 located on the peripheral upper surface 13 a of the lower board 13 are brought into contact with each other. A vacuum chamber 14 is formed. Then, a vacuum device (not shown) is operated, and the air inside the vacuum chamber 14 formed in the space surrounded by the pressurized film body 18, the pressurized film body 29, and the vacuum chamber forming member 25 through the air flow path 25 b. To be in a vacuum state (strictly, a reduced pressure state). At the same time, air is sucked through the air passages 21 and 32 of the upper board 12 and the lower board 13, and the pressure film bodies 18 and 29 of the upper board 12 and the lower board 13 27 is kept in close contact with each other. Further, since the carrier film F is pressed and held by the lower surface of the vacuum chamber forming member 25 having a predetermined plate thickness, the laminated body C is in a state of being close to the pressure film body 29 on the plate plate 27 of the lower board 13. I keep it. Therefore, even when the laminated body C is pressed toward the pressure film body 29 on the plate plate 27 at the time of pressurization by the pressure film body 18, the carrier film F is not forcibly pulled downward.

真空室14内部が所定の真空状態となると、図2に示されるように、上盤12のエア流路21を大気または圧縮空気供給装置に連通するように切換え、上盤12のプレート板16と加圧膜体18の間に空気を供給する。そして外形形状の小さい積層物Aに近接する上盤12の加圧膜体18を他方の下盤13のプレート板27上の加圧膜体29に向けて膨出させ、積層体Cを上面から加圧する。この際下盤13のエア流路32はバキューム装置に連通され、加圧膜体29はプレート板27に密着した状態のままである。このようにして積層体Cを外形形状が小さい積層物Aに近接する加圧膜体18により加圧することにより、外形形状が大きい積層物Bはその下面全体が下盤13のプレート板27上の加圧膜体29に略均等に当接可能となり、端部付近が割れたりすることがない。   When the inside of the vacuum chamber 14 is in a predetermined vacuum state, as shown in FIG. 2, the air passage 21 of the upper panel 12 is switched to communicate with the atmosphere or compressed air supply device, and the plate plate 16 of the upper panel 12 Air is supplied between the pressurized film bodies 18. Then, the pressurizing film body 18 of the upper board 12 adjacent to the laminate A having a small outer shape is swelled toward the pressurizing film body 29 on the plate plate 27 of the other lower board 13, and the laminate C is lifted from the upper surface. Pressurize. At this time, the air flow path 32 of the lower board 13 is communicated with the vacuum device, and the pressure film body 29 remains in close contact with the plate plate 27. In this way, by pressing the laminate C with the pressurizing film body 18 adjacent to the laminate A having a small outer shape, the entire bottom surface of the laminate B having a large outer shape is on the plate plate 27 of the lower board 13. The pressure film body 29 can be contacted substantially evenly, and the vicinity of the end portion is not cracked.

そして所定時間加圧膜体18による積層体Cの加圧が行われると、上盤12のエア流路21をバキューム装置に連通するように切換えるとともに、真空室形成部材25のエア流路25bを大気に開放し、真空室14内部を大気圧に戻す。そのことにより加圧膜体18は積層体Cから離隔され、プレート板16に密着した状態となる。そして次に下盤13を下降させて真空室14を開き、キャリアフィルムFにより積層成形の完了した積層体Cを搬出口23aから真空積層装置11の外へ搬出するとともに、次の積層体Cを搬入口22aから真空積層装置11に搬入する。   When the laminate C is pressurized by the pressurizing film body 18 for a predetermined time, the air flow path 21 of the upper panel 12 is switched to communicate with the vacuum device, and the air flow path 25b of the vacuum chamber forming member 25 is changed. Open to the atmosphere and return the inside of the vacuum chamber 14 to atmospheric pressure. As a result, the pressurized film body 18 is separated from the laminated body C and is in close contact with the plate plate 16. Then, the lower board 13 is lowered to open the vacuum chamber 14, and the laminated body C, which has been laminated and formed by the carrier film F, is carried out of the vacuum laminating apparatus 11 from the carry-out port 23a, and the next laminated body C is removed. It is carried into the vacuum laminating apparatus 11 from the carry-in port 22a.

また図3、図4に示される例は、外形形状が大きい積層物Bが上側に、それより外形形状が小さい積層物Aが下側に重ねられた状態の積層体Dを、真空積層装置11により積層成形する例である。この例では、真空室形成部材25は、下盤13のシリンダ33により下盤13に保持され、前記積層体Dは、下盤13に保持された真空室形成部材25と上盤12の間の搬入口22bから真空積層装置11に搬入される。この例では図4に示されるように真空室14内部を真空状態にした後、下側の外形形状が小さい積層物Aに近接する下盤13の加圧膜体29を上盤12に向けて膨出させ、積層体Dを加圧するので、上側の外形形状の大きい積層物Bが割れることはない。またその際キャリアフィルムFは所定板厚を有する真空室形成部材25の上面により押えられ挟持されているから、加圧膜体29による加圧時にキャリアフィルムFが無理に上向きに引っ張られることがない。そして積層成形が完了すると真空室14が開かれ、真空室形成部材25が下盤13に保持された搬出口23bから積層体Dが搬出される。    In the example shown in FIGS. 3 and 4, the laminate D in a state where the laminate B having a large outer shape is stacked on the upper side and the laminate A having a smaller outer shape is stacked on the lower side is used. This is an example of laminate molding. In this example, the vacuum chamber forming member 25 is held on the lower plate 13 by the cylinder 33 of the lower plate 13, and the laminate D is placed between the vacuum chamber forming member 25 held on the lower plate 13 and the upper plate 12. It is carried into the vacuum laminating apparatus 11 from the carry-in port 22b. In this example, as shown in FIG. 4, the inside of the vacuum chamber 14 is evacuated, and then the pressure film body 29 of the lower board 13 close to the laminate A having a lower outer shape is directed toward the upper board 12. Since the laminate D is swelled and pressurized, the laminate B having a large upper outer shape is not broken. At that time, since the carrier film F is pressed and held by the upper surface of the vacuum chamber forming member 25 having a predetermined plate thickness, the carrier film F is not forcibly pulled upward when the pressure film 29 is pressed. . When the lamination molding is completed, the vacuum chamber 14 is opened, and the laminate D is carried out from the carry-out port 23b in which the vacuum chamber forming member 25 is held by the lower panel 13.

本発明では上記のように、いずれか一方の面からのみしか加圧できない前記積層体Cおよび前記積層体Dを、加圧に適した面からのみ選択的に加圧することにより、一台の真空積層装置11により種々の積層体に不良品を発生させることなく効率的に積層成形することができる。なお前記種々の積層体は、前工程から所定のロット毎に順不同に送られてくる際に、搬送経路に備えられたCCDカメラや光電管等の検出手段により検出される。そして前記検出手段から真空積層装置に対して直接に、或いはPLC等の制御装置を介して、積層体を上面のみから加圧するか或いは下面のみから加圧するかの信号が送信される。また予め入力された製造品番に対応してPLC等の制御装置から真空積層装置に信号が送られるようにしてもよい。   In the present invention, as described above, the laminate C and the laminate D that can be pressurized only from any one surface are selectively pressurized only from the surface suitable for pressurization, so that one vacuum is formed. The laminating apparatus 11 can efficiently laminate and mold various laminated bodies without causing defective products. The various laminates are detected by detection means such as a CCD camera or a phototube provided in the transport path when they are sent in random order from the previous process for each predetermined lot. Then, a signal is transmitted from the detection means to the vacuum laminating apparatus directly or via a control device such as a PLC to pressurize the laminated body only from the upper surface or only from the lower surface. Further, a signal may be sent from a control device such as a PLC to the vacuum laminating device in accordance with a product number inputted in advance.

また本発明については、一々列挙はしないが、上記した本実施形態のものに限定されず、当業者が本発明の趣旨を踏まえて変更を加えたものについても、適用されることは言うまでもないことである。例えば本発明では三種類以上の積層体を二台の真空積層装置のいずれかにより積層成形するようにしてもよく、システム全体で使用される真空積層装置の台数は必ずしも一台に限定されない。また真空積層装置により加圧された積層体は、そのまま、或いは更に別の積層物を更に重ねた上で、別の真空積層装置や平坦化プレス装置により再加圧するようにしてもよい。そしてその場合、先の真空積層装置により加圧された面と異なる面を加圧する場合も有り得る。   Further, the present invention is not enumerated one by one, but is not limited to the above-described embodiment, and it goes without saying that the present invention can be applied to those modified by a person skilled in the art based on the gist of the present invention. It is. For example, in the present invention, three or more types of laminates may be laminated and formed by one of two vacuum lamination apparatuses, and the number of vacuum lamination apparatuses used in the entire system is not necessarily limited to one. The laminate pressed by the vacuum laminating apparatus may be re-pressurized as it is, or after another laminate is further stacked, by another vacuum laminating apparatus or a flattening press apparatus. In that case, a surface different from the surface pressed by the previous vacuum laminating apparatus may be pressed.

本実施形態の真空積層装置において、外形形状が大きい積層物が下側に重ねられた積層体が真空積層装置に搬入された状態を示す断面図である。In the vacuum lamination apparatus of this embodiment, it is sectional drawing which shows the state in which the laminated body on which the laminated body with a large external shape was piled down was carried in to the vacuum lamination apparatus. 図1の状態で搬入された積層体が上盤に設けられた加圧膜体により下盤に向けて加圧されている状態を示す断面図である。It is sectional drawing which shows the state by which the laminated body carried in in the state of FIG. 1 is pressurized toward the lower board by the pressurization film body provided in the upper board. 本実施形態の真空積層装置において、外形形状が大きい積層物が上側に重ねられた積層体が真空積層装置に搬入された状態を示す断面図である。In the vacuum lamination apparatus of this embodiment, it is sectional drawing which shows the state in which the laminated body on which the laminated body with a large external shape was piled up was carried in to the vacuum lamination apparatus. 図3の状態で搬入された積層体が下盤に設けられた加圧膜体により上盤に向けて加圧されている状態を示す断面図である。It is sectional drawing which shows the state by which the laminated body carried in in the state of FIG. 3 is pressurized toward the upper board | substrate by the pressurization film body provided in the lower board | substrate. 真空積層装置において加圧膜体により積層体が不適切な面から加圧され不良品が発生した状態を示す拡大断面図である。It is an expanded sectional view showing the state where a layered product was pressed from an improper surface by a pressure film in a vacuum laminating device, and a defective product was generated. 真空積層装置において加圧膜体により積層体が不適切な面から加圧され不良品が発生した状態を示す拡大断面図である。It is an expanded sectional view showing the state where a layered product was pressed from an improper surface by a pressure film in a vacuum laminating device, and a defective product was generated.

符号の説明Explanation of symbols

11 真空積層装置
12 上盤
12a 周辺部下面
13 下盤
13a 周辺部上面
14 真空室
15,26 凹部
16,27 プレート板
17,28 断熱板
18,29 加圧膜体
19,30 ボルト
20,31 Oリング
21,25b,32 エア流路
22a,22b 搬入口
23a,23b 搬出口
24,33 シリンダ
24a,33a ロッド
24b,33b ナット
25 真空室形成部材
25a 貫通孔
A 外形形状の小さい積層物
B 外形形状の大きい積層物
C,D 積層体
F キャリアフィルム
DESCRIPTION OF SYMBOLS 11 Vacuum laminating apparatus 12 Upper board 12a Peripheral part lower surface 13 Lower board 13a Peripheral part upper surface 14 Vacuum chamber 15,26 Recessed part 16,27 Plate board 17,28 Thermal insulation board 18,29 Pressurized film body 19,30 Bolt 20,31 O Ring 21, 25b, 32 Air flow path 22a, 22b Carry-in port 23a, 23b Carry-out port 24, 33 Cylinder 24a, 33a Rod 24b, 33b Nut 25 Vacuum chamber forming member 25a Through hole A Laminate with small outer shape B Shape of outer shape Large laminate C, D Laminate F Carrier film

Claims (4)

相対向する上盤と下盤のそれぞれに加圧膜体が設けられ、前記上盤と下盤の間に真空室を形成して、一方の盤の加圧膜体を他方の盤に向けて膨出させることにより積層体を加圧する真空積層装置において、
加圧される種々の積層体に対応して、上下いずれか一方の盤に設けられた加圧膜体を他方の盤に向けて膨出させて、積層体をいずれか一方の面からのみ選択的に加圧することを特徴とする真空積層装置。
A pressure film body is provided on each of the upper and lower boards facing each other, a vacuum chamber is formed between the upper board and the lower board, and the pressure film body of one board faces the other board. In a vacuum laminating apparatus that pressurizes the laminate by swelling,
Corresponding to various laminates to be pressurized, pressurized film body provided on either one of the upper and lower panels is swelled toward the other panel, and the laminate is selected only from one side A vacuum laminator characterized by pressurizing.
前記真空積層装置の積層体の搬入口および搬出口には真空室形成部材が配設され、
前記真空室形成部材は積層体の加圧に用いられる加圧膜体と同じ盤の側に選択的に保持されることを特徴とする請求項1に記載の真空積層装置。
Vacuum chamber forming members are disposed at the inlet and outlet of the laminate of the vacuum laminator,
The vacuum laminating apparatus according to claim 1, wherein the vacuum chamber forming member is selectively held on the same side as a pressurizing film body used for pressurizing the laminated body.
相対向する上盤と下盤のそれぞれに加圧膜体が設けられ、前記上盤と下盤の間に真空室を形成して、一方の盤の加圧膜体を他方の盤に向けて膨出させることにより積層体を加圧する真空積層方法において、
加圧される種々の積層体に対応して、上下いずれか一方の盤に設けられた加圧膜体を他方の盤に向けて膨出させて、積層体を一方の面からのみ選択的に加圧することを特徴とする真空積層方法。
A pressure film body is provided on each of the upper and lower boards facing each other, a vacuum chamber is formed between the upper board and the lower board, and the pressure film body of one board faces the other board. In the vacuum lamination method of pressurizing the laminate by bulging,
Corresponding to the various laminates to be pressed, the pressurized film body provided on one of the upper and lower panels is swelled toward the other panel, and the laminate is selectively only from one side. A vacuum lamination method characterized by applying pressure.
前記積層体は外形形状が小さい積層物とそれより外形形状が大きくかつガラス板等の脆性体からなる積層物とを重ねた積層体であり、前記外形形状が小さい積層物に近接する加圧膜体を他方の盤に向けて膨出させて、前記積層体を外形形状が小さい積層物の側からのみ加圧することを特徴とする請求項3に記載の真空積層方法。   The laminate is a laminate in which a laminate having a small outer shape and a laminate having a larger outer shape and made of a brittle body such as a glass plate are stacked, and a pressure film adjacent to the laminate having a small outer shape The vacuum laminating method according to claim 3, wherein the body is bulged toward the other board, and the laminate is pressurized only from the side of the laminate having a small outer shape.
JP2004293498A 2004-10-06 2004-10-06 Vacuum laminating apparatus and vacuum laminating method Pending JP2006103177A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109904267A (en) * 2019-04-12 2019-06-18 徐圣最 A kind of laminar structure of vacuum laminator
JP2021088072A (en) * 2019-12-03 2021-06-10 株式会社日本製鋼所 Vacuum lamination system, method for detecting molding defect of vacuum lamination system, and method for correcting molding condition of vacuum lamination system

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109904267A (en) * 2019-04-12 2019-06-18 徐圣最 A kind of laminar structure of vacuum laminator
JP2021088072A (en) * 2019-12-03 2021-06-10 株式会社日本製鋼所 Vacuum lamination system, method for detecting molding defect of vacuum lamination system, and method for correcting molding condition of vacuum lamination system
JP7071956B2 (en) 2019-12-03 2022-05-19 株式会社日本製鋼所 Vacuum stacking system, vacuum stacking system molding defect detection method, and vacuum stacking system molding condition correction method

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