JP2006100686A - Stage apparatus and exposure device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To move a stage without degrading a throughput. <P>SOLUTION: This stage apparatus is provided with a moving stage 53 moving along a moving surface Ba, and a first moving table 52 which holds a test piece P and which can be moved to the moving stage 53. The apparatus is provided with a second moving table 70 which is provided on the moving stage, and which is positioned at a first position K1 when the first moving table 52 is moved from the first position K1 to a second position K2. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a stage apparatus and an exposure apparatus. For example, the present invention relates to a stage apparatus and an exposure apparatus suitable for use in so-called immersion exposure in which a liquid is supplied onto a substrate for exposure.

Semiconductor devices and liquid crystal display devices are manufactured by a so-called photolithography technique in which a pattern formed on a mask is transferred onto a photosensitive substrate.
An exposure apparatus used in this photolithography process has a mask stage for supporting a mask and a substrate stage for supporting a substrate, and a mask pattern is transferred via a projection optical system while sequentially moving the mask stage and the substrate stage. It is transferred to the substrate. In recent years, in order to cope with higher integration of device patterns, higher resolution of the projection optical system is desired. The resolution of the projection optical system becomes higher as the exposure wavelength used is shorter and the numerical aperture of the projection optical system is larger. Therefore, the exposure wavelength used in the exposure apparatus is shortened year by year, and the numerical aperture of the projection optical system is also increasing. The mainstream exposure wavelength is 248 nm of the KrF excimer laser, but the 193 nm of the shorter wavelength ArF excimer laser is also being put into practical use. Also, when performing exposure, the depth of focus (DOF) is important as well as the resolution. The resolution R and the depth of focus δ are each expressed by the following equations.
R = k1 · λ / NA (1)
δ = ± k2 · λ / NA ² (2)
Here, λ is the exposure wavelength, NA is the numerical aperture of the projection optical system, and k1 and k2 are process coefficients. From the equations (1) and (2), it can be seen that the depth of focus δ becomes narrower when the exposure wavelength λ is shortened and the numerical aperture NA is increased in order to increase the resolution R.

At this time, if the depth of focus δ becomes too narrow, it becomes difficult to match the substrate surface with the image plane of the projection optical system, and there is a possibility that the margin during the exposure operation will be insufficient.
Therefore, as a method for substantially shortening the exposure wavelength and increasing the depth of focus, for example, a liquid immersion method disclosed in Patent Document 1 below has been proposed. In this immersion method, a space between the lower surface of the projection optical system and the substrate surface is filled with a liquid such as water or an organic solvent to form an immersion region, and the wavelength of exposure light in the liquid is 1 / n of that in air. (Where n is the refractive index of the liquid, which is usually about 1.2 to 1.6), the resolution is improved, and the depth of focus is expanded about n times.
International Publication No. 99/49504 Pamphlet

However, the following problems exist in the conventional technology as described above.
For example, when exchanging a substrate after the exposure processing, it is necessary to move the substrate stage to a substrate exchanging position (loading position). At this time, since the substrate stage deviates from a position facing the projection optical system, the supply of the liquid must be stopped and the supplied liquid must be recovered in order to avoid the liquid from leaking. Further, after the substrate is exchanged, it is necessary to again fill the liquid between the projection optical system and the substrate stage, so that there is a problem that time loss is large and throughput is lowered.
In addition, since drying is performed by collecting the liquid, there are problems that a watermark is generated in the projection optical system, and that a temperature change occurs in the projection lens, the liquid supply nozzle, and the like due to vaporization heat.

Therefore, when the substrate stage is moved to the loading position, the substrate stage (or the immersion region forming member provided on the substrate stage) is provided so that the immersion region is continuously formed with the projection optical system. Although it is conceivable to increase the size, in this case, there arises a problem that the weight of the substrate stage is increased and the throughput is lowered. Further, since it becomes necessary to increase the distance between the interferometer and the movable mirror provided for obtaining the position information of the substrate, there arises a problem that the apparatus is enlarged and the measurement accuracy is lowered.
This problem is not limited to the case where the substrate stage moves to the loading position. As shown in Japanese Patent Application Laid-Open No. 10-214783, this problem also occurs when the stage is replaced in a twin stage type stage apparatus in which a plurality of substrate stages are replaceably provided. It occurs in the same way.

  The present invention has been made in consideration of the above points, and an object of the present invention is to provide a stage apparatus and an exposure apparatus that can move the stage without reducing the throughput.

In order to achieve the above object, the present invention adopts the following configuration corresponding to FIGS. 1 to 15 showing the embodiment.
The stage apparatus of the present invention includes a moving stage (53) that moves along the moving surface (Ba), and a first moving table (52) that holds the sample (P) and is movable with respect to the moving stage (53). ), Provided on the moving stage (53), when the first moving table (52) is moved from the first position (K1) to the second position (K2). The second moving table (70) positioned at the first position (K1) is provided.

  Therefore, in the stage apparatus of the present invention, after performing a desired process (for example, a liquid supply process) using the first moving table (52) at the first position (K1), the moving stage (53) is moved. Even when the first moving table (52) is moved to the second position with respect to the moving stage (53), the second moving table (70) positioned at the first position (K1) is used to obtain a desired value. The process can be continued. Therefore, in the present invention, it is not necessary to stop a desired process, for example, a liquid supply process even when the first moving table (52) is moved to the second position, and it becomes possible to prevent a decrease in throughput.

  Further, the stage apparatus of the present invention moves the first moving table (52A, 52B) and the first moving table (52A, 52B) that hold the sample (P) and can move along the moving surface (Ba). The first moving table (52A, 52B) and the first moving table (52A, 52B) with a moving stroke larger than the moving stroke by the first moving device (100A, 100B) of the first moving table (52A, 52B). A stage device (ST) having a second moving device (63A, 63B or 62A, 62B) to be moved, provided in the second moving device (63A or 62A), and a first moving table (52A, 52B). ) Includes a second movement table (70) that moves to the first position (K1) when moving from the first position (K1) to the second position (K3). It is intended.

  Therefore, in the stage apparatus of the present invention, after performing a desired process (for example, a liquid supply process) using the first movement table (52A, 52B) at the first position (K1), the first movement apparatus (100A, 100B) or the second moving device (63A, 63B or 62A, 62B), even if the first moving table (52A, 52B) is moved to the second position, the second position positioned at the first position (K1). A desired process can be continuously performed using the moving table (70). Therefore, in the present invention, it is not necessary to stop a desired process, for example, a liquid supply process even when the first movement table (52A, 52B) is moved to the second position, and it is possible to prevent a decrease in throughput. Become.

  The exposure apparatus according to the present invention includes the above stage in an exposure apparatus (EX) that exposes a pattern to a substrate (P), which is a sample placed on a stage apparatus (ST), via a projection optical system (PL). An apparatus is used.

  Therefore, in the exposure apparatus of the present invention, the pattern is exposed while performing a desired process (for example, a liquid supply process) on the substrate (P) held on the first moving table (52) at the first position (K1). Later, even when the first movement table (52) moves to the second position (K2), the desired process is continuously performed using the second movement table (70) positioned at the first position (K1). it can. Therefore, in the present invention, it is not necessary to stop a desired process, for example, a liquid supply process even when the first moving table (52) is moved to the second position, and it becomes possible to prevent a decrease in throughput.

  In order to explain the present invention in an easy-to-understand manner, the description has been made in association with the reference numerals of the drawings showing one embodiment, but it goes without saying that the present invention is not limited to the embodiment.

  In the present invention, even when the first moving table is moved to the second position, it is not necessary to stop a desired process by using the second moving table, and it is possible to prevent a decrease in throughput.

Embodiments of the stage apparatus and exposure apparatus of the present invention will be described below with reference to FIGS.
In the present embodiment, as the exposure apparatus EX, scanning exposure is performed in which the pattern formed on the mask M is exposed to the substrate P while the mask M and the substrate (sample) P are synchronously moved in different directions (reverse directions) in the scanning direction. A case where an apparatus (so-called scanning stepper) is used will be described as an example. In the following description, the direction that coincides with the optical axis AX of the projection optical system PL is the Z-axis direction, the synchronous movement direction (scanning direction) between the mask M and the substrate P in the plane perpendicular to the Z-axis direction is the X-axis direction, A direction (non-scanning direction) perpendicular to the Z-axis direction and the X-axis direction is defined as a Y-axis direction. Further, the rotation (inclination) directions around the X axis, Y axis, and Z axis are the θX, θY, and θZ directions, respectively. Here, the “substrate” includes a semiconductor wafer coated with a photoresist, which is a photosensitive material, and the “mask” includes a reticle on which a device pattern to be reduced and projected on the substrate is formed.
In this exposure apparatus EX, the stage apparatus of the present invention is described as being applied to a substrate stage.

(First embodiment)
In FIG. 1, the exposure apparatus EX of the present embodiment uses a mask stage MST that supports a mask M, an illumination optical system IL that illuminates the mask M supported by the mask stage MST with exposure light EL, and exposure light EL. A projection optical system PL for projecting and exposing the pattern image of the illuminated mask M onto the substrate P supported by the substrate stage PST as a stage device, and the overall operation of the exposure device EX is controlled by the control device CONT. Is done.

  The exposure apparatus EX of the present embodiment is an immersion exposure apparatus to which an immersion method is applied in order to substantially shorten an exposure wavelength to improve resolution and substantially widen a focal depth. A liquid supply mechanism (liquid supply device) 10 for supplying the liquid 1 to the substrate P and a liquid recovery mechanism 20 for recovering the liquid 1 on the substrate P are provided. While transferring at least the pattern image of the mask M onto the substrate P, the exposure apparatus EX uses a liquid 1 supplied from the liquid supply mechanism 10 to a part on the substrate P including the projection area AR1 of the projection optical system PL ( Locally, the immersion area (first position) AR2 is formed. Specifically, the exposure apparatus EX employs a local immersion method in which the liquid 1 is filled between the optical element 2 at the image plane side end portion of the projection optical system PL and the surface of the substrate P disposed on the image plane side. The pattern of the mask M is projected onto the substrate P by irradiating the substrate P with the exposure light EL that has passed through the mask M via the liquid 1 between the projection optical system PL and the substrate P and the projection optical system PL. Exposure.

  The illumination optical system IL illuminates the mask M supported by the mask stage MST with the exposure light EL, and the exposure light source, and an optical integrator and an optical integrator for uniformizing the illuminance of the light beam emitted from the exposure light source A condenser lens that collects the exposure light EL from the light source, a relay lens system, and a variable field stop that sets the illumination area on the mask M by the exposure light EL in a slit shape. A predetermined illumination area on the mask M is illuminated by the exposure light EL having a uniform illuminance distribution by the illumination optical system IL. As the exposure light EL emitted from the illumination optical system IL, for example, far ultraviolet light (g-line, h-line, i-line) and KrF excimer laser light (wavelength 248 nm) emitted from a mercury lamp, DUV light), vacuum ultraviolet light (VUV light) such as ArF excimer laser light (wavelength 193 nm) and F2 laser light (wavelength 157 nm), or the like is used. In this embodiment, ArF excimer laser light is used.

  The mask stage MST supports the mask M, and can move two-dimensionally in a plane perpendicular to the optical axis AX of the projection optical system PL, that is, in the XY plane, and can be slightly rotated in the θZ direction. Mask stage MST is driven by a mask stage driving device such as a linear motor. The mask stage driving device is controlled by the control device CONT. A movable mirror 50 is provided on the mask stage MST. Further, an XY interferometer 51 including a laser interferometer is provided at a position facing the movable mirror 50. The two-dimensional position and rotation angle of the mask M on the mask stage MST are measured in real time by the XY interferometer 51, and the measurement result is output to the control unit CONT. The controller CONT positions the mask M supported by the mask stage MST by driving the mask stage driving device based on the measurement result of the XY interferometer 51.

  The projection optical system PL projects and exposes the pattern of the mask M onto the substrate P at a predetermined projection magnification β, and is an optical element provided at the terminal portion on the substrate P side (image plane side of the projection optical system PL). (Lens) 2 includes a plurality of optical elements, and these optical elements are supported by a lens barrel PK. In the present embodiment, the projection optical system PL is a reduced inverted system whose projection magnification β is, for example, 1/4 or 1/5. The projection optical system PL may be either an equal magnification system or an enlargement system, and may be an inverted system or an erect system. When the projection optical system PL is an erect system, the mask M and the substrate P scan in the same direction. Further, the optical element (lens) 2 at the tip of the projection optical system PL of the present embodiment is provided so as to be detachable (replaceable) with respect to the lens barrel PK, and the liquid 1 in the liquid immersion area AR2 is provided in the optical element 2. Touch.

  In the present embodiment, pure water is used as the liquid 1. Pure water is not only ArF excimer laser light, but also far ultraviolet light (DUV light) such as ultraviolet emission lines (g-line, h-line, i-line) emitted from mercury lamps and KrF excimer laser light (wavelength 248 nm). Can also be transmitted. In this embodiment, the numerical aperture of the projection optical system to which pure water for immersion exposure is applied is set to 1 or more (about 1.0 to 1.2).

The optical element 2 is made of meteorite. Since the surface of the meteorite or the surface to which MgF ₂ , Al ₂ O ₃ , SiO ₂ or the like is attached has high affinity with water, the liquid 1 can be brought into close contact with almost the entire liquid contact surface 2 a of the optical element 2. it can. That is, in this embodiment, since the liquid (water) 1 having high affinity with the liquid contact surface 2a of the optical element 2 is supplied, the adhesion between the liquid contact surface 2a of the optical element 2 and the liquid 1 is set. The optical path between the optical element 2 and the substrate P can be reliably filled with the liquid 1. The optical element 2 may be quartz having a high affinity with water. Alternatively, the liquid contact surface 2a of the optical element 2 may be subjected to a hydrophilic (lyophilic) treatment to further increase the affinity with the liquid 1.

Hereinafter, the substrate stage PST that can move while holding the substrate P will be described.
The substrate stage PST moves in the XY directions along the moving surface Ba on the base (surface platen) BP while supporting the substrate table 52 and supporting the substrate table 52 (first moving table) 52 holding the substrate P. An XY stage (moving stage) 53 is provided.

  The substrate stage PST is driven by a substrate stage driving device such as a linear motor. The substrate stage driving device is controlled by the control device CONT. The substrate table 52 is provided on the XY stage 53 via a plurality of (here, three) actuators 30 (30A to 30C) configured by, for example, piezoelectric elements and voice coil motors (VCM). The actuators 30A to 30C move the substrate table 52 with respect to the XY stage 53 slightly in the Z-axis direction as a whole based on a drive signal from the control device CONT, and are minutely moved in the θX direction and the θY direction. By tilting, the position in the Z-axis direction (focus position) of the substrate P held by the substrate table 52 and the position in the θX and θY directions are controlled.

  That is, the substrate table 52 controls the focus position and the tilt angle of the substrate P to align the surface of the substrate P with the image plane of the projection optical system PL by the autofocus method and the autoleveling method. Is positioned in the XY plane (X, Y, θZ directions). Needless to say, the substrate table 52 and the XY stage 53 may be provided integrally.

  In addition, a plurality of pin members (not shown) are provided on the upper surface (support surface) of the substrate table 52, and vacuum suction holes connected to a vacuum system are provided between the plurality of pin members. That is, the substrate table has a so-called pin chuck mechanism, and holds the back surface of the substrate P by vacuum suction with the pin member supported by the pin member.

Further, the substrate table 52 is provided with lift pins 72 that hold the substrate by suction and move up and down (lift) in the Z-axis direction. As shown in FIG. 2, the lift pins 72 are configured to suck and hold the substrate P at a plurality of locations (here, 3 locations).
Then, the suction holding of the substrate P to the substrate table 52 is released, and the lift of the lift pins 72 is performed by holding the substrate P by suction, whereby the substrate P is detached from the substrate table 52 and delivered to the wafer loader 73. It is possible.
Actually, the substrate table 52 is provided with a substrate holder, and the substrate P is sucked and held by the substrate holder. Here, the substrate table 52 will be described as including the substrate holder.

  An XY movable mirror 55 is provided on a side surface (side surface on the −X side in FIG. 1) of the substrate stage PST (substrate table 52). Further, an XY interferometer (position detection device) 56 including a laser interferometer that irradiates the measurement beam (beam) B toward the XY movable mirror 55 is provided at a position facing the XY movable mirror 55. The position information of the substrate stage PST (and thus the substrate table 52 and the substrate P) in the two-dimensional direction and the rotation angle (position information regarding the X, Y, and θZ directions) are obtained by reflecting the reflected light of the measurement beam B from the XY moving mirror 55. It is measured in real time by the XY interferometer 56, and the measurement result is output to the control device CONT. The control device CONT drives the substrate stage driving device based on the measurement result of the XY interferometer 56, thereby positioning the substrate stage PST holding the substrate P.

  A plate member 60 is provided on the substrate stage PST (substrate table 52) so as to surround the substrate P held by the substrate stage PST. The plate member 60 is formed outside the substrate P so as to extend from the substrate table 52. The plate member 60 has a flat surface (flat portion) 60A having substantially the same height (level) as the surface of the substrate P held by the substrate stage PST.

The plate member 60 is formed of a material having liquid repellency such as polytetrafluoroethylene (Teflon (registered trademark)). Therefore, the flat surface 60A has liquid repellency.
Note that the flat surface 60A may be made liquid repellent by, for example, forming the plate member 60 from a predetermined metal and applying a liquid repellent treatment to at least the flat surface 60A of the metal plate member 60. As the liquid repellent treatment of the plate member 60 (flat surface 60A), for example, a liquid repellent material such as a fluororesin material such as polytetrafluoroethylene or an acrylic resin material is applied, or the liquid repellent material is used. Apply a thin film. As the liquid repellent material for making it liquid repellent, a material insoluble in the liquid 1 is used. In addition, the application region of the liquid repellent material may be applied to the entire surface of the plate member 60, or may be applied only to a part of the region requiring liquid repellency such as the flat surface 60A. It may be.

  Since the plate member 60 having the flat surface 60A substantially flush with the surface of the substrate P is provided around the substrate P, even when the edge region E of the substrate P is subjected to immersion exposure, the liquid is placed under the projection optical system PL. 1 is maintained, and the liquid immersion area AR2 can be satisfactorily formed on the image plane side of the projection optical system PL. Further, by making the flat surface 60A liquid repellent, the outflow of the liquid 1 to the outside of the substrate P (outside the flat surface 60A) during the immersion exposure is suppressed, and the liquid 1 is smoothly recovered even after the immersion exposure. This prevents the liquid 1 from remaining on the flat surface 60A or the like.

  In the present embodiment, the substrate table 52 (plate member 60) is opposed to the position facing the optical element 2 of the projection optical system PL, more specifically, the position deviated from the first position facing the liquid immersion area AR2 (for example, A movement table (second movement table) 70 is provided that moves in the Z direction so as to be positioned at a position facing the liquid immersion area AR2 when the substrate P is moved to the exchange position (second position). . The moving table 70 is made of the same liquid-repellent material as the plate member 60 and is movable in the Z-axis direction by driving the lifting device 71. The thickness of the moving table 70 is such that the irradiation of the measurement beam B onto the substrate table 52 is maintained even when the measurement beam B of the XY interferometer 56 is traversed during elevation and the position measurement can be continued (for example, the measurement beam). When the beam diameter of B is about 8 mm, the thickness of the moving table 70 is set to about 2 mm).

  The elevating device 71 includes an actuator including an air cylinder, a motor, and a cam. A cylinder 71a connected to the moving table 70 extends in the Z direction under the control of the control device CONT, so that the moving table 70 has a surface thereof. (Liquid repellent part) 70A is substantially flush with the flat surface 60A of the plate member 60 and is aligned with the plate member 60 with a small gap, and a retreat position below the measurement beam B (position shown in FIG. 1). It is configured to move up and down. The minute gap is set to about several μm to several mm, for example, and the liquid 1 is suppressed from leaking through the minute gap due to the surface tension of the liquid 1.

  Returning to FIG. 1, the liquid supply mechanism 10 supplies the liquid 1 onto the substrate P, and includes a liquid supply device 11 including a tank that stores the liquid 1 and a pressure pump, and the liquid supply device 11. And a supply pipe 13 having the other end connected to the supply nozzle 14. The supply nozzle 14 is disposed close to the substrate P and supplies the liquid 1 from above the substrate P. The liquid 1 delivered from the liquid supply device 11 and supplied onto the substrate P via the supply pipe 13 and the supply nozzle 14 fills the space between the optical element 2 at the tip of the projection optical system PL and the substrate P. Thus, the liquid immersion area AR2 is formed.

  The liquid recovery mechanism 20 recovers the liquid 1 on the substrate P. The liquid recovery mechanism 20 includes a vacuum system such as a vacuum pump, a gas-liquid separator, a tank that stores the recovered liquid 1, and the like. The liquid recovery device 21 includes a recovery pipe 23 having one end connected to the liquid recovery device 21 and the other end connected to a recovery nozzle 24. The recovery nozzle 24 is disposed in the vicinity of the substrate P and can recover the liquid 1 on the substrate P. By driving the vacuum system of the liquid recovery device 21, the liquid 1 on the substrate P is sucked and recovered by the liquid recovery device 21 via the recovery nozzle 24 and the recovery tube 23.

  When forming the liquid 1 immersion area AR2 on the substrate P, the control device CONT drives the liquid supply device 11 of the liquid supply mechanism 10 to the substrate P via the supply pipe 13 and the supply nozzle 14. While supplying a predetermined amount of liquid 1 per unit time, the liquid recovery device 21 of the liquid recovery mechanism 20 is driven, and a predetermined amount of liquid 1 per unit time is recovered from the substrate P via the recovery nozzle 24 and the recovery pipe 23. To do. Thereby, the liquid 1 is arrange | positioned in the space between the optical element 2 and the board | substrate P of the front-end | tip part of the projection optical system PL, and immersion area AR2 is formed.

  FIG. 3 is a plan view showing the positional relationship between the liquid supply mechanism 10, the liquid recovery mechanism 20, and the projection area AR1 of the projection optical system PL. In FIG. 3, the projection area AR1 of the projection optical system PL has a rectangular shape elongated in the Y-axis direction, and three supply nozzles 14A to 14C are provided on the + X direction side so as to sandwich the projection area AR1 in the X-axis direction. Two collection nozzles 24A and 24B are arranged on the −X direction side. The supply nozzles 14 </ b> A to 14 </ b> C are connected to the liquid supply apparatus 11 via the supply pipe 13, and the recovery nozzles 24 </ b> A and 24 </ b> B are connected to the liquid recovery apparatus 21 via the recovery pipe 23. Further, the supply nozzles 16A to 16C and the recovery nozzles 26A and 26B are arranged in a positional relationship in which the supply nozzles 14A to 14C and the recovery nozzles 24A and 24B are rotated by approximately 180 ° with respect to the center of the projection area AR1. . The supply nozzles 14A to 14C and the recovery nozzles 26A and 26B are alternately arranged in the Y axis direction, the supply nozzles 16A to 16C and the recovery nozzles 24A and 24B are alternately arranged in the Y axis direction, and the supply nozzles 16A to 16C are The recovery nozzles 26 </ b> A and 26 </ b> B are connected to the liquid recovery apparatus 21 via a recovery pipe 27.

  When scanning exposure is performed by moving the substrate P in the scanning direction (−X direction) indicated by the arrow Xa, the supply pipe 13, the supply nozzles 14A to 14C, the recovery pipe 23, and the recovery nozzles 24A and 24B are used. Thus, the liquid supply device 11 and the liquid recovery device 21 supply and recover the liquid 1. That is, when the substrate P moves in the −X direction, the liquid 1 is supplied between the projection optical system PL and the substrate P from the liquid supply device 11 via the supply pipe 13 and the supply nozzles 14 (14A to 14C). At the same time, the liquid 1 is recovered by the liquid recovery device 21 via the recovery nozzle 24 (24A, 24B) and the recovery tube 23, and the space between the optical element 2 on the image plane side of the projection optical system PL and the substrate P. The liquid 1 flows in the −X direction so as to fill.

  On the other hand, when scanning exposure is performed by moving the substrate P in the scanning direction (+ X direction) indicated by the arrow Xb, the supply pipe 17, the supply nozzles 16A to 16C, the recovery nozzles 26A and 26B, and the recovery pipe 27 are used. The liquid supply device 11 and the liquid recovery device 21 supply and recover the liquid 1. That is, when the substrate P moves in the + X direction, the liquid 1 is supplied between the projection optical system PL and the substrate P from the liquid supply device 11 via the supply pipe 17 and the supply nozzles 16 (16A to 16C). In addition, the liquid 1 is recovered by the liquid recovery device 21 through the recovery nozzle 26 (26A, 26B) and the recovery tube 27, and fills the space between the optical element 2 on the image plane side of the projection optical system PL and the substrate P. Thus, the liquid 1 flows in the + X direction.

  As described above, the control device CONT uses the liquid supply device 11 and the liquid recovery device 21 to cause the liquid 1 to flow in the same direction as the movement direction of the substrate P along the movement direction of the substrate P. In this case, for example, the liquid 1 supplied from the liquid supply device 11 via the supply nozzle 14 is placed in the space between the optical element 2 of the projection optical system PL and the substrate P as the substrate P moves in the −X direction. Since the liquid flows so as to be drawn, the liquid 1 can be easily supplied to the space between the optical element 2 and the substrate P even if the supply energy of the liquid supply device 11 is small. Then, by switching the direction in which the liquid 1 flows according to the scanning direction, the liquid 1 is moved between the optical element 2 and the substrate P when the substrate P is scanned in either the + X direction or the −X direction. And a high resolution and a wide depth of focus can be obtained.

  At the time of scanning exposure, a part of the pattern image of the mask M is projected onto the projection area AR1 of the projection optical system PL, and the mask M is at a velocity V in the −X direction (or + X direction) with respect to the projection optical system PL. In synchronization with the movement, the substrate P moves in the + X direction (or -X direction) at a speed β · V (β is the projection magnification) via the XY stage 53. Then, after the exposure of one shot area is completed, the next shot area is moved to the scanning start position by stepping the substrate P, and thereafter, the exposure process for each shot area is sequentially performed by the step-and-scan method.

  The shape of the nozzle described above is not particularly limited. For example, the liquid 1 may be supplied or recovered with two pairs of nozzles on the long side of the projection area AR1. In this case, the supply nozzle and the recovery nozzle may be arranged vertically so that the liquid 1 can be supplied and recovered from either the + X direction or the −X direction. . Although not shown, the nozzles for supplying and collecting the liquid 1 are provided at predetermined intervals around the optical element 2 of the projection optical system PL, and the substrate P is in the scanning direction (+ X direction, −X direction). When moving in a direction other than), the liquid 1 can flow in the same direction as the movement direction of the substrate P in parallel with the movement direction of the substrate P.

  Photoresist (photosensitive material) is applied to the surface PA, which is the exposure surface of the substrate P. In this embodiment, the photosensitive material is a photosensitive material for ArF excimer laser (for example, TARF-P6100 manufactured by Tokyo Ohka Kogyo Co., Ltd.) and has liquid repellency (water repellency). In the present embodiment, the side surface of the substrate P is subjected to liquid repellent treatment (water repellent treatment). Specifically, the photosensitive material having liquid repellency is also applied to the side surface of the substrate P. Further, the photosensitive material is also applied to the back surface of the substrate P to be liquid repellent.

Next, an operation when the pattern of the mask M is subjected to immersion exposure on the substrate P using the exposure apparatus EX described above will be described.
When the pattern is exposed on the substrate P, the XY stage 53 is previously set at an exposure position (position shown in FIG. 1, first position) K1 where the exposure area on the substrate P faces the projection area AR1 in the liquid immersion area AR2. Keep driving.

Then, while the liquid 1 is supplied onto the substrate P by the liquid supply mechanism 10, the liquid 1 on the substrate P is recovered by the liquid recovery mechanism 20 to form the liquid immersion area AR2. Then, the control device CONT irradiates the substrate P with the exposure light EL via the projection optical system PL and the liquid 1, and moves the substrate stage PST (substrate table 52) that supports the substrate P while moving the pattern image of the mask M. Is projected onto the substrate P, and immersion exposure for exposing the substrate P is performed.
At this time, since the moving table 70 is in the retracted position shown in FIG. 1 below the optical path of the measurement beam B, the measurement beam B is not shielded. Therefore, the substrate table 52 (substrate P) by the XY interference system 56 is used. This will not interfere with the position measurement (or speed measurement).

  On the other hand, when the substrate P is exchanged after the exposure processing for the substrate P is completed, the controller CONT drives the lifting device 71 and lifts the cylinder 71a after the completion of the immersion exposure, and as shown in FIG. As described above, the moving table 70 is moved to a height at which the surface 70A is substantially flush with the surface 60A of the plate member 60, and the substrate replacement position K2 that is the second position (in FIG. 4, + X more than the projection optical system PL). XY stage 53 is moved to the side).

  When the moving table 70 is raised, the moving table 70 crosses the measurement beam B of the XY interferometer 56. However, the thickness of the moving table 70 hinders position measurement by the XY interferometer 56 using the measurement beam B. Therefore, the position measurement when the XY stage 53 (substrate table 52) moves to the substrate replacement position can be continued without interruption.

Further, as the XY stage 53 moves to the substrate exchange position, the liquid immersion area AR2 on the substrate P or the plate member 60 is detached from the plate member 60, and as shown in FIG. 70 is located on the surface 70A. In other words, the moving table 70 is positioned at the position K1 corresponding to the exposure position.
At this time, the liquid immersion area AR2 spans the gap between the plate member 60 and the moving table 70, but both the surface 60A of the plate member 60 and the surface 70A of the moving table 70 have liquid repellency. In addition, since the gap is set to a size corresponding to the surface tension of the liquid 1, the moving table 70 can be positioned in the liquid immersion area AR2 without the liquid 1 leaking from the gap.

  When the substrate stage PST is positioned at the substrate exchange position K2, the controller CONT releases the suction holding of the substrate P to the substrate table 52, and the lift pin 72 is held in the state where the lift P 72 holds the substrate P by suction. The substrate P is raised and separated from the substrate table 52. Then, the transfer arm 73 enters between the substrate P raised by the lift pins 72 and the substrate table 52, and supports the lower surface of the substrate P (see FIGS. 2 and 4). Then, the transfer arm 73 unloads the substrate P from the substrate table 52 (substrate stage PST) and places the substrate on which the next exposure process is performed on the substrate table 52.

  The substrate stage PST that has completed the substrate replacement at the substrate replacement position K2 as described above moves again to the exposure position K1. Here, the controller CONT drives the lifting device 71 after the immersion area AR2 moves from the moving table 70 to the substrate table 52 (plate member 60 or substrate) as the substrate stage PST moves, The moving table 70 is moved to the retracted position shown in FIG. 1 by lowering the cylinder 71a. This makes it possible to perform the exposure process without hindering position measurement using the measurement beam B.

  Thus, in the present embodiment, even when the substrate table 52 having the plate member 60 is moved from the exposure position K1 to the substrate replacement position K2, the moving table 70 is positioned at the position K1 and the liquid 1 leaks. Therefore, the substrate replacement can be performed without stopping the liquid supply and liquid recovery to the liquid immersion region AR2. Therefore, in this embodiment, even when the substrate table 52 includes a sequence that deviates from the exposure position, the standby time associated with the liquid supply and recovery can be reduced, and the throughput can be improved. Furthermore, in the present embodiment, since the liquid immersion area AR2 is always formed, there is a problem that a watermark is generated in the projection optical system PL and a problem that a temperature change occurs in the projection lens, the liquid supply nozzle, etc. due to heat of vaporization. Can be avoided.

  Further, in this embodiment, since the surface 70A of the moving table 70 has liquid repellency, even when the liquid immersion area AR2 is positioned on the movement table 70, the liquid 1 does not spread out and is immersed in the liquid immersion area AR2. Can be maintained. In addition, in the present embodiment, since the moving table 70 and the plate member 60 are formed of the same material, even when the liquid immersion area AR2 is formed straddling the moving table 70 and the plate member 60, the repellent properties. It is possible to prevent the liquid 1 from being biased toward the inferior liquid repellency side due to the difference in liquid property and the liquid immersion area AR2 from being stably formed.

  Further, in the present embodiment, the thickness of the moving table 70 is set based on the beam diameter of the measurement beam B so that the position measurement by the XY interferometer 56 can be continued. Even if the beam B is traversed, the position measurement is not interrupted, and therefore an error due to the inability to measure and the like is not caused, and stable exposure processing can be performed.

(Second Embodiment)
Next, a second embodiment of the stage apparatus according to the present invention will be described with reference to FIGS.
The stage apparatus ST in the present embodiment shown in FIG. 5 is a twin stage type stage apparatus in which two stages for holding the substrate P are mounted, and is a first substrate stage that can move independently on a common base BP. A PST1 and a second substrate stage PST2 are provided. Further, the twin stage type stage apparatus ST has a measurement relating to an exposure area A (left side in FIG. 5) where the immersion area AR2 is disposed and performs an exposure process on the substrate P, and a substrate stage PST1 (or PST2) holding the substrate P. A measurement area AL (on the right side in FIG. 5) for processing is provided. By moving the first substrate stage PST1 and the second substrate stage PST2, the first substrate stage PST1 and the second substrate stage PST2 can be exchanged between the exposure area A and the measurement area AL. In the measurement area AL, loading (loading) and unloading (unloading) of the substrate P with respect to the substrate stage PST1 (PST2) is performed. That is, the substrate P is exchanged in the measurement area AL.

  The stage device 12 is connected to the stators 58 and 58 via the X guide stage 61A and the stators 58 and 58 disposed along the Y-axis direction on both outer sides of the base plate BP in the X-axis direction. The substrate stage PST1 is moved along the stators 58, 58 connected to the substrate stage PST2 via the X guide stage 61B and the movers 62A, 62A that move the substrate stage PST1 in the Y-axis direction by moving along the Y-axis. Movable elements 62B and 62B for moving the PST2 in the Y-axis direction, the X guide stage 61A constructed along the X direction between the movable elements 62A and 62A, and the movable element 62B and 62B installed along the X direction The X guide stage 61B and the X stage connected to the substrate stage PST1 and moving along the X guide stage 61A Moving stage 63A, and an X coarse movement stage 63B that moves along a connected X guide stage 61B to the substrate stage PST2.

  The stator 58 and the mover 62A constitute a Y linear motor 65A, and the substrate stage PST1 moves in the Y-axis direction when the mover 62A is driven by electromagnetic interaction with the stator 58. . Similarly, a Y linear motor 65B is constituted by the stator 58 and the mover 62B, and the substrate stage PST2 is moved in the Y-axis direction when the mover 62B is driven by electromagnetic interaction with the stator 58. Move to. That is, in the present embodiment, the Y linear motors 65A and 65B share the stator 58.

  Further, stators (not shown) are respectively embedded in the X guide stages 61A and 61B along the X direction, and the X coarse movement stages 63A and 63B are respectively moved along the stators (not shown). A mover is provided. The X linear motors 67A and 67B are configured by the stator provided on the X guide stages 61A and 61B and the mover provided on the X coarse movement stages 63A and 63B, and the mover is disposed between the stator and the stator. The substrate stages PST1 and PST2 move in the X-axis direction by being driven by electromagnetic interaction.

FIG. 6 is a front view of the substrate stage PST1 (PST2).
Since the configurations of the substrate stages PST1 and PST2 are the same, only the substrate stage PST1 will be described below, and only the reference numeral (mainly suffixed B) is described for the substrate stage PST2.

  As shown in FIG. 6, the substrate stage PST1 is composed of the above-described X coarse movement stage (second movement device) 63A and a table portion 80A provided to be exchangeable with respect to the X coarse movement stage 63A. . A plurality of vacuum preload type air bearings 82 which are non-contact bearings are provided on the bottom surface of the coarse movement stage 63A, and pressurized gas (for example, helium or nitrogen gas) blown from the bearing surface of the air bearing 82 is provided. The coarse movement stage 63A has a clearance of about several microns above the moving surface Ba, which is the upper surface of the base plate (plate) BP, due to the balance between the static pressure of the coarse movement stage 63A, the weight of the entire coarse movement stage 63A and the vacuum suction force. It is designed to be supported without contact.

  The table unit 80A includes a substrate table (first moving table) 52A that holds the substrate P, and a fine movement stage (first moving device) 100A that supports the substrate table 52A via a Z / tilt driving mechanism. Yes. The Z / tilt driving mechanism includes, for example, a stator of a voice coil motor disposed at the position of the apex of a regular triangle on the fine movement stage 100A, and three disposed on the bottom surface of the substrate table 52A corresponding to these stators. These three voice coil motors move the substrate table 52A in the Z-axis direction, θx direction (rotation direction around the X axis), and θy direction (rotation direction around the X axis) by these three voice coil motors. With respect to the direction of three degrees of freedom, the substrate table 52A can be driven with a slightly smaller amount than the X coarse movement stage 63A.

  A plurality of vacuum preload type air bearings 81 which are non-contact bearings are provided on the bottom surface of fine movement stage 100A, and pressurized gas (for example, helium or nitrogen gas) blown from the bearing surface of air bearing 81 is provided. Due to the balance between the static pressure, the total weight of the table portion 80A, and the vacuum suction force, the table portion 80A is supported in a non-contact manner above the moving surface Ba, which is the upper surface of the surface plate BP, with a clearance of about several microns. It is like that.

  A substrate P is fixed to the upper surface of the substrate table 52A by electrostatic adsorption or vacuum adsorption via a holder (not shown). The upper surface of the substrate table 52A is subjected to a liquid repellent treatment such as a fluororesin coating, and has a liquid repellency with respect to the liquid 1.

  On both sides of fine movement stage 100A in the Y-axis direction, magnets 75a, 75a and 75b, 75b facing each other at an interval in the Z direction are arranged at the same position in the Z direction. Further, the X coarse movement stage 63A is provided with a stator 74 having a built-in armature unit protruding from a position sandwiched between the magnets 75a, 75a and 75b, 75b. The gaps between the magnets 75a and 75a and the gaps between the magnets 75b and 75b are set to the same position in the Z direction as the stator 74 and open on the side facing the stator 74, and are symmetrical with respect to the Y direction (see FIG. 6 is symmetrical). The fine movement stage 100A provided with the magnets 75a and 75b constitutes an X linear motor 76A together with the stator 74 as a mover, and is finely moved in the X-axis direction by being driven by electromagnetic interaction with the stator 74. Moving. Although not shown, fine movement stage 100A is constrained to be movable only within a predetermined movement range with respect to the X-axis direction by a driving device such as a voice coil motor, and with respect to the Y-axis direction, X coarse movement stage. It is configured to move without being restricted in a direction away from 63A. That is, the fine movement stage 100A moves slightly in at least the X direction and the Y direction with respect to the X coarse movement stage 63A, and moves away from the X coarse movement stage 63A by moving in the Y direction away from the X coarse movement stage 63A. On the contrary, it is configured to be detachable so as to be connected to the X coarse movement stage 63A by moving in the approaching direction.

  Then, the X coarse movement stage 63A is positioned at a position facing the liquid immersion area AR2 when the substrate table 52A moves to a position (second position) deviated from the exposure position K1 facing the liquid immersion area AR2. As shown, a moving table (second moving table) 70 that moves in the Z direction (not attached to the X coarse movement stage 63B, but provided only on the X coarse movement stage 63A, no subscript is added) is provided. . The moving table 70 is made of the same liquid-repellent material as the substrate table 52A, and is movable in the Z-axis direction by driving the lifting device 71. Further, when the X coarse movement stage 63A moves on the base plate BP in the exchange sequence of the table portions 80A, 80B, etc., the moving table 70 is moved when the substrate table 52 moves away from the position facing the liquid immersion area AR2. One of the portions is formed in a size facing the liquid immersion area AR2.

  The lifting device 71 is configured such that the cylinder 71a connected to the moving table 70 extends in the Z direction under the control of the control device CONT, so that the surface 70A is substantially flush with the flat surface 52A ′ of the substrate table 52A. In addition, between a position aligned with the substrate table 52A with a minute gap (a position indicated by a solid line in FIG. 6) and a retracted position (a position indicated by a two-dot chain line in FIG. 6) below measurement beams BA and BB described later. It is configured to move up and down. The minute gap is set to about several μm to several mm, for example, and the liquid 1 is suppressed from leaking through the minute gap due to the surface tension of the liquid 1.

  The position of the wafer stage in the exposure area A in the Y-axis direction is measured by the laser interferometer 32 that irradiates the measurement beam BA to the −Y side surface of the substrate table 52A (or 52B). The position is measured by the laser interferometer 33 that irradiates the measurement beam to the −X side surface of the substrate table 52A, and the result is output to the control device CONT. Also in the present embodiment, as in the first embodiment, the thickness of the substrate table 52A (and 52B) is such that the substrate table 52A of the measurement beam BA is also measured when the measurement beam BA of the laser interferometer 32 is crossed during elevation. Is set to such a size that the position measurement can be continued.

  The position of the substrate stage in the measurement area AL in the Y-axis direction is a laser interference that is provided at the approximate center of the base plate BP and irradiates the measurement beam BB to the −Y side surface of the substrate table 52B (or 52A). The position in the X-axis direction is measured by a total 34 and measured by a laser interferometer 35 that irradiates a measurement beam to the −X side side surface of the substrate table 52B, and the result is output to the control unit CONT.

  As shown in FIG. 7, the laser interferometer 34 is provided with a lock mechanism 90 that locks (holds) the table portions 80A and 80B (fine movement stages 100A and 100B) on both sides in the X-axis direction. The lock mechanism 90 includes a shaft member 90a disposed along the Z-axis direction, and, for example, an electromagnetic solenoid actuator 90b that drives the shaft member 90a in the Z-axis direction under the control of the control device CONT. . On each side, the shaft member 90a is disposed at the same pitch as the two holes 85, 85 of the bracket 86 provided in the table portions 80A, 80B (fine movement stages 100A, 100B), and when lowered, the holes 85, 85 And the table portions 80A and 80B are positioned (fixed) at an exchange position described later.

Subsequently, replacement (exchange) of the table unit in the operation of the stage apparatus ST according to the present embodiment will be described with reference to FIGS. 5 and 8 to 12.
In these drawings, only those related to the operations described with reference to each drawing are denoted by reference numerals.

FIG. 5 is a diagram in which an exposure process is performed on the substrate stage PST1 (table unit 80A) located in the exposure area A. FIG.
At this time, the liquid immersion area AR2 is formed on the table portion 80A (or the substrate P) located at the exposure position K1, and the liquid does not leak out.
When the exposure process for the substrate stage PST1 located in the exposure area A is finished and the measurement process for the substrate stage PST2 located in the measurement area AL is finished, as shown in FIG. 8, the X coarse movement stage 63A is moved to the X guide. The X coarse movement stage 63B is moved along the X guide stage 61B to the + X axis side end along the stage 61A.

  At this time, since the liquid immersion area AR2 faces the surface 70A at the + X side and + Y side corners of the moving table 70, the liquid immersion area AR2 is maintained without leakage of liquid. Further, in the process in which the substrate stage PST1 moves from the exposure position K1 shown in FIG. 5 to the replacement preparation position shown in FIG. 8, before the immersion area AR2 moves from the substrate table 52A onto the moving table 70, control is performed. When the apparatus CONT drives the elevating apparatus 71 and raises the cylinder 71a, the surface 70A moves to a height that is substantially flush with the flat surface 52A ′ of the substrate table 52A, as shown by a two-dot chain line in FIG. The table 70 is moved. Accordingly, the liquid immersion area AR2 formed on the flat surface 52A ′ of the substrate table 52A can smoothly move onto the surface 70A of the moving table 70. Although the liquid immersion area AR2 extends over the substrate table 52A and the moving table 70, since these gaps are very small, the liquid does not leak due to surface tension, as in the first embodiment. .

Next, the movers 62A and 62B are respectively moved forward (directions approaching each other) along the stator 58, and as shown in FIG. 9, the table portions 80A and 80B are located on the side of the interferometer 34 (X direction). The substrate stages PST1 and PST2 are moved to the table portion replacement position (second position) K3 located on both sides. Then, as shown in FIG. 7, the actuator 90b of the lock mechanism 90 is driven to lower the shaft member 90a. Thereby, as shown by a two-dot chain line, the shaft member 90a is fitted into the hole 85 of the bracket 86, and the table portions 80A and 80B are locked at the table portion replacement position K3.
When the table portion 80A is positioned at the table portion replacement position K3, the liquid immersion area AR2 faces the surface 70A at the + X side and −Y side corners of the moving table 70, so that the liquid does not leak out. The immersion area AR2 is maintained.

Subsequently, as shown in FIG. 10, the movers 62A and 62B are moved rearward (in a direction away from each other) along the stator 58, and magnets 75a and 75a provided on the table portion 80A (see FIG. 6). The stator 74 is pulled out from the gap (the gap between the magnets 75b and 75b in the table portion 80B). At this time, the movers 62A and 62B are moved at a low speed in order to increase the safety of the initial several tens of millimeters where the stator 74 is located in the gap between the magnets 75a and 75a (or 75b and 75b), and After 74 is removed from the magnets 75a and 75a (or 75b and 75b), the magnet 74 is moved at a medium speed in order to improve the throughput.
When the table portion 80A and the X coarse movement stage 63A are separated, the liquid immersion area AR2 faces the surface 70A at the + X side and + Y side corners of the moving table 70, so that the liquid does not leak out. The immersion area AR2 is maintained.

  Next, as shown in FIG. 11, the X coarse movement stage 63A is moved in the + X direction along the X guide stage 61A so as to face the table portion 80B, and the X coarse movement stage 63B is moved along the X guide stage 61B. It is moved in the X direction to face the table portion 80A. At this time, since the liquid immersion area AR2 faces the surface 70A at the −X side and + Y side corners of the moving table 70, the liquid immersion area AR2 is maintained without leakage of liquid.

Next, as shown in FIG. 12, the movers 62A and 62B are advanced along the stator 58 in a direction approaching each other, and the stator 74 provided on the X coarse movement stages 63A and 63B is moved to the table portion 80A, Insert into the gap between 80B magnets. In this case, the stator 74 of the table portion 80A is inserted into the gap between the magnets 75b and 75b, and the stator 74 of the table portion 80B is inserted into the gap between the magnets 75a and 75a. At this time, since the liquid immersion area AR2 faces the surface 70A at the −X side and −Y side corners of the moving table 70, the liquid immersion area AR2 is maintained without leakage of liquid.
At this time, in order to improve the throughput, the movers 62A and 62B are moved at a medium speed until the stator 74 reaches the gap between the magnets, and several tens of times after the stator 74 reaches the gap between the magnets. It is preferable to move the movers 62A and 62B at a low speed in order to increase safety.

Thereafter, the actuator 90b of the lock mechanism 90 is driven to raise the shaft member 90a. As a result, as shown by a solid line in FIG. 7, the shaft member 90a is detached from the hole 85 of the bracket 86, and the lock on the table portions 80A and 80B is released. Subsequently, by moving the movers 62A and 62B rearward along the stator 58, the replacement (exchange) of the substrate stage (table unit) is completed. Then, the X coarse movement stage 63A is moved along the X guide stage 61A, and the table unit 80B is positioned at the exposure position K1 where the liquid immersion area AR2 is formed in the opposed state, whereby the substrate table 52B of the table unit 80B. An exposure process is performed on the substrate held on the substrate.
At this time, after the liquid immersion area AR2 has moved from the moving table 70 to the substrate table 52B, the control device CONT drives the lifting device 71 and lowers the cylinder 71a, as shown by a solid line in FIG. The moving table 70 is moved to the retracted position.

  In such a stage apparatus ST, the two table stages PST1 and PST2 are independently moved in the two-dimensional direction while the table sections 80A and 80B are replaced (exchanged), and the substrate on the substrate stage in the exposure area A is replaced. The parallel processing of the exposure sequence and the substrate exchange and alignment sequence for the substrate on the substrate stage in the measurement area AL is repeatedly performed.

  As described above, in the present embodiment, when the double stage method in which the exposure process and the measurement process are performed in parallel while exchanging the plurality of substrate stages PST1 and PST2, the table portion is out of the exposure position K1. Even in this case, the immersion table AR2 can be maintained without the liquid 1 leaking out by the moving table 70. Therefore, the stage exchange and the substrate exchange can be performed without stopping the liquid supply to the liquid immersion area AR2 and the liquid recovery. It becomes possible to improve.

  In the second embodiment described above, the moving table 70 is provided on the X coarse movement stage 63A. However, the present invention is not limited to this. For each table unit 80A, 80B, as in the first embodiment. The movable table 70 may be provided (that is, a plurality of substrate tables and movable tables are provided). In this case, in the table portion located in the exposure area A, when the substrate table is out of the exposure position, the moving table 70 is moved to the exposure position (position facing the liquid immersion area AR2 and substantially flush with the upper surface of the substrate table). What is necessary is just to position.

(Third embodiment)
Subsequently, a third embodiment of the stage apparatus ST will be described with reference to FIGS. In these drawings, the same reference numerals are given to the same elements as those of the second embodiment shown in FIGS. 5 to 12, and the description thereof is omitted or simplified.
In the second embodiment, in the double stage type stage apparatus, the moving table is provided on the X coarse movement stage 63A. However, in this embodiment, the substrate table 52A is driven with a larger stroke than the fine movement stage 100A. The moving table 70 is connected to the mover 62A of the motor 65A.

  That is, in the present embodiment, as shown in FIG. 13, a stay 76 extending in the X direction is horizontally disposed between the pair of movers (second moving devices) 62A and 62A constituting the Y linear motor 65A. Suspended. From the stay 76, the position in the X-axis direction is the same as the liquid immersion area AR2, and the moving table 70 extends to the + Y side. The moving table 70 is made of the same liquid-repellent material as the substrate table 52A. As shown in FIG. 14, the surface 70A is the upper surface 52A ′ (or 52B ′) of the substrate table 52A (or 52B). When the table portions 80A and 80B are coupled to the stator 74 (X coarse movement stage 63A), the substrate table 52A (or 52B) is aligned with a minute gap that does not leak liquid. Has been placed.

  The moving table 70 is disposed at a height that does not contact the X coarse movement stage 63A even when the X coarse movement stage 63A moves in the X axis direction along the X guide stage 61A. Furthermore, as shown in FIG. 15, the surface 70A is formed in such a size that the moving table 70 is opposed to the liquid immersion area AR2 even when the table 62 is replaced when the mover 62A moves to the + Y side most.

In this embodiment, since the moving table 70 is always at the same height as the substrate tables 52A and 52B, the position of the substrate table located in the exposure area A is measured by the laser interferometer 34 and located in the measurement area AL. The position of the substrate table is measured by a laser interferometer 32 provided at the + Y side end L of the base plate BP. Note that the moving table 70 does not always have to have the same height as 52A and 52B, and the moving table 70 may be driven along the Z direction as in the above-described embodiment.
Other configurations are the same as those of the second embodiment.

  In the present embodiment, as in the second embodiment, the liquid immersion area AR2 can be maintained without the liquid 1 leaking by the moving table 70 even when the table portion is out of the exposure position K1, so the liquid immersion area AR2 The stage exchange and the substrate exchange can be performed without stopping the liquid supply to the liquid and the liquid recovery, and the throughput can be improved. Moreover, in this Embodiment, since it is not the structure which provided the drive mechanism for the movement of the movement table 70 separately, it can contribute to a cost reduction. In addition, the moving table 70 can be easily attached to an existing stage apparatus.

  In the above embodiment, the moving table is described as a configuration in which the immersion area AR2 is formed in the immersion exposure instead of the substrate table. However, the present invention is not limited to this. It is also possible to adopt a configuration in which measurement processing is performed when the moving table is moved to the measurement position when the substrate table is moved from the measurement position on the base plate BP.

In the second embodiment, the Y linear motors 65A and 65B share the stator 58. However, the stator may be provided separately.
Furthermore, in the first and second embodiments, liquid (droplets) adheres to the surface 70A of the moving table 70 after the liquid immersion area AR2 is formed, and the XY stage 53 and the X coarse movement stage 63A. There is a possibility of scattering by the impact of driving. For this reason, the liquid may be removed by blowing air to the moving table 70 that has been lowered by the driving of the elevating device 71, or the moving table may be inclined at the time of lowering to drop the liquid by its own weight.

Furthermore, in the above-described embodiment, the substrate stages PST1, PST2 (table portions 80A, 80B) are configured to be movably supported by the common base plate BP. It is also possible to adopt a format.
In the above embodiment, the stage apparatus of the present invention is applied to the substrate stage. However, it can also be applied to the mask stage MST.

  In the above embodiment, the case where the substrate is exchanged, aligned, etc. on the other substrate stage while the exposure is performed using the pattern of one mask on one substrate stage has been described. For example, as disclosed in Japanese Patent Application Laid-Open No. 10-214783, a double exposure is performed using a pattern of two masks on one substrate stage using a mask stage on which two masks can be mounted. During the process, substrate exchange, alignment, etc. may be performed in parallel on the other substrate stage. In this way, high resolution and an improved DOF (depth of focus) can be obtained by double exposure without significantly reducing the throughput by simultaneous parallel processing.

  As described above, in the present embodiment, when ArF excimer laser light is used as exposure light, pure water is supplied as a liquid for immersion exposure. Pure water has the advantage that it can be easily obtained in large quantities at a semiconductor manufacturing factory or the like and has no adverse effect on the photoresist, optical element (lens), etc. on the substrate (wafer). In addition, pure water has no adverse effects on the environment, and since the impurity content is extremely low, it can be expected to clean the surface of the substrate and the surface of the optical element provided on the front end surface of the projection optical system.

  The refractive index n of pure water (water) with respect to the exposure light EL having a wavelength of about 193 nm is said to be approximately 1.44. When ArF excimer laser light (wavelength 193 nm) is used as the light source of the exposure light EL, On the substrate P, the wavelength is shortened to 1 / n, that is, about 134 nm, and a high resolution can be obtained. Furthermore, since the depth of focus is enlarged by about n times, that is, about 1.44 times compared with that in the air, the projection optical system PL can be used when it is sufficient to ensure the same depth of focus as that in the air. The numerical aperture can be further increased, and the resolution is improved in this respect as well.

In addition, as the liquid 1, it is also possible to use a liquid that is transparent to the exposure light, has a refractive index as high as possible, and is stable with respect to the photoresist applied to the projection optical system PL and the substrate P surface. Is possible.
When F ₂ laser light is used as the exposure light, a fluorine-based liquid such as fluorine-based oil or perfluorinated polyether (PFPE) that can transmit the F ₂ laser light may be used as the liquid.

  When the immersion method as described above is used, the numerical aperture NA of the projection optical system PL may be 0.9 to 1.3. As described above, when the numerical aperture NA of the projection optical system PL is increased, the imaging characteristics may be deteriorated due to the polarization effect with the random polarized light conventionally used as the exposure light. It is desirable. In that case, linearly polarized illumination is performed in accordance with the longitudinal direction of the line pattern of the mask (reticle) line-and-space pattern. From the mask (reticle) pattern, the S-polarized light component (TE-polarized light component), that is, the line pattern It is preferable that a large amount of diffracted light having a polarization direction component is emitted along the longitudinal direction. When the space between the projection optical system PL and the resist applied on the surface of the substrate P is filled with a liquid, the space between the projection optical system PL and the resist applied on the surface of the substrate P is filled with air (gas). In comparison with the case where the numerical aperture NA of the projection optical system exceeds 1.0, the transmittance of the diffracted light of the S-polarized component (TE-polarized component), which contributes to the improvement of contrast, on the resist surface is increased. High imaging performance can be obtained. Further, it is more effective to appropriately combine a phase shift mask or an oblique incidence illumination method (particularly a dipole illumination method) adapted to the longitudinal direction of the line pattern as disclosed in JP-A-6-188169.

  Further, for example, ArF excimer laser light is used as exposure light, and a fine line and space pattern (for example, L / S of about 25 to 50 nm) is formed on the substrate P by using the projection optical system PL with a reduction magnification of about 1/4. When exposing upward, depending on the structure of the mask M (for example, the fineness of the pattern and the thickness of chrome), the mask M acts as a polarizing plate due to the wave guide effect, and the P-polarized component (TM-polarized component) reduces the contrast. ) Diffracted light of S polarization component (TE polarization component) is emitted from the mask more than the diffracted light of). In this case as well, it is desirable to use linearly polarized illumination as described above, but even if the mask M is illuminated with random polarized light, high resolution is achieved using a projection optical system having a large numerical aperture NA such as 0.9 to 1.3. It becomes possible to obtain performance. When an extremely fine line and space pattern on the mask M is exposed on the substrate P, the P-polarized component (TM-polarized component) is replaced with the S-polarized component (TE-polarized component) by the Wave guide effect. Although, for example, ArF excimer laser light is used as exposure light, and a line and space pattern larger than 25 nm is exposed on the substrate P using a projection optical system with a reduction ratio of about 1/4. Under such conditions, the diffracted light of the S-polarized component (TE-polarized component) is emitted from the mask more than the diffracted light of the P-polarized component (TM-polarized component), so the numerical aperture NA of the projection optical system is 0.9. High resolution performance can be obtained even when it is as large as ˜1.3.

  Furthermore, not only linearly polarized illumination (S-polarized illumination) matched to the longitudinal direction of the line pattern of the mask (reticle) but also a circle centered on the optical axis as disclosed in JP-A-6-53120. A combination of the polarization illumination method that linearly polarizes in the tangential (circumferential) direction and the oblique incidence illumination method is also effective. In particular, when a mask (reticle) pattern includes not only a line pattern extending in a predetermined direction but also a plurality of line patterns extending in different directions, the same is disclosed in Japanese Patent Laid-Open No. 6-53120. In addition, by using the polarization illumination method that linearly polarizes in the tangential direction of the circle centered on the optical axis and the annular illumination method, high imaging performance can be obtained even when the numerical aperture NA of the projection optical system is large. it can.

  The substrate P in each of the above embodiments is not only a semiconductor wafer for manufacturing a semiconductor device, but also a glass substrate for a display device, a ceramic wafer for a thin film magnetic head, or an original mask or reticle used in an exposure apparatus. (Synthetic quartz, silicon wafer) or the like is applied.

  As the exposure apparatus EX, in addition to the step-and-scan type scanning exposure apparatus (scanning stepper) that scans and exposes the pattern of the mask M by moving the mask M and the substrate P synchronously, the mask M and the substrate P Can be applied to a step-and-repeat type projection exposure apparatus (stepper) in which the pattern of the mask M is collectively exposed while the substrate P is stationary and the substrate P is sequentially moved stepwise. The present invention can also be applied to a step-and-stitch type exposure apparatus that partially transfers at least two patterns on the substrate P.

  In the above-described embodiment, a scanning exposure apparatus (scanner) having a catadioptric system with a magnification of 1/4 is used as an example of the immersion exposure apparatus, but the present invention is not limited to this. For example, an immersion stepper having a refractive system (total bending type) with a magnification of 1/8 may be used. When the magnification is 1/8, a large area chip cannot be exposed at one time. Therefore, a stitching method may be adopted for a large area chip.

  The type of the exposure apparatus EX is not limited to an exposure apparatus for manufacturing a semiconductor element that exposes a semiconductor element pattern on the substrate P, but an exposure apparatus for manufacturing a liquid crystal display element or a display, a thin film magnetic head, an image sensor (CCD). ) Or an exposure apparatus for manufacturing reticles or masks.

  When using a linear motor (see USP5,623,853 or USP5,528,118) for the substrate stage PST and mask stage MST, use either an air levitation type using air bearings or a magnetic levitation type using Lorentz force or reactance force. Also good. Each stage PST, MST may be a type that moves along a guide, or may be a guideless type that does not have a guide.

  As a driving mechanism for each stage PST, MST, a planar motor that drives each stage PST, MST by electromagnetic force with a magnet unit having a two-dimensionally arranged magnet and an armature unit having a two-dimensionally arranged coil facing each other is provided. It may be used. In this case, either one of the magnet unit and the armature unit may be connected to the stages PST and MST, and the other of the magnet unit and the armature unit may be provided on the moving surface side of the stages PST and MST.

As described in JP-A-8-166475 (USP 5,528,118), the reaction force generated by the movement of the substrate stage PST is not transmitted to the projection optical system PL, but mechanically using a frame member. You may escape to the floor (ground).
As described in JP-A-8-330224 (US S / N 08 / 416,558), a frame member is used so that the reaction force generated by the movement of the mask stage MST is not transmitted to the projection optical system PL. May be mechanically released to the floor (ground).

  As described above, the exposure apparatus EX according to the present embodiment maintains various mechanical subsystems including the respective constituent elements recited in the claims of the present application so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. Manufactured by assembling. In order to ensure these various accuracies, before and after assembly, various optical systems are adjusted to achieve optical accuracy, various mechanical systems are adjusted to achieve mechanical accuracy, and various electrical systems are Adjustments are made to achieve electrical accuracy. The assembly process from the various subsystems to the exposure apparatus includes mechanical connection, electrical circuit wiring connection, pneumatic circuit piping connection and the like between the various subsystems. Needless to say, there is an assembly process for each subsystem before the assembly process from the various subsystems to the exposure apparatus. When the assembly process of the various subsystems to the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies as the entire exposure apparatus. The exposure apparatus is preferably manufactured in a clean room where the temperature, cleanliness, etc. are controlled.

  As shown in FIG. 16, a microdevice such as a semiconductor device includes a step 201 for designing a function / performance of the microdevice, a step 202 for producing a mask (reticle) based on the design step, and a substrate as a substrate of the device. Manufacturing step 203, exposure processing step 204 for exposing the mask pattern onto the substrate by the exposure apparatus EX of the above-described embodiment, device assembly step (including dicing process, bonding process, packaging process) 205, inspection step 206, etc. It is manufactured after.

1 is a diagram showing an embodiment of the present invention, and is a schematic block diagram showing an embodiment of an exposure apparatus. 2 is a schematic plan view of a substrate table constituting the exposure apparatus. FIG. It is a schematic plan view which shows a liquid supply mechanism and a liquid recovery mechanism. It is a figure which shows the operation | movement at the time of board | substrate replacement | exchange. It is a top view which shows schematically the stage apparatus of 2nd Embodiment. It is a schematic front view of the substrate stage which comprises the stage apparatus. It is a figure which shows the locking mechanism which locks a table part. It is a figure which shows exchange operation | movement of a table part. It is a figure which shows exchange operation | movement of a table part. It is a figure which shows exchange operation | movement of a table part. It is a figure which shows exchange operation | movement of a table part. It is a figure which shows exchange operation | movement of a table part. It is a top view which shows schematically the stage apparatus of 3rd Embodiment. It is a schematic front view of the substrate stage which comprises the stage apparatus. It is a figure for demonstrating exchange operation | movement of a table part. It is a flowchart figure which shows an example of the manufacturing process of a semiconductor device.

Explanation of symbols

K1 ... Exposure position (first position), K2 ... Substrate exchange position (second position), K3 ... Table part exchange position (second position), B ... Measurement beam (beam), Ba ... Moving surface, EX ... Exposure apparatus M ... Mask (reticle), P ... Substrate (sample), PL ... Projection optical system, PST ... Substrate stage (stage device), ST ... Stage device, 1 ... Liquid, 10 ... Liquid supply mechanism (liquid supply device), 52, 52A, 52B ... substrate table (first moving table), 53 ... XY stage (moving stage), 56 ... XY interferometer (position detecting device), 62A ... mover (second moving device), 63A ... X coarse Moving stage (second moving device), 70 ... Moving table (second moving table), 70A ... Surface (liquid repellent part), 100A ... Fine moving stage (first moving device)

Claims (13)

A stage apparatus comprising: a moving stage that moves along a moving surface; and a first moving table that holds the sample and is movable with respect to the moving stage,
A stage apparatus, comprising: a second moving table provided on the moving stage and positioned at the first position when the first moving table moves from a first position to a second position. The stage apparatus according to claim 1, wherein
The stage apparatus, wherein the second moving table moves in a direction intersecting the moving surface. The stage apparatus according to claim 1 or 2,
A stage apparatus, wherein a flat portion having a height substantially the same as the surface of the sample is provided, and the flat portion and the second moving table are made of the same material.   A stage apparatus, wherein a flat portion having substantially the same height as the surface of the sample is provided, and the flat portion and the second moving table are subjected to the same liquid repellent treatment. A first moving table that can move along the moving surface while holding the sample, a first moving device that moves the first moving table, and a moving stroke of the first moving table that is larger than the moving stroke of the first moving device. A second moving device that moves the first moving table with a moving stroke; and a stage device comprising:
A stage apparatus, comprising: a second movement table that is provided in the second movement device and moves to the first position when the first movement table moves from the first position to the second position. In the stage apparatus as described in any one of Claim 1 to 5,
A position detecting device for detecting position information of the first moving table using a beam;
The stage apparatus characterized in that the thickness of the second moving table is based on the size of the beam. In the stage apparatus as described in any one of Claim 1 to 6,
A stage apparatus comprising a plurality of the first movement table and the second movement table. In the stage apparatus as described in any one of Claim 1 to 3, 5 to 7,
The second moving table includes a liquid repellent part having liquid repellency. The stage apparatus according to claim 5, wherein
The stage apparatus, wherein the surface of the second moving table is substantially at the same position as the surface of the sample when the second moving table is at the first position. The stage apparatus according to claim 5, wherein
The stage device characterized in that the first moving table is detachable from the second moving device. In an exposure apparatus that exposes a pattern to a substrate, which is a sample placed on a stage apparatus, via a projection optical system,
An exposure apparatus using the stage apparatus according to any one of claims 1 to 10. The exposure apparatus according to claim 11, wherein
The exposure apparatus according to claim 1, wherein the first position is a position facing the projection optical system, and the second position is a position not facing the projection optical system. The exposure apparatus according to claim 11 or 12,
An exposure apparatus comprising: a liquid supply device that supplies a liquid between the projection optical system and the substrate.

Images