JP2006080003A5 - - Google Patents
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- JP2006080003A5 JP2006080003A5 JP2004264338A JP2004264338A JP2006080003A5 JP 2006080003 A5 JP2006080003 A5 JP 2006080003A5 JP 2004264338 A JP2004264338 A JP 2004264338A JP 2004264338 A JP2004264338 A JP 2004264338A JP 2006080003 A5 JP2006080003 A5 JP 2006080003A5
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- JP
- Japan
- Prior art keywords
- hole
- opening
- reflector
- plating film
- light emitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Claims (11)
前記貫通孔は、第1開口と、前記第1開口より一回り小さい第2開口とを有し、
前記貫通孔の内壁面は、前記第1開口から前記第2開口に向けて狭まるすり鉢状に形成され、かつ一部がめっき膜で覆われており、
前記照明装置用反射板の前記第2開口側の主面及び前記第2開口のエッジは、前記電気絶縁基材の構成材料が露出していることを特徴とする照明装置用反射板。 A reflector for an illuminating device comprising an electrically insulating base material containing a resin material, and a through hole formed in the electrically insulating base material for accommodating a light emitting element,
The through hole has a first opening and a second opening that is slightly smaller than the first opening,
The inner wall surface of the through hole is formed in a mortar shape that narrows from the first opening toward the second opening, and a part thereof is covered with a plating film,
The constituent material of the electrically insulating base material is exposed at the main surface on the second opening side of the reflector for lighting device and the edge of the second opening.
前記照明装置用反射板の前記第2開口側の主面に対する前記第2傾斜面の傾斜角度は、前記主面に対する前記第1傾斜面の傾斜角度よりも大きい請求項1に記載の照明装置用反射板。 An inner wall surface of the through hole is located on the first opening side, is located on the first inclined surface covered with the plating film, and on the second opening side, and the constituent material of the electrically insulating base material is exposed. The second inclined surface,
2. The illumination device according to claim 1, wherein an inclination angle of the second inclined surface with respect to the main surface on the second opening side of the reflector for the illumination device is larger than an inclination angle of the first inclined surface with respect to the main surface. a reflector.
前記照明装置用反射板は、前記貫通孔内に前記発光素子が収容され、かつ前記第2開口側の主面が前記基板側に位置するように前記基板上に貼り合わされている照明装置。 A substrate including a base layer, an electric insulating layer including a resin material laminated on the base layer, and a wiring pattern formed on the electric insulating layer, and a light emitting element mounted on the wiring pattern, And the reflector for lighting device according to 1.
The illuminating device reflecting plate is an illuminating device in which the light emitting element is accommodated in the through hole, and is bonded to the substrate so that a main surface on the second opening side is located on the substrate side.
前記有底穴の内壁面をめっき膜で覆い、
前記有底穴の前記底部を貫通して発光素子を収容するための貫通孔を形成する照明装置用反射板の製造方法。 By applying a pressing process using a punch having a diameter equal to or larger than the diameter of the bottomed hole to one main surface of the electrically insulating base material including the resin material, the mortar-shaped bottomed hole part is directed from the opening to the bottom part. Forming a mortar-shaped bottomed hole that narrows
Cover the inner wall surface of the bottomed hole with a plating film,
The manufacturing method of the reflector for lighting devices which forms the through-hole for penetrating the said bottom part of the said bottomed hole, and accommodates a light emitting element.
請求項1に記載の照明装置用反射板の前記貫通孔内に前記発光素子が収容され、かつ前記照明装置用反射板の前記第2開口側の主面が前記基板側に位置するように前記基板上に前記照明装置用反射板を貼り合わす照明装置の製造方法。 A light emitting element is mounted on the wiring pattern of a substrate including a base layer, an electric insulating layer including a resin material laminated on the base layer, and a wiring pattern formed on the electric insulating layer,
The said light emitting element is accommodated in the said through-hole of the reflecting plate for illuminating devices of Claim 1, and the said 2nd opening side main surface of the said reflecting plate for illuminating devices is located in the said board | substrate side. The manufacturing method of the illuminating device which bonds the said reflecting plate for illuminating devices on a board | substrate.
前記有底穴の内壁面をめっき膜で覆い、
前記電気絶縁基材の前記一主面に対する裏面に接着シートを貼り合わせ、
前記有底穴の前記底部と前記底部に面する接着シートとを貫通して発光素子を収容するための貫通孔を形成することによって、照明装置用反射板と前記接着シートとが貼り合わされた積層体を形成し、
別に、ベース層と前記ベース層上に積層された樹脂材料を含む電気絶縁層と前記電気絶縁層上に形成された配線パターンとを含む基板の前記配線パターン上に発光素子を実装し、
前記照明装置用反射板の前記貫通孔内に前記発光素子が収容され、かつ前記接着シートが前記基板側に位置するように前記基板上に前記積層体を貼り合わす照明装置の製造方法。
Forming a mortar-shaped bottomed hole that narrows from the opening toward the bottom on one main surface of the electrically insulating base material containing the resin material,
Cover the inner wall surface of the bottomed hole with a plating film,
Adhering an adhesive sheet to the back surface of the electrical insulating substrate relative to the one main surface,
A laminate in which the reflector for lighting device and the adhesive sheet are bonded together by forming a through hole for accommodating the light emitting element through the bottom portion of the bottomed hole and the adhesive sheet facing the bottom portion Form the body,
Separately, a light emitting element is mounted on the wiring pattern of a substrate including a base layer, an electric insulating layer including a resin material laminated on the base layer, and a wiring pattern formed on the electric insulating layer,
The manufacturing method of the illuminating device which bonds the said laminated body on the said board | substrate so that the said light emitting element is accommodated in the said through-hole of the said reflecting plate for illuminating devices, and the said adhesive sheet is located in the said board | substrate side.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004264338A JP4533058B2 (en) | 2004-09-10 | 2004-09-10 | Reflector for lighting device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004264338A JP4533058B2 (en) | 2004-09-10 | 2004-09-10 | Reflector for lighting device |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2006080003A JP2006080003A (en) | 2006-03-23 |
JP2006080003A5 true JP2006080003A5 (en) | 2007-08-16 |
JP4533058B2 JP4533058B2 (en) | 2010-08-25 |
Family
ID=36159270
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004264338A Expired - Fee Related JP4533058B2 (en) | 2004-09-10 | 2004-09-10 | Reflector for lighting device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4533058B2 (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4863193B2 (en) * | 2005-08-31 | 2012-01-25 | スタンレー電気株式会社 | Semiconductor light emitting device |
US20090032829A1 (en) * | 2007-07-30 | 2009-02-05 | Tong Fatt Chew | LED Light Source with Increased Thermal Conductivity |
JP5064254B2 (en) * | 2008-01-30 | 2012-10-31 | 日東電工株式会社 | Resin sheet for optical semiconductor element sealing and optical semiconductor device |
JP5077679B2 (en) * | 2008-02-29 | 2012-11-21 | 日立化成工業株式会社 | Manufacturing method of bonded substrate |
JP2010238596A (en) * | 2009-03-31 | 2010-10-21 | Showa Denko Kk | Lighting device |
JP5394899B2 (en) * | 2009-11-19 | 2014-01-22 | パナソニック株式会社 | reflector |
JP2013030599A (en) * | 2011-07-28 | 2013-02-07 | Sumitomo Bakelite Co Ltd | Light emitting device and lighting device |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3227295B2 (en) * | 1993-12-28 | 2001-11-12 | 松下電工株式会社 | Light emitting diode manufacturing method |
JP3675358B2 (en) * | 2001-05-17 | 2005-07-27 | 日立エーアイシー株式会社 | Display body and method of manufacturing printed wiring board used therefor |
JP2003218401A (en) * | 2002-01-18 | 2003-07-31 | Matsushita Electric Ind Co Ltd | Semiconductor light emitting device and its manufacturing method |
JP4307094B2 (en) * | 2003-02-04 | 2009-08-05 | パナソニック株式会社 | LED light source, LED illumination device, and LED display device |
-
2004
- 2004-09-10 JP JP2004264338A patent/JP4533058B2/en not_active Expired - Fee Related
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