JP2006073603A5 - - Google Patents

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Publication number
JP2006073603A5
JP2006073603A5 JP2004252127A JP2004252127A JP2006073603A5 JP 2006073603 A5 JP2006073603 A5 JP 2006073603A5 JP 2004252127 A JP2004252127 A JP 2004252127A JP 2004252127 A JP2004252127 A JP 2004252127A JP 2006073603 A5 JP2006073603 A5 JP 2006073603A5
Authority
JP
Japan
Prior art keywords
wafer
alignment method
detected
outer peripheral
peripheral portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004252127A
Other languages
English (en)
Japanese (ja)
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JP2006073603A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2004252127A priority Critical patent/JP2006073603A/ja
Priority claimed from JP2004252127A external-priority patent/JP2006073603A/ja
Publication of JP2006073603A publication Critical patent/JP2006073603A/ja
Publication of JP2006073603A5 publication Critical patent/JP2006073603A5/ja
Pending legal-status Critical Current

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JP2004252127A 2004-08-31 2004-08-31 ウエハのアライメント方法 Pending JP2006073603A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004252127A JP2006073603A (ja) 2004-08-31 2004-08-31 ウエハのアライメント方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004252127A JP2006073603A (ja) 2004-08-31 2004-08-31 ウエハのアライメント方法

Publications (2)

Publication Number Publication Date
JP2006073603A JP2006073603A (ja) 2006-03-16
JP2006073603A5 true JP2006073603A5 (enExample) 2007-01-18

Family

ID=36153941

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004252127A Pending JP2006073603A (ja) 2004-08-31 2004-08-31 ウエハのアライメント方法

Country Status (1)

Country Link
JP (1) JP2006073603A (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4803703B2 (ja) * 2005-02-28 2011-10-26 日東電工株式会社 半導体ウエハの位置決定方法およびこれを用いた装置
JP2007288010A (ja) * 2006-04-19 2007-11-01 Lintec Corp シート切断装置及び切断方法
JP4607910B2 (ja) * 2007-01-16 2011-01-05 東京エレクトロン株式会社 基板搬送装置及び縦型熱処理装置
JP4564022B2 (ja) * 2007-01-16 2010-10-20 東京エレクトロン株式会社 基板搬送装置及び縦型熱処理装置
JP4616873B2 (ja) * 2007-09-28 2011-01-19 東京エレクトロン株式会社 半導体製造装置、基板保持方法及びプログラム
US8435366B2 (en) 2008-04-11 2013-05-07 Lintec Corporation Sheet peeling apparatus and sheet peeling method
US8570516B2 (en) 2008-09-12 2013-10-29 Cognex Corporation Infrared direct illumination machine vision technique for semiconductor processing equipment
JP5381046B2 (ja) * 2008-11-28 2014-01-08 株式会社Ｓｕｍｃｏ 半導体ウェーハのスクライブ装置、およびそれを備えたスクライブシステム
CN109473388B (zh) * 2017-09-07 2020-11-24 上海新昇半导体科技有限公司 一种晶圆寻边装置
MY205496A (en) 2018-04-24 2024-10-23 Disco Hi Tec Europe Gmbh Alignment device and alignment method
JP7325903B2 (ja) * 2019-07-12 2023-08-15 株式会社ディスコ ウェーハの加工方法
CN115172331B (zh) * 2021-04-06 2025-05-27 芯恩（青岛）集成电路有限公司 晶圆对准标记、制作方法、晶圆对准装置及晶圆对准方法

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