JP2006073603A5 - - Google Patents

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Publication number
JP2006073603A5
JP2006073603A5 JP2004252127A JP2004252127A JP2006073603A5 JP 2006073603 A5 JP2006073603 A5 JP 2006073603A5 JP 2004252127 A JP2004252127 A JP 2004252127A JP 2004252127 A JP2004252127 A JP 2004252127A JP 2006073603 A5 JP2006073603 A5 JP 2006073603A5
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JP
Japan
Prior art keywords
wafer
alignment method
detected
outer peripheral
peripheral portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004252127A
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Japanese (ja)
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JP2006073603A (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2004252127A priority Critical patent/JP2006073603A/en
Priority claimed from JP2004252127A external-priority patent/JP2006073603A/en
Publication of JP2006073603A publication Critical patent/JP2006073603A/en
Publication of JP2006073603A5 publication Critical patent/JP2006073603A5/ja
Pending legal-status Critical Current

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Claims (3)

少なくとも表面に保護テープが貼り付けられたウエハを保持して回転させ、このウエハの外周部を赤外線を用いて非接触で検出してアライメントするウエハのアライメント方法。   A wafer alignment method in which at least a wafer having a protective tape affixed to a surface is held and rotated, and the outer peripheral portion of the wafer is detected and aligned in a non-contact manner using infrared rays. 上記ウエハの外周部を、赤外線照射手段と赤外線受光手段を用いて赤外線で検出する請求項１に記載のウエハのアライメント方法。 The wafer alignment method according to claim 1, wherein the outer peripheral portion of the wafer is detected by infrared rays using infrared irradiation means and infrared light reception means . ウエハを非接触式ハンドにて吸着保持しながらアライメントを行う請求項１又は２に記載のウエハのアライメント方法。 Wafer alignment method according to claim 1 or 2 performs alignment while sucking and holding the wafer in a non-contact type hand.
JP2004252127A 2004-08-31 2004-08-31 Alignment method of wafer Pending JP2006073603A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004252127A JP2006073603A (en) 2004-08-31 2004-08-31 Alignment method of wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004252127A JP2006073603A (en) 2004-08-31 2004-08-31 Alignment method of wafer

Publications (2)

Publication Number Publication Date
JP2006073603A JP2006073603A (en) 2006-03-16
JP2006073603A5 true JP2006073603A5 (en) 2007-01-18

Family

ID=36153941

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004252127A Pending JP2006073603A (en) 2004-08-31 2004-08-31 Alignment method of wafer

Country Status (1)

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JP (1) JP2006073603A (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4803703B2 (en) * 2005-02-28 2011-10-26 日東電工株式会社 Semiconductor wafer position determination method and apparatus using the same
JP2007288010A (en) * 2006-04-19 2007-11-01 Lintec Corp Device and method for cutting sheet
JP4607910B2 (en) * 2007-01-16 2011-01-05 東京エレクトロン株式会社 Substrate transfer device and vertical heat treatment device
JP4564022B2 (en) * 2007-01-16 2010-10-20 東京エレクトロン株式会社 Substrate transfer device and vertical heat treatment device
JP4616873B2 (en) * 2007-09-28 2011-01-19 東京エレクトロン株式会社 Semiconductor manufacturing apparatus, substrate holding method, and program
JP4782892B2 (en) * 2008-04-11 2011-09-28 リンテック株式会社 Sheet peeling apparatus and peeling method
US8570516B2 (en) 2008-09-12 2013-10-29 Cognex Corporation Infrared direct illumination machine vision technique for semiconductor processing equipment
JP5381046B2 (en) * 2008-11-28 2014-01-08 株式会社Ｓｕｍｃｏ Semiconductor wafer scribing apparatus and scribing system including the same
CN109473388B (en) * 2017-09-07 2020-11-24 上海新昇半导体科技有限公司 Edge finding device for wafer
KR102555605B1 (en) 2018-04-24 2023-07-18 디스코 하이테크 유럽 게엠베하 Alignment device and alignment method
JP7325903B2 (en) * 2019-07-12 2023-08-15 株式会社ディスコ Wafer processing method

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