CN109473388B - Edge finding device for wafer - Google Patents
Edge finding device for wafer Download PDFInfo
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- CN109473388B CN109473388B CN201710802096.7A CN201710802096A CN109473388B CN 109473388 B CN109473388 B CN 109473388B CN 201710802096 A CN201710802096 A CN 201710802096A CN 109473388 B CN109473388 B CN 109473388B
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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Abstract
The invention provides a wafer edge-searching device, comprising: the rotatable supporting device is arranged in the liquid and used for fixedly supporting the wafer to be edge-searched which is arranged in the liquid and driving the wafer to be edge-searched to rotate, wherein a notch is arranged at the edge of the wafer to be edge-searched; the transmitter and the receiver are oppositely arranged in the liquid on two sides of the surface of the wafer to be edge-searched, the transmitter is used for transmitting continuous sound waves, the receiver is used for receiving the sound waves, and a contact point is arranged between a path of the sound waves and a supporting plane of the supporting device so that the receiver can receive the sound waves and send a control signal to the control device when the notch rotates to intersect with the path of the sound waves; and the control device is used for receiving the control signal output from the receiver, calculating the position of the notch, and controlling the support device to rotate so as to enable the notch of the wafer to be edge-searched to rotate to a fixed position.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to an edge finding device for a wafer.
Background
The 12-inch semiconductor industry often determines the position of a silicon wafer through a notch (notch) to realize the opposite side of the silicon wafer. Notch refers to a Notch intentionally formed in a wafer (wafer).
Edge finding is usually performed by a red laser in the current process. I.e. the wafer is placed on the sample stage, assuming that the laser is blocked by the wafer at this time. When the wafer starts to rotate, when the wafer rotates to the notch position, the laser emitted by the red laser can reach the laser collector through the notch. The position information of the notch on the wafer can be obtained through calculation.
However, this method cannot be implemented for wafers in water because water has a strong absorption of red light, and the number of photons that reach the light receiver through the notch when the wafer is rotated at high speed is inherently small. Once loss occurs in water, the optical detector cannot capture enough transmitted optical signals, and edge finding fails.
For the silicon wafer manufacturing industry, a chemical mechanical polishing process is often called a wet-out process, i.e., after a certain amount of polishing, a wafer needs to be immersed in water when the polishing is finished, and then the wafer is immediately transferred to a cleaning machine for cleaning. This is because the polished wafer surface is stuck with a slurry (slurry). The slurry (slurry) is generally alkaline and causes corrosion to the wafer, and if the slurry (slurry) is not immersed in water, the surface of the wafer is dried, and the slurry (slurry) is dried. The current laser edge searching obviously cannot meet the requirement of edge searching in water.
In view of the above problems, it is desirable to provide a new wafer edge finder.
Disclosure of Invention
In this summary, concepts in a simplified form are introduced that are further described in the detailed description. This summary of the invention is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used as an aid in determining the scope of the claimed subject matter.
Aiming at the defects of the prior art, the invention provides a wafer edge searching device, which comprises:
the rotatable supporting device is arranged in the liquid and used for fixedly supporting the wafer to be edge-searched which is arranged in the liquid and driving the wafer to be edge-searched to rotate, wherein a notch is arranged at the edge of the wafer to be edge-searched;
the transmitter and the receiver are oppositely arranged in the liquid on two sides of the surface of the wafer to be edge-searched, the transmitter is used for transmitting continuous sound waves, the receiver is used for receiving the sound waves, a path of the sound waves and a supporting plane of the supporting device are provided with contact points, and when the notch rotates to be intersected with the path of the sound waves, the receiver can receive the sound waves and send a control signal to a control device;
and the control device is used for receiving the control signal output from the receiver, calculating the position of the notch, and controlling the supporting device to rotate so as to enable the notch of the wafer to be edge-searched to rotate to a fixed position.
Illustratively, the transmitter is configured to transmit a continuous pulsed acoustic wave.
Illustratively, the distance between the contact point and the center of the support plane is greater than the minimum distance between the notch and the center point of the wafer to be edge-searched and less than the maximum distance between the notch and the center point of the wafer.
Illustratively, the control device includes a computer.
Exemplarily, the supporting device comprises:
a support portion in which a central through hole extending in an axial direction of the support portion is provided;
the supporting part comprises a supporting part and a plurality of supporting arms, the supporting part is provided with a through hole, the supporting arms are arranged in the through hole, the through hole is communicated with the through hole, the supporting arms are arranged in the through hole, and the supporting parts are arranged in the through hole;
an edge grip movably disposed on the base plate at the second end of each of the support arms and having a top surface higher than a top surface of the support arms;
and the vacuumizing device is connected with the supporting part and used for controlling the edge gripper to move inwards or outwards so as to clamp or loosen the wafer to be edge-searched.
Illustratively, the support arms include the bottom plate and the top plate enclosing the cavity and extending outwardly of the top plate ends at the second ends, the top plate of each support arm being connected at the first ends.
Exemplarily, the supporting device further comprises:
a baffle fixedly disposed on the floor at the second end of the support arm and projecting upwardly from the floor;
a breathable waterproof membrane covering the opening of the cavity adjacent the baffle and the edge grip disposed on the bottom panel between the baffle and the breathable waterproof membrane;
the elastic component is connected with the baffle and the edge gripper, and the extending direction of the elastic component is parallel to the bottom plate.
Exemplarily, the method further comprises the following steps: and the limiting component is arranged between the baffle and the edge gripper and is fixedly arranged on the side wall of the baffle.
Illustratively, the resilient member includes a normally closed spring for maintaining the edge grip in contact with the stop member in the released state.
Illustratively, the material of the breathable waterproof membrane comprises polytetrafluoroethylene.
Illustratively, the included angles between adjacent support arms of the plurality of support arms are equal, and the support arms are located in the same plane.
Illustratively, a vertical distance between an outer side surface of the air-permeable waterproof membrane and an axis of the support is smaller than a radius of the wafer to be edge-sought, and a vertical distance between an outer side surface of the edge gripper and an axis of the support is larger than the radius of the wafer to be edge-sought.
Exemplarily, the method further comprises the following steps: and the mechanical arm is used for grabbing the wafer to be edge-searched and moving the wafer from one position to another position.
The wafer edge searching device comprises a supporting device, a control device, and a receiver and a transmitter which are arranged on two sides of the surface of a wafer to be edge searched, wherein the transmitter transmits sound waves as a signal source to realize edge searching in liquid such as water. When the wafer to be edge-searched rotates to a corresponding angle, the sound wave penetrates through the notch to enable the receiver opposite to the transmitter to receive the sound wave signal, the control device receives a control signal output by the receiver to calculate the position of the notch and controls the support device to rotate so that the notch of the wafer to be edge-searched rotates to a fixed position, edge searching of the wafer edge-searching device in the liquid is achieved, the edge-searching function is achieved, the problem that grinding fluid cannot be cleaned due to drying of the surface of the wafer is solved, and the yield of the wafer is improved.
Drawings
The following drawings of the invention are included to provide a further understanding of the invention. The drawings illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.
In the drawings:
FIGS. 1A-1B are schematic views showing the location of contaminants in a notched alignment;
FIG. 2 is a schematic diagram of a wafer edge finder according to an embodiment of the present invention;
FIG. 3 illustrates a graph of transmitted signal strength versus time and a graph of received signal strength versus time for one embodiment of the present invention;
FIG. 4 shows a schematic view of a support device according to an embodiment of the invention;
FIG. 5A shows a cross-sectional view of the support device taken along section 2 of FIG. 4 with the edge grip disengaged;
FIG. 5B shows a cross-sectional view of the support device taken along section 2 of FIG. 4 with the edge grip clamped;
FIG. 6 is a schematic diagram illustrating sequential steps of the wafer edge-finding method.
Detailed Description
In the following description, numerous specific details are set forth in order to provide a more thorough understanding of the present invention. It will be apparent, however, to one skilled in the art, that the present invention may be practiced without one or more of these specific details. In other instances, well-known features have not been described in order to avoid obscuring the invention.
It is to be understood that the present invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. In the drawings, the size and relative sizes of layers and regions may be exaggerated for clarity. Like reference numerals refer to like elements throughout.
It will be understood that when an element or layer is referred to as being "on," "adjacent to," "connected to," or "coupled to" other elements or layers, it can be directly on, adjacent to, connected or coupled to the other elements or layers or intervening elements or layers may be present. In contrast, when an element is referred to as being "directly on," "directly adjacent to," "directly connected to" or "directly coupled to" other elements or layers, there are no intervening elements or layers present. It will be understood that, although the terms first, second, third, etc. may be used to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the present invention.
Spatial relational terms such as "under," "below," "under," "above," "over," and the like may be used herein for convenience in describing the relationship of one element or feature to another element or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, then elements or features described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the exemplary terms "under" and "under" can encompass both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatial descriptors used herein interpreted accordingly.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. As used herein, the term "and/or" includes any and all combinations of the associated listed items.
Embodiments of the invention are described herein with reference to cross-sectional illustrations that are schematic illustrations of idealized embodiments (and intermediate structures) of the invention. As such, variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and/or tolerances, are to be expected. Thus, embodiments of the invention should not be limited to the particular shapes of regions illustrated herein but are to include deviations in shapes that result, for example, from manufacturing. For example, an implanted region shown as a rectangle will typically have rounded or curved features and/or implant concentration gradients at its edges rather than a binary change from implanted to non-implanted region. Also, a buried region formed by implantation may result in some implantation in the region between the buried region and the surface through which the implantation is performed. Thus, the regions illustrated in the figures are schematic in nature and their shapes are not intended to illustrate the actual shape of a region of a device and are not intended to limit the scope of the present invention.
In order to provide a thorough understanding of the present invention, a detailed structure will be set forth in the following description in order to explain the present invention. The following detailed description of the preferred embodiments of the invention, however, the invention is capable of other embodiments in addition to those detailed.
At present, under the condition that the edge cannot be automatically searched, the following problems can be caused:
problem one, when carrying out vertical pulling drying to the wafer, in order to realize pulling drying, the area of contact when leaving the water is minimum, because the breach is a V type groove usually, V type groove opening both sides all contact level when going out water, and remaining water stain area is also the biggest, often does not want final play water of breach (notch) department, and can't realize this function to the grooving is sought the limit.
Second, if a cleaning machine has a problem, for example, as shown in fig. 1A and 1B, a robot (robot)11, a wafer boat (wafer) 12, etc. of the cleaning machine is contaminated 10, if there is an edge-seeking and edge-aligning operation (i.e. notch alignment), an area contaminated by a wafer usually has a fixed position, and at present, since an edge cannot be automatically sought in water, even a wafer needs to be manually moved before entering the cleaning machine to complete a wafer edge-aligning operation to perform troubleshooting (bottom trimming), the above-mentioned problem causes a significant loss to a product yield, and the manual edge-seeking consumes manpower and material resources, which increases a production cost.
In view of the above problems, the present invention provides an edge finding device for edge finding and positioning a wafer to be edge-found having a notch, comprising:
the rotatable supporting device is arranged in the liquid and used for fixedly supporting the wafer to be edge-searched which is arranged in the liquid and driving the wafer to be edge-searched to rotate, wherein a notch is arranged at the edge of the wafer to be edge-searched;
the transmitter and the receiver are oppositely arranged in the liquid on two sides of the surface of the wafer to be edge-searched, the transmitter is used for transmitting continuous sound waves, the receiver is used for receiving the sound waves, a path of the sound waves and a supporting plane of the supporting device are provided with contact points, and when the notch rotates to be intersected with the path of the sound waves, the receiver can receive the sound waves and send a control signal to a control device;
and the control device is used for receiving the control signal output from the receiver, calculating the position of the notch, and controlling the supporting device to rotate so as to enable the notch of the wafer to be edge-searched to rotate to a fixed position.
The wafer edge searching device comprises a supporting device, a control device, and a receiver and a transmitter which are arranged on two sides of the surface of a wafer to be edge searched, wherein the transmitter transmits sound waves as a signal source to realize edge searching in liquid such as water. When the wafer to be edge-searched rotates to a corresponding angle, the sound wave penetrates through the notch to enable the receiver opposite to the transmitter to receive the sound wave signal, the control device receives a control signal output by the receiver to calculate the position of the notch and controls the support device to rotate so that the notch of the wafer to be edge-searched rotates to a fixed position, edge searching of the wafer edge-searching device in the liquid is achieved, the edge-searching function is achieved, the problem that grinding fluid cannot be cleaned due to drying of the surface of the wafer is solved, and the yield of the wafer is improved.
Next, the wafer edge finder of the present invention will be described in detail with reference to fig. 2, fig. 3, fig. 4, fig. 5A, fig. 5B and fig. 6.
As an example, as shown in fig. 2, the wafer edge finder of the present invention is used to perform edge finding positioning on an edge-to-be-found wafer 21 having a notch 25, where the notch may be a V-shaped groove disposed at an edge of the edge-to-be-found wafer 21, or a notch with another shape.
Illustratively, the wafer to be edge-searched is, for example, a silicon wafer, which may be after the chemical mechanical polishing of the wafer to be edge-searched is finished, the wafer to be edge-searched is in a hydrophilic state, and the surface is covered with water molecules.
In order to prevent the grinding fluid from drying on the wafer to be edge-searched, the polished wafer to be edge-searched needs to be placed in the liquid, especially water, and at this time, in order to realize the edge-searching of the wafer to be edge-searched in the water, the invention provides an edge-searching device for the wafer, as shown in fig. 2.
In one example, the wafer edge finder comprises a rotatable supporting device 22, the supporting device 22 is disposed in a liquid 20, particularly water, and the supporting device 22 is used for fixedly supporting the wafer 21 to be edge-found, which is disposed in the liquid 20, and for driving the wafer 21 to be edge-found to rotate.
Wherein the support means may be any suitable rotatable support means known to the person skilled in the art, such as a rotating carrier table, or a support stand, etc.
Illustratively, the support device rotates with a line passing through a center of a support plane of the support device and perpendicular to the support plane as a rotation axis.
The supporting plane is also the plane where the wafer to be edge-searched is placed on the supporting device.
Further, the wafer edge finder further comprises a transmitter 23, wherein the transmitter 23 is disposed in the liquid 20 and is used for transmitting a continuous sound wave 24, that is, transmitting a continuous sound wave signal, as shown in fig. 3.
The transmitter 23 may be any transmitter known to those skilled in the art capable of transmitting an acoustic signal.
Illustratively, the emitter 23 is used for emitting continuous pulse sound waves, such as pulse sound waves with the working frequency of 3-97 kHz.
Illustratively, the wafer edge-seeking device of the present invention further includes a receiver 26 disposed in the liquid 20 for receiving the acoustic wave emitted from the emitter 23, wherein the emitter 23 and the receiver 26 are disposed on opposite sides of the surface of the wafer 21 to be edge-sought, for example, the emitter 23 is disposed below the wafer 21 to be edge-sought and the receiver 26 is disposed above the wafer 21 to be edge-sought, or the emitter 23 is disposed above the wafer 21 to be edge-sought and the receiver 26 is disposed below the wafer 21 to be edge-sought.
Illustratively, the receiver is able to receive an acoustic signal only when the transmitter transmits an acoustic wave that is passing through the gap 25, as shown in FIG. 3.
In one example, the path of the acoustic wave 24 and the support plane of the support device have a contact point such that when the gap 25 rotates to intersect the path of the acoustic wave 24, the receiver can receive the acoustic wave and send a control signal to a control device, while otherwise the acoustic wave 24 emitted by the transmitter is blocked by the edge-seeking wafer 21 such that the receiver 26 does not receive the acoustic wave signal.
Illustratively, the path of the acoustic wave 24 and the supporting plane of the supporting device 22 have a contact point, and the distance between the contact point and the center of the supporting plane is greater than the minimum distance between the notch and the center point of the wafer to be edge-searched and less than the maximum distance between the notch and the center point of the wafer, so as to ensure that the receiver can receive the acoustic wave and send a control signal to a control device only when the notch 25 rotates to intersect with the path of the acoustic wave 24, and otherwise, the receiver cannot receive the acoustic wave signal due to the blockage of the wafer to be edge-searched.
For example, the receiver may be a receiving transducer, and the receiving transducer is a transducer capable of converting an acoustic wave signal in water into an electrical signal, that is, the receiver converts the acoustic wave signal into the electrical signal after receiving the acoustic wave signal, and outputs the electrical signal to the control device as the control signal.
In one example, the wafer edge searching device comprises a control device (not shown) for receiving the control signal output from the receiver, calculating the position of the notch, and controlling the support device to rotate, so that the notch of the wafer to be edge searched is rotated to a fixed position, and the edge searching of the wafer is realized.
The control device comprises a computer, wherein the computer is used for receiving the control signal output from the receiver, calculating the position of the notch, and controlling the supporting device to rotate, so that the notch of the wafer to be edge-searched rotates to a fixed position, and the edge searching of the wafer is realized.
Illustratively, the control device controls a driving device of the supporting device, and the driving device drives the supporting device to rotate so as to rotate the notch of the wafer to be edge-searched to a fixed position.
In one example, in order to realize the transfer of the edge-seeking wafer, a robot (not shown) is further included, and the robot is used for grabbing the edge-seeking wafer and moving the edge-seeking wafer from one position to another position, for example, grabbing the polished edge-seeking wafer and placing the polished edge-seeking wafer on a supporting device, or grabbing the edge-seeking wafer after the edge seeking is completed and directly placing the edge-seeking wafer in a carrier (carrier).
The wafer edge searching device can realize the edge searching of the wafer in water, thereby avoiding the problem that the grinding fluid is dried on the surface of the wafer and can not be cleaned, improving the yield of the wafer, avoiding the manual movement of the wafer to align the wafer by automatic edge searching, and saving the labor and the production cost.
As an example, in order to support the edge-seeking wafer in liquid (e.g., water), the present invention further provides a supporting device 22, as shown in fig. 4, 5A and 5B, the supporting device 22 includes a supporting portion 220, and a central through hole 221 extending in an axial direction of the supporting portion 220 is provided in the supporting portion 220.
Illustratively, the support portion may be a support rod having a central through hole, or other suitable component capable of serving as a support.
Illustratively, the bottom end of the supporting part is fixedly installed in a trough body for containing liquid, for example, fixedly installed on the bottom or the side wall of the trough body.
In one example, the supporting part can also be rotatably installed in the groove body, and the supporting part is driven to rotate so as to realize the rotation of the whole supporting device.
Further, the supporting device further comprises a plurality of supporting arms, each supporting arm comprises a first end and a second end which are oppositely arranged, the first end of each supporting arm is connected with the top end of the supporting portion 220, the second end is located on the outer side of the side wall of the supporting portion 220, a cavity 225 which extends along the axial direction of the supporting arm is arranged in each supporting arm, and the cavity 225 is communicated with the central through hole 221.
Illustratively, the number of the supporting arms can be any suitable number, and for better supporting effect, the number of the supporting arms is preferably at least 3, for example, the number of the supporting arms can be 4, 5, 6, etc.
For example, in order to balance the stress, the included angles between adjacent support arms in the plurality of support arms are equal, that is, the support arms are uniformly and respectively arranged on the outer sides of the side walls of the support portion.
It is also possible, by way of example, for the support arms to lie in the same plane, which is parallel to the support plane. In one example, the plane of the support arm is perpendicular to the axis of the support portion.
In one example, as shown in fig. 5A and 5B, the support arms include a bottom plate 223 and a top plate 224, the bottom plate 223 and the top plate enclose a cavity 225, and at the second end, the bottom plate 223 extends outward from the end of the top plate, the top plate 224 of each support arm is connected at the first end, as shown, the top plate 224 is connected as a whole, and the bottom plate and the support portion are connected to achieve connection of the support arm and the branch portion.
In one example, the cavities 225 of each of the support arms communicate with each other and with the central through-hole 221.
In one example, when the number of the support arms is even, the axes of the opposite support arms are located on the same straight line.
The support arm can be a round support rod, a square support rod or other support rods suitable for forming.
In one example, the supporting arm may be fixedly connected to the supporting portion, for example, by welding or screwing, or other suitable means, for example, when the supporting arm is fixedly connected to the supporting portion, the rotation of the supporting portion may drive the rotation of the entire supporting device, so as to drive the rotation of the wafer to be edge-searched.
In one example, the support arm may also be rotatably connected to the support portion, the support portion is fixed, and the drive device drives the support arm to rotate integrally, so as to drive the wafer to be edge-searched to rotate.
In one example, as shown in fig. 5B and 5A, the axis of the supporting portion is perpendicular to the plane where all the supporting arms are located, and the supporting device uses the axis of the supporting portion as a rotating shaft.
In one example, the support device 22 further includes an edge gripper 227 movably disposed on the bottom plate 223 at the second end of each support arm, and a top surface of the edge gripper 227 is higher than a top surface of the support arm, e.g., the top surface of the edge gripper 227 is higher than a top surface of the top plate 224, so that the edge gripper 227 can grip a wafer to be edge-sought while the wafer to be edge-sought floats above the support arm.
In one example, the support device further comprises a baffle 226, the baffle 226 being fixedly disposed on the base plate 223 at the second end of the support arm and projecting upwardly from the base plate 223.
The baffle 226 may be fixedly connected to the base plate by welding or other suitable means, and the baffle 226 may also be integrally formed with the base plate 223.
In one example, the support device further comprises a breathable waterproof membrane 228, the breathable waterproof membrane 228 enclosing the opening of the cavity 225 adjacent the baffle 226, and the edge grip 227 is disposed on the bottom panel 223 between the baffle 226 and the breathable waterproof membrane 228.
The gas-permeable, waterproof membrane 228 may be any suitable membrane known to those skilled in the art that is capable of passing gas but not water, for example, the material of the gas-permeable, waterproof membrane 228 may include Polytetrafluoroethylene (PTFE).
In one example, the supporting device 22 further includes an elastic member 229, the elastic member 229 connects the blocking plate 226 and the edge grip 227, and the elastic member 229 extends in a direction parallel to the bottom plate 223.
Optionally, the elastic member 229 is a normally closed elastic member 229, such as a normally closed spring. The resilient member may also be other suitable resilient members.
In one example, the support device 22 further includes a position limiting part 2210, and the position limiting part 2210 is disposed between the blocking plate 226 and the edge grip 227 and fixedly installed on a side wall of the blocking plate 226 to limit the edge grip 227. The stop member may be secured to the side wall of the baffle by, for example, welding. The edge gripper can be pulled by the elastic component due to the use of the limiting component. Further, the elastic component comprises a normally closed spring for keeping the edge gripper in contact with the limiting component in the loosening state.
In one example, the vertical distance between the outer side surface of the air-permeable waterproof membrane 228 and the axis of the supporting part is smaller than the radius of the edge finding wafer 21, so that the edge of the edge finding wafer 21 is positioned outside the air-permeable waterproof membrane 228, thereby ensuring that the edge of the edge finding wafer can be clamped by the edge gripper, and the vertical distance between the outer side surface of the edge gripper and the axis of the supporting part is larger than the radius of the edge finding wafer, so that the edge finding wafer can be easily placed in the area surrounded by the edge gripper 227.
In one example, the inside surface of the edge finger 227 may match the edge of the wafer, and the bottom surface of the edge finger 227 matches the surface of the base plate 223.
Illustratively, the edge fingers 227 are movably mounted to the base plate 223, such as by sliding rails or other suitable attachment.
In one example, the supporting device 22 further includes a vacuum device connected to the supporting portion 220 for controlling the edge gripper to move inward or outward to clamp or unclamp the wafer 21 to be edge-sought.
Illustratively, the vacuum-pumping means includes a vacuum pump (not shown) for pumping vacuum to the central through-hole 221 and the cavity 225, and a vacuum valve 222 provided on the support 220 for being opened when the vacuum is pumped and being closed when the vacuum-pumping means is not operated.
As shown in fig. 5A, when the wafer 21 to be edge-sought is held by the robot above the supporting device, the edge gripper is opened by the elastic member (e.g., spring), as shown in fig. 5B, the vacuum pumping device controls the inward or outward movement of the edge gripper, for example, during vacuum pumping, the edge gripper pulls the elastic member 229 to move inward due to the difference in gas pressure between the inner side and the outer side of the edge gripper, so as to clamp the wafer to be edge-sought.
When the vacuum suction force exists, the suction force can be transmitted to the edge hand grip through the breathable waterproof membrane, so that the edge hand grip overcomes the force of an elastic component (such as a spring) to fold and clamp the wafer to be edge-searched.
Specifically, the edge finding of the edge-to-be-found wafer by the wafer apparatus according to the present invention, as shown in fig. 6, includes: after polishing the wafer to be edge-searched, the wafer to be edge-searched is in hydrophilic property, and the surface is covered by liquid (such as water molecules); placing the edge-searching wafer in hydrophilic property on the supporting device by using a mechanical arm, and performing liquid (such as water) edge searching by using the wafer edge-searching device; after seeking the limit, directly place the wafer in the load-bearing device of liquid (for example water) by the manipulator again, the wafer is covered by liquid at whole in-process, when having guaranteed to seek limit function normal clear, it can not remain on the wafer surface by the drying still to have guaranteed that the lapping liquid after having just avoided the drying can not get rid of and cause the problem of corruption to the wafer by the cleaning machine and appear, simultaneously owing to having sought the limit, the breach alignment of wafer is placed, even the pollutant appears on the wafer, this pollutant also can appear in fixed position, be convenient for realize troubleshooting (bottom smoothing).
In summary, the wafer edge finding device of the invention realizes edge finding in liquid (such as water), improves product yield, and reduces production cost.
The present invention has been illustrated by the above embodiments, but it should be understood that the above embodiments are for illustrative and descriptive purposes only and are not intended to limit the invention to the scope of the described embodiments. Furthermore, it will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and that many variations and modifications may be made in accordance with the teachings of the present invention, which variations and modifications are within the scope of the present invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (13)
1. An edge finder for a wafer, comprising:
rotatable strutting arrangement sets up in liquid for fixed support is arranged in waiting to seek limit wafer in the liquid, and be used for driving wait to seek limit wafer rotatory, wherein, be provided with the breach in the edge of waiting to seek limit wafer, strutting arrangement includes:
a support portion in which a central through hole extending in an axial direction of the support portion is provided;
the supporting device comprises a supporting part, a plurality of supporting arms and a plurality of supporting arms, wherein each supporting arm comprises a first end and a second end which are arranged oppositely, the first end of each supporting arm is connected with the top end of the supporting part, a cavity extending along the axial direction of the supporting arm is arranged in each supporting arm, and the cavity is communicated with the central through hole;
an edge grip movably disposed on the base plate at the second end of each of the support arms and having a top surface higher than a top surface of the support arms;
the vacuumizing device is connected with the supporting part and used for controlling the edge gripper to move inwards or outwards so as to clamp or loosen the wafer to be edge-searched;
a baffle fixedly disposed on the floor at the second end of the support arm and projecting upwardly from the floor;
a breathable waterproof membrane covering the opening of the cavity adjacent the baffle;
the elastic component is connected with the baffle and the edge gripper;
the transmitter and the receiver are oppositely arranged in the liquid on two sides of the surface of the wafer to be edge-searched, the transmitter is used for transmitting continuous sound waves, the receiver is used for receiving the sound waves, a path of the sound waves and a supporting plane of the supporting device are provided with contact points, and when the notch rotates to be intersected with the path of the sound waves, the receiver can receive the sound waves and send a control signal to a control device;
and the control device is used for receiving the control signal output from the receiver, calculating the position of the notch, and controlling the supporting device to rotate so as to enable the notch of the wafer to be edge-searched to rotate to a fixed position.
2. The wafer edge finder device as claimed in claim 1, wherein the transmitter is configured to transmit a continuous pulsed acoustic wave.
3. The wafer edge finder device as claimed in claim 1, wherein the distance between the contact point and the center of the support plane is greater than the minimum distance between the notch and the center point of the wafer to be edge-found and less than the maximum distance between the notch and the center point of the wafer.
4. The wafer edge finder device as claimed in claim 1, wherein the control device comprises a computer.
5. The wafer edge finder device of claim 1,
the second end is located outside the side wall of the support portion.
6. The wafer edge finder device of claim 1, wherein the support arms include the bottom plate and a top plate enclosing the cavity and extending outwardly of ends of the top plate at the second end, the top plate of each support arm being connected at the first end.
7. The wafer edge finder device as claimed in claim 1, wherein the support device further comprises:
the edge hand grab is arranged on the bottom plate between the baffle and the breathable waterproof film;
the extending direction of the elastic component is parallel to the bottom plate.
8. The wafer edge finder device as claimed in claim 1, further comprising: and the limiting component is arranged between the baffle and the edge gripper and is fixedly arranged on the side wall of the baffle.
9. The wafer edge finder device as claimed in claim 8, wherein the resilient member includes a normally closed spring for maintaining the edge finger in contact with the stop member in the released state.
10. The wafer edge finder device as claimed in claim 1, wherein the material of the air-permeable waterproof membrane comprises polytetrafluoroethylene.
11. The wafer edge finder device as claimed in claim 1, wherein the angles between adjacent support arms of the plurality of support arms are equal and the support arms are located in the same plane.
12. The wafer edge finder of claim 1, wherein a vertical distance between an outer side surface of the gas-permeable waterproof membrane and an axis of the support is smaller than a radius of the wafer to be edge-found, and a vertical distance between an outer side surface of the edge gripper and an axis of the support is larger than the radius of the wafer to be edge-found.
13. The wafer edge finder device as claimed in claim 1, further comprising: and the mechanical arm is used for grabbing the wafer to be edge-searched and moving the wafer from one position to another position.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710802096.7A CN109473388B (en) | 2017-09-07 | 2017-09-07 | Edge finding device for wafer |
| TW106145672A TWI639189B (en) | 2017-09-07 | 2017-12-26 | Edge position controller for a wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710802096.7A CN109473388B (en) | 2017-09-07 | 2017-09-07 | Edge finding device for wafer |
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| Publication Number | Publication Date |
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| CN109473388A CN109473388A (en) | 2019-03-15 |
| CN109473388B true CN109473388B (en) | 2020-11-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201710802096.7A Active CN109473388B (en) | 2017-09-07 | 2017-09-07 | Edge finding device for wafer |
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| Country | Link |
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| CN (1) | CN109473388B (en) |
| TW (1) | TWI639189B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110459488B (en) * | 2019-07-10 | 2021-06-18 | 福建省福联集成电路有限公司 | Intelligent ranging wafer edge searching device and method |
| CN110911325B (en) * | 2019-11-29 | 2024-03-26 | 西安奕斯伟材料科技股份有限公司 | Wafer conveying blade |
| TWI799724B (en) * | 2020-07-23 | 2023-04-21 | 三和技研股份有限公司 | Wafer notch leveling device |
| CN113658901B (en) * | 2021-10-21 | 2022-01-21 | 西安奕斯伟材料科技有限公司 | Method and system for positioning center of V-shaped notch of wafer and computer storage medium |
| CN118016588A (en) * | 2024-04-07 | 2024-05-10 | 无锡尚积半导体科技有限公司 | Multifunctional manipulator for etching |
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Also Published As
| Publication number | Publication date |
|---|---|
| TWI639189B (en) | 2018-10-21 |
| CN109473388A (en) | 2019-03-15 |
| TW201913788A (en) | 2019-04-01 |
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