JP2006073603A5 - - Google Patents

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Publication number
JP2006073603A5
JP2006073603A5 JP2004252127A JP2004252127A JP2006073603A5 JP 2006073603 A5 JP2006073603 A5 JP 2006073603A5 JP 2004252127 A JP2004252127 A JP 2004252127A JP 2004252127 A JP2004252127 A JP 2004252127A JP 2006073603 A5 JP2006073603 A5 JP 2006073603A5
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JP
Japan
Prior art keywords
wafer
alignment method
detected
outer peripheral
peripheral portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004252127A
Other languages
English (en)
Japanese (ja)
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JP2006073603A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2004252127A priority Critical patent/JP2006073603A/ja
Priority claimed from JP2004252127A external-priority patent/JP2006073603A/ja
Publication of JP2006073603A publication Critical patent/JP2006073603A/ja
Publication of JP2006073603A5 publication Critical patent/JP2006073603A5/ja
Pending legal-status Critical Current

Links

JP2004252127A 2004-08-31 2004-08-31 ウエハのアライメント方法 Pending JP2006073603A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004252127A JP2006073603A (ja) 2004-08-31 2004-08-31 ウエハのアライメント方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004252127A JP2006073603A (ja) 2004-08-31 2004-08-31 ウエハのアライメント方法

Publications (2)

Publication Number Publication Date
JP2006073603A JP2006073603A (ja) 2006-03-16
JP2006073603A5 true JP2006073603A5 (enrdf_load_stackoverflow) 2007-01-18

Family

ID=36153941

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004252127A Pending JP2006073603A (ja) 2004-08-31 2004-08-31 ウエハのアライメント方法

Country Status (1)

Country Link
JP (1) JP2006073603A (enrdf_load_stackoverflow)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4803703B2 (ja) * 2005-02-28 2011-10-26 日東電工株式会社 半導体ウエハの位置決定方法およびこれを用いた装置
JP2007288010A (ja) * 2006-04-19 2007-11-01 Lintec Corp シート切断装置及び切断方法
JP4607910B2 (ja) * 2007-01-16 2011-01-05 東京エレクトロン株式会社 基板搬送装置及び縦型熱処理装置
JP4564022B2 (ja) * 2007-01-16 2010-10-20 東京エレクトロン株式会社 基板搬送装置及び縦型熱処理装置
JP4616873B2 (ja) * 2007-09-28 2011-01-19 東京エレクトロン株式会社 半導体製造装置、基板保持方法及びプログラム
KR101464488B1 (ko) 2008-04-11 2014-11-24 린텍 가부시키가이샤 시트 박리 장치 및 박리 방법
US8570516B2 (en) 2008-09-12 2013-10-29 Cognex Corporation Infrared direct illumination machine vision technique for semiconductor processing equipment
JP5381046B2 (ja) * 2008-11-28 2014-01-08 株式会社Ｓｕｍｃｏ 半導体ウェーハのスクライブ装置、およびそれを備えたスクライブシステム
CN109473388B (zh) * 2017-09-07 2020-11-24 上海新昇半导体科技有限公司 一种晶圆寻边装置
KR102555605B1 (ko) 2018-04-24 2023-07-18 디스코 하이테크 유럽 게엠베하 얼라인먼트 장치 및 얼라인먼트 방법
JP7325903B2 (ja) * 2019-07-12 2023-08-15 株式会社ディスコ ウェーハの加工方法
CN115172331B (zh) * 2021-04-06 2025-05-27 芯恩（青岛）集成电路有限公司 晶圆对准标记、制作方法、晶圆对准装置及晶圆对准方法

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