JP2006070252A5 - - Google Patents

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Publication number
JP2006070252A5
JP2006070252A5 JP2005218644A JP2005218644A JP2006070252A5 JP 2006070252 A5 JP2006070252 A5 JP 2006070252A5 JP 2005218644 A JP2005218644 A JP 2005218644A JP 2005218644 A JP2005218644 A JP 2005218644A JP 2006070252 A5 JP2006070252 A5 JP 2006070252A5
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JP
Japan
Prior art keywords
methyl
pentene
resin composition
poly
molding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2005218644A
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English (en)
Japanese (ja)
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JP2006070252A (ja
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Publication date
Application filed filed Critical
Priority to JP2005218644A priority Critical patent/JP2006070252A/ja
Priority claimed from JP2005218644A external-priority patent/JP2006070252A/ja
Publication of JP2006070252A publication Critical patent/JP2006070252A/ja
Publication of JP2006070252A5 publication Critical patent/JP2006070252A5/ja
Withdrawn legal-status Critical Current

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JP2005218644A 2004-08-03 2005-07-28 ポリ４−メチル−１−ペンテン樹脂組成物、フィルムおよび電子部品封止体製造用型枠 Withdrawn JP2006070252A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005218644A JP2006070252A (ja) 2004-08-03 2005-07-28 ポリ４−メチル−１−ペンテン樹脂組成物、フィルムおよび電子部品封止体製造用型枠

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004227209 2004-08-03
JP2005218644A JP2006070252A (ja) 2004-08-03 2005-07-28 ポリ４−メチル−１−ペンテン樹脂組成物、フィルムおよび電子部品封止体製造用型枠

Publications (2)

Publication Number Publication Date
JP2006070252A JP2006070252A (ja) 2006-03-16
JP2006070252A5 true JP2006070252A5 (OSRAM) 2008-09-04

Family

ID=36151199

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005218644A Withdrawn JP2006070252A (ja) 2004-08-03 2005-07-28 ポリ４−メチル−１−ペンテン樹脂組成物、フィルムおよび電子部品封止体製造用型枠

Country Status (1)

Country Link
JP (1) JP2006070252A (OSRAM)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5047575B2 (ja) * 2006-09-29 2012-10-10 三井化学株式会社 表面保護フィルム
EP2308924B1 (en) 2008-08-01 2013-01-02 Mitsui Chemicals, Inc. Poly(4-methyl-1-pentene) resin composition, film containing same, microporous film, battery separator and lithium ion battery
JP5684986B2 (ja) * 2010-01-08 2015-03-18 三井化学株式会社 樹脂組成物、およびその成形フィルム
JP5489729B2 (ja) * 2010-01-08 2014-05-14 三井化学株式会社 樹脂組成物、およびそれを含むフィルム
JP2012153775A (ja) * 2011-01-25 2012-08-16 Mitsui Chemicals Inc フィルム、前記フィルムの製造方法及びそれを用いたｌｅｄパッケージの製造方法
JP5871734B2 (ja) * 2011-07-07 2016-03-01 三井化学株式会社 表面保護フィルム
WO2013099876A1 (ja) 2011-12-27 2013-07-04 三井化学株式会社 ４－メチル－１－ペンテン（共）重合体組成物、該組成物からなるフィルムおよび中空成形体
JP5840064B2 (ja) * 2012-04-25 2016-01-06 三井化学株式会社 組成物、フィルム、前記フィルムの製造方法
JP5784858B1 (ja) 2013-09-10 2015-09-24 旭化成ケミカルズ株式会社 離型フィルム、成型体の製造方法
JP5920497B2 (ja) * 2014-03-31 2016-05-18 大日本印刷株式会社 半導体発光装置及び光半導体実装用基板
JP7144180B2 (ja) * 2018-04-24 2022-09-29 三井化学株式会社 積層体および離型紙
JP2019183175A (ja) * 2019-08-01 2019-10-24 ダイキン工業株式会社 離型フィルム

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