JP2006066248A - Spontaneous light-emitting panel and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent a short circuit of a draw-out wiring and a metallic sealing member, due to the occurrence of migration, and to make a selfluminous light-emitting panel operate normally. <P>SOLUTION: A photocurable adhesive layer 4 is formed at a bonding region La formed in the peripheral edge of the metallic sealing member 3 so as to form a sealing space M to cover the spontaneous light-emitting element part 2 on a transparent supporting substrate in which the selfluminous light emitting element part 2 has been formed, and the supporting substrate 1 and the sealing member 3 are pasted together. The layer is provided with the draw-out wiring 5 to be drawn-out outside the sealing space M from the selfluminous light-emitting element part 2, the draw-out wiring 5 is composed of a transparent conductive film 50 formed on the supporting substrate 1 and a metal electrode layer 51, containing a metal element easy to cause migration laminated on the transparent conductive film 50, and a water shut-off region 4h is formed at least at the outermost part of the adhesive layer 4 on the draw-out wiring 5 crossing the bonding region La. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a self-luminous panel and a method for manufacturing the same.

  A self-luminous panel typified by an organic EL (Electroluminescence) panel is not only a display of a mobile phone, a flat-screen TV, an information terminal, but also an in-vehicle function display, such as an instrument panel such as a speedometer, or a function display unit of an electrical appliance, It is expected to be applied to film displays, outdoor guidance displays, or lighting, and is actively developed and researched. Such a self-light-emitting panel generally employs a sealing structure that blocks the self-light-emitting element part from the outside air in order to maintain the light emission characteristics of the self-light-emitting element part. This sealing structure is a structure in which a sealing member is bonded to form a sealing space that covers the self light emitting element portion on the support substrate on which the self light emitting element portion is formed. A metal sealing member is used, and a photocurable adhesive layer is formed in the bonding region formed on the periphery of the metal sealing member, and the sealing member and the support substrate are bonded together from the transparent support substrate side. The adhesive is cured by irradiating light.

  In such a self-luminous panel, in order to drive the self-luminous element portion, COF (Chip On Film), COG (Chip On Glass) or the like is provided on the lead-out wiring drawn out of the sealing space from the self-luminous element portion. In view of this structure, it is necessary to take a structure in which the lead-out wiring is drawn from the inside of the sealing space to the outside across the above-described adhesion region. At this time, when a transparent conductive film such as ITO is adopted as the lead-out wiring, light is cured from the transparent support substrate side regardless of the presence of the lead-out wiring crossing the adhesion area, and the entire adhesion area is photocured. The adhesive can be cured. However, when light-impervious metal or alloy is used for the lead-out wiring, light is blocked at the part where the lead-out wiring crosses even if light is irradiated from the transparent support substrate side. There is a problem that the photocurable adhesive cannot be sufficiently cured, and the sealing property of the sealed space cannot be sufficiently ensured.

  In a self-luminous element such as an organic EL element that can obtain light emission luminance by current drive, it is desirable to reduce the resistance of the lead wiring as much as possible. Therefore, in order to ensure good light emission performance that meets user needs In addition, it is becoming indispensable to laminate a metal auxiliary electrode layer made of a metal such as low resistance silver (Ag), tin (Sn), lead (Pb), or an alloy thereof on the lead-out wiring. In that case, the above-mentioned problem of lack of sealing performance in the sealed space becomes apparent as an important problem.

In order to solve such a problem, a conventional technique described in Patent Document 1 below has been proposed. FIG. 1 is an explanatory diagram for explaining this prior art, and shows a plan view of an organic EL device and sectional views taken along lines XX ′ and YY ′. The organic EL device is a transparent electrode on a transparent substrate J1 J2, J2 ₀ is formed, on the transparent electrode J2 with lead wirings J4 formed by laminating a metal auxiliary electrode J3 on the transparent electrode J2 ₀ is formed An organic thin film J5 is formed, and a back electrode J6 is laminated on the organic thin film J5 so as to face the transparent electrode J2. Thus, an organic EL element is formed, and the sealing is positioned so as to cover the organic EL element. The stop member J7 is bonded to the transparent substrate J1 and the lead-out wiring J4 with a photocurable adhesive J8, and the organic EL element that becomes the self-light emitting element portion is sealed between the sealing member J7 and the transparent substrate J1. In particular, the exposed portion of the transparent electrode J2 (or the discontinuous portion of the metal auxiliary electrode J3) St is drawn in the lead-out wiring portion located in the adhesion region with the sealing member J7. Connect both ends of wiring J4 It is sea urchin formation.

JP 2002-198186 A

According to the prior art, since forming the exposed portion St of the transparent electrode J2 ₀ to the extraction wiring portion across the bonding area of the sealing member J7, when irradiated with light from the transparent supporting substrate J1 side, The adhesive J8 can be cured by the light that has passed through the exposed portion St, and the lack of sealing performance of the sealing space M can be eliminated.

  However, even a self-luminous panel employing such a conventional technique may cause another serious problem due to the influence of the lead-out wiring portion that crosses the adhesion region. This problem occurs when the metal auxiliary electrode layer of the lead-out wiring contains a metal element that easily undergoes migration, and occurs when a conductive metal sealing member is used as the sealing member. This is due to the migration phenomenon that occurs between the metal auxiliary electrode layer containing the metal element and the metal sealing member. Here, the metal elements that are likely to cause migration are silver (Ag), copper (Cu), tin (Sn), lead (Pb), and the like, and in particular, a metal auxiliary electrode layer containing silver or a silver alloy was used. In some cases, a migration phenomenon is likely to occur.

  This migration phenomenon is caused by the movement of silver ions through the insulating material due to the addition of moisture, etc., especially when the insulating material is in contact with silver or a silver alloy. It is known as a phenomenon that is formed. Various factors are considered as causes of migration, but it cannot be denied that moisture exists as one of the major factors.

FIG. 2 is a schematic view showing the vicinity of the adhesion region in the above-described prior art in an enlarged manner (the reference is quoted from FIG. 1). Adhesive J8 on bonding region La is in a portion where the lead wire J4 crosses, completely cured portions UV exposed portion St of the transparent electrode J2 ₀ is irradiated only from the transparent substrate J1 side was formed hits J8 _h However, semi-cured portions J8 _S1 and J8 _S2 are formed in the other portions. Since the semi-cured portions J8 _S1 and J8 _S2 of the adhesive J8 have a low function of blocking moisture and the like, the moisture of the outside air enters the portion J8 _S1 on the side in contact with the outside air. Thus, a state in which migration is likely to occur is formed.

  When this state continues, metal ions move and precipitate from the surface of the metal auxiliary electrode J3 containing silver into the adhesive to form a conductive path, and finally the wiring electrode J4 and the metal seal are formed. There is a problem that the member J7 is short-circuited, and this makes it impossible to ensure insulation between adjacent lead wires.

  This invention makes it an example of a subject to cope with such a problem. That is, the adhesive region formed on the periphery of the metal sealing member is photocurable so as to form a sealing space that covers the self-light-emitting element portion on the transparent support substrate on which the self-light-emitting element portion is formed. In the self-luminous panel in which the adhesive layer is formed and the support substrate and the sealing member are bonded together, the short circuit between the lead-out wiring and the metal sealing member due to the occurrence of migration is prevented in advance, and the self-luminous panel is normal It is an object of the present invention to operate the system.

  In order to achieve such an object, the self-luminous panel and the manufacturing method thereof according to the present invention include at least the configurations according to the following independent claims.

  [Claim 1] In an adhesive region formed at the periphery of a metal sealing member so as to form a sealing space that covers the self-light-emitting element part on a transparent support substrate on which the self-light-emitting element part is formed. A self-luminous panel in which a photocurable adhesive layer is formed and the support substrate and the sealing member are bonded to each other, and a lead-out wiring led out of the sealing space from the self-luminous element portion And the lead-out wiring is composed of a transparent conductive film formed on the support substrate and a metal electrode layer containing a metal element that is likely to cause migration laminated on the transparent conductive film, and the lead-out wiring crosses the adhesion region. A self-luminous panel, wherein a moisture blocking region is formed on at least an outermost portion of the adhesive layer on the wiring.

  [Claim 4] In an adhesive region formed at the periphery of the metal sealing member so as to form a sealing space covering the self-light-emitting element part on a transparent support substrate on which the self-light-emitting element part is formed. A method of manufacturing a self-luminous panel in which a photocurable adhesive layer is formed and light is irradiated from the support substrate side in a state where the support substrate and the sealing member are bonded to each other. In addition, a transparent conductive film and a metal electrode layer containing a metal element that is likely to cause migration laminated on the transparent conductive film, and forming a lead-out wiring led out of the sealing space from the self-light emitting element portion, A method of manufacturing a self-luminous panel, wherein a moisture blocking region is formed in at least an outermost portion of the adhesive layer on the lead-out wiring crossing the adhesive region.

  FIG. 3 is an explanatory view showing a self-luminous panel according to an embodiment of the present invention (FIG. 3 (a) is a plane BB cross-sectional view, and FIG. 3 (b) is an AA cross-sectional view). The self-light-emitting panel 10 is made of a transparent support substrate 1, a self-light-emitting element portion 2 formed on the support substrate 1, and a metal such as stainless steel that forms a sealing space M that covers the self-light-emitting element portion 2. The sealing member 3 is provided, the photocurable adhesive layer 4 is formed in the adhesive region La formed at the periphery of the sealing member 3, and the support substrate 1 and the sealing member 3 are bonded together. is there. The self-light-emitting element unit 2 is formed by, for example, planar arrangement of self-light-emitting elements such as organic EL elements, and emits light from the transparent support substrate 1 side to form a light-emitting panel (or display panel).

  The self-light-emitting panel 10 includes a lead-out wiring 5 that is led out of the sealing space M from the self-light-emitting element portion 2. The lead-out wiring 5 is such that a terminal such as COF (Chip On Film) or COG (Chip On Glass) is connected to a wiring portion led out of the sealing space M to drive the self-light-emitting element portion 2. The transparent electrode film 50 formed on the support substrate 1 and the metal electrode layer 51 laminated on the transparent electrode film 50 form a desired wiring pattern. For the metal electrode layer 51, a metal material (metal or alloy) containing silver is employed as a material capable of obtaining as low an electrical resistance as possible in order to improve the light emitting performance of the self light emitting element portion 2. Hereinafter, silver will be described as a metal element that easily causes migration. However, the present invention is not limited to this, and other migrations including copper (Cu), tin (Sn), lead (Pb), and the like. The present invention can also be applied to metal elements that are likely to cause oxidization.

  And in this self-light-emitting element part 2, the lead-out wiring 5 is drawn out from the inside of the sealing space M across the adhesion region La. On the lead-out wiring crossing the adhesion region La, the adhesive layer 4 In this structure, the moisture blocking region 4h is formed at least at the outermost part. That is, in this embodiment, a notch 51t is formed by notching the metal electrode layer 51 of the lead-out wiring 5 at the outermost portion of the adhesion region La, and the adhesive layer 4 is formed by light irradiation from the notch 51t. A moisture blocking region 4h that is completely cured is formed.

  The manufacturing method of such a self-light-emitting panel 10 will be described. A sealing member is formed so as to form a sealing space M that covers the self-light-emitting element portion 2 on the transparent support substrate 1 on which the self-light-emitting element portion 2 is formed. The photocurable adhesive layer 4 is formed in the adhesion region La formed on the periphery of the substrate 3, and light (ultraviolet rays or the like) is emitted from the support substrate 1 side in a state where the support substrate 1 and the sealing member 3 are bonded together. The adhesive layer 4 is cured by irradiation.

  At this time, since the light-impermeable metal electrode layer 51 is laminated on the lead-out wiring 5, there is a place where light is not irradiated on the lead-out wiring crossing the adhesion region La, and the adhesive layer 4 is in a semi-cured state. The portion 4s is formed, but in the other adhesive region La, the adhesive layer 4 is irradiated with light through the support substrate 1 so that the adhesive layer 4 is completely cured. Therefore, in this embodiment, a notch 51t is formed by notching the metal electrode layer 51 of the lead-out wiring 5 in the outermost part of the adhesion region La, and light is transmitted from the notch 51t to the adhesive layer 4. The moisture blocking region 4 h in which the adhesive layer 4 is completely cured is formed on the outermost part of the adhesive layer 4 on the lead-out wiring 5 that crosses the adhesive region La so as to be irradiated.

  The lead-out wiring 5 is formed at the same time as or before and after the self-light-emitting element forming step for forming the self-light-emitting element portion 2 on the support substrate 1. As an example, a transparent conductive film 50 serving as a base is formed simultaneously with the formation of a transparent electrode of a self-luminous element, a metal film for forming a metal electrode layer 51 is formed on the lead wiring formation region, and this is patterned. . At the time of this patterning or after that, the notch 51t is patterned so as to traverse one lead wire 5. Here, the notch 51t is required to be accurately positioned so that the outermost part of the adhesion region La is included.

  According to the self-luminous panel and the manufacturing method thereof according to such an embodiment, the moisture blocking region 4h is formed on the outermost portion of the adhesive layer 4 on the lead-out wiring 5 that crosses the bonding region La. Even if the semi-cured portion 4s of the adhesive layer 4 is formed inside 4h, moisture does not enter the semi-cured portion 4s, and the surface of the metal electrode layer 51 and the metal seal are sealed. It is possible to avoid a state in which migration is likely to occur by preventing moisture from entering the entire bonding region La where the surface of the member 3 faces through the adhesive layer 4.

  Of course, as in the prior art, the moisture that enters the sealed space M can be blocked by the presence of the moisture blocking region 4h, so that the sealing property of the sealed space M is sufficiently secured and the self-light emitting element is secured. It becomes possible to maintain the light emission characteristics of the portion 2 within a practically acceptable range.

  In the above-described embodiment, the moisture blocking region 4h is formed in the outermost part of the adhesive layer 4 by forming the notch 51t in the metal electrode layer 51. However, the present invention is not limited to this. The moisture blocking region 4h can also be formed directly by irradiating light (ultraviolet rays) directly from the outside of the layer 4 or the like.

  Hereinafter, as a more specific embodiment of the present invention, the structure of an organic EL panel in which a self-luminous element portion 2 serving as a display portion is formed of an organic EL element will be described with reference to FIG.

  The basic configuration of the organic EL panel 100 is that a plurality of organic EL elements 110 are formed on a support substrate 101 with an organic material layer 104 including an organic light emitting functional layer interposed between a first electrode 102 and a second electrode 103. Is. In the illustrated example, a silicon coating layer 101a is formed on a support substrate 101, the first electrode 102 formed thereon is set as an anode made of a transparent electrode such as ITO, and the second electrode 103 is made of Al or the like. The bottom emission method is configured such that light is extracted from the transparent support substrate 101 side by setting the cathode made of the above metal material. Further, as the organic material layer 104, an example of a three-layer structure of a hole transport layer 104A, a light emitting layer 104B, and an electron transport layer 104C is shown. Then, a sealing space M is formed on the support substrate 101 by bonding the support substrate 101 and the sealing member 105 via the adhesive layer 106, and a display including the organic EL element 110 is formed in the sealing space M. Forming part.

  In the example shown in the figure, the display unit composed of the organic EL elements 110 has a first electrode 102 partitioned by an insulating layer 107, and a unit display area (110R) by each organic EL element 110 under the partitioned first electrode 102. , 110G, 110B). In addition, a drying means 108 is attached to the inner surface of the sealing member 105 that forms the sealing space M to prevent deterioration of the organic EL element 110 due to moisture.

  In addition, a pattern is formed on the end portion of the support substrate 101 in a state where the first electrode layer 109A formed by the same material and in the same process as the first electrode 10 is insulated from the first electrode 102 by the insulating layer 107. Has been. A second electrode layer 109B for forming a low resistance wiring portion containing a silver alloy is formed on the lead portion of the first electrode layer 109A, and a protective coating 109C such as IZO is further formed thereon as necessary. Is formed, and the lead-out wiring 109 made of the first electrode layer 109A, the second electrode layer 109B, and the protective film 109C is formed. The end portion 103 a of the second electrode 103 is connected to the lead wire 109 at the inner end portion of the sealing space M.

  Although the drawing wiring of the first electrode 102 is omitted in the drawing, it can be formed by extending the first electrode 102 and pulling it out of the sealing space M. Also in this lead wiring, as in the case of the second electrode 103 described above, an electrode layer for forming a low resistance wiring portion containing Ag or the like can be formed.

One of the first electrode 102 and the second electrode 103 is usually set on the cathode side and the other is set on the anode side. The anode side is made of a material having a higher work function than the cathode side, and is transparent such as a metal film such as chromium (Cr), molybdenum (Mo), nickel (Ni), platinum (Pt), or a metal oxide film such as ITO or IZO. A conductive film is used. Conversely, the cathode side is made of a material having a lower work function than the anode side, such as alkali metals (Li, Na, K, Rb, Cs), alkaline earth metals (Be, Mg, Ca, Sr, Ba), rare earth metals, etc. , Metal having a low work function, a compound thereof, or an alloy containing them, amorphous semiconductors such as doped polyaniline and doped polyphenylene vinylene, and oxides such as Cr ₂ O ₃ , NiO, and Mn ₂ O ₅ are used. it can. In this embodiment, as described above, in order to adopt the bottom emission method, the first electrode 102 is formed of a transparent conductive film as an anode, and the second electrode 103 is set as a cathode made of a metal electrode or the like. .

  A drive circuit component and a flexible wiring board for driving the organic EL panel 100 are connected to the lead wiring (the lead wiring 109 and the lead wiring of the first electrode 102 shown in the drawing). Preferably, as described above, the second electrode layer 109B made of a low-resistance metal electrode layer containing Ag is laminated on the first electrode layer 109A made of a transparent conductive film. A cutout portion t is formed by partially removing the second electrode layer 109B and the protective coating 109C at the outermost portion of the adhesion region La.

  The organic material layer 104 is composed of a single-layer or multilayer organic compound material layer including at least an organic EL light emitting functional layer, but the layer structure may be formed in any manner. In general, as shown in FIG. 4, a layer in which a hole transport layer 104A, a light emitting layer 104B, and an electron transport layer 104C are stacked from the anode side to the cathode side can be used. The hole transport layer 104A and the electron transport layer 104C may be provided not only as a single layer but also as a plurality of layers, and both the hole transport layer 104A and the electron transport layer 104C may be omitted. The layer may be omitted. It is also possible to insert an organic material layer such as a hole injection layer or an electron injection layer depending on the application. For the hole transport layer 104A, the light emitting layer 104B, and the electron transport layer 104C, conventionally used materials (regardless of polymer materials or low molecular materials) can be appropriately selected and employed. The light emitting material forming the light emitting layer 104B employs either light emission (fluorescence) when returning from the singlet excited state to the ground state or light emission (phosphorescence) when returning from the triplet excited state to the ground state. May be.

  Here, a plate-like member or a container-like member made of metal such as stainless steel is used as the sealing member 105. Further, as the adhesive forming the adhesive layer 106, a light (ultraviolet) curable adhesive is used, and acrylic resin, epoxy resin, polyester, polyolefin, or the like can be used as a material.

  The drying means 108 is a physical desiccant such as zeolite, silica gel, carbon or carbon nanotube, a chemical desiccant such as alkali metal oxide, metal halide or chlorine peroxide, or an organometallic complex in toluene, xylene or aliphatic organic. It can be formed with a desiccant dissolved in a petroleum solvent such as a solvent, a desiccant in which desiccant particles are dispersed in a binder such as polyethylene, polyisoprene, and polyvinyl cinnaate having transparency.

  Further, the organic EL panel 100 may be a single color display or a multi-color display. In order to realize the multi-color display, the organic EL panel 100 includes a single color display method as well as a single color display such as white or blue. A method in which a color filter or a color conversion layer made of a fluorescent material is combined with a light emitting functional layer (CF method, CCM method), a method for realizing multiple light emission by irradiating an electromagnetic wave to a light emitting area of a single color light emitting functional layer (photo bleach A method in which unit display areas of two or more colors are stacked vertically to form one unit display area (SOLED (transparent stacked OLED) system) or the like can be employed.

  Moreover, the manufacturing method of an organic EL element can be formed by a conventionally known method. Examples of these methods include a method for forming a low molecular organic material by vacuum deposition, a method for forming a high molecular organic material by a printing method, and a laser for transferring a pre-formed organic EL film to the substrate side by a laser. Examples thereof include a thermal transfer method (LITI (Laser-induced Thermal Imaging) method).

  As described above, according to the self-light-emitting panel and the manufacturing method thereof according to the embodiment of the present invention, the short-circuit between the lead-out wiring and the metal sealing member due to the occurrence of migration is prevented and the self-light-emitting panel operates normally. Can be made.

It is explanatory drawing of a prior art. It is explanatory drawing explaining the subject of this invention. It is explanatory drawing explaining the self-light-emitting panel which concerns on embodiment of this invention, and its manufacturing method (the figure (a) is plane BB sectional drawing, the figure (b) is AA sectional drawing). It is explanatory drawing which shows the organic electroluminescent panel which concerns on the Example of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Self-light-emitting panel 1 Support substrate 2 Self-light-emitting element part 3 Sealing member 4 Adhesive layer 4h Moisture blocking area 5 Extraction electrode 50 Transparent conductive film 51 Metal electrode layer 51t, t Notch M Sealing space La Adhesive area

Claims (7)

Photo-curing adhesion to an adhesive region formed at the periphery of a metal sealing member so as to form a sealing space that covers the self-luminous element part on a transparent support substrate on which the self-luminous element part is formed. A self-luminous panel in which an agent layer is formed and the support substrate and the sealing member are bonded together,
With a lead-out wiring that is drawn out of the sealed space from the self-luminous element part,
The lead-out wiring is composed of a transparent conductive film formed on the support substrate and a metal electrode layer containing a metal element that is easily formed on the transparent conductive film,
A self-luminous panel, wherein a moisture blocking region is formed at least at an outermost portion of the adhesive layer on the lead-out wiring crossing the adhesive region.   The self-luminous panel according to claim 1, wherein the moisture blocking region is formed by a completely cured state of the adhesive layer.   The cutout portion formed by cutting out the metal electrode layer of the lead-out wiring is formed at the outermost portion of the adhesion region, and the moisture blocking region is formed by light irradiation from the cutout portion. The self-luminous panel described in 1 or 2.   The self-luminous panel according to claim 1, wherein the metal element is any one of silver (Ag), copper (Cu), tin (Sn), and lead (Pb). Photo-curing adhesion to an adhesive region formed at the periphery of a metal sealing member so as to form a sealing space that covers the self-luminous element part on a transparent support substrate on which the self-luminous element part is formed. A method for producing a self-luminous panel in which an agent layer is formed and light is emitted from the support substrate side in a state in which the support substrate and the sealing member are bonded together,
A lead-out wiring made of a transparent conductive film and a metal electrode layer containing a metal element that is likely to cause migration laminated on the support substrate, and is drawn out of the sealed space from the self-luminous element portion Form the
A method of manufacturing a self-luminous panel, wherein a moisture blocking region is formed in at least an outermost portion of the adhesive layer on the lead-out wiring crossing the adhesive region.   The method for manufacturing a self-luminous panel according to claim 5, wherein the moisture blocking region is formed by irradiating light to an outermost part of the adhesive layer.   The moisture blocking region is formed by forming a cutout portion in which the metal electrode layer of the lead-out wiring is cut out at an outermost portion of the adhesion region, and light irradiation from the cutout portion. A method for producing a self-luminous panel described in 5 or 6.

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