KR20060042246A - Wiring board, method of manufacturing the same, and organic el panel - Google Patents

Abstract

The present invention prevents migration between wiring electrodes only by the structure of the wiring electrodes irrespective of the protective layer.

The present invention provides a wiring substrate 1 having at least two wiring electrodes 11 adjacent to each other on an insulating substrate 10, wherein the wiring electrodes 11 contain a low resistance wiring portion 11a containing a metal which is likely to cause migration. ) And a wiring region 11b which is connected to the low resistance wiring portion 11a and is formed on the substrate 10 between the low resistance wiring portion 11a and the other wiring electrode, and the wiring region {11b (12b to 22b). } Is formed of a material that does not contain metal that is prone to migration.

Wiring board, organic EL panel, low resistance wiring part

Description

WIRING BOARD, METHOD OF MANUFACTURING THE SAME, AND ORGANIC EL PANEL}

1 is an explanatory diagram (sectional view) showing a configuration example of a wiring board according to an embodiment of the present invention.

2 is an explanatory diagram (sectional view) showing a structural example of a wiring board according to an embodiment of the present invention.

3 is an explanatory diagram (sectional view) showing a structural example of a wiring board according to an embodiment of the present invention.

4 is an explanatory diagram showing the operation of the wiring board according to the embodiment of the present invention.

5 is an explanatory diagram (sectional view) showing a configuration example of a wiring board according to an embodiment of the present invention.

6 is an explanatory diagram (sectional view) showing a configuration example of a wiring board according to an embodiment of the present invention.

7 is an explanatory diagram (sectional view) showing a configuration example of a wiring board according to an embodiment of the present invention.

8 is an explanatory diagram illustrating a wiring board according to an embodiment of the present invention, showing a pattern example of each wiring electrode.

Fig. 9 is an explanatory diagram illustrating a wiring board according to the embodiment of the present invention, and is a plan view showing a pattern example of each wiring electrode.

Fig. 10 is an explanatory diagram for explaining a wiring board according to the embodiment of the present invention, and is a plan view showing a pattern example of each wiring electrode.

Fig. 11 is a diagram showing the state of potential difference between wiring electrodes in the embodiment of the present invention.

12 is an explanatory diagram illustrating a wiring board according to an embodiment of the present invention, showing a pattern example of each wiring electrode.

Fig. 13 is an explanatory diagram illustrating a wiring board according to an embodiment of the invention, which is a plan view showing a pattern example of each wiring electrode.

FIG. 14 is an explanatory diagram illustrating a wiring board according to an embodiment of the present invention, showing a pattern example of each wiring electrode. FIG.

15 is an explanatory diagram (sectional view) for explaining an organic EL panel according to an embodiment of the present invention.

16 is an explanatory diagram (sectional view) for explaining an organic EL panel according to an embodiment of the present invention.

<Explanation of symbols for main parts of the drawings>

1: wiring board

10: Substrate

11, 12 ₁ , 12 ₂ , 13 ₁ , 13 ₂ , 14, 15, 16, 17, 18, 19, 20, 21, 22: wiring electrode

11a, 12a, 13a, 14a, 15a, 16a, 17a, 18a, 19a, 20a, 21a, 22a: low resistance wiring portion

11b, 12b, 13b, 14b, 15b, 16b, 17b, 18b, 19b, 20b, 21b, 22b: wiring area

14A, 15A, 16A: first electrode layer

14B, 15B ₁ , 15B ₂ , and 16B: second electrode layer

S, S ₁ , S ₂ : Connection

Ea: electric field gradient

100: organic EL panel

30: organic EL element

31: first electrode

32: second electrode

33: organic material layer

34: insulation layer

35: cathode partition wall

40: sealing member

40S: sealed space

41: adhesive layer

42: desiccant

The present invention relates to a wiring board, a method of forming a wiring board, and an organic EL panel.

In recent years, in order to meet the demand for miniaturization and high performance of electronic devices or electronic parts, wiring densification and low resistance have been progressed, but accordingly, problems of performance deterioration and failure due to migration have emerged remarkably. The term migration refers to a wiring electrode which must be electrically insulated from time or time on the surface or inside of the insulating substrate by a metal (metal ion) forming the wiring electrode formed between the adjacent wiring electrodes. Refers to the phenomenon of conducting the liver.

This migration uses metals such as silver (Ag), copper (Cu), tin (Sn), lead (Pb), or alloys containing these metals as electrode materials, which are close to each other, and are known as low resistance materials. It is confirmed that it is easy to generate | occur | produce in a case. Therefore, when attempting to increase the density of wiring electrodes and increase the resistance (high performance), preventing migration is an important problem that cannot be avoided.

[0004] In the display device, which is being developed for the purpose of displaying images with high clarity, there is a tendency to increase the density of the drawn wiring electrodes for driving each pixel. In particular, in a display panel of a current drive such as an organic EL panel, the light emission characteristics change depending on the magnitude of the driving current, which greatly affects the display performance. Therefore, in order to improve the display performance, the wiring electrode should be made low resistance. There is a need. For this reason, in an organic EL panel, the use of the low resistance material which is easy to generate | occur | produce migration, such as a silver palladium (AgPd) alloy, is made to the densified wiring electrode, and it is what prevents the migration mentioned above in an organic EL panel. It is an important task.

Various proposals are made to prevent migration. For example, in the following Patent Documents 1 and 2, a plurality of wiring conductors containing silver, aluminum, or an alloy of these metals are provided on the upper surface of the wiring board at intervals of 10 ?? m to 100 ?? m, and these It is disclosed that the wiring conductor is commonly covered with an insulating protective layer containing epoxy resin as a main component, and the protective layer contains 0.5 ~ m ~ 5.0 ?? m specific resin filler in a specific distribution.

(Patent Document 1) Patent Publication No. 2001-237523

(Patent Document 2) Patent Publication No. 2001-339143

According to the above-mentioned prior art, since it is necessary to contain a specific resin filler in a specific distribution in the protective layer, there is a problem that the formation of the protective layer is cumbersome and expensive.

In addition, recent studies say that direct contact between metals that are susceptible to migration {silver (Ag), copper (Cu), tin (Sn), lead (Pb), etc.) and insulating materials is one of the causes of migration. It is also concerned that covering the wiring electrode with the insulating protective layer does not prevent effective migration.

This invention makes it an example of a subject to cope with such a problem. That is, it is possible to reliably prevent migration between the wiring electrodes only by the structure of the wiring electrodes without forming a complicated protective layer, and to achieve high performance of display devices such as organic EL panels by preventing the migration. This is an object of the present invention.

In order to achieve such an object, the present invention includes at least the configuration of each of the following independent claims.

Claim 1 A wiring board having at least two wiring electrodes adjacent to each other formed on an insulating substrate, wherein at least one of the wiring electrodes includes a low resistance wiring portion containing a metal that is likely to cause migration and a low resistance wiring portion. And a wiring region that is conductive and is formed on the substrate between at least the low resistance wiring portion and another wiring electrode, wherein the wiring region does not contain a metal that is likely to cause migration.

15. A method of forming a wiring board in which at least two wiring electrodes adjacent to each other are formed on an insulating substrate, wherein at least one of the wiring electrodes is formed with a low resistance wiring portion containing a metal that is likely to cause migration. At least a wiring region conductive to the low resistance wiring portion is formed on the substrate between the low resistance wiring portion and another wiring electrode, and the wiring region is formed of a material that does not contain metal that is likely to cause migration. A method of forming a wiring board.

[Claim 18] A plurality of organic EL elements are formed on an insulating substrate by holding an organic material layer including an organic light emitting functional layer between a pair of electrodes, and wiring wires drawn from the pair of electrodes are formed on the substrate. An organic EL panel, wherein the wiring electrodes have at least two wiring electrodes adjacent to each other, and at least one of the wiring electrodes is electrically connected to the low resistance wiring portion and the low resistance wiring portion containing a metal that is likely to cause migration. And at least a wiring region formed on the substrate between the low resistance wiring portion and another wiring electrode, wherein the wiring region does not contain a metal that is likely to cause migration.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described with reference to drawings. 1-3 and 5-7 are explanatory drawing (sectional drawing) which shows the structural example of the wiring board which concerns on one Embodiment of this invention. In the wiring board 1 shown in these figures, at least two wiring electrodes adjacent to each other are formed on the insulating substrate 10. In the following description, two wiring electrodes are shown and described, and of course, the plurality of wiring electrodes can be described in the same manner.

In the embodiment of the present invention, as shown in FIG. 1, at least one of the wiring electrodes 11 and 11 in the wiring board 1 is formed of a metal that is likely to cause migration {eg, Ag (silver ), Cu (copper), Sn (tin), Pb (lead), or a low resistance wiring portion 11a containing one or more thereof; It has a wiring region 11b formed on the substrate 10 between 11a) and another wiring electrode, and the wiring region 11b is characterized in that it does not contain metal that is likely to cause migration. Although the wiring area | region 11b is provided in the both wiring electrodes 11 and 11 in embodiment of FIG. 1, it is not limited to this, The wiring area | region 11b was provided in one of the wiring electrodes 11,11. It may be.

2 and 3 show a modification of the wiring board 1 according to the embodiment of the present invention. As shown in FIG. 2, the wiring board 1 according to the embodiment of the present invention includes the low-resistance wiring portion 12a and the migration, in which both wiring electrodes 12 ₁ and 12 ₂ contain a metal that is likely to cause migration. The wiring area 12b which does not contain the metal which is easy to generate | occur | produce this may be provided, and this wiring area | region 12b may be provided only in the one direction in the same direction with respect to the low resistance wiring part 12a, or As shown in Fig. 3, both the wiring electrodes 13 ₁ and 13 ₂ contain a low resistance wiring portion 13a containing a metal that is likely to cause migration and a wiring region that does not contain a metal that is likely to cause migration. 13b), and the wiring region 13b is provided only on one side in the other direction with respect to the low resistance wiring portion 13a, so that the wiring region 13b is formed between the two wiring electrodes 13 ₁ and 13 ₂ . To form mutually opposite You may also do it.

FIG. 4 is an explanatory diagram showing the action of the wiring board 1 according to this embodiment, which is a diagram showing the potential difference state between the wiring electrodes 11 and 11. In the wiring board 1 according to this embodiment, as shown in the figure, even when a potential difference occurs between the two wiring electrodes 11 and 11, a low resistance wiring portion 11a containing a metal that is likely to cause migration and Since the wiring region 11b which does not contain the metal that is likely to migrate is brought to the same potential, metal ions (eg, Ag +) of the metal that are likely to cause migration are transferred to the electric field gradient Ea between the wiring electrodes 11 and 11. It doesn't matter. Therefore, the movement of the metal ions due to the electric field gradient Ea can be suppressed, and the migration phenomenon can be effectively prevented. This effect also applies to the wiring electrodes 13 ₁ and 13 ₂ in the embodiment shown in FIG. 3.

Also, as in the embodiment shown in Fig. 2, even in the case where the wiring region 12b is formed in only one side of each wiring electrode in the two wiring electrodes 12 ₁ and 12 ₂ , the above-described operation is performed. Since at least the metal ions moving from the wiring electrode 12 ₁ toward the wiring electrode 12 ₂ can be suppressed, a certain migration prevention effect can be expected. In addition, in the case where the potential difference between the wiring electrodes 12 ₁ and 12 ₂ is uniform (the wiring electrode side 12 ₁ is at a high ratio at a high ratio), the migration phenomenon can be effectively prevented only by arranging such wiring regions 12b. can do.

5-7 is explanatory drawing (sectional drawing) which shows more specific embodiment of this invention. In these embodiments, the low-resistance wiring portions 14a, 15a, and 16a containing the metals that tend to generate the migration described above are formed in the first electrode layers 14A, 15A, and 16A, and the migrations described above are easy to occur. Wiring regions 14b, 15b, and 16b containing no metal are formed in the second electrode layers 14B, 15B ₁ , 15B ₂ , and 16B.

Specifically, in the wiring board 1 according to the embodiment of FIG. 5, the wiring electrodes 14 and 14 form the first electrode layer 14A and the wiring region 14b forming the low resistance wiring portion 14a. It has the 2nd electrode layer 14B formed, and is formed by laminating | stacking the 1st electrode layer 14A on the 2nd electrode layer 14B formed on the board | substrate 10. FIG. In addition, the width of the second electrode layer 14B is wider than that of the first electrode layer 14A. In the illustrated example, the first electrode layer 14A is directly laminated on the second electrode layer 14B, but is not limited to this, and the second electrode layer 14B is interposed between the second electrode layer 14B and the first electrode layer 14A. It may be a laminate.

In the wiring board 1 according to the embodiment of FIG. 6, the wiring electrodes 15 and 15 are the first to form the low resistance wiring portion 15a on the second electrode layer 15B ₁ formed on the substrate 10. an electrode layer (15A) identical to the embodiment of FIG. 5 and up to the lamination to form, but the second electrode layer does not contain the metal easy to cause migration in addition, (15B ₂₎ laminated thereon, the The first electrode layer 15A is formed to cover the second electrode layer 15B ₂ .

In the wiring board 1 according to the embodiment of FIG. 7, the wiring electrodes 16 and 16 form the first electrode layer 16A forming the low resistance wiring portion 16a on the substrate 10, and migrate. The 2nd electrode layer 16B which does not contain the metal which is easy to generate | occur | produce this is laminated | stacked on it, and the 1st electrode layer 16A is formed so that the 2nd electrode layer 16B may be covered.

In this embodiment, the wiring area 14b which does not contain the metal which tends to generate migration on the board | substrate 10 between the low resistance wiring parts 14a, 15a, and 16a in one wiring electrode and the other wiring electrode. , 15b, and 16b), and as described above, even when a potential difference is generated between the two electrodes, it is possible to suppress the movement of metal ions that are likely to cause migration, and thus, a problem such as short circuit between the wiring electrodes due to migration phenomenon. Can be prevented.

8 to 10 and 12 to 14 are explanatory views for explaining the wiring board according to the embodiment of the present invention. Although the pattern structure of the wiring electrode shown here has a structure in which the above-mentioned wiring area has the linear pattern formed along the low-resistance wiring part mentioned above, it is not specifically limited to this in embodiment of this invention. In addition, the wiring electrode of embodiment shown below can be formed in accordance with any one of the cross-sectional structures shown to FIGS. 1-3 and FIGS.

In the embodiment shown in Fig. 8, the wiring electrode 17 is formed with a linear pattern along this with respect to the low resistance wiring portion 17a containing a metal which is likely to cause migration. The wiring area 17b which does not contain the metal which is easy to make is formed. Here, the wiring region 17b is formed so as to face each other between the wiring electrodes 17 and in parallel with the low resistance wiring portion 17a. Further, one wiring region 17b has a gap formed between the low resistance wiring portion 17a and has a plurality of connection portions S partially connected to the low resistance wiring portion 17a.

In the embodiment shown in Fig. 9, the wiring electrode 18 is formed in the same manner as in the embodiment of Fig. 8 with respect to the low resistance wiring portion 18a containing a metal which is likely to cause migration. By this linear pattern, the wiring area 18b which does not contain the metal which tends to generate migration is formed. Further, the wiring region 18b is formed so as to face each other between the wiring electrodes 18 and in parallel with the low resistance wiring portion 18a. Further, the wiring region 18b has a gap formed between the low resistance wiring portion 18a and has connection portions S ₁ and S ₂ partially connected to the low resistance wiring portion 18a. Further, the positions of the connecting portions S ₁ and S ₂ adjacent to each other in the arrangement direction of the wiring electrode 18 are formed so as not to be parallel to the same position along the wiring electrode 18.

In the embodiment shown in Fig. 10, the wiring electrode 19 is similar to the embodiment of Figs. 8 and 9 with respect to the low-resistance wiring portion 19a containing a metal that is likely to cause migration. The wiring region 19b is formed which does not contain a metal that is likely to cause migration by the linear pattern. Here, the wiring region 19b is formed only on one side of the low resistance wiring portion 19a between the wiring electrodes 19. The wiring region 19b has a gap formed between the low resistance wiring portion 19a and has a connecting portion S that is partially connected to the low resistance wiring portion 19a.

Fig. 11 is a diagram showing the potential difference state between wiring electrodes in this embodiment. In this embodiment, when a potential difference occurs between the wiring electrodes, for example, the state of potential difference on the X ₁ -X ₁ line in FIG. 8 becomes the same as that shown in FIG. 4, but X ₂ -in FIG. The potential difference state on the X ₂ line is as shown in FIG. 11 (a), and the potential difference state on the X ₃ -X ₃ line in FIG. 9 is as shown in FIG. 11 (b) (in FIG. The wiring electrode is in a high potential state, and in FIG. 11B, the wiring electrode on the right side is in a high potential state.}.

In other words, the potential difference between these portions (X ₂ -X ₂ or X ₃ -X ₃ ) is equal to that of the low resistance wiring portion 17a (or 18a) and the wiring region 17b (or 18b). However, the gap between both forms an uneven portion of the potential, and the metal ions (eg, Ag +) in the low resistance wiring portion 17a (or 18a) are suppressed by the uneven portion of the potential difference. . Thereby, the metal ion which tends to generate migration becomes irrelevant to the electric field gradient Ea between the wiring electrodes 17 (18), and migration phenomenon can be prevented effectively.

In the embodiment shown in Figs. 8 to 10, all have shown that a gap is formed between the low resistance wiring portions 17a to 19a and the wiring regions 17b to 19b. The linear pattern is not limited to this. For example, as shown in FIG. 12, the wiring electrode 20 is formed of the low resistance wiring portion 20a and the wiring region 20b containing no metal which is likely to cause migration, and the low resistance wiring portion 20a. And wiring region 20b may be conducting in a wide region. In this case, the low-resistance wiring portion 20a can obtain the action shown in Fig. 4 in a wide range.

8 to 10 show that a plurality of connection portions between the low resistance wiring portions 17a to 19a and the wiring regions 17b to 19b are formed in one wiring region. It is not limited, It may provide one connection part with respect to one wiring area.

13 and 14 are explanatory views showing another embodiment of the pattern configuration of the wiring electrodes. In these embodiments, the wiring electrode 21 (22) is formed of the low resistance wiring portion 21a (22a) and the wiring region {21b (22b)} which does not contain a metal that is likely to cause migration, and the wiring region { 21b (22b)} is formed in a linear pattern along the low resistance wiring portion 21a (22a), which is the same as the above-described embodiment, but this embodiment wires the wiring area {21b (22b)}. It is formed partially along the electrode {21 (22)}.

That is, in this embodiment, the wiring area | region {21b (22b)} which does not contain the metal which is easy to generate | occur | produce migration can be formed only in the part which selected, especially the part which is easy to generate | occur | produce migration, and selects the wiring area | region {21b] in it. (22b)} can be formed. As a part which migration is easy to produce, the part using an adhesive agent, etc. are mentioned. In the examples of FIGS. 13 and 14, the wiring regions 21b (22b) are partially formed in accordance with the strip-shaped portions of the bonding regions M for joining the sealing substrate or the like on the substrate on which the wiring electrodes 21 (22) are formed. An example is shown.

13 shows an example in which the width of the low resistance wiring portion 21a is made uniform, and the wiring region 21b is formed on both or one side thereof, and the embodiment shown in FIG. In the form, the width | variety of the low resistance wiring part 22a is narrowed in the part in which the wiring area | region 22b is formed, and the example formed so that the width | variety may become uniform over the whole wiring electrode 22 is shown. According to this embodiment, since the patterning area for forming the wiring areas 22a and 22b can be narrowed, the process can be simplified.

The formation method of the wiring board 1 which concerns on embodiment of this invention mentioned above can be implemented by various methods. In other words, any formation method may be used as long as it forms a low-resistance wiring portion containing a metal that is likely to generate migration described above and a wiring region that does not contain a metal that is likely to cause migration.

A specific example of the formation method will be described with reference to the embodiments shown in FIGS. 5 to 7 by forming the first electrode layers 14A, 15A, and 16A forming the low resistance wiring portions 14a, 15a, and 16a. Patterning the low resistance wiring portions 14a, 15a, and 16a, and forming the second electrode layers 14B, 15B, and 16B forming the wiring regions 14b, 15b, and 16b to form the wiring regions 14b and 15b. , 16b).

In the embodiment of FIG. 5, after forming the second electrode layer 14B on the substrate 10 to pattern the wiring region 14b, the first electrode layer is directly on the second electrode layer 14B or via another layer. The film can be formed by forming the low-resistance wiring portion 14a by forming the film 14A.

In the embodiment of FIG. 6, after forming the second electrode layer 15B ₁ on the substrate 10 to pattern the wiring region 15b, the second electrode layer 15B ₁ is directly formed on the second electrode layer 15B ₁ or via another layer. The low resistance wiring portion 15a is patterned by forming the first electrode layer 15A, and the second wiring layer 15B ₂ is formed to form the wiring region 15b.

In the embodiment of FIG. 7, after forming the first electrode layer 16A on the substrate 10 to pattern the low resistance wiring portion 16a, the second electrode layer ( 16B) can be formed by patterning the wiring region 16b.

<Example>

Hereinafter, as an example of the present invention, an organic EL panel to which the wiring board according to the above-described embodiment is applied will be described. However, the wiring board or the method for forming the same according to the embodiment of the present invention is not limited to the following uses, but can be widely applied to other electronic devices and electronic components.

15 and 16 are explanatory diagrams (sectional views) for explaining an organic EL panel according to an embodiment of the present invention. FIG. 15 is a sectional view taken along the line A ₂ -A _{2 in} FIG. 16, and FIG. 16 is a sectional view taken along the line A ₁ -A _{1 in} FIG. 15.

In the drawing, the basic configuration of the organic EL panel 100 is maintained on the substrate 10 by holding the organic material layer 33 including the organic light emitting functional layer between the first electrode 31 and the second electrode 32. A plurality of organic EL elements 30 are formed. In the illustrated example, the silicon coating layer 10a is formed on the substrate 10, the first electrode 31 formed thereon is set as an anode made of a transparent electrode such as ITO, and the second electrode 32 is set. The lower emission system which sets it as the cathode which consists of metal materials, such as Al, and extracts light from the board | substrate 10 side, is comprised. As the organic material layer 33, an example of a three-layer structure of the hole transport layer 33A, the light emitting layer 33B, and the electron transport layer 33C is shown. Then, by bonding the substrate 10 and the sealing member 40 through the adhesive layer 41, a sealing space 40S is formed on the substrate 10, and the display portion made of the organic EL element 30 in the sealing space 40S. To form.

In the example shown, the display part which consists of organic electroluminescent element 40 partitions the 1st electrode 31 by the insulating layer 34, and also insulates the 2nd electrode 32 by the cathode partition wall 35. The unit display regions 30R, 30G, and 30B by the organic EL elements 30 are formed under the partitioned first electrode 31. In addition, a drying means 42 is attached to the inner surface of the sealing member 40 forming the sealing space 40S to prevent deterioration of the organic EL element 30 due to moisture.

Here, FIG. 15 shows the lead-out wiring electrode of the second electrode 32 serving as the cathode (here, an example in which the lead-out wiring electrode 14 shown in FIG. 5 is employed for this lead-out wiring electrode). In the lead-out wiring electrode of the second electrode 32, the second electrode layer 14B having the wiring material 14b (not shown) formed by the same material and the same process as the first electrode 31 is the first electrode 31. The fruit is patterned in the state insulated by the insulating layer 34. At the lead portion of the second electrode layer 14B, a first electrode layer 14A for forming a low resistance wiring portion 14a containing an alloy of silver palladium (AgPd: a material containing a metal that is likely to cause migration) is formed. In addition, a protective film 14C such as IZO is formed thereon, and a wiring electrode 14 made of the second electrode layer 14B, the first electrode layer 14A, and the protective film 14C is formed thereon. It is. The end 32a of the second electrode 32 is connected to the wiring electrode 14 at the inner end of the sealing space 40S.

On the other hand, FIG. 16 shows the lead-out wiring electrode of the first electrode 31 serving as an anode. In the lead-out wiring electrode of the first electrode 31, the wiring electrode 31a is formed by extending the first electrode 31 and drawing it out of the sealing space 40S. Here, the wiring electrode according to the embodiment of the present invention is used only for the lead-out wiring electrode on the anode side, but the wiring electrode according to the embodiment of the present invention may be adopted only for the lead-out wiring electrode on the cathode side, and the anode side and the cathode side. You may employ | adopt for all. In addition, a specific wiring electrode may be selected from these lead-out wiring electrodes, and the wiring electrode according to the embodiment of the present invention may be adopted.

In addition, as described above, the wiring region 14b of the wiring electrode 14 may be formed in the entire region of one wiring electrode 14, for example, only partially in a specific portion such as the adhesive region M. FIG. It can also be formed.

According to the organic EL panel 100 according to the embodiment of the present invention, the wiring electrodes 14 drawn out from the cathode side (or the anode side) are arranged in close proximity, and the wiring electrode 14 can be reduced in resistance. Even when the low-resistance wiring portion 14a containing a metal that is susceptible to migration is formed, the metal ions (silver ions Ag +) generated around the wiring electrode 14 are piggybacked on the electric field gradient toward the neighboring wiring electrode. Since there is no work, problems such as a short circuit between the wiring electrodes due to migration or a change in the current flowing through the wiring electrodes can be avoided in advance.

Hereinafter, each component of the organic EL panel 100 according to the embodiment of the present invention will be described in more detail.

a. Board;

As the board | substrate 10 of the organic electroluminescent panel 100, it is preferable that it is flat form and film form which have transparency, and glass, plastic, etc. can be used as a material.

b. electrode;

In the above-described embodiment, the first electrode 31 is the anode, the second electrode 32 is the cathode, and the hole transport layer 33A, the light emitting layer 33B, and the electron transport layer 33C from the first electrode 31 side. In this embodiment, either of the first electrode 31 and the second electrode 32 may be set as a cathode or an anode. As the electrode material, the anode is made of a material having a higher work function than the cathode, and a metal film such as chromium (Cr), molybdenum (Mo), nickel (Ni), platinum (Pt), or a metal oxide film such as ITO, IZO, or the like. The transparent conductive film of is used. On the contrary, the negative electrode is composed of a material having a lower work function than the positive electrode, and includes a metal film such as aluminum (Al) and magnesium (Mg), an amorphous semiconductor such as doped polyaniline or doped polyphenylenevinylene, Cr ₂ O ₃ and NiO. And oxides such as Mn ₂ O ₅ can be used. In addition, when both the 1st electrode 31 and the 2nd electrode 32 are comprised by the transparent material, it is set as the structure which provided the reflecting film in the electrode side opposite to the emission side of light.

c. Organic material layer;

The organic material layer 33 is a combination of the hole transport layer 33A, the light emitting layer 33B, and the electron transport layer 33C as in the above-described embodiment, but the hole transport layer 33A, the light emitting layer 33B, the electron transport layer ( 33C) may be provided not only in one layer but also in plural layers, respectively. For the hole transport layer 33A and the electron transport layer 33C, either layer may be omitted or both layers may be omitted. It is also possible to insert organic material layers such as a hole injection layer and an electron injection layer depending on the application. The hole transport layer 33A, the light emitting layer 33B, and the electron transport layer 33C can be appropriately selected from conventionally used materials (regardless of a high molecular material or a low molecular material).

As the light emitting material forming the light emitting layer 33B, a material showing light emission (fluorescence) when returning from the singlet excited state to the ground state, and light emission when returning to the ground state from the triplet excited state ( Any of materials exhibiting phosphorescence) may be used.

d. Sealing member;

In the organic EL panel 100, a plate member or a container member made of metal, glass, plastic, or the like can be used as the sealing member 40 for hermetically sealing the organic EL element 30. What formed the sealing recessed part (regardless of 1-stage grooving or 2-stage grooving) on glass sealing board by press molding, etching, blasting process, etc., or using flat glass The sealing space 40S can also be formed between the board | substrate 10 with the spacer made of glass (it may be plastic).

e. Adhesive layer;

As the adhesive for forming the adhesive layer 41 in the organic EL panel 100, a thermosetting type, a chemical curing type (2 liquid mixture), a light (ultraviolet) curing type, or the like can be used. As a material, an acrylic resin, an epoxy resin, a poly Ester, polyolefin, etc. can be used. In particular, it is preferable to use an ultraviolet curing epoxy resin adhesive having no heat treatment and high instant curing property.

f. Drying means;

Drying means 42 is a physical drying agent such as zeolite, silica gel, carbon, carbon nanotube, chemical drying agent such as alkali metal oxide, metal halide, chlorine peroxide, organic metal complexes such as toluene, xylene, aliphatic organic solvents, etc. The desiccant and the desiccant particle | grains melt | dissolved in the system solvent can be formed with the desiccant disperse | distributed to binders, such as polyethylene, polyisoprene, and polyvinyl cinnanate which have transparency.

g. Various methods of the organic EL display panel;

As the organic EL panel 100 serving as an embodiment of the present invention, various design changes can be made without departing from the gist of the present invention. For example, the light emitting form of the organic EL element 30 may be a lower emission method for extracting light from the substrate 10 side as in the above-described embodiment, but an upper emission method for extracting light from the opposite side to the substrate 10. It does not matter. In addition, the organic EL panel 100 according to the embodiment of the present invention may be a monochromatic display or a plural color display. In order to realize the plural color display, the organic EL panel 100 may include a division coating method or a single color such as white or blue. A method in which a color filter or a color conversion layer made of a fluorescent material is combined with a light emitting functional layer (CF method, CCM method), or a method of realizing multiple light emission by irradiating an electromagnetic wave to a light emitting region of a monochromatic light emitting function layer {Photobleaching ( photobleaching), a method in which one unit display region is formed by vertically stacking two or more unit display regions {SOLED (transparent stacked OLED) scheme), and the like.

The features of each embodiment or example of the present invention are summarized as follows (the following symbols correspond to the drawings of FIGS. 1 to 16).

On the other hand, as the wiring board 1 in which at least two wiring electrodes 11 (12 to 22) adjacent to each other are formed on the insulating substrate 10, at least one of the wiring electrodes 11 (12 to 22) The low resistance wiring portions 11a (12a to 22a) containing metals that tend to cause migration and the low resistance wiring portions 11a (12a to 22a) are connected to at least the low resistance wiring portions 11a (12a to 22a). ) And wiring area | regions 11b (12b-22b) formed on the board | substrate 10 between other wiring electrodes, and the said wiring area | regions 11b (12b-22b) do not contain the metal which is easy to produce migration. It features.

As a result, even when a potential difference occurs between the adjacent wiring electrodes 11 (12 to 22), the low resistance wiring portions 11a (12a to 22a) and the wiring regions 11b (12b to 22b) become the same potential. Since the electric field gradient Ea is not formed around the low resistance wiring portions 11a (12a to 22a), the metal ion in the low resistance wiring portions 11a (12a to 22a) is the wiring electrode 11 (12 to 12a). 22)} there is no movement relative to the electric field gradient (Ea). Therefore, even when the wiring electrodes 11 (12 to 22) are in any potential difference state, the movement of metal ions from the wiring electrode side on which the wiring region 11b is formed to the other wiring electrodes can be prevented. As a result, even in the case where the wiring electrodes 11 (12 to 22) including the low resistance wiring portions 11a (12a to 22a) containing metals that are likely to migrate are formed at high density, the structure of the wiring electrodes can be effectively used. The occurrence of migration can be suppressed.

On the other hand, in the above-described wiring board 1, the wiring regions 11b (12b to 22b) have a linear pattern formed along the low resistance wiring portions 11a (12a to 22a). According to this, in addition to the above-described action, it is possible to effectively suppress the occurrence of migration in the region of the linear pattern formed along the low resistance wiring portions 11a (12a to 22a).

On the other hand, in the above-described wiring board 1, the wiring regions 11b (12b to 22b) are formed so as to face each other of the two wiring electrodes 11 (12 to 22). According to this, in addition to the above-described operation, even if the potential difference state between the wiring electrodes 11 (12 to 22) is changed, the movement of metal ions from one side to the other (one side from the other) can be prevented. Therefore, migration can be prevented effectively.

On the other hand, in the above-described wiring board 1, the wiring regions 11b (12b to 22b) are formed on both sides of the low resistance wiring portions 11a (12a to 22a). According to this, in addition to the above-described action, the movement of metal ions from the low resistance wiring portions 11a (12a to 22a) of the predetermined wiring electrodes 11 (12 to 22a) toward the wiring electrodes arranged on both sides thereof is effectively performed. You can stop it.

On the other hand, in the wiring board 1 described above, the wiring regions 17b (18b, 19b, 21b, 22b) are partially connected to the low resistance wiring portions 17a (18a, 19a, 21a, 22a). which it is characterized by having the connecting _{{S (S 1, S 2} )}.

According to this, in addition to the above-described operation, the portions where the wiring regions 17b (18b, 19b, 21b, 22b) and the low resistance wiring portions 17a (18a, 19a, 21a, 22a) are not connected are connected between the two. A gap is formed, whereby an uneven portion of the potential difference is formed when a potential difference occurs between the wiring electrodes. By the uneven portion of the potential difference, the movement of the metal ions in the low resistance wiring portions 17a (18a, 19a, 21a, 22a) can be effectively prevented.

On the other hand, in the above-mentioned wiring board 1, the connection part is parallel with the same position along the wiring electrode 18 in the position of the connection parts S ₁ and S ₂ adjacent to each other in the arrangement direction of the wiring electrode 18. Characterized in that not to be formed.

According to this, in the case where the connecting portions are arranged side by side, the gap between the low resistance wiring portion 18a and the wiring region 18b is not formed on the line connecting the connecting portions, and the metal ion movement is prevented by the gap. Although the effect cannot be obtained, the gap between the low resistance wiring portion 18a and the wiring region 18b can be effectively formed by avoiding the connecting portions in parallel with each other.

On the other hand, in the above-described wiring board 1, a plurality of connecting portions S (S ₁ , S ₂ ) are formed for one wiring area 17b (18b, 18b, 19b, 21b, 22b). As a result, the low resistance wiring portions 17a (18a, 19a, 21a, 22a) and the wiring regions 17b (18b, 19b, 21b, 22b) can be reliably set at the same potential, and the low resistance wiring The electric field gradient Ea is not formed around the portion 17a (18a, 19a, 21a, 22a), therefore, as described above, the occurrence of migration can be effectively prevented.

On the other hand, in the above-described wiring board 1, the wiring area 21b (22b) is partially formed along the wiring electrode 21 (22). According to this, in particular, since the wiring region 21b (22b) can be formed in a part where migration is likely to occur, the migration can be effectively prevented and the wiring region 22a (22b) is formed. Since the patterning area can be narrowed, the process can be simplified.

On the other hand, in the above-described wiring board 1, the wiring electrodes 14 (15, 16) are formed of the first electrode layers 14A (15A, 16A) forming the low resistance wiring portions 14a (15a, 16a). ) And second electrode layers 14B (15B ₁ , 15B ₂ , 16B) forming wiring regions 14b (15b, 16b). According to this, the wiring electrode 14 (15, 16) described above can be formed by stacking the first electrode layer 14A (15A, 16A) and the second electrode layer 14B (15B ₁ , 15B ₂ , 16B). It is relatively easy to form.

On the other hand, in the above-described wiring board 1, the wiring electrode 15 (16) is formed so as to cover the first electrode layer 15A (16A) with the second electrode layer 15B ₂ (16B). It features. As a result, the contact area between the low resistance wiring portion 15a (16a) and the wiring region 15b (16b) can be widened, so that the wiring region having the same potential as the low resistance wiring portion 15a (16a) { 15b (16b)} can be reliably formed, and the electric field gradient Ea is not formed around the low resistance wiring portion 15a (16a).

On the other hand, in the above-described wiring board 1, the wiring electrode 14 (15) is formed on the second electrode layer 14B (15B ₁ ) formed on the substrate 10 directly or via another layer. 1 electrode layer 14A (15A) is laminated | stacked and formed, It is characterized by the above-mentioned. According to this, the wiring electrode 14 (15) having the low resistance wiring portion 14a (15a) and the wiring region 14b (15b) can be formed relatively easily.

On the other hand, in the above-mentioned wiring board 1, the metal which is easy to generate | occur | produce migration is one or more of Ag (silver), Cu (copper), Sn (tin), Pb (lead), The low resistance wiring portions 11a (12a to 22a) are characterized by containing silver palladium (AgPd) alloy. By the wiring electrodes 11 (12 to 22) having the low resistance wiring portions 11a (12a to 22a) containing these metals, the wiring board 1 having low resistance and hardly causing migration can be obtained.

In addition, according to the formation method for forming the wiring board 1 described above, it is possible to form a wiring board which does not easily cause problems due to migration while wiring the low resistance wiring electrode at high density, thereby improving the manufacturing quality. have.

In the formation method for forming the wiring board 1 described above, the first electrode layer 14A (15A, 16A) forming the low resistance wiring portions 14a (15a, 16a) is formed to form a low resistance wiring portion. Patterning the {14a (15a, 16a)}, and forming the second electrode layer 14B (15B ₁ , 15B ₂ , 16B) forming the wiring regions {14b (15b, 16b)} to form a wiring region {14b ( 15b, 16b)}, and a second electrode layer 14B (15B ₁ ) forming the wiring region 14b (15b) on the substrate 10 to form a wiring region { 14b (15b)}, after the process of patterning, the first electrode layer 14A (15A) forming the low resistance wiring portion 14a (15a)} directly or via another layer on the second electrode layer 14B (15B ₁ )}. } And the low resistance wiring portion {14a (15a)} is patterned. According to this, since the wiring electrode 14 (15) can be formed by film-forming and patterning conventionally performed, the wiring board with a high migration prevention effect can be formed by the economic manufacturing method using a conventional process.

In addition, according to the organic EL panel 100 employing the wiring board 1 described above, the light emitting characteristics of the organic EL element 30 can be improved in quality by using a low resistance wiring electrode, and the wiring electrode having a high density. By using this, image display with high definition and compactness of the panel can be realized. Also in the organic EL panel 100 which has such an improvement in performance, problems such as short circuit between electrodes due to migration can be solved.

 The present invention prevents migration between wiring electrodes only by the structure of the wiring electrodes irrespective of the protective layer.

Claims (18)

A wiring board comprising at least two wiring electrodes adjacent to each other on an insulating substrate, At least one of the wiring electrodes includes a low resistance wiring portion containing a metal which is susceptible to migration, and a wiring area that is connected to the low resistance wiring portion and is formed on the substrate between at least the low resistance wiring portion and another wiring electrode. And wherein the wiring area does not contain a metal that is prone to migration. The wiring board according to claim 1, wherein the wiring region has a linear pattern formed along the low resistance wiring portion. The wiring board according to claim 1 or 2, wherein the wiring area is formed to face each other of the two wiring electrodes. The wiring board according to any one of claims 1 to 3, wherein the wiring area is formed on both sides of the low resistance wiring portion. The wiring board according to any one of claims 1 to 4, wherein the wiring area has a connection part that is partially connected to the low resistance wiring part. 6. The wiring board according to claim 5, wherein the connection portion is formed such that positions of adjacent connection portions adjacent to each other in the arrangement direction of the wiring electrode are not aligned with the same position along the wiring electrode. 7. The wiring board according to claim 5 or 6, wherein a plurality of connecting portions are formed for one wiring area. 8. The wiring board according to any one of claims 1 to 7, wherein the wiring area is partially formed along the wiring electrode. The wiring board according to any one of claims 1 to 8, wherein the wiring electrode has a first electrode layer forming the low resistance wiring portion and a second electrode layer forming the wiring region. The wiring board of claim 9, wherein the wiring electrode is formed to cover the first electrode layer with the second electrode layer. The wiring board according to claim 9 or 10, wherein the wiring electrode is formed by stacking the first electrode layer directly or via another layer on the second electrode layer formed on the substrate. 12. The wiring board according to claim 11, wherein the second electrode layer is formed to be wider than the first electrode layer. The metal according to any one of claims 1 to 12, wherein the metal that is likely to generate migration is one or a plurality of Ag (silver), Cu (copper), Sn (tin), and Pb (lead). Wiring board. The wiring board according to any one of claims 1 to 13, wherein the low resistance wiring portion contains a silver palladium (AgPd) alloy. A method of forming a wiring board in which at least two wiring electrodes adjacent to each other are formed on an insulating substrate, At least one of the wiring electrodes is formed with a low resistance wiring portion containing a metal that is likely to cause migration, and at least one of the wirings is connected to the low resistance wiring portion on the substrate between the low resistance wiring portion and another wiring electrode. And a wiring region is formed of a material that does not contain a metal that is likely to cause migration. The process of claim 15, further comprising: forming a first electrode layer forming the low resistance wiring portion to pattern the low resistance wiring portion, and forming a second electrode layer forming the wiring region to pattern the wiring region. Forming a wiring board, characterized in that having a. The low resistance wiring according to claim 15 or 16, wherein after forming the second electrode layer forming the wiring region on the substrate and patterning the wiring region, the low resistance wiring is directly on the second electrode layer or via another layer. And forming the first electrode layer forming the portion to pattern the low resistance wiring portion. An organic EL panel in which a plurality of organic EL elements are formed on an insulating substrate by holding an organic material layer including an organic light emitting functional layer between the pair of electrodes, and wiring wires drawn from the pair of electrodes formed on the substrate. as, The wiring electrode has at least two wiring electrodes in close proximity to each other, and at least one of the wiring electrodes has a low resistance wiring portion containing a metal that is likely to cause migration, and at least the low resistance wiring conductive to the low resistance wiring portion. An organic EL panel comprising a wiring region formed on the substrate between a portion and another wiring electrode, wherein the wiring region does not contain a metal that is likely to cause migration.

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