JP2006061781A - 気液接触装置 - Google Patents
気液接触装置 Download PDFInfo
- Publication number
- JP2006061781A JP2006061781A JP2004244942A JP2004244942A JP2006061781A JP 2006061781 A JP2006061781 A JP 2006061781A JP 2004244942 A JP2004244942 A JP 2004244942A JP 2004244942 A JP2004244942 A JP 2004244942A JP 2006061781 A JP2006061781 A JP 2006061781A
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- liquid
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- 239000007788 liquid Substances 0.000 title claims abstract description 202
- 238000012856 packing Methods 0.000 claims description 87
- 239000007921 spray Substances 0.000 claims description 25
- 230000001737 promoting effect Effects 0.000 claims description 24
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 238000005507 spraying Methods 0.000 claims description 5
- 230000001174 ascending effect Effects 0.000 abstract description 7
- 239000000945 filler Substances 0.000 abstract 6
- 239000006185 dispersion Substances 0.000 abstract 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 44
- 239000007789 gas Substances 0.000 description 32
- 238000004821 distillation Methods 0.000 description 25
- 229910052786 argon Inorganic materials 0.000 description 22
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 19
- 238000000926 separation method Methods 0.000 description 12
- 230000007423 decrease Effects 0.000 description 11
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 9
- 239000001301 oxygen Substances 0.000 description 9
- 229910052760 oxygen Inorganic materials 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 8
- 239000000047 product Substances 0.000 description 8
- 230000000630 rising effect Effects 0.000 description 8
- 229910052757 nitrogen Inorganic materials 0.000 description 7
- 229910001873 dinitrogen Inorganic materials 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- 229910001882 dioxygen Inorganic materials 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 238000006731 degradation reaction Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 230000009897 systematic effect Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
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- Separation By Low-Temperature Treatments (AREA)
- Vaporization, Distillation, Condensation, Sublimation, And Cold Traps (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
Abstract
【解決手段】 自己分配促進型規則充填物を充填した気液接触装置の充填層を、下部の主充填層と上部の副充填層とで形成し、副充填層を、主充填層よりも小さな比表面積の自己分配促進型規則充填物で形成するとともに、充填層上部に設ける液分配器を、主充填層を構成する自己分配促進型規則充填物に対応した液散布密度よりも小さな液散布密度を有する液分配器とする。
【選択図】 図1
Description
C:流出係数 [−]
A:散布孔の面積 [m2]
g:重力加速度 [m/s2]
H:散布箱内の液深さ [m]
Claims (4)
- 自己分配促進型規則充填物を充填した充填層の上方に液分配器を配置し、該液分配器により分配されて前記充填層中を下降する液体と、下方から前記充填層中を上昇する気体とを接触させる気液接触装置において、前記充填層を、下部の主充填層と上部の副充填層とで形成し、該副充填層を、前記主充填層を形成する自己分配促進型規則充填物の比表面積よりも小さい比表面積を有する自己分配促進型規則充填物で形成するとともに、前記液分配器を、前記主充填層を構成する自己分配促進型規則充填物に対応した液散布密度よりも小さな液散布密度を有する液分配器としたことを特徴とする気液接触装置。
- 前記液分配器の液散布密度を、前記副充填層を形成する自己分配促進型規則充填物の比表面積に比例させて決定することを特徴とする請求項1記載の気液接触装置。
- 前記主充填層及び副充填層を形成する自己分配促進型規則充填物は、鉛直線に対して30〜45度に傾斜した流路を有する波形シート状金属からなり、その比表面積が250〜750m2/m3の範囲にあることを特徴とする請求項1又は2記載の気液接触装置。
- 前記自己分配促進型規則充填物は、前記流路の上端及び下端の少なくともいずれか一方の形状が変形していることを特徴とする請求項3記載の気液接触装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004244942A JP4580199B2 (ja) | 2004-08-25 | 2004-08-25 | 気液接触装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004244942A JP4580199B2 (ja) | 2004-08-25 | 2004-08-25 | 気液接触装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006061781A true JP2006061781A (ja) | 2006-03-09 |
JP4580199B2 JP4580199B2 (ja) | 2010-11-10 |
Family
ID=36108705
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004244942A Expired - Fee Related JP4580199B2 (ja) | 2004-08-25 | 2004-08-25 | 気液接触装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4580199B2 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010046616A (ja) * | 2008-08-22 | 2010-03-04 | Taiyo Nippon Sanso Corp | 気液接触装置 |
CN104147805A (zh) * | 2014-08-15 | 2014-11-19 | 苏州市兴鲁空分设备科技发展有限公司 | 一种气体分离装置 |
CN104841247A (zh) * | 2015-04-17 | 2015-08-19 | 泰州润达环保科技有限公司 | 一种脱硝塔结构 |
JP2018058009A (ja) * | 2016-10-04 | 2018-04-12 | 株式会社Ihi | 気液接触装置 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07318239A (ja) * | 1994-05-20 | 1995-12-08 | Hitachi Ltd | 精留塔 |
JPH09250898A (ja) * | 1996-03-18 | 1997-09-22 | Hitachi Ltd | 充填物による液分配装置 |
JP2000249464A (ja) * | 1998-12-28 | 2000-09-14 | Nippon Sanso Corp | 気液接触装置、空気液化分離装置、およびガス分離方法 |
JP2002143602A (ja) * | 2000-09-11 | 2002-05-21 | L'air Liquide Sa Pour L'etude & L'exploitation Des Procede S Georges Claude | 熱および/または物質を交換するための充填塔 |
-
2004
- 2004-08-25 JP JP2004244942A patent/JP4580199B2/ja not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07318239A (ja) * | 1994-05-20 | 1995-12-08 | Hitachi Ltd | 精留塔 |
JPH09250898A (ja) * | 1996-03-18 | 1997-09-22 | Hitachi Ltd | 充填物による液分配装置 |
JP2000249464A (ja) * | 1998-12-28 | 2000-09-14 | Nippon Sanso Corp | 気液接触装置、空気液化分離装置、およびガス分離方法 |
JP2002143602A (ja) * | 2000-09-11 | 2002-05-21 | L'air Liquide Sa Pour L'etude & L'exploitation Des Procede S Georges Claude | 熱および/または物質を交換するための充填塔 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010046616A (ja) * | 2008-08-22 | 2010-03-04 | Taiyo Nippon Sanso Corp | 気液接触装置 |
CN104147805A (zh) * | 2014-08-15 | 2014-11-19 | 苏州市兴鲁空分设备科技发展有限公司 | 一种气体分离装置 |
CN104841247A (zh) * | 2015-04-17 | 2015-08-19 | 泰州润达环保科技有限公司 | 一种脱硝塔结构 |
JP2018058009A (ja) * | 2016-10-04 | 2018-04-12 | 株式会社Ihi | 気液接触装置 |
Also Published As
Publication number | Publication date |
---|---|
JP4580199B2 (ja) | 2010-11-10 |
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