JP2006060027A - Plate-type temperature sensor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a plate-type temperature sensor which is composed of a heat-sensitive element with a lead wire and a plate-type insulating coating of organic resin material formed on its surface, which is thin and can be fitted in a small gap, exhibits a quick thermal response, can be brought into surface contact with an object to be detected, and exhibits an excellent electric isolation and a high weather resistance. <P>SOLUTION: The heat-sensitive element is composed of a heat-sensitive element which has an electrode for external lead and a lead wire which is electrically connected with the electrode. In this case, the heat-sensitive element and a part of the lead wire is covered with a plate-type integral insulating coating of organic resin material. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a flat plate type temperature sensor, and more particularly to a flat plate type temperature sensor in which a flat insulating film is formed on a surface of a thermosensitive element having a lead wire with a resin.

  Conventionally, as a method of ensuring the electrical insulation and weather resistance of a temperature sensor constituted by soldering a thermal element and a lead wire, as shown in FIG. 10, a tank B filled with an organic resin material 87 such as epoxy is used. After immersing a part of the thermosensitive element 86 of the temperature sensor and the lead wires 83a and 83b, it was taken out from the tank B, and the organic resin material 87 was heated and cured in a high temperature atmosphere to form an insulating film. However, this method can produce a temperature sensor with good electrical insulation and weather resistance. However, the organic resin material 87 attached to the lead wires 83a and 83b before being heated and cured is surrounded by a surface tension around the thermal element 86. As a result, a thick spherical insulating coating 87a is formed on the thermosensitive element 86, or excess resin collects at the tip of the temperature sensor due to gravity, resulting in variations in the shape after heat curing of the resin, resulting in defective products due to shape defects. There were drawbacks such as generation. Further, the temperature sensor thus completed has a response time until the heat of the insulating coating 87a absorbed from the detection object is transmitted to the thermal sensing device 86 due to the variation in the thickness of the insulating coating 87a covering the thermal sensing device 86. Variations occurred and the thermal response was not satisfactory. In addition, this temperature sensor is not suitable for applications in which the insulating coating 87a is thick and has a spherical shape, so that it must be inserted into a narrow gap to detect the temperature.

As a temperature sensor that solves such a problem, for example, a thin temperature sensor having a structure disclosed in Japanese Patent Laid-Open No. 8-54292 (Patent Document 1) has been proposed. In this temperature sensor, as shown in FIG. 11 (a), portions extending from one end of a pair of narrow metal plate portions 93a and 93b are external lead terminals 93a ′ and 93b ′, and the narrow metal plate portion 93a. , 93b are formed with clamping portions 96a, 96b. The electrode portions of the chip-like thermal element 97 are electrically connected to the side walls of the pair of clamping portions 96a, 96b, and the external lead terminals 93a ′, 93b are connected. It is a thin temperature sensor formed by bonding insulating sheets 98a and 98b with adhesive except for a part of '. Since this thin temperature sensor is thin and has a flat plate shape, it can be mounted in a small gap without providing a special space, and has advantages such as a high thermal response speed.
JP-A-8-54292

  However, since the thin temperature sensor having the structure disclosed in Patent Document 1 has a structure in which a metal plate portion excluding a part of the thermal element and the external lead terminal is bonded with an insulating sheet with an adhesive, When used for a long period of time, the adhesive strength of the adhesive of the insulating sheet is reduced, and the insulating sheet may be peeled off from the metal plate portion, which is not sufficient in terms of long-term reliability. In addition, as shown in the cross-sectional view of FIG. 11 (b), the structure of this temperature sensor is a structure in which a thin insulating sheet is used and bonded to the thermal element and the narrow metal plate part from both sides. A gap (t) is generated in the side wall portion of the heat sensitive element or the narrow metal plate, moisture or moisture enters from the gap portion due to a change in ambient temperature, the electrical characteristics of the heat sensitive element deteriorate, the insulating sheet peels off, etc. It was not enough in terms of long-term reliability. The thin temperature sensor has a structure in which a thin insulating sheet is used and pasted along the shape of the thermal element, so that the thermal element of the thermal part protrudes from the thickness of the clamping part. Further, there are drawbacks such that the thermal element portion is damaged due to excessive stress in contact with the body to be detected, and the insulating sheet is broken by the corner portions of the thermal element to cause insulation failure.

  The present invention has been made in view of the above-described problems, and is a flat plate type temperature sensor in which an insulating film is formed of an organic resin material on the surface of a thermosensitive element having a lead wire, and the thickness is thin and a slight gap is formed. An object of the present invention is to provide a flat plate type temperature sensor that can be mounted, has a high thermal response, can be brought into surface contact with an object to be detected, and is excellent in electrical insulation and weather resistance.

  The present invention has been made to achieve the above-described problems, and the invention of claim 1 is a heat-sensitive element comprising a heat-sensitive element having an electrode for external lead and a lead wire electrically connected to the electrode. The element is a flat plate type temperature sensor in which a part of the heat sensitive element and the lead wire are formed in a flat plate shape with an organic resin material and the same insulating film is formed. The flat plate temperature sensor completed by this manufacturing method can be formed in a small gap in the sensing object because it can form a thin flat insulating film, has high thermal response, and can be in surface contact with the sensing object. In addition, it has excellent electrical insulation and weather resistance.

  According to a second aspect of the present invention, a recess having a flat bottom is provided on the base, and the heat-sensitive element of the heat-sensitive element and a part of the lead wire are disposed in the recess, After flowing the organic resin material into the recess so that a part of the thermal element and the lead wire of the thermal element is buried, the organic resin material is heated and cured to form a flat insulating film. The flat plate type temperature sensor according to claim 1. The flat plate temperature sensor completed by this manufacturing method can be mounted in a small gap in the detected object because a thin flat insulating film can be formed on the thermal element and the lead wire. It is fast in response, can be in surface contact with the object to be detected, and has excellent electrical insulation and weather resistance. Moreover, the thickness of the insulating coating of a finished product can be managed by changing the depth of the recessed portion provided on the base.

  According to a third aspect of the present invention, a convex portion having a flat top is provided on the base, and the thermal element of the thermal element and a part of the lead wire are disposed on the convex portion. The liquid organic resin material is allowed to flow on the convex portion so that a part of the thermal element and the lead wire of the thermal element is buried, and then the organic resin material is heated and cured to form a flat insulating coating. The flat plate type temperature sensor according to claim 1, wherein: The flat plate temperature sensor completed by this manufacturing method can be mounted in a small gap in the detected object because a thin flat insulating film can be formed on the thermal element and the lead wire. It is fast in response, can be in surface contact with the object to be detected, and has excellent electrical insulation and weather resistance.

  In the invention according to claim 4 of the present invention, after a preliminary insulating film obtained by heat-curing a liquid organic resin material in advance is formed at a predetermined position on the base, the thermal element and the lead wire of the thermal element are formed. The organic resin is disposed so that a part thereof is positioned on the preliminary insulating coating, and the liquid organic resin material is flowed so that the thermal element of the thermal element and a part of the lead wire are buried. 5. The flat plate type temperature sensor according to claim 1, wherein the material is heat-cured to form an insulating coating that is the same as the preliminary insulating coating. The flat plate temperature sensor completed by this manufacturing method can be mounted in a small gap in the detected object because a thin flat insulating film can be formed on the thermal element and the lead wire. It is fast in response, can be in surface contact with the object to be detected, and has excellent electrical insulation and weather resistance. In addition, after forming a preliminary insulating film in which a liquid organic resin material is previously heat-cured at a predetermined position on the base, the thermal element of the thermal element and a part of the lead wire are positioned on the preliminary insulating film. Therefore, the thickness of the insulating coating of the finished product can be easily managed, and the electrical insulation is improved.

  The invention according to claim 5 of the present invention is the flat plate type temperature sensor according to any one of claims 1 to 4, wherein a lead wire constituting the heat sensitive element is constituted by a lead frame. The flat plate temperature sensor completed by this manufacturing method can be mounted in a small gap in the detected object because a thin flat insulating film can be formed on the thermal element and the lead wire. It is fast in response, can be in surface contact with the object to be detected, and has excellent electrical insulation and weather resistance.

  The invention according to claim 6 of the present invention is characterized in that the organic resin material is made of one of polyimide resin, polyamideimide resin, polyurethane resin, polyester resin, polyethylene resin, and silicone resin. This is a flat plate type temperature sensor. The flat plate temperature sensor completed by this manufacturing method can be mounted in a small gap in the detected object because a thin flat insulating film can be formed on the thermal element and the lead wire. It is fast in response, can be in surface contact with the object to be detected, and has excellent electrical insulation and weather resistance.

  The flat plate type temperature sensor of the present invention is a thermal element in which a lead wire is electrically connected to a thermal element on which an electrode for external drawing is formed. The thermal element is placed on a base having a flat surface, and a liquid organic After allowing the resin material to flow on the base so that a part of the thermal element and the lead wire of the thermal element is buried, the organic resin material is cured by heating to form a flat insulating film, By insulatingly coating a part of the heat sensitive element and the lead wire, there is a problem in the structure in which the metal plate part excluding a part of the heat sensitive element and the lead wire as shown in the conventional example is bonded with an insulating sheet with an adhesive. The problems of reliability such as insulation performance and durability due to peeling of the insulation sheet in a high-temperature and high-humidity environment or long-term use can be solved. The flat plate type temperature sensor of the present invention has a flat insulating film made of an organic resin material for a part of the heat sensitive element and the lead wire, so that it is difficult to use a conventional temperature sensor with a spherical tip. A flat plate temperature sensor capable of detecting temperature can be manufactured. In addition, the flat plate temperature sensor of the present invention is capable of detecting the temperature with high accuracy because it can detect the temperature by surface contact with the object to be detected by forming the flat insulating film on the heat sensitive portion as described above. is there.

  Hereinafter, embodiments of a flat plate temperature sensor of the present invention will be described with reference to the drawings. FIG. 1 is an explanatory view of a flat plate temperature sensor and a lead frame according to the present invention, FIG. 1 (a) is a perspective view of the flat plate temperature sensor, and FIG. 1 (b) is an X- FIG. 1C is a cross-sectional view taken along the X-ray, and FIG. 1C is a plan view showing the shape of a lead frame serving as a lead wire used in the flat plate temperature sensor according to the present invention. First, a lead frame used in the flat plate type temperature sensor of the present invention will be described with reference to FIG. A is a lead frame formed by chemical etching or pressing a strip-shaped metal plate such as stainless steel, Kovar, nickel or nickel alloy. Lead portions 3 a and 3 b are connected to the belt-like portion 2 in which the sprocket holes 1 are formed at regular intervals in a direction perpendicular to the belt-like portion 2. As described above, a plurality of sets each including the parallel lead portions 3 a and 3 b are provided in the belt-like portion 2. At the tips of the lead portions 3a and 3b, sandwiching portions 5a and 5b for sandwiching the thermal element are formed.

  Next, an embodiment of the flat plate type temperature sensor of the present invention will be described with reference to FIGS. 1 (a) and 1 (b). FIG. 1A shows the structure of a flat plate type temperature sensor of the present invention. The thermal element 6 such as a thermistor is sandwiched between the sandwiching portions 5a and 5b, and the electrode portions formed on the thermal element 6 are electrically connected by solder. A flat insulating film 7 formed by heat curing an organic resin material such as polyamide-imide resin or polyimide resin is formed on the heat-sensitive element 6 and part of the sandwiching portions 5a and 5b and the lead portions 3a and 3b. .

  Next, a method for manufacturing this flat plate type temperature sensor will be briefly described.

  FIG. 2 is a view for explaining the structure of the base for manufacturing the flat plate type temperature sensor according to the first embodiment of the present invention, and FIG. 2 (a) is a perspective view showing the structure of the base. 2B is a cross-sectional view taken along line YY in FIG. FIG. 3 is a diagram showing a manufacturing method of the flat plate type temperature sensor of the present invention according to the first embodiment. FIG. 3A shows a thermal element made of a lead frame in a recess provided on a base. It is a perspective view which shows the set state. 3B is a cross-sectional view taken along line YY in FIG. 3A, and FIG. 3C is a cross-sectional view taken along line YY showing an organic resin material poured into the recess on the base. FIG. 3D is a perspective view showing a lead frame in which a flat insulating film is formed on a series of thermosensitive elements taken out from the base.

  First, the structure of the base for forming an insulating film on the thermosensitive element will be described. As shown in FIGS. 2A and 2B, a recess 51 having a depth of 0.5 to 1.0 mm is formed on the base J in order to form a dielectric coating 7 by pouring a liquid organic resin material. Further, a positioning pin 52 for positioning the lead frame A, and the belt-like portion 2 of the lead frame A are fixed to hold the thermal element 6 and part of the lead portions 3a and 3b in the recess 51. A pedestal portion 53 is formed. The depth of the recessed part 51 in the said Example is not limited above, It can be made into the depth for obtaining the insulating film of desired thickness.

  Next, the manufacturing method of the flat plate type temperature sensor of this invention using this base is demonstrated. First, a method for manufacturing a thermal element using the lead frame A will be briefly described. The thermal element 6 having electrodes formed on both sides is sandwiched and fixed in the gaps between the sandwiching portions 5a and 5b provided at the tip portions of the lead portions 3a and 3b extending from the belt-like portion 2 of the lead frame A. Thereafter, the lead frame A with the thermal element 6 sandwiched is sent to a solder bath, and the thermal element 6 and the sandwiching portions 5a and 5b are soldered and electrically connected and fixed (not shown). A series of thermosensitive elements formed on the lead frame A in this way is formed by positioning the sprocket holes 1 of the lead frame A through the positioning pins 52 of the base J as shown in FIGS. 3 (a) and 3 (b). The thermal element 6 and a part of the lead portions 3 a and 3 b are held in the recess 51 by the pedestal portion 53. Next, as shown in FIG. 3C, the liquid organic resin material 7 is filled in the concave portion 51 to the extent that the thermal element 6 and the lead portions 3a and 3b are buried. In this embodiment, polyimide amide resin or polyimide resin is used as the liquid organic resin material, but polyurethane resin, polyester resin, polyester imide resin, polyethylene resin, silicone resin, etc. can also be used. Next, the base J filled with the liquid organic resin material 7 is heated and cured for a certain period of time in a thermostat set at a specified heat-curing temperature, and the heat-sensitive element 6 and a part of the lead portions 3a, 3b. An insulating coating 7 is formed by coating Thereafter, as shown in FIG. 3D, the lead frame A taken out from the base J is cut from the portion indicated by the line CC, and the flat plate temperature sensor S is completed. In this embodiment, the insulating film 7 of the flat plate type temperature sensor completed by changing the depth of the concave portion corresponding to the thickness of the lead portions 3a and 3b and the dimension of the thermal element 6 in the thickness direction of the lead frame A. The thickness can be adjusted.

  The thermal element 6 disclosed in the present embodiment has been described with respect to a thermistor element having a structure having electrodes on both sides. However, the present invention is not limited to this, and as shown in FIG. You may use the element of the thin film structure in which the electrode was formed on the surface. In this case, a thin film element may be bridged between the lead portions 3a and 3b to electrically connect the electrode and the lead portion. Of course, it is possible to use an element having a structure such as a multilayer chip thermistor.

  FIG. 4 is a view for explaining a method of manufacturing the flat plate type temperature sensor of the present invention according to the second embodiment. FIG. 4A shows a series of thermal elements formed in the recesses on the base. FIG. 4B is a cross-sectional view showing a cross section taken along line YY of FIG. 4A, and FIG. 4C is a view of a recess on the base. FIG. 4D is a perspective view showing a lead frame in which an insulating film is formed on a series of thermosensitive elements taken out from the base, showing a state in which the organic resin material is filled. In addition, the code | symbol used uses the same code | symbol about the same part as Example 1, and uses the same base as what was shown in FIG.

  The method for manufacturing the thermosensitive element using the lead frame A has been described briefly in the first embodiment, and will be omitted. The feature of the manufacturing method of the flat plate type temperature sensor according to the present embodiment is that a small amount of polyamideimide resin liquid organic resin material is poured into the bottom of the recess 51 formed on the base J in advance, and is cured by heating and preliminarily insulating coating 7a. It is to form. As described above, the thermal element 6 and the lead portions 3a and 3b are held in the recess 51 of the base J on which the preliminary insulating film 7a is formed in advance, as shown in FIGS. 4 (a) and 4 (b). To do. Then, as shown in FIG. 4C, a liquid organic resin material 7 made of polyamideimide resin is filled using a discharge device or the like until the thermal element 6 and the lead portions 3a and 3b are buried. Next, the base J filled with the liquid organic resin material 7 is held for a certain period of time in a thermostatic bath set to a specified heat curing temperature to heat and cure the organic resin material 7 so that the thermal element 6 and the lead An insulating film 7 covering a part of the portions 3a and 3b is formed. Next, as shown in FIG. 4D, the lead frame A is taken out from the base J, and the portion indicated by the line CC is cut by a cutting machine or the like to complete the flat plate temperature sensor S.

  In the first and second embodiments, the example of the base in which one concave portion corresponds to one thermal element has been described, but one concave portion is formed for a series of thermal elements arranged in the lead frame A. You may use the base which we did. In this case, since one insulating film is formed for a series of thermosensitive elements, individual flat plate type temperature sensors completed by cutting the formed insulating film individually after heat curing are obtained. It is done.

  FIG. 5 is a view for explaining a method of manufacturing the flat plate type temperature sensor of the present invention according to the third embodiment. FIG. 5 (a) is a perspective view showing the structure of the base, and FIG. 5 (b). FIG. 5 shows a cross-sectional view taken along the line ZZ in FIG. FIG. 6 is a diagram for explaining a method for manufacturing a flat plate type temperature sensor according to the present invention. FIG. 6A shows a lead frame in which a series of heat-sensitive elements are formed on convex portions formed on a base. FIG. 6B is a cross-sectional view showing a cross section cut along the line ZZ in FIG. 6A, and FIG. 6C is an organic resin material on the convex portion on the base. FIG. 6D is a perspective view showing a lead frame in which an insulating film is formed on a series of thermal elements taken out from the base.

  Next, the manufacturing method of the flat plate type temperature sensor of this invention using this base is demonstrated. The method for manufacturing the thermosensitive element using the lead frame A has been described briefly in the first embodiment, and will be omitted. As shown in FIGS. 5 (a) and 5 (b), a convex portion 54 having a flat top corresponding to the shape of the insulating coating 7 to be formed is formed on the base J. Further, as shown in FIG. A positioning pin 52 for positioning the frame A and a pedestal portion 53 for fixing the strip-shaped portion of the lead frame A are formed.

  First, a series of thermosensitive elements formed on the lead frame A are positioned by inserting the sprocket holes 1 of the lead frame A into the positioning pins 52 of the base J as shown in FIG. The pedestal portion 53 holds the thermal element 6 and part of the lead portions 3a and 3b on the convex portion 54 having a flat top portion. Next, as shown in FIG.6 (c), the organic resin material 7 is discharged using a discharge apparatus etc. to such an extent that the thermal element 6 and lead part 3a, 3b are buried. At this time, the organic resin material stays on the convex portion 54 having a flat top due to surface tension and maintains the shape of the convex portion. Next, the base J filled with the liquid organic resin material 7 is heated and cured for a certain period of time in a thermostat set at a specified heat-curing temperature, and the heat-sensitive element 6 and a part of the lead portions 3a, 3b. An insulating coating 7 coated with is formed. Finally, as shown in FIG. 6D, the lead frame A portion is removed from the base J, and the portion indicated by line CC is cut to complete the flat plate temperature sensor S. As the organic resin material, a polyimide amide resin or a polyimide resin was used as in the above example.

  FIG. 7 is a view for explaining a method of manufacturing the flat plate type temperature sensor of the present invention according to the fourth embodiment, and FIG. 7A is a lead frame in which a series of thermal elements are formed on a base. 7B is a cross-sectional view taken along line ZZ in FIG. 7A, and FIG. 7C is a top view of a convex portion having a flat top on the base. FIG. 7D is a cross-sectional view taken along the line ZZ showing a state in which an insulating film is formed on a series of thermal elements using an organic resin material. FIG. 7D shows an insulating film formed on the series of thermal elements removed from the base. It is a perspective view which shows a lead frame. In addition, the code | symbol used uses the same code | symbol about the same part as another Example, and uses the same base as what was shown in FIG.

  The method for manufacturing the thermosensitive element using the lead frame A has been described briefly in the first embodiment, and will be omitted. A feature of the manufacturing method of the flat plate type temperature sensor according to the present embodiment is that a small amount of polyamide-imide resin or polyimide resin liquid organic resin material is poured on the top of the projection 54 having a flat top formed in advance on the base J. The preliminary insulating coating 7a is formed by heat curing. As shown in FIGS. 7A and 7B, the thermal element 6 and the lead portions 3a and 3b are arranged on the convex portion 54 of the base J on which the preliminary insulating coating 7a is formed in advance. Thereafter, as shown in FIG. 7 (c), the liquid organic resin material 7 made of polyamideimide resin or polyimide resin is discharged using a discharge device or the like until the thermal element 6 and the lead portions 3a and 3b are buried. It can be retained by the surface tension at the flat top of the convex portion 54. Next, the base J in which the liquid organic resin material 7 stays on the flat top of the convex portion 54 is held for a certain period of time in a thermostatic bath set to a specified heat-curing temperature, and is heat-cured. As a result, an insulating film 7 covering a part of the lead portions 3a and 3b is formed. Finally, as shown in FIG. 7 (d), the lead frame A is removed from the base J, and the portion indicated by line CC is cut to complete the flat plate temperature sensor S.

  FIG. 8 is a diagram showing another embodiment of the flat plate type temperature sensor of the present invention. As shown in FIG. 8A, instead of the thermal element using the lead frame of the above embodiment, a single wire is used. A flat insulating film may be formed on the thermosensitive element using the lead wires 3a and 3b by the above method, or a screw hole for fixing the insulating film 7 to the object to be detected as shown in FIG. By changing the shape of the filling portion of the organic resin material of the base in accordance with the shape of the detection portion of the object to be detected, a flat plate type temperature sensor having an optimum shape can be manufactured. 8 (c) and 8 (d) show that an insulating film is formed after coating an insulating material such as varnish 8 on the heat sensitive element portion before molding the organic resin material for applications requiring further electrical insulation. Of course, lead wires 3a and 3b in which covering portions 3a 'and 3b' such as enamel are formed may be used.

  Further, since the flat plate type temperature sensor of the present invention can form an insulating coating that can be freely shaped according to the shape of the object to be detected, it is adapted to the curved surface of the heating roller used in the fixing device of the copying machine as shown in FIG. A flat plate-shaped temperature sensor can be manufactured. Also, it is possible to manufacture a temperature sensor having a shape that can be in close contact with the cell surface of the battery pack or a shape that can detect the surface temperature of the pipe.

FIG. 1 is an explanatory view of a flat plate type temperature sensor and a lead frame according to the present invention. FIG. 2 is a view for explaining the structure of a base for manufacturing the flat plate type temperature sensor of the present invention according to the first embodiment and the second embodiment. FIG. 3 is a diagram showing a manufacturing method of the flat plate type temperature sensor of the present invention according to the first embodiment. FIG. 4 is a view for explaining a method of manufacturing the flat plate type temperature sensor of the present invention according to the second embodiment. FIG. 5 is a view for explaining the structure of a base for manufacturing the flat plate type temperature sensor of the present invention according to the third and fourth embodiments. FIG. 6 is a diagram for explaining the method for manufacturing the flat plate type temperature sensor of the present invention according to the third embodiment. FIG. 7 is a view for explaining a method of manufacturing the flat plate type temperature sensor of the present invention according to the fourth embodiment. FIG. 8 is a view showing another embodiment of the flat plate type temperature sensor of the present invention. FIG. 9 is an explanatory diagram illustrating attachment to a detection target. FIG. 10 is an explanatory diagram for explaining a conventional temperature sensor manufacturing method and structure. FIG. 11 is an explanatory diagram illustrating the structure of a conventional thin temperature sensor.

Explanation of symbols

S flat plate type temperature sensor 3a, 3b lead wire 5a, 5b clamping part 6 thermal element 7 insulating coating J base 51 concave part 52 positioning pin 53 pedestal part 54 convex part

Claims (6)

  In a heat sensitive element comprising a heat sensitive element having an electrode for external extraction and a lead wire electrically connected to the electrode, the heat sensitive element and a part of the lead wire are insulated in a flat form by an organic resin material. A flat plate type temperature sensor characterized in that a film is formed.   A concave portion having a flat bottom is provided on a base, and the thermal element of the thermal element and a part of the lead wire are arranged in the concave portion, and a liquid organic resin material is used as the thermal element of the thermal element. 2. The flat insulating film is formed by causing the organic resin material to heat and cure after flowing into the recess so that a part of the lead wire is buried. Flat plate temperature sensor.   A convex part having a flat top is provided on the base, and the thermal element of the thermal element and a part of the lead wire are arranged on the convex part, and a liquid organic resin material is disposed on the thermal element. The flat plate-like insulating film is formed by heat-curing the organic resin material after flowing the heat-sensitive element and the lead wire so that a part of the lead wire is buried. The flat plate type temperature sensor according to 1.   After forming a preliminary insulating film in which a liquid organic resin material is previously heat-cured at a predetermined position on the base, the thermal element of the thermal element and a part of the lead wire are positioned on the preliminary insulating film. The liquid organic resin material is flowed so that the thermal element of the thermal element and a part of the lead wire are buried, and then the organic resin material is heated and cured to form the preliminary insulating coating. 4. The flat plate type temperature sensor according to claim 1, wherein the same insulating film is formed.   5. The flat plate type temperature sensor according to claim 1, wherein the lead wire constituting the heat sensitive element is constituted by a lead frame. 6. The flat plate type temperature sensor according to claim 1, wherein the organic resin material is one of polyimide resin, polyamideimide resin, polyurethane resin, polyester resin, polyesterimide resin, polyethylene resin, and silicone resin.

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