JP2006053325A - Drawing apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To form a pattern having high accuracy and excellent visibility without producing a boundary line in the pattern by scanning. <P>SOLUTION: A boundary line Bym (wherein m=0, 1, 2, ...) of a scanning band, that is an exposure area, is set in the center position between scanning line patterns along a sub scanning direction (Y direction) and successively calculated. From division raster data DBm having the data width larger than the band width of a scanning band SBm, raster data DB'm present in the range of boundary lines from Bym-1 to Bym are extracted. A DMD control unit controls micromirrors in a drawing area as a portion area in the entire DMD based on the raster data DB'm to form a pattern. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a drawing apparatus for drawing a pattern such as a circuit pattern on a mask (reticle) or a substrate, and a method for manufacturing a substrate using the drawing apparatus.

In the drawing apparatus, a drawing process is performed on blanks coated with a photosensitive material such as a photoresist, and a pattern is formed on the substrate through processes such as development, etching, and resist peeling. In an exposure method using a light modulation unit such as a DMD (Digital Micro-mirror Device) or LCD with two-dimensionally arranged micromirrors, the light modulation element of the light modulation unit is used to irradiate the substrate with light according to the pattern. Each is independently ON / OFF controlled (see, for example, Patent Document 1). In the case of the raster scanning method, the exposure area, which is an irradiation spot, is moved relative to the scanning band defined along the main scanning direction for drawing. (See Patent Document 2 and Patent Document 3).
JP 2003-57837 A JP 2002-6511 A JP 2000-122303 A

  When manufacturing a liquid crystal panel, a plasma display panel, or the like, a drawing process is performed so as to regularly and repeatedly form a pixel pattern or a pattern corresponding to a scanning line. The size of the exposure area by the light modulation unit such as DMD does not match the size of each pixel pattern or each line pattern, and the size of the pixel pattern or line pattern is not determined according to the size of the DMD light modulation unit. Therefore, the boundary line of the scanning band, that is, the boundary line of the exposure area adjacent in the sub-scanning direction may be located inside the pixel pattern or the line pattern. When an LCD or a plasma display with a boundary line defined in this way is manufactured and an image is displayed, a joint portion of exposure appears as a line along the boundary line of the exposure area and is visually recognized. In addition, when the same pattern such as a lead frame is repeatedly formed on a single substrate, a joint portion corresponding to the boundary line is generated inside the pattern, and the accuracy of the wiring pattern may be reduced.

  The drawing apparatus of the present invention is a drawing apparatus including a light source, a light modulation unit, a scanning unit, and a drawing unit, and is a drawing device that performs patterning by scanning a light modulation unit such as a DMD. For example, a circuit pattern can be formed on the substrate, or the pattern can be hard copied. In the light modulation unit, a plurality of light modulation elements such as micromirrors are regularly arranged, and light from the light source is selectively guided to the substrate based on the position of the light modulation element corresponding to the pattern. The scanning unit relatively moves the exposure area by the light modulation unit along a plurality of scanning bands defined along the scanning direction of the substrate. For example, the exposure area is sequentially moved along the main scanning direction while moving the table on which the substrate is mounted. The drawing means generates divided drawing data for each scanning band from the pattern data, and controls a plurality of light modulation elements based on the generated divided drawing data. For example, drawing data such as raster data is generated as divided drawing data corresponding to the scanning band based on pattern data that is vector data. Then, the light modulation element is controlled based on the drawing data, and light corresponding to the pattern is irradiated onto the substrate.

  In the drawing apparatus of the present invention, the scanning unit relatively moves the exposure area while causing the projection areas of all the drawing areas of the light modulation unit to overlap each other. As a result, the drawing process is performed based on a drawing area whose scanning bandwidth is shorter than the projection area corresponding to the entire drawing area of the light modulation unit and whose area size is smaller than the entire drawing area. The drawing means defines the boundary line of the exposure area in an area between adjacent patterns. Here, the non-pattern region indicates a region where a pattern such as a pixel pattern is not formed along the main scanning direction. For example, when the same pattern is repeated, such as a PDP scanning line pattern, a pixel pattern such as an LCD, or a lead frame attached to the same substrate, a boundary line is defined between the patterns. The drawing means draws based on the drawing data corresponding to the width of each scanning band defined according to the boundary line.

  For example, when the pattern data is data of a pattern in which the reference pattern is regularly repeated at a predetermined interval, the drawing means determines the position of the boundary line between the adjacent reference patterns based on the arrangement interval of the reference patterns. Boundary line calculating means for calculating, divided drawing data generating means for generating divided drawing data having a data width size larger than the width of the scanning band based on the pattern data, and outside the boundary line calculated from the generated divided drawing data And a drawing data extracting means for removing the non-irradiation drawing data.

  The drawing method of the present invention applies light from a light source to a light modulation unit in which a plurality of light modulation elements are regularly arranged, selectively guides light from the light source to a substrate, and exposes the light by the light modulation unit. The area is relatively moved along a plurality of scanning bands defined along the scanning direction of the substrate, and divided drawing data is generated for each scanning band from the pattern data, and a plurality of areas are generated based on the generated divided drawing data. In this drawing method, each of the light modulation elements is controlled by moving the exposure area relative to each other while overlapping the projection areas corresponding to all the drawing areas of the light modulation unit. The non-pattern region is drawn, and drawing is performed based on drawing data corresponding to the width of each scanning band defined according to the boundary line.

  The drawing data processing apparatus of the present invention calculates a boundary line for a plurality of scanning bands defined along the substrate scanning direction by determining the position of the boundary line of the adjacent scanning band as a non-drawing area outside the pattern. Calculation means, divided drawing data generation means for generating divided drawing data having a data width size larger than the projection area from the pattern data, and drawing data outside the calculated boundary line is removed from the generated divided drawing data A drawing data extracting means for performing drawing processing based on drawing data corresponding to the width of each scanning band defined according to the boundary line.

  The drawing data processing program of the present invention calculates a boundary line for a plurality of scanning bands defined along the substrate scanning direction by determining the position of the boundary line of the adjacent scanning band as a non-drawing area outside the pattern. Calculation means, divided drawing data generation means for generating divided drawing data having a data width size larger than the projection area from the pattern data, and drawing data outside the calculated boundary line is removed from the generated divided drawing data And a drawing data extracting means that functions.

  In the substrate manufacturing method of the present invention, 1) a photosensitive material is applied to a substrate that is a blank, 2) drawing is performed on the applied substrate, 3) development is performed on the drawn substrate, and 4) current processing is performed. 5) A method of manufacturing a substrate including a step of etching the substrate and 5) peeling the photosensitive material from the etched substrate, wherein a plurality of light modulation elements are regularly arranged in drawing. The light from the light source is applied to the modulation unit, the light from the light source is selectively guided to the substrate, and the exposure area by the light modulation unit is set along a plurality of scanning bands defined along the scanning direction of the substrate. A relative modulation unit that generates divided drawing data for each scanning band from pattern data, and controls a plurality of light modulation elements based on each generated divided drawing data. The exposure areas are moved relative to each other while the projection areas corresponding to the entire drawing area overlap each other, the boundary line of the exposure area is defined as a non-pattern area between adjacent patterns, and the width of each scanning band defined according to the boundary line It draws based on the drawing data according to.

  According to the present invention, a boundary line is not generated inside a pattern by scanning, and a pattern with high accuracy and excellent visibility can be formed.

  Below, the drawing apparatus which is embodiment of this invention is demonstrated with reference to drawings.

  FIG. 1 is a perspective view schematically showing a drawing apparatus according to the present embodiment. FIG. 2 is a diagram schematically showing the configuration of the exposure head of the drawing apparatus. FIG. 3 is a diagram showing a pattern for a plasma display.

  The drawing apparatus 10 is an apparatus for drawing while continuously moving the drawing table 18, and includes a gate-like structure 12 and a base 14. The drawing table 18 on which the substrate SW is mounted is supported by a guide rail 19X mounted on the base 14, and the drawing table 18 is movable along the guide rail 19X. The guide rail 19Y that supports the exposure unit 20 is mounted on the gate-like structure 12, and the exposure unit 20 is movable along the guide rail 19Y. Here, the moving direction of the drawing table 18 (hereinafter referred to as the X direction) and the moving direction of the exposure unit 20 (hereinafter referred to as the Y direction) are orthogonal to each other, the X direction being the main scanning direction and the Y direction being the sub scanning direction. Determine.

  The substrate SW is composed of a glass substrate for plasma display, and is subjected to pre-pag processing, coating of a photoresist, which is a photosensitive material, and the like in advance, and is mounted on the drawing table 18 as blanks. The drawing apparatus 10 is connected to the drawing control unit 30, and the drawing control unit 30 controls execution of drawing processing.

  As shown in FIG. 2, the exposure unit 20 is provided with a light source 21 and an exposure head 25. The exposure head 25 includes an illumination optical system 24, a DMD 22, and an imaging optical system 26, and the illumination optical system 24 is disposed between the light source 21 and the DMD 22. Light emitted from the semiconductor laser 21 as a light source enters the illumination optical system 24 and irradiates the DMD 22. The illumination optical system 24 shapes the beam shape and guides the light to the DMD 22 as parallel light.

The DMD 22 is a light modulation unit in which M × N rectangular micromirrors are arranged in a matrix, and each micromirror X _ij (1 ≦ i ≦ m, 1 ≦ j) having a size of height H and width W. ≦ N) is rotated (attitude change) by the electrostatic field effect. That is, the drawing control unit 30 is positioned in one of the first posture (ON state) that reflects light toward the substrate SW and the second posture (OFF state) that reflects light toward the outside of the substrate SW. The posture is switched based on the drawing signal from.

In the case of the first posture, the light reflected on the micromirror is guided to the imaging optical system 26, and the light irradiates a predetermined place on the substrate SW. On the other hand, in the second posture, the light reflected on the micromirror is guided out of the substrate SW. Each micromirror X _ij is independently ON / OFF controlled, and the light irradiated on the entire DMD 22 is configured as light selectively reflected by the micromirror. As a result, the exposure surface SU is irradiated with light corresponding to the pattern to be formed at that location.

  When the drawing table 18 is moved along the X direction (main scanning direction) while the exposure unit 20 is stopped, the exposure area EA that is an irradiation spot by the DMD 22 relatively moves the substrate SW along the X direction. . A plurality of scanning bands are defined on the substrate SW in accordance with the exposure area EA, and the exposure area EA relatively moves along the scanning band. During this time, light corresponding to the pattern is irradiated according to the relative position of each exposure area. Here, the projection magnification is set to 1.

  When the drawing process for one scanning band is completed, the exposure unit 20 moves a predetermined distance in the Y direction (sub-scanning direction), and the exposure area EA moves relative to the next scanning band. By sequentially moving the exposure area EA through the scanning band, the drawing process is performed on the entire substrate. When the drawing process ends, the substrate SW is subjected to development processing, etching, resist stripping processing, and the like, whereby the substrate SW on which the circuit pattern is formed is manufactured.

  FIG. 3 shows a pattern for a plasma television display formed on the substrate SW, and scanning line patterns PP serving as scanning lines are arranged along the sub-scanning direction at predetermined intervals. When a television incorporating a substrate is displayed, the scanning line pattern PP serves as a scanning line to form an image.

  FIG. 4 is a block diagram of the drawing apparatus 10 and the drawing control unit 30.

  When pattern data for the entire substrate is sent as CAD data from a workstation (not shown) to the drawing control unit 30, the raster conversion unit 42 converts the pattern data, which is vector data, into raster data. The raster data is two-dimensional dot pattern data of a circuit pattern and is binarized so as to indicate whether the micromirror is on or off. The raster data is generated for each scanning band and is sequentially sent to the raster data extraction unit 41.

  As will be described later, the raster data extraction unit 41 extracts only raster data necessary for pattern irradiation. The extracted raster data is sequentially stored in a bitmap memory (not shown) of the DMD control unit 34. The table control unit 38 controls the X-direction drive mechanism 46 and the Y-direction drive mechanism 48 provided with motors, and controls the movement and stop of the drawing table 18 and the exposure unit 20. The position detector 40 detects the relative position of the exposure area EA and outputs a drawing timing signal to the DMD controller 34.

  In the DMD control unit 34, corresponding raster data is read from the bitmap memory based on the relative position of the exposure area EA. Then, raster data is output as a drawing signal in synchronization with the drawing timing signal, and each micromirror of the DMD 22 is ON / OFF controlled based on the corresponding drawing element signal.

  The system control circuit 32 controls the drawing process and outputs a control signal to each circuit such as the DMD control unit 34 and the raster data extraction unit 41. In addition, it receives information related to the drawing pattern sent from the workstation together with the pattern data, and outputs a control signal to the raster data extraction unit 41 based on the information of the DMD 22 stored in advance in a memory (not shown). A program for controlling the drawing process is stored in advance in a ROM (not shown) in the system control circuit 32.

  FIG. 5 is a flowchart showing a drawing process executed under the control of the system control circuit 32.

  In step S101, as described later, a boundary line between adjacent scanning bands, that is, a boundary line of an exposure area is calculated. In step S102, the band number “m” indicating the order of the scanning bands is set to 0 as the first scanning band.

  In step S103, it is determined whether the drawing process can be executed. If it is determined that the drawing process cannot be executed, step S103 is repeatedly executed. On the other hand, if it is determined that the drawing process can be executed, the process proceeds to step S104, and the raster data transfer process is executed as described later. In step S105, the DMD 22 is controlled based on the raster data, and drawing processing is performed.

  In step S106, it is determined whether or not the drawing process has been completed up to the last scanning band on the substrate. If it is determined that the drawing has not reached the last scanning band, the process proceeds to step S107, where the band number “m” is reached. 1 is incremented to return to step S103. Steps S103 to S107 are repeatedly executed until the drawing process for all the scanning bands is executed.

  FIG. 6 is a subroutine of step S101 in FIG. FIG. 7 shows the pattern pitch. FIG. 8 is a diagram showing the overlap of the projection area of the DMD 22. FIG. 9 is a diagram showing boundary lines. The band boundary line calculation processing will be described with reference to FIGS.

  In step S201, the band number “m” is set to 0, and the boundary line calculation process for the first scanning band is set. In step S202, drawing pattern information is read out. The pattern to be formed on the substrate SW is a pattern in which the scanning line pattern PP is regularly formed at a predetermined interval, and the pattern pitch Pp, the pattern shift distance Ps, and the pattern width Pw are read as the drawing pattern information (FIG. 7). reference). The pattern shift distance Ps represents a distance from the origin “Y0” to the first scanning line pattern PP along the sub-scanning direction in the two-dimensional coordinate system (XY) defined on the substrate SW. When step S202 is executed, the process proceeds to step S203.

  In step S203, DMD information is read. Here, as the DMD information, the projection area KA by all the drawing areas corresponding to all the micromirrors of the DMD 22 and the distance Dsm from the origin Y0 in the sub-scanning direction Y to the end piece of the DMD 22 are read out. However, Dym and Dsm indicate the projection area and distance corresponding to the scanning band SBm of the band number m. When step S203 is executed, the process proceeds to step S204.

  In step S204, the boundary line of the adjacent scanning band is determined according to the scanning line pattern PP. Hereinafter, calculation of the boundary line will be described.

  In FIG. 8, the scanning bands SBm (SB0, SB1, SB2,...) Are shown in order from the origin Y0, and the exposure areas EA move in order along the scanning band SBm. The drawing area for guiding light to the substrate SW on the DMD 22 is constituted by a part of the total drawing (total reflection) area of the DMD 22, and the drawing areas at both ends along the sub-scanning direction Y are not used. Here, since the projection magnification (reduction magnification) is 1, light is not irradiated to the non-drawing projection areas AW1 and AW2 corresponding to the drawing regions at both ends of the DMD 22. Then, the movement of the exposure head 25 is controlled so that the projection areas KA of all the drawing areas of the DMD 22 overlap each other. The width (length) corresponding to the sub-scanning direction (Y direction) of the drawing area on the DMD 22 corresponds to the width SWm of the scanning band SBm.

Whereas the pattern width Pw of each scanning line pattern PP is several micrometers, the projection area of the DMD 22 is defined to be about several millimeters. Therefore, a large number of scanning line patterns PP are contained in the exposure area of the DMD 22. Therefore, when n scanning line patterns PP exist for one scanning band, n satisfies the following expression. However, the first scanning band SB0 is targeted.

Ps + Pp × n <(Dy0 + Ds1) / 2 <Ps + Pp × (n + 1)
(1)

The value of n satisfying the expression (1) varies according to the pitch of the scanning line pattern PP formed on the substrate.

In the present embodiment, as shown in FIG. 9, the boundary line of the scanning band is determined at an intermediate position along the sub-scanning direction (Y direction) of the adjacent scanning line pattern PP. That is, a boundary line is defined at an intermediate position with respect to the non-pattern region between the scanning line patterns PP. For example, the boundary line By0 of the scanning bands SB1 and SB2 is obtained by the following equation with reference to FIG. However, the boundary line By0 is represented by the distance from the origin Y0.

By0 = Ps + Pp × (n + 1) −Pw / 2 (2)

  By obtaining an integer n satisfying the equation (1) and substituting the obtained n into the equation (2), By0 is calculated. The boundary line BYm for any adjacent scanning bands SBm and SBm + 1 is obtained by replacing Dy0 with Dym and replacing Ds1 with Dsm + 1 in equation (1). However, values are set in advance for the boundary line that is the lower end of the scanning band SB0.

  When the boundary line Bym for the scanning band SBm of the band number “m” is calculated in step S204 of FIG. 6, the process proceeds to step S205. In step S205, it is determined whether or not the calculation process is for the last scan band. If it is determined that the last scan band is not the target, the process proceeds to step S206, and 1 is incremented to the band number “m”. When step S206 is executed, the process returns to step S203, and steps S203 to S206 are repeatedly executed until boundary lines are calculated for all scanning bands.

  FIG. 10 is a subroutine of step S104 in FIG. FIG. 11 is a diagram showing raster data for each scanning band. The raster data transfer process will be described with reference to FIGS.

  The pattern data, which is vector data, is converted into a plurality of divided pattern data according to each scanning band, and each divided pattern data is converted into divided raster data as drawing data. The divided raster data RBwm is data having a width larger than the projection length Dym of the DMD 22 as shown in FIG. 11, and adjacent divided raster data overlap each other. In step S301, the value of the data bandwidth RBwm of the divided raster data DBm is read. Further, the value of the distance D'sm along the Y 'direction from the origin Y'0 of the divided raster data DBm is read out. The coordinate position of the divided raster data DBm is expressed based on a coordinate system in which the position is shifted by Ds0 from the origin Y0 of the coordinate system shown in FIG. 8 and the origin is defined as “Y′0” in the sub-scanning direction. The The distance D'sm of the divided raster data DBm is used to represent the divided raster data, for which the coordinate systems are separately defined separately, with a common coordinate system (origin Y'0). Further, values such as the boundary line Bym represented by the coordinate system with reference to the substrate SW shown in FIG. 8 are subjected to coordinate conversion and processed.

  In step S302, the divided raster data DBm corresponding to the scanning band SBm is read from the raster conversion unit. In step S303, for the read divided raster data DBm, a raster positioned below the boundary line Bym-1 near the origin Y′0 of both boundary lines Bym-1 and Bym of the corresponding scanning band SBm. Data is cleared because it is outside the scan band. For example, in the case of the scan band SB1, raster data on the origin Y′0 side from the boundary line By0 is removed. Further, in step S304, the raster data positioned above the other calculated boundary line Bym (located far from the origin Y′0) is cleared because it is positioned outside the scanning band. For example, in the case of the scanning band SB1, raster data located at a position farther from the origin Y′0 than the boundary line By1 is removed. As a result, the divided raster data DBm is converted into raster data DB′m having a data width from the boundary lines Bym−1 to Bym along the sub-scanning direction (Y direction). For example, in the case of the scan band SB1, raster data DB'1 having a data width from the boundary lines By0 to By1 is generated, and the data width becomes the width SW1 of the scan band SB1.

  In step S305, the raster data DB′m extracted from the divided raster data DBm is transferred to the DMD control unit 34. When step S305 is executed, the process returns to step S105 in FIG. In step S105, drawing processing is performed based on raster data having a predetermined data width, that is, the width SWm of the scanning band SBm. At this time, the micromirror located in the drawing area on the DMD 22 corresponding to the cleared raster data is set to the OFF state.

  Since the position of the boundary line Bym is determined by the pattern pitch Pp of the scanning line pattern PP, the scanning band width SWm is obtained for each scanning band SBm. Accordingly, the width (length) of the non-drawn projection areas AW1 and AW2 (see FIG. 8) along the sub-scanning direction (Y direction) varies depending on the scanning band SBm.

  As described above, according to the present embodiment, the scanning band, that is, the boundary line Bym (m = 0, 1, 2,...) At the center position between the scanning line patterns PP along the sub-scanning direction (Y direction).・) Is calculated sequentially. Then, raster data DB′m in the range from the divided raster data DBm having a data width larger than the bandwidth SWm of the scanning band SBm to the boundary lines Bym−1 to Bym is extracted and transferred to the DMD control unit 34. Based on the raster data DB′m, a part of the entire DMD 22 is defined as a drawing area, and a pattern is formed by micromirrors in the drawing area.

  Note that the present invention can also be applied to a case where a pixel pattern such as an LCD is regularly formed repeatedly in the main scanning direction and the sub-scanning direction (see FIG. 12A). Furthermore, the present invention can also be applied to the case where a pattern such as a lead frame is repeatedly formed (multi-faceted) on one substrate (see FIG. 12B). In addition to the DMD, a light modulation unit that regularly arranges light modulation elements such as an LCD and selectively guides light to the substrate may be applied. The data width of the divided raster data may be generated in accordance with all areas of the DMD. The pattern may be a pattern in which substantially the same or similar patterns are repeatedly arranged. Alternatively, a series of patterns (character information, characters, etc.) arranged along the main scanning direction may be arranged along the sub-scanning direction (Y direction) at predetermined intervals. The data content of the pattern data is arbitrary, and the size of the DMD 22, the projection magnification, and the size of the pattern are also arbitrary.

It is the perspective view which showed schematically the drawing apparatus which is this embodiment. It is the figure which showed typically the structure of the exposure head of a drawing apparatus. It is the figure which showed the pattern for plasma displays. It is a block diagram of a drawing apparatus and a drawing control part. It is the flowchart which showed the drawing process. This is a subroutine of step S101 in FIG. It is the figure which showed the pitch of the pattern. It is the figure which showed the overlap of the projection area of DMD. It is the figure which showed the boundary line. This is a subroutine of step S104 in FIG. It is the figure which showed the raster data with respect to each scanning band. It is the figure which showed the other pattern arrangement | sequence.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Drawing apparatus 18 Drawing table 21 Semiconductor laser (light source)
22 DMD (Light Modulation Unit)
DESCRIPTION OF SYMBOLS 30 Drawing control part 32 System control circuit 34 DMD control part 41 Raster data extraction part 42 Raster conversion part SW board | substrate DB1 Divided raster data (divided drawing data)
DB'1 Raster data Bym Boundary line PP Scan line pattern (reference pattern)
KA projection area X _ij micromirror (light modulation element)

Claims (7)

A light source;
A light modulation unit in which a plurality of light modulation elements are regularly arranged, and selectively guides light from the light source to a substrate;
Scanning means for relatively moving an exposure area by the light modulation unit along a plurality of scanning bands defined along a scanning direction of the substrate;
A drawing unit that generates divided drawing data for each scanning band from the pattern data, and includes a drawing unit that controls the plurality of light modulation elements based on the generated divided drawing data,
The scanning means relatively moves the exposure area while overlapping the projection areas corresponding to the entire drawing area of the light modulation unit;
The drawing means defines a boundary line of the exposure area as a non-pattern region between adjacent patterns, and draws based on drawing data corresponding to the width of each scanning band defined according to the boundary line. Drawing device. The pattern data is data of a pattern in which the reference pattern is regularly repeated at a predetermined interval,
The drawing means;
Boundary line calculation means for determining and calculating the position of the boundary line between adjacent reference patterns based on the arrangement interval of the reference patterns;
Based on the pattern data, divided drawing data generation means for generating divided drawing data having a data width size larger than the projection area;
The drawing apparatus according to claim 1, further comprising: drawing data extraction means for removing drawing data outside the boundary line from the generated divided drawing data. A light from a light source is applied to a light modulation unit in which a plurality of light modulation elements are regularly arranged, and the light from the light source is selectively guided to a substrate,
The exposure area by the light modulation unit is relatively moved along a plurality of scanning bands defined along the scanning direction of the substrate,
A drawing method for generating divided drawing data for each scanning band from pattern data and controlling each of the plurality of light modulation elements based on each generated divided drawing data,
Relative movement of the exposure area while overlapping projection areas according to the entire drawing area of the light modulation unit,
A drawing method, wherein a boundary line of the exposure area is defined as a non-pattern region between adjacent patterns, and drawing is performed based on drawing data corresponding to the width of each scanning band defined according to the boundary line. Boundary line calculation means for calculating a plurality of scanning bands defined along the scanning direction of the substrate by determining the position of the boundary line of the adjacent scanning band in a non-drawing area outside the pattern;
Divided drawing data generating means for generating divided drawing data having a data width size larger than the projection area from pattern data;
Drawing data extracting means for removing drawing data outside the calculated boundary line from the generated divided drawing data;
A drawing data processing apparatus, wherein drawing processing is performed based on drawing data corresponding to the width of each scanning band defined according to a boundary line. Boundary line calculation means for calculating a plurality of scanning bands defined along the scanning direction of the substrate by determining the position of the boundary line of the adjacent scanning band in a non-drawing area outside the pattern;
Divided drawing data generating means for generating divided drawing data having a data width size larger than the projection area from pattern data;
A drawing data processing program that causes a drawing data extraction unit that removes drawing data outside the calculated boundary line to function from the generated divided drawing data. 1) Apply a photosensitive material to the substrate, which is a blank,
2) Draw on the coated substrate,
3) Develop the drawn substrate,
4) Etch the currently processed substrate,
5) A method for manufacturing a substrate including a step of peeling a photosensitive material from an etched substrate,
In drawing,
A light from a light source is applied to a light modulation unit in which a plurality of light modulation elements are regularly arranged, and the light from the light source is selectively guided to a substrate,
The exposure area by the light modulation unit is relatively moved along a plurality of scanning bands defined along the scanning direction of the substrate,
Generating divided drawing data for each scanning band from the pattern data, and controlling each of the plurality of light modulation elements based on each generated divided drawing data;
Relative movement of the exposure area while overlapping projection areas according to the entire drawing area of the light modulation unit,
A substrate manufacturing method, wherein a boundary line of the exposure area is defined as a non-pattern region between adjacent patterns, and drawing is performed based on drawing data corresponding to the width of each scanning band defined according to the boundary line. A substrate manufactured by the manufacturing method according to claim 6.

Images