JP2003195512A - Apparatus and method for multiple exposure drawing - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain a multiple exposure drawing apparatus which can draw a whole pattern with excellent continuity and unitedness. <P>SOLUTION: The multiple exposure drawing apparatus is equipped with a plurality of exposure units which are arrayed in Y direction. A circuit pattern is drawn partially in beltlike regions Ra<SB>01</SB>, Ra<SB>02</SB>, Ra<SB>03</SB>,... with multiple exposure light beams of the respective exposure units and the beltlike regions Ra<SB>01</SB>, Ra<SB>02</SB>, Ra<SB>03</SB>,... are connected partially overlying one another in the Y direction to obtain the whole circuit pattern. The number of micromirrors for exposing border parts Rb<SB>01</SB>, Rb<SB>02</SB>,... of two adjacent beltlike regions is gradually decreased or increased at a fixed ratio in X direction or the Y direction to obtain the circuit pattern which has excellent continuity and unitedness. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a drawing apparatus for drawing a predetermined pattern on a drawing surface by using an exposure unit having a large number of modulators, and more particularly to a whole pattern by connecting a plurality of partial patterns. The present invention relates to a drawing device.

[0002]

2. Description of the Related Art A drawing apparatus is generally used for optically drawing a fine pattern or a symbol such as a character on a surface of an appropriate object to be drawn. A typical example of use is drawing a circuit pattern when a printed circuit board is manufactured by a photolithography method. In this case, the object to be drawn is a photosensitive film for a photomask or a substrate. It is a photoresist layer.

In recent years, a series of processes from the circuit pattern design process to the drawing process have been integrated into a system. In this integrated system, in addition to the drawing device, a CAD (Computer) for designing a circuit pattern is provided. A
ided Design) station, CA that edits vector data of circuit patterns obtained at this CAD station
An M (Computer Aided Manufacturing) station and the like are provided. The vector data created by the CAD station or the vector data edited by the CAM station is transferred to the drawing device, where it is converted into raster data and then stored in the bitmap memory.

As the exposure unit of the drawing apparatus, for example, D
MD (Digital Micromirror Device) and LCD (Liquid
Crystal Display) An array or the like is known. As is well known, micromirrors are arranged in a matrix on the reflecting surface of the DMD, and the reflecting directions of the individual micromirrors are independently controlled. Therefore, the entire reflecting surface of the DMD is covered. The introduced luminous flux is split as a luminous flux reflected by each micromirror, and therefore each micromirror functions as a modulation element. Further, in the LCD array, liquid crystal is sealed between a pair of transparent substrates, and a large number of pairs of fine transparent electrodes aligned with each other are arranged in a matrix on both the transparent substrates. The transmission and non-transmission of the light flux is controlled depending on whether or not a voltage is applied to the pair of transparent electrodes. Therefore, each pair of transparent electrodes functions as a modulation element.

For the drawing device, a suitable light source device according to the photosensitivity of the object to be drawn, such as an ultra-high pressure mercury lamp, a xenon lamp, a flash lamp, an LED (Light Emitting Diod) is used.
e), a laser and the like are provided, and an imaging optical system is incorporated in the exposure unit. The light flux emitted from the light source device is introduced into the exposure unit through the illumination optical system, and the individual modulation elements of the exposure unit modulate the light flux incident thereon according to the raster data of the circuit pattern, whereby the circuit pattern is formed on the object. And is optically drawn.

An exposure unit including a DMD or LCD array is generally limited to a few cm square area that can be exposed, but the drawing area of a circuit pattern to be drawn on a drawing object is larger than the exposure area of the exposure unit. Is also much larger. Therefore, in a conventional drawing apparatus, a plurality of exposure units are arranged in a predetermined direction, and while the drawing target or the exposure unit is relatively moved along a direction substantially perpendicular to the arrangement direction of the exposure units, each exposure unit By connecting the partial circuit patterns to be drawn, the whole circuit pattern is drawn on the object to be drawn. In particular, a step-and-repeat method is known in which drawing is performed by alternately repeating exposure and intermittent movement.

[0007]

In the conventional drawing apparatus as described above, the continuity or the integrity of the circuit pattern drawn on the drawing object is impaired at the boundary between adjacent partial patterns. Accompanied by. This is due to individual differences in the exposure units, specifically, slight differences in the optical characteristics of the imaging optical system, and slight deviations in the mounting positions of the exposure units. In order to eliminate the difference in the optical characteristics of the imaging optical system, it is necessary to use a lens without distortion, and such a lens is not only expensive, but also its mounting requires time and labor. It Further, in order to eliminate the deviation of the mounting position, it is necessary to finely adjust the position of each exposure unit with a highly accurate tool, which requires extremely complicated and time-consuming work.

Therefore, an object of the present invention is to provide a multi-exposure drawing apparatus and a multi-exposure drawing apparatus capable of obtaining a whole pattern having good continuity and integrity in a drawing apparatus for joining partial patterns drawn by individual exposure units. It is to provide an exposure drawing method.

[0009]

A multiple-exposure drawing apparatus according to the present invention draws a plurality of partial patterns lined up in a first direction on a drawing surface by multiple exposure to form a pattern in which partial patterns are joined together. A multi-exposure drawing apparatus for obtaining the whole of the above, which has a large number of modulation elements arranged in a matrix and drives the modulation elements based on the raster data of the partial pattern, and the exposure unit in the first direction. Arrangement means arranged along the same number as the number of partial patterns, moving means for moving the drawing surface relative to the exposure unit along a second direction different from the first direction, and drawing two adjacent partial patterns In the exposure unit, the number of modulators to be driven corresponding to the boundary region where the partial patterns overlap is gradually decreased or gradually increased along the second direction at a constant rate. Characterized in that it comprises a modulation element selection means for. By gradually changing the number of the modulation elements corresponding to the boundary area, it is possible to draw the entire pattern having integral and good continuity.

In the above multiple exposure drawing apparatus, it is preferable that the area of the boundary area occupies 5 to 10% of the area of the exposure area exposed by one exposure unit.

The multiple-exposure drawing apparatus further stores memory means for holding raster data of the entire pattern, first coordinate data indicating the relative position of the exposure unit with respect to the drawing surface, and relative positions of individual modulators in the exposure unit. The relative position coordinate data of each modulator with respect to the drawing surface is calculated by adding the second coordinate data shown, and the address data corresponding to the pixel size of the raster data is generated based on the relative position coordinate data for each modulator. And an exposure data generation unit that reads raster data corresponding to the address data from the memory unit and generates exposure data for instructing each modulation element to perform an exposure operation or an exposure operation stop. Well, at this time, the modulator selection means specifically addresses the modulator to be exposed. Together provide an address data obtained from the detection means to the exposure data generating means, for modulating element should stop the exposure operation it is preferable to present the dummy data to the exposure data generating means.

In the multiple exposure drawing apparatus, specifically,
The entire surface exposure region exposed by one exposure of each exposure unit has a rectangular shape having a length D1 in the first direction, and two adjacent entire surface exposure regions in the first direction have a length D2 (D
2 <D1) overlap. Further, it is preferable that the first-direction length D2 at which two adjacent whole-surface exposure regions overlap is 5 to 10% of the first-direction length D1 of the whole-surface exposure region. More preferably, in one of the two overall exposure regions adjacent to each other, the second exposure region is located on the other overall exposure region side, the first direction length is D2, and the second direction length is the second overall exposure region.
A triangular area equal to the direction length is defined as the first exposure stop area, and in the other of the two adjacent whole surface exposure areas,
A triangular area located on the side of one whole surface exposure area and having a length in the first direction D2 and a length in the second direction equal to the length in the second direction of the whole surface exposure area is defined as the second exposure stop area. The exposure operation of the modulation elements corresponding to the first and second exposure stop regions is stopped.

The multiple exposure drawing method according to the present invention is
A multiple-exposure drawing method for obtaining a whole pattern in which partial patterns are joined by drawing a plurality of partial patterns arranged along the first direction on a drawing surface by multiple exposure. Exposure units for driving the modulation elements based on the raster data of the partial patterns are arranged by the same number as the number of the partial patterns along the first direction, and the drawing surface is different from the first direction. Regarding an exposure unit that moves two adjacent partial patterns relative to the exposure unit along the second direction, the number of modulation elements corresponding to the boundary region where the partial patterns overlap should be driven along the second direction. It is characterized by gradually decreasing or increasing gradually at a constant rate. It is characterized by

[0014]

BEST MODE FOR CARRYING OUT THE INVENTION Next, an embodiment of a multiple exposure drawing apparatus according to the present invention will be described with reference to the accompanying drawings.

FIG. 1 is a perspective view schematically showing an embodiment of a multiple exposure drawing apparatus according to the present invention. This multiple-exposure drawing apparatus is configured to directly draw a circuit pattern on a photoresist layer formed on a substrate for manufacturing a printed circuit board.

The multiple-exposure drawing apparatus 10 is provided with a base 12 installed on the floor, a pair of guide rails 14 are laid in parallel on the base 12, and drawing is further performed on the guide rails 14. The table 16 is mounted. The multiple-exposure drawing apparatus 10 is provided with an appropriate drive mechanism (not shown) such as a ball screw driven by a stepping motor or the like, and the drive mechanism relatively moves the drawing table 16 along the pair of guide rails 14 in the longitudinal direction thereof. To be made.

An object 30 to be drawn is placed on the drawing table 16.
As a substrate having a photoresist layer is installed as a substrate, the object 30 to be drawn is appropriately fixed on the drawing table 16 by an appropriate clamp means (not shown).

A gate-shaped structure 18 is fixedly mounted on the base 12 so as to straddle the pair of guide rails 14, and a plurality of exposure units are arranged on the upper surface of the gate-shaped structure 18 to move the drawing table 16. They are arranged in two rows in a first direction (hereinafter, referred to as Y direction) perpendicular to two directions (hereinafter, referred to as X direction). The eight exposure units arranged in the first row are numbered as _{01 01} , 20 ₀₃ , 2 in order from the left side of the drawing.
The seven exposure units in the second row, which are indicated by reference numerals 0 ₀₅ , 20 ₀₇ , 20 ₀₉ , 20 ₁₁ , 20 ₁₃ and 20 ₁₅ and are arranged behind them, are denoted by reference numerals 20 ₀₂ , 20 ₀₄ , 20 ₀₆ from the left side of the drawing. Two
It is indicated by 0 ₀₈ , 20 ₁₀ , 20 ₁₂ and 20 ₁₄ .

First row exposure unit 20₀₁, 20₀₃,
20₀₅, 20₀₇, 20₀₉, 20₁₁, 20₁₃And 20₁₅
And the exposure unit 20 in the second row₀₂, 20₀₄, 20₀₆,
20 ₀₈, 20_Ten, 20₁₂And 20₁₄Is so-called staggered
Will be placed. That is, the distance between two adjacent exposure units
The separation is set to be approximately equal to the width of one exposure unit.
Exposure unit 20 in the second row₀₂, 20₀₄, 20₀₆,
20₀₈, 20_Ten, 20₁₂And 20₁₄The array pitch of
First row exposure unit 20₀₁, 20₀₃, 20₀₅Two
0₀₇, 20₀₉, 20₁₁, 20₁₃And 20₁₅Array of
It is shifted by half a pitch with respect to Ji.

In this embodiment, 15 exposure units 2
Each of _{01 01 to} 20 ₁₅ is configured as a DMD unit, and the reflection surface of each exposure unit is, for example, 1024 × 1.
It is composed of 1310720 micromirrors arranged in a matrix of 280. Each exposure unit 20 ₀₁
˜20 ₁₅ are installed so that 1024 micromirrors are arranged along the X direction and 1280 micromirrors are arranged along the Y direction.

An appropriate place on the upper surface of the gate structure 18,
For example, the light source device 22 is provided on the left side of the first exposure unit _{20001 in} the drawing. The light source device 22 includes a plurality of LEDs (Light Emitting Diodes) (not shown), and the light emitted from these LEDs is condensed and emitted from the emission port of the light source device 22 as a parallel light flux. The light source device 22 has LE
In addition to D, a laser, an ultra-high pressure mercury lamp, a xenon lamp, a flash lamp or the like may be used.

[0022] The exit of the light source device 22 is connected an optical fiber bundle of cables 15 present, each optical fiber cable 24 is extended to each of the fifteen exposure units 20 ₀₁ to 20 _15, thereby the illumination light is introduced from the light source device 22 to the respective exposure units 20 ₀₁ to 20 _15.

The exposure units 20 _{01 to} 20 ₁₅ modulate the illumination light from the light source device 22 according to the circuit pattern to be drawn, and move downward in the drawing, that is, inside the gate-like structure 18 to the drawing table 16. The light is emitted toward the upper drawing object 30. As a result, only the portion of the photoresist layer formed on the upper surface of the object 30 to be exposed is illuminated with the illumination light.

[0024] Figure 2, main components of the first exposure unit 20 ₀₁ is conceptually illustrated. Other fourteen exposure units 20 ₀₂ to 20 ₁₅ have the same structure and function as the first exposure unit 20 _01, and a description thereof will be omitted.

[0025] The first exposure unit 20 _01, the illumination optical system 26 and the imaging optical system 28 is incorporated, DMD element 27 is provided on an optical path between them. The DMD element 27 is a device for operating a square micromirror having a high reflectance, which is formed on a wafer by aluminum sputtering, by an electrostatic field action.

On the silicon memory chip of the DMD element 27, there are 1024 × micromirrors of size C × C.
Laminated in a matrix of 1280, each of these micromirrors operates independently. C is, for example, 20
μm. Here, the micromirror is designated by the code M (m, n)
(1 ≦ m ≦ 1024; 1 ≦ n ≦ 1280). The parameter m indicates the line number along the X-axis direction of the first exposure unit ₂₀₀₀₁ , and the parameter n indicates the line number along the Y-axis direction of the first exposure unit ₂₀₀₀₁ .

The illumination optical system 26 includes a convex lens 26A and a collimating lens 26B, and the convex lens 26A is optically coupled to the optical fiber cable 24 extending from the light source device 22. With such an illumination optical system 26, the luminous flux emitted from the optical fiber cable 24 is transmitted to the DMD element 27.
Is shaped into a parallel light beam LB that illuminates the entire reflection surface of the. The imaging optical system 28 includes two convex lenses 28A and 2A.
8C and a reflector 28B arranged between the two convex lenses 28A and 28C are included, and the magnification of this imaging optical system 28 is set to, for example, 1 × (magnification 1).

[0028] 131 contained in the first exposure unit 20 ₀₁
0720 micro mirrors M (m, n) (1 ≦ m ≦ 1
024; 1 ≦ n ≦ 1280) can be independently independently rotated and tilted about a diagonal line, and two stable postures, specifically, the light fluxes incident on each of them are formed in the imaging optical system 2
A first reflection position (hereinafter, referred to as an exposure position) for reflecting the light beam toward the beam No. 8 and a second reflection position (hereinafter, referred to as a non-exposure position) for reflecting the light flux so as to deviate from the imaging optical system 28. ) And are positioned. Normally, all the micromirrors M (m, n) are positioned at the non-exposure position, but when each corresponding unit exposure area is to be exposed, each is rotationally displaced from the non-exposure position to the exposure position. . The rotational displacement of each micromirror M (m, n) between the non-exposure position and the exposure position is controlled by the exposure data generated based on the raster data of the circuit pattern.

When an arbitrary micro mirror M (m, n) is positioned at the exposure position, the spot light incident thereon is reflected toward the image forming optical system 28 as shown by the chain line LB ₁ and is combined. Drawing table 1 by the image optical system 28
6 is guided to the drawing surface 32 of the object 30 to be drawn. Assuming that the size of the micro mirror M (m, n) is C × C, the magnification of the imaging optical system 28 is equal to,
The reflecting surface of the micro mirror M (m, n) is imaged as an exposure area having an area C × C on the drawing surface 32. The exposure area of area C × C obtained by one micromirror M (m, n) is referred to as unit exposure area U (m, n) in the following description.

On the other hand, when the micro mirror M (m, n) is positioned at the non-exposure position, the spot light is changed to the alternate long and short dash line LB.
₂ is reflected toward the light absorbing plate 29 and is absorbed by the light absorbing plate 29, that is, the spot light LB.
₂ does not reach the drawing surface 32, and the corresponding region (area C × C) on the drawing surface 32 is not exposed.

[0031] 131 contained in the first exposure unit 20 ₀₁
All 0720 micromirrors M (1,1) to M
When (1024, 1280) is placed at the exposure position,
All micromirrors M (1,1) to M (1024,128
All the spot light reflected from 0) is incident on the imaging optical system 28, and the area on the drawing surface 32 (C × 1024) ×
The area of (C × 1280) is exposed. First
Region may be exposed by all the micromirrors of the exposure unit 20 ₀₁ are hereinafter referred to as entire exposure area Ua _01. One side length C of the unit exposure area U (m, n) is 20μ
If m, the total exposure area Ua _{01 has} an area of 25.6 mm.
(= 1024 × 20 μm) × 20.48 mm (= 128
0 × 20 μm), and the total number of pixels included therein is of course 1024 × 1280.

As is apparent from FIG. 2, the unit exposure area U
(1,1), U (1,2), U (1,3), U (1,
4), U (1,5), ..., U (1,1280) is 1280 micro mirrors M (1, 1) ~M the first line along the Y-axis of the first exposure unit 20 ₀₁ (1, 1280) and the unit exposure areas U (2,1), U
(2,2), U (2,3), U (2,4), U (2
5), ..., U (2,1280) is the first exposure unit 20.
It is obtained from 1280 micromirrors M (2,1) to M (2,1280) of the second line along the Y axis of ₀₁ , and unit exposure areas U (3,1), U (3,2) ), U
(3,3), U (3,4), U (3,5), ..., U
(3,1280) is the first exposure unit 20 ₀₁ of the micromirrors of the third line along the Y-axis M (3, 1) ~M (3,
1280).

The unit exposure area U (1,1) corresponding to the micro mirror M (1,1) is located at the lower left corner of the entire exposure area Ua _{01 in} the figure, and the unit corresponding to the micro mirror M (1024,1). The exposure area U (1024, 1) is located at the upper left corner of the entire exposure area Ua _{01 in} the figure. Further, the unit exposure area U (1,1) corresponding to the micromirror M (1,1280)
280) is located in the lower right corner of the figure of the entire exposure area Ua ₀₁ ,
The unit exposure area U (1024, 1280) corresponding to the micro mirror M (1024, 1280) is the entire surface exposure area U.
It is located in the upper right corner in the figure of a _01.

Drawing of the drawing surface 32 in the multiple exposure drawing apparatus 10 will be described with reference to FIGS. 3 (a) to 3 (c). FIGS. 3A to 3C are plan views showing the relative positional relationship between the drawing surface 32 and the entire surface exposure area, and are diagrams showing changes over time during the drawing operation in stages.

As a drawing method, an operation of intermittently moving the drawing table 16 along the main scanning direction (X direction),
By alternately repeating the operation of partially drawing the circuit pattern by exposure when the drawing table 16 is stopped,
A step-and-repeat (Step & Repeat) method may be adopted in which each drawing area is added to obtain the entire circuit pattern, or the drawing operation is performed simultaneously while moving the drawing table 16 at a constant speed. Good. In the present embodiment, a step-and-repeat method is adopted to facilitate the description. That is, the multiple-exposure drawing apparatus 10 employs a drawing method of drawing a circuit pattern by multiple exposure while intermittently moving the drawing table 16 at a predetermined movement interval.

[0036] The plane containing the drawing surface 32 is defined X-Y orthogonal coordinate system, X-axis is perpendicular to the arrangement direction of the exposure unit 20 _{01-20 15.} Also, the drawing surface 32 is X
Move relative to the negative direction of the axis.

The rectangular area surrounded by the broken line is XY by each of the ₁₅ exposure units 20 _{01 to} 20 _15.
The entire surface exposure areas Ua _{01 to} Ua ₁₅ obtained on a plane.
First-row whole-surface exposure area Ua ₀₁ , Ua ₀₃ , Ua ₀₅ , U
a ₀₇ , Ua ₀₉ , Ua ₁₁ , Ua ₁₃ and Ua ₁₅ are arranged so that the lower side in the figure coincides with the Y-axis, and the entire surface exposure areas Ua ₀₂ , Ua ₀₄ , Ua ₀₆ , Ua _{08 of} the second row, Ua ₁₀ ,
Ua ₁₂ and Ua ₁₄ are arranged so that the lower side in the figure coincides with a straight line separated from the Y axis by a distance S on the negative side.

Since the X-axis forms a right angle with the arrangement direction of the exposure units 20 _{01 to} 20 ₁₅ , each of the exposure units 20 ₀₁ to
13 10720 (1024 × 128) in 20 ₁₅
The 0) micromirrors are also arranged in a matrix along the X axis and the Y axis.

[0039] In Figure 3, the coordinate origin of the X-Y orthogonal coordinate system is shown to be consistent to the lower left corner in the figure in the entire exposure area Ua ₀₁ obtained by the first exposure unit 20 ₀₁ of the first row and which is, precisely, the coordinate origin is the unit exposure region U (1 obtained by the top of the micromirror M of the first line along the Y-axis of the first exposure unit 20 ₀₁ (1,1),
Located in the center of 1). As described above, in the present embodiment, the size of the unit exposure area U (1,1) is 20 μm × 20.
because it is [mu] m, Y-axis and is obtained by entering the inside by 10μm from the boundary of the entire exposure area Ua ₀₁ with the first exposure unit 20. In other words, the eight exposure units ₂₀₀₀₁ , ₂₀₀₀₃ , ₂₀₀₅ , ₂₀₀₇ , _{2009 of} the first row,
1280 micromirrors M (1, n) (1 included in the first lines of 20 ₁₁ , 20 ₁₃ and 20 ₁₅ respectively.
All centers of ≦ n ≦ 1280) are located on the Y axis.

Since the drawing surface 32 is moved in the negative direction along the X axis by the drawing table 16 as indicated by the white arrow, the entire surface exposure areas Ua _{01 to} Ua ₁₅ are relative to the drawing surface 32. It will move relative to the positive direction of the X axis.

Drawing start position SL set on the drawing surface 32
Is the Y axis, that is, the eight exposure units 20 in the first row₀₁Two
0₀₃, 20₀₅, 20₀₇, 20₀₉, 20₁₁, 20₁₃and
20 ₁₅The entire surface exposure area Ua of the first column corresponding to₀₁, Ua
₀₃, Ua₀₅, Ua₀₇, Ua₀₉, Ua₁₁, Ua₁₃And U
a₁₅If it coincides with the boundary of, the exposure unit of the first row
20₀₁, 20₀₃, 20₀₅, 20₀₇, 20₀₉, 20₁₁Two
0₁₃And 20₁₅The exposure of the drawing surface 32 is started by
It

As shown in FIG. 3 (a), the entire surface exposure areas Ua ₀₁ , Ua ₀₃ , Ua ₀₅ , Ua ₀₇ , Ua ₀₉ , U of the first column are formed.
The micro mirrors corresponding to the portions of a ₁₁ , Ua ₁₃ and Ua ₁₅ which do not reach the Y axis do not operate while being positioned at the non-exposure position, and the entire surface exposure area U of the second row
Since a ₀₂ , Ua ₀₄ , Ua ₀₆ , Ua ₀₈ , Ua ₁₀ , Ua ₁₂ and Ua ₁₄ also do not reach the Y axis, exposure unit 2
The exposure by ₀₂ , 20 ₀₄ , 20 ₀₆ , 20 ₀₈ , 20 ₁₀ , 20 ₁₂ and 20 ₁₄ is also stopped. In FIG. 3, the eight exposure units ₂₀₀₀₁ , ₂₀₀₀₃ , ₂₀₀₅ in the first row,
The areas (partial patterns) exposed by 20 ₀₇ , 20 ₀₉ , 20 ₁₁ , 20 ₁₃ and 20 ₁₅ are shown by upward hatching.

When the drawing surface 32 further moves and the boundaries of the entire surface exposure areas Ua ₀₂ , Ua ₀₄ , Ua ₀₆ , Ua ₀₈ , Ua ₁₀ , Ua ₁₂ and Ua ₁₄ coincide with the Y-axis, seven pixels in the second row Exposure units 20 ₀₂ , 20 ₀₄ , 20 ₀₆ , 20 ₀₈ , 2
The exposure with 0 ₁₀ , 20 ₁₂ and 20 ₁₄ is started. Figure 3 (b), the second column of the exposure unit 20 _02,
20 ₀₄ , 20 ₀₆ , 20 ₀₈ , 20 ₁₀ , 20 ₁₂ and 20 ₁₄
The exposure by means of the exposure unit ₂₀₀₀₁ , 2
0 _03, 20 _05, 20 _07, 20 _09, 20 _11, 20 ₁₃ and proceeds with a delay always a distance S than the exposure by 20 _15. In FIG. 3, the exposure units 20 ₀₂ , 2
The areas exposed by 0 ₀₄ , 20 ₀₆ , 20 ₀₈ , 20 ₁₀ , 20 ₁₂ and 20 ₁₄ are indicated by hatching to the lower right.

Further, the drawing surface 32 moves relatively, and FIG.
As shown in (c), the entire surface exposure area Ua of the first column₀₁, U
a₀₃, Ua₀₅, Ua₀₇, Ua₀₉, Ua₁₁, Ua₁₃and
Ua₁₅When the border of reaches the drawing end position EL, the first column
Exposure unit 20₀₁, 20₀₃, 20₀₅, 20₀₇, 20
₀₉, 20₁₁, 20₁₃And 20₁₅Stop the exposure by
To be Strictly speaking, the unit that reaches the drawing end position EL
Micromirror M corresponding to exposure area U (m, n)
It is stopped at the non-exposure position in order from (m, n). Figure 3
The drawing surface 32 further advances by the distance S from the state of (c).
And the entire surface exposure area Ua in the second column₀₂, Ua₀₄, Ua₀₆,
Ua₀₈, Ua_Ten, Ua₁₂And Ua₁₄Ends the drawing
Reaching the position EL, the exposure unit 20 in the second row₀₂, 20
₀₄, 20₀₆, 20 ₀₈, 20_Ten, 20₁₂And 20₁₄By
Exposure is stopped.

As described above, the drawing surface 32 relatively moves in parallel with the X-axis, so that the 15 exposure units 20 are exposed.
_{In 01 to} 20 ₁₅ , the circuit pattern is partially drawn by exposing the strip-shaped regions parallel to the X axis, and the width of each of the strip-shaped regions is the entire surface exposure region Ua _01.
Substantially match the width of ~ Ua ₁₅ . The boundary portion between two adjacent strip-shaped regions is overlapped by a small amount. In order to match the circuit patterns to be drawn on the same line, the exposure units ₂₀₀₀₁ , ₂₀₀₃ in the first row,
20 ₀₅ , 20 ₀₇ , 20 ₀₉ , 20 ₁₁ , 20 ₁₃ and 20 ₁₅
When the exposure data according to the circuit pattern of the predetermined line is given to the exposure units 20 ₀₂ , 20 ₀₄ , 2
The exposure data of the same line is given to 0 ₀₆ , 20 ₀₈ , 20 ₁₀ , 20 ₁₂ and 20 ₁₄ at a timing delayed by the time when the drawing surface 32 moves the distance S.

Details of the drawing in FIG. 3 will be described with reference to FIG. 4 shows a part of the entire exposure area Ua ₀₁ on the drawing surface 32 that is exposed by the first exposure unit 20 ₀₁ is shown.

[0047] Basically, the relative moving distance of the drawing surface 32 is set smaller than X direction length of the entire exposure area Ua ₀₁ of the first exposure unit 20 ₀₁ (C × 1024), thereby drawing surface 32 The same area is exposed multiple times, that is, multiple exposure is performed by the first exposure unit ₂₀₀₀₁ . For example, when the relative movement distance of the drawing surface 32 per exposure is set to the distance A (for example, A = 4C) that is an integral multiple of the side length C of the unit exposure region U (m, n), the exposure unit 20 ₀₁ is moved by a (= 4C) on the positive side along the X-axis, the center of the unit exposure region U (m, n) is always coincident on the same point. Therefore, the area of the area C × C of the drawing surface 32 exposed by the leading micromirror M (1,1) in the first column is further reduced to the (4k + 1) th leading micromirror M (4k + 1,1). ), Where 1 ≦ k ≦ 255, a total of 256 times (= 102
4C / A) will be subjected to multiple exposure.

In FIG. 4, the moving distance of the drawing surface 32 is not an integral multiple of the side length C of the unit exposure area U (m, n), for example, the distance A (A = 4C) and the distance a (0 <a. An example in which the sum is set to <C) is shown.

The drawing surface 32 is moved to its negative side along the X-axis by the drawing table 16, i.e., the first exposure unit 20 ₀₁ is relatively moved toward the positive side of the X axis with respect to the drawing plane 32, When the unit exposure area Ua ₀₁ reaches the drawing start position SL on the drawing surface 32, the unit exposure area Ua ₀₁ is once stopped and is included in the first line of the first exposure unit 20 ₀₁ .
Zero micro mirrors M (1,1) to M (1,128
0) is operated according to the exposure data of the circuit pattern to be drawn, and the first exposure is performed. The relative position of the drawing surface 32 at this time is defined as the first exposure position.

When the first exposure is completed, the first exposure unit ₂₀₀₀₁ again moves relative to the positive side along the X-axis, and the movement amount of the unit exposure area Ua ₀₁ becomes (A + a). , The first exposure unit ₂₀₀₀₁ is judged to have reached the second exposure position, and is stopped.
0 ₀₁ 1st to 5th lines of micromirror M (1, 1)
.About.M (5,1280) are operated according to the exposure data of the circuit pattern to perform the second exposure.

When the second exposure is completed, the first exposure unit ₂₀₀₀₁ further moves along the X axis toward the positive side thereof (A
+ A) only be stopped at the third exposure position is moved, the first exposure unit 20 ₀₁ of the first to ninth lines of the micromirror M (1,1) ~M (9,1280) exposure of a circuit pattern It is operated according to the data and the third exposure is performed.

As described above, every time the first exposure unit ₂₀₀₀₁ is moved to the positive side along the X axis by the movement amount (A + a), the exposure operation is repeated and the drawing surface 32 is repeated.
That is, the same area is subjected to multiple exposure by the first exposure unit ₂₀₀₀₁ multiple times.

The movement distance of the drawing surface 32 is (A + a = 4C +
a), the overlapping unit exposure areas U (m, n)
The center of is gradually shifted by the distance a, and the same region is not always subjected to multiple exposure 256 times. Therefore, the predetermined area is set to 256
In order to perform the single exposure, 256 centers of each unit exposure area U (m, n) are evenly arranged in this predetermined area, and the multiple exposure is substantially performed 256 times.

In FIGS. 3 and 4, the movement direction of the drawing surface 32 is parallel to the X axis, but as shown in FIG.
May be tilted by a small angle with respect to the X axis and moved. For example, when the drawing target 30, that is, the drawing surface 32 is fixed on the drawing table 16 by inclining with respect to the X axis, and the drawing table 16 is moved along the X axis to the negative side by a predetermined distance, each time the movement is made. The unit exposure area U (m, n) is the drawing surface 3
Not only does it shift to the positive side along the X axis with respect to 2,
Along the Y-axis, the negative side is also relatively shifted by a predetermined distance.

FIG. 5 is a diagram showing the displacement of the unit exposure region U (m, n) with time when the drawing object 30 is sequentially moved while being inclined by the angle α with respect to the X axis. Referring to FIG. 5, a part of the entire exposure area Ua ₀₁ with the first-time exposure position is shown in dashed lines, a portion of the entire exposure area Ua ₀₁ with the second exposure position is indicated by a dashed line, the A part of the entire surface exposure area Ua ₀₁ at the third exposure position is shown by a solid line. The shift amount along the negative side of the Y axis of each unit exposure region U (m, n) is indicated by b.

[0056] The first time the first exposure unit 20 ₀₁ of the first line micromirror M in the exposure position (1, 1) to
Unit exposure area U obtained by M (1,1280)
Focusing on (1,1), U (1,2), ... U (1,1280), these unit exposure regions U (1,1), U (1,2)
2), ... with respect to U (1,1280), units obtained by the first exposure unit 20 ₀₁ of the fifth line micromirrors M in the second exposure position (5,1) ~M (5,1280) Exposure areas U (5,1), U (5,2), ...
U (5,1280) overlaps each other with (+ a) and (-b) offset along the X and Y axes, respectively.
Further, at the third exposure position, the first exposure unit 2
0 ₀₁ 9th line micromirrors M (9,1) to M
Unit exposure area U obtained by (9,1280)
(9,1), U (9,2), ... U (9,1280) are
(+ 2a) and (-) in the X-axis direction and the Y-axis direction, respectively.
2b) and will overlap each other. In addition,
In FIG. 5, three unit exposure areas U that overlap each other
(1,1), U (5,1) and U (9,1) are exemplarily shown by a broken line, a one-dot chain line and a solid lead line, respectively.

Here, the relative position of each unit exposure area U (m, n) is represented by the exposure point CN (m, n), which is the center of the unit exposure area U (m, n), and the exposure point CN (5,5 at the second exposure position is shown.
1) is the exposure point CN (1,
The exposure point CN (9,1) at the third exposure position is (+ 2a, -2) apart from the exposure point CN (1,1) at the first exposure position.
Only b) will exist. The distance between the exposure points adjacent to each other in the line is the unit exposure area U (m,
It corresponds to the size C (= 20 μm) of n).

As described above, the moving distance is an integral multiple of the side length C of the unit exposure area U (m, n) and the distance a (0 <a
<C), by appropriately selecting the distances a and b, the exposure point CN is formed in the area (area C × C) having the same size as the individual unit exposure area U (m, n). Can be evenly distributed.

For example, as shown in FIG. 6, a region (area C × C = 20 μm) having the same size as the unit exposure region U (m, n).
In order to distribute 240 exposure points in (m × 20 μm), 16 exposure points should be arranged along the X-axis and 15 exposure points should be arranged along the Y-axis. Is determined by the following formula. a = C / 16 = 20 μm / 16 = 1.25 μm b = C / 256 = 20 μm / 240 = 0.0833 μm

Needless to say, the distance b is 0.0
Setting to 833 μm means that the drawing table 16
Of the drawing table 16 so that each unit exposure region U (m, n) shifts to the negative side of the Y-axis by 0.0833 μm when is moved to the negative side of the X-axis by a distance (A + a = 81.25 μm). It is nothing but setting the inclination angle α (about 0.0588 degrees).

In FIG. 6, the exposure point indicated by reference numeral CN (1,1) is, for example, the leading micromirror M (1,1 included in the first line of the first exposure unit ₂₀₀₀₁ at the first exposure position. Assuming that it is the unit exposure area U (1,1) obtained by 1), as is apparent from the above description, the exposure point CN (5,1) is the first exposure unit 20 at the second exposure position. It is the center of the unit exposure area U (5,1) obtained by the micromirror M (5,1) at the beginning of the fifth line of ₀₁ , and the exposure point CN (9,
1) is the first exposure unit 20 at the third exposure position
_{It is} the center of the unit exposure area U (9,1) obtained by the micromirror M (9,1) at the beginning of the ninth line ₀₁ .

Further, the exposure point CN (61, 61, distant from the exposure point CN (1, 1) by a distance (+ 16a, -16b)).
1) is the center of the unit exposure area U (61,1) obtained by the micromirror M (61,1) at the head of the 61st line at the 16th exposure position, and the exposure point CN
Exposure point CN distant from (1,1) by a distance (0, -a)
(65,1) is the center of the unit exposure area U (65,1) obtained by the micromirror M (65,1) at the head of the 65th line at the 17th exposure position. Similarly, the exposure point CN (897,1), which is separated from the exposure point CN (1,1) by the distance (0, -14a), is the leading micromirror M of the 897th line at the 225th exposure position.
(897,1) unit exposure area U (89
Exposure point CN (957, 1) which is the center of the exposure point CN (957)
1) is the center of the unit exposure area U (957,1) obtained by the micromirror M (957,1) at the head of the 957th line at the 240th exposure position.

Thus, 15 exposure units 20 _01-
20 ₁₅ for the drawing table 16 X
When the negative side of the axis is moved intermittently, their exposure unit 20 _{01-20 15} individual micromirrors M (m,
n) the center of the unit exposure area U (m, n) obtained by
That is, the exposure points CN (m, n) are arranged over the entire drawing surface 32 at the pitches a and b along the X-axis and the Y-axis, respectively, and have the same size as the unit exposure area U (m, n). In xC (20 μm × 20 μm), 240 exposure points are uniformly distributed.

[0064] Incidentally, it is also of course possible to further distribute a high density of individual exposure point of the exposure unit 20 _{01-20 15} over the entire drawing surface 32, for example, 20 [mu] m
When 480 exposure points, which is twice the above example, are uniformly arranged in the area of × 20 μm, the distance A is set to twice the size C of the unit exposure area (40 μm), and the distance a
And b are 1.25 / 2 μm and 0.0833 /, respectively.
It is set to 2 μm.

Further, in the example shown in FIG. 6, 16 exposure points are arranged in parallel along the Y-axis, but the exposure points can be changed to the Y-axis by slightly changing the values of the distances a and b. It is also possible to arrange them diagonally.

As described above, in the multiple-exposure drawing apparatus 10 of this embodiment, when drawing is performed based on the raster data of the circuit pattern, no matter what size the pixel size of the circuit pattern data is, It is possible to draw a circuit pattern. In other words, it can be said that the concept of a pixel for a circuit pattern to be drawn does not exist on the side of the multiple exposure drawing apparatus 10.

For example, the pixel size of raster data is 20
In the case of setting to 1 μm × 20 μm, if “1” is given to any 1-bit data, one pixel area (20 μm × 20
.mu.m) corresponding to each exposure point CN (m, n) corresponding to each micromirror M (m, n) is operated by the 1-bit data to rotate from the non-exposure position to the exposure position. One pixel area (20μm × 20μ
m) will undergo multiple exposures a total of 240 times.

As another example, when the pixel size of the raster data is set to 10 μm × 10 μm, if “1” is given to any 1-bit data, the 1-bit data will be added to the 1-bit data during the exposure operation. Individual exposure points CN included in the corresponding one pixel area (10 μm × 10 μm)
The micromirror M (m, n) corresponding to (m, n) is operated by the 1-bit data to be rotated from the non-exposure position to the exposure position, whereby the one pixel area (1
0 μm × 10 μm) will be subjected to multiple exposure a total of 60 times.

The exposure time, that is, the time during which the individual micromirrors M (m, n) remain at the exposure position is determined by the number of exposures within one pixel area on the drawing surface 32 and the object 30 to be drawn (in this embodiment). Then, it is determined based on the sensitivity of the photoresist layer), the light intensity of the light source device 22, and the like, and is set so that a desired exposure amount is obtained for each one-pixel exposure region.

FIG. 7 is a block diagram of the multiple exposure drawing apparatus 10. As shown in the figure, the multiple exposure drawing apparatus 10 is provided with a system control circuit 34 including a microcomputer. That is, the system control circuit 34 is a central processing unit (CPU), a read-only memory (ROM) for storing programs and constants for executing various routines, and a writable / readable memory for temporarily storing operation data and the like. The multi-exposure drawing apparatus 10 is generally controlled by a memory (RAM) and an input / output interface (I / O).

The drawing table 16 is driven by the drive motor 36 along the X-axis direction. The drive motor 36 is configured as, for example, a stepping motor, and its drive control is performed according to the drive pulse output from the drive circuit 38. A drive mechanism including a ball screw or the like is interposed between the drawing table 16 and the drive motor 36, as described above.
Is symbolically indicated by a dashed arrow.

The drive circuit 38 is a drawing table control circuit 40.
This drawing table control circuit 4 is operated under the control of
0 is connected to the drawing table position detection sensor 42 provided in the drawing table 16. The drawing table position detection sensor 42 detects an optical signal from the linear scale 44 installed along the movement path of the drawing table 16 to detect the position of the drawing table 16 in the X-axis direction. In FIG. 7, detection of an optical signal from the linear scale 44 is symbolically shown by a broken line arrow.

While the drawing table 16 is moving, the drawing table position detection sensor 42 sequentially detects a series of optical signals from the linear scale 44 and outputs them to the drawing table control circuit 40 as a series of detection signals (pulses). The drawing table control circuit 40 appropriately processes the series of detection signals input thereto, and creates a series of control clock pulses based on the detection signals. Drawing table control circuit 40
Outputs a series of control clock pulses to the drive circuit 38, and the drive circuit 38 creates drive pulses for the drive motor 36 in accordance with the series of control clock pulses. In short, the drawing table 16 can be moved along the X-axis direction with accuracy according to the accuracy of the linear scale 44. Note that such a drawing table 16
The movement control itself is well known.

As shown in FIG. 7, the drawing table control circuit 40 is connected to the system control circuit 34, whereby the drawing table control circuit 40 is controlled by the system control circuit 34. On the other hand, a series of detection signals output from the drawing table position detection sensor 42 is also input to the system control circuit 34 via the drawing table control circuit 40, whereby the system control circuit 34 moves the drawing table 16 along the X axis. The position can be constantly monitored.

The system control circuit 34 is a LAN
It is connected to a CAD station or a CAM station via (Local Area Network), and the vector data of the circuit pattern created there is transferred to the system control circuit 34 from the CAD station or the CAM station. System control circuit 34
A hard disk device 46 is connected as a data storage means to the HDD, and when the vector data of the circuit pattern is transferred from the CAD station or the CAM station to the system control circuit 34, the system control circuit 34 once outputs the vector data of the circuit pattern to the hard disk device 46. Write to and store. The system control circuit 34 has a keyboard 48 as an external input device.
Are connected, and various command signals, various data, and the like are input to the system control circuit 34 via the keyboard 48.

The raster conversion circuit 50 is operated under the control of the system control circuit 34. Prior to the drawing process, the vector data of the circuit pattern to be drawn is read from the hard disk drive 46 and the raster conversion circuit 50 is read.
And is converted into raster data here. This raster data is written in the bitmap memory 52. In short, the circuit pattern is stored in the bitmap memory 52.
Bit data represented by 0'and '1' is stored. The data conversion processing in the raster conversion circuit 50 and the data writing processing in the bitmap memory 52 are started by a command signal input via the keyboard 48.

Fifteen exposure data generation circuits 54 _{01 to} 54 ₁₅ (only four exposure data generation circuits 54 ₀₁ , 54 ₀₂ , 54 ₀₃ and 54 ₁₅ are shown in FIG. 7) are connected to the bitmap memory 52. It 15 exposure data circuits 54
_{01 to} 54 ₁₅ are 15 exposure units 20 ₀₁ to 2 respectively
It corresponds to 0 ₁₅ and reads necessary raster data from the bit map memory 52 to generate exposure data to be given to each exposure unit and output it to the DMD drive circuit 56.

[0078] exposure data exposure unit 20 _{01-20 15}
Is bit data for positioning the individual micromirrors included in the exposure position or the non-exposure position. When the exposure data is '1', the micromirror is set to the exposure position, and when the exposure data is '0', the micromirror is set. The mirror is set in the non-exposure position. The exposure data is the exposure unit 20.
_It is rewritten each time the exposure operation from _{01 to} 20 ₁₅ is repeated.

[0079] DMD drive circuit 56, based on a given exposure data operates the exposure unit 20 _{01-20 15} independently, thereby the exposure unit 20 _01-2
0 ₁₅ individual micromirrors will selectively perform the exposure operation.

In FIG. 7, the exposure operation of the individual micromirrors is symbolically illustrated by broken line arrows. Also,
Although only one exposure unit is shown in FIG. 7 in order to avoid complication of the drawing, actually 15 exposure units (20 _{01 to} 20
₁₅ ) Needless to say, they exist and are each driven by the DMD drive circuit 56.

FIG. 8 schematically shows a part of the raster data of the circuit pattern developed on the bit map memory 52. The line number L shown in FIG.
Corresponding to the drawing line number along the Y-axis of the circuit pattern to be drawn above, each line contains 1280 × 15 bit data. As shown in the figure, each bit data is represented by "B", and "B" is given a value of "1" or "0" according to the circuit pattern to be drawn.

According to the present invention, the pixel size of the circuit pattern data (raster data), that is, the size of each bit data "B" can be given various sizes at the design stage of the circuit pattern. . For example, if the size of the bit data “B” is 10 μm × 10 μm, the width of the drawing line to be drawn on the drawing surface 32 is also 10
The size of bit data “B” is 20 μm ×
If it is 20 μm, the width of the drawing line is also 20 μm,
If the size of the bit data “B” is 30 μm × 30 μm, the width of the drawing line is also 30 μm.

As shown in FIG. 8, 1 included in each line
280 × 15 bit data is the first to fifteenth
Divided into the second group. If the drawing surface 32 as shown in FIGS. 3 and 4 are moved in a direction parallel to the X-axis, the data necessary for the circuit pattern to be drawn by the first exposure unit 20 ₀₁ in the raster data of 1280 bits from the left end is there. On the other hand, as shown in FIG.
When tilting relative to the axis and moving relatively, the exposure area U
Since a ₀₁ shifts along the Y axis, raster data of 1280 bits or more is required to generate exposure data.

Therefore, in the present embodiment, the first exposure data generation circuit 54 ₀₁
Raster data of (1280 + β) bits is read from the head (the left end in the figure), and 1280 bits to be given to 1280 micromirrors arranged in the Y-axis direction from the read raster data of the first group. Raster data is selected and output as exposure data.

The second exposure data generating circuit 54 ₀₂ reads from the bit map memory 52 from the 1281th to the 25th from the left end.
Raster data up to the 60th, which includes 1280 bits of raster data, and (1280 + 2β) bits of raster data, which is larger by β bits before and after that, is read as the second group, and exposure data to be given to the second exposure unit ₂₀₀₀₂ is generated. To do. Third to Fourteenth Exposure Data Generation Circuit 54 _03-
Also for 54 ₁₄ , similarly to the second exposure data generation circuit 54 ₀₂ , raster data for (1280 + 2β) bits is read to generate exposure data. 15 exposure data generating circuit 54 _15, the last generates a read exposure data (1280 + beta) bits of raster data (right end in the drawing).

The number of bits β is a constant set in the system control circuit 34, and is a positive number larger than the number of bits corresponding to the relative movement amount of the first exposure unit along the Y axis, for example, about several tens. preferable. Further, it is not necessary to make all the numbers of raster data of each group equal, and it is possible to arbitrarily change each group.

Address data [L _x , R _y ] as schematically shown in FIG. 9 is given to the individual bit data “B” of each group. The address data component L _x indicates the line number L (FIG. 8), and the address data component R _y
Represents the number of bits counted from the most significant bit of each group. For example, address data [00000
1, 0001] represents the bit data “B” of the most significant bit of the line number 1 of each group, and the address data [0
[00003, 0001] represents the bit data "B" of the most significant bit of the line number 3 of each group, and the address data [000001, 1278] is the 1278th bit counted from the most significant bit of the line number 1 of each group. Represents data “B” and represents address data [00000
3, 1278] represents the 1278th bit data “B” counted from the most significant bit of the line number 3 of each group, and the address data [000001, 1280] is the least significant bit of the line number 1 of each group. Represents data “B” and represents address data [000003,12
80] represents the bit data “B” of the least significant bit of the line number 3 of each group.

The relationship between the individual micromirrors M (m, n) of the first exposure unit ₂₀₀₀₁ and the bit data "B" at each exposure position will be described. Regarding the other exposure units 20 _{02 to} 20 ₁₅ , the first exposure unit 20 ₀₁
Therefore, the description is omitted here.

When the exposure unit ₂₀₀₀₁ is sequentially moved in the X-axis direction by a distance (A + a) from the exposure start position, that is, the first exposure position, and reaches the i-th exposure position, the exposure unit _{20001 at} that time. Relative position, specifically, the XY coordinates Xs (i) and Ys (i) of the exposure point CN (1,1) corresponding to the first micromirror M (1,1) of the first line are the exposure position data. (First coordinate data)
Is defined as follows, and is expressed by the following equations (1) and (2).

[0090] Xs (i) = (A + a) (i-1) (1) Ys (i) =-b (i-1) (2) Here, “i” is the number of exposures.

Exposure position data Xs (i) and Ys
(I) is sequentially calculated by the system control circuit 34 each time the exposure operation is performed, that is, each time the relative movement of the exposure unit ₂₀₀₀₁ is performed. The exposure position data Xs (0) and Ys (0) at the exposure start position both have a value of zero.

Subsequently, an arbitrary micromirror M (m, n) ( _1≤m≤102 in the first exposure unit 20001.
4, 1 ≦ n ≦ 1280) to specify the relative position,
The exposure point CN (1,1) corresponding to the first micromirror M (1,1) of the first line is set as the origin, and a two-dimensional coordinate system having two axes parallel to the X axis and the Y axis is set. Relative coordinates Xp of exposure point CN (m, n) in the three-dimensional coordinate system
(M, n) and Yp (m, n) are defined as exposure point coordinate data (second coordinate data). That is, n of the m-th line
The th micromirror M (m, n) is 1 in the first line.
The second micromirror M (1,1) is separated by a distance Xp (m, n) in the X direction and a distance Yp (m, n in the Y direction.
The exposure operation is always performed at a position separated by n). The exposure point coordinate data Xp (m, n) and Yp (m, n) are represented by the following equations (3) and (4).

Xp (m, n) = (m-1) C ... (3) Yp (m, n) = (n-1) Cb (m-1) ... (4) where , C is the size of the unit exposure area U (m, n), and b is the exposure point CN (m, n) in the X-axis direction (A + a).
Is the amount of movement in the Y direction when the relative movement is made only.

Exposure point coordinate data Xp (m, n) and Y
p (m, n) is an eigenvalue corresponding to each of the 1280 micromirrors, is calculated by the system control circuit 34 when the distance b is determined, and is stored in the RAM. Will be reviewed and updated as needed.

[0095] When the first exposure unit 20 ₀₁ reaches from the exposure start position to the i-th exposure position, the micro mirror M (m, n) of the relative position coordinate data words exposure point CN
XY coordinates P [x (m, n), y (m, n) of (m, n)
[n]] can be represented by the sum of the exposure position data and the exposure point coordinate data, as shown in the following equations (5) and (6).

[0096]       x (m, n) = Xs (i) + Xp (m, n) (5)       y (m, n) = Ys (i) + Yp (m, n) (6)

At the i-th exposure position, the exposure point CN (m, n) corresponding to an arbitrary micromirror M (m, n).
Is included in a certain one-pixel area, the address [L _x , R _y ] of the bit data “B” corresponding to that one-pixel area is the calculation result of the above two equations (5) and (6). Can be expressed by the following formula.

L _x = INT [x (m, n) / PS] +1 (7) R _y = INT [y (m, n) / PS] +1 (8) Here, in general, In addition, when the division e / f is performed, the operator INT [e / f] represents the quotient of the division e / f, and 0 ≦ e <f
, INT [e / f] = 0 is defined. Further, "PS" represents the size of the bit data "B".

Thus, at the i-th exposure position, as exposure data for operating the micromirror M (m, n) corresponding to the XY coordinates P [x (m, n), y (m, n)], The bit data “B” of the address [L _x , R _y ] determined by the calculation results of the above equations (7) and (8) is read from the bitmap memory 52.

The above-mentioned XY coordinates P [x (m, n), y
(M, n)] has a negative X component, that is, x (m, n) <0
If it is, it is considered that the exposure point CN (m, n) has not yet entered the drawing area on the drawing surface 32, and the micromirror M (m, n) is operated according to the dummy data “0”. To be Also, the XY coordinate P [x (m, n), y
Y component of (m, n)] is a negative value, that is, y (m, n) <0
If it is, it is considered that the exposure point CN (m, n) crosses the negative side boundary line along the Y axis of the drawing area, and in this case also, the micromirror M (m, n) has dummy data “ 0 "
Operated according to.

[0102] As described above, in the multi-exposure drawing device 10 of the present embodiment, the exposure unit 20 _{01-20 15} are arranged in the Y-direction is a first direction, each of the exposure unit 2
A partial circuit pattern is drawn by multiple exposure in a drawing area divided in the Y direction by 0 _{01 to} 20 ₁₅ , and an exposure area for one time (entire exposure area U ₀₁ , ...・, Exposure operation is performed while moving a distance relatively shorter than the size of U ₁₅ ). In particular,
15 exposure units ₂₀₀₀₁ to
20 ₁₅ relative position coordinates of the 1280 × 1024 micromirrors M (m, n), that is, the exposure points CN (m, n
n) XY coordinates P [x (m, n), y (m, n)] are calculated, and the micromirror M (m, n) is exposed or not exposed based on the bit data corresponding to the XY coordinates P. By positioning at the exposure position, the entire circuit pattern is drawn on the object to be exposed.

[0102] Here, as a feature of the present embodiment should be noted (see Figure 3) band region or the partial pattern is exposed by the individual exposure units 20 ₀₁ to 20 ₁₅ are spliced superimposed portion in the Y-direction It is possible to obtain the whole circuit pattern by doing so. At the boundary between two adjacent strip-shaped areas, due to individual differences of the exposure units, specifically, slight differences in the optical characteristics of the imaging optical system, and minute deviations in the mounting positions of the exposure units, The continuity or integrity of the circuit pattern is impaired in the Y direction. Therefore, in this embodiment, two adjacent strip-shaped regions are partially overlapped and the number of micromirrors to be operated in both exposure units is changed in both the X direction and the Y direction, so that continuity and unity can be achieved. A drawing circuit pattern that is not damaged is obtained.

With reference to FIG. 10, the superposition of the strip-shaped regions (partial patterns) will be described in detail. FIG. 10 shows the first, second and third exposure units ₂₀₀₀₁ , ₂₀₀₂ and _2003.
Exposure areas Ua ₀₁ , Ua ₀₂ and Ua corresponding to
₀₃ and strip-shaped regions Ra ₀₁ , Ra _02, and Ra that are multiple-exposed by the exposure units ₂₀₀₀₁ , _2002, and ₂₀₀₃ .
It is a schematic diagram which shows the relationship with ₀₃ . In order to simplify the description, a case where the drawing surface 32 is moved parallel to the X axis (FIG. 3) will be described here.

[0104] The first exposure unit 20 ₀₁ is drawn by multiple exposure to band-like region is the same width and the entire exposure area Ua ₀₁ in the drawing plane 32. This strip-shaped region is referred to as a first strip-shaped region R.
It is defined as a ₀₁ (indicated by hatching that rises to the right), and its Y-direction length is defined as the exposure width D1. The Y-direction length of the circuit pattern drawn in the first strip-shaped region Ra ₀₁ corresponds to about 1/15 of the Y-direction length of the entire circuit pattern. Similarly, the area of the exposure width D1 which is subjected to multiple exposure by the second exposure unit 20 ₀₂ is defined as the second strip area Ra ₀₂ (indicated by hatching in the lower right direction) and the third exposure unit 20 _03.
The area of the exposure width D1 that is subjected to multiple exposure by is defined as the third strip-shaped area Ra ₀₃ .

Two adjacent strip-shaped regions, for example, the first strip-shaped region Ra ₀₁ and the second strip-shaped region Ra ₀₂ partially overlap each other, and the overlapping region is defined as the first boundary region Rb _01. The length in the Y direction is defined as the boundary width D2. The boundary width D2 is 5 to 10% of the exposure width D1. The first boundary region Rb ₀₁ is subjected to multiple exposure by both the first exposure unit 20 ₀₁ and the second exposure unit 20 ₀₂ .

[0106] Although one region exposable by the exposure operation of the first exposure unit 20 ₀₁ is entirely exposed area Ua ₀₁ rectangular enclosed by heavy solid line, the second exposure unit 20 ₀₂ side shown by dashed hatching (Upper side in the figure) The triangular area Ud ₀₁ on the edge is not exposed. That is, the micro mirror corresponding to the triangular region Ud ₀₁ in the first exposure unit 20 ₀₁ is fastened to the non-exposure position, it does not operate in accordance with the raster data. On the other hand, in the second exposure unit 20 _01, the first exposure unit entire exposure area Ua ₀₂ 20 ₀₁
The micromirror corresponding to the triangular area Uc ₀₂ on the side (the lower side in the drawing) is also stopped at the non-exposure position and does not substantially operate.

Therefore, the number of micromirrors of the first exposure unit 20 ₀₁ used for the exposure of the first boundary region Rb ₀₁ is constant along the X-axis in the negative direction (left in the figure). While gradually decreasing, the number of micromirrors of the second exposure unit ₂₀₀₂ used for exposing the first boundary region Rb ₀₁ gradually increases in the negative direction along the X axis at a constant rate. Similarly for the Y direction, the first boundary region Rb
The number of micromirrors of the first exposure unit 20 ₀₁ that is used to expose the ₀₁ along the Y-axis positive direction gradually and finally decreases at a constant rate of 1024 total toward (upward in the figure) While the number of micromirrors of the second exposure unit ₂₀₀₂ used for exposing the first boundary region Rb ₀₁ gradually increases from 0 in the positive direction along the Y axis at a constant rate. In the end, it reaches 1024.

Thus, the two exposure units 20₀₁,
20₀₂The number of micromirrors operating in
One along the direction (first exposure unit 20₀₁) Is gradually
Decrease and the other (second exposure unit 20₀₂) Increases
Therefore, as it moves in the positive direction of the Y-axis, the first exposure unit 2
0₀₁Second exposure unit
20₀₂The effect of gradually increases. Therefore, two exposures
Unit 20₀₁, 20 ₀₂Of the optical characteristics of the
The generation of clear muscles due to minute deviations is prevented, and Y
The first strip-shaped region Ra in the direction₀₁To the second strip region Ra
₀₂The circuit patterns leading to are connected continuously and integrally.
Be done.

Similarly, for the second strip-shaped region Ra ₀₂ that is multiple-exposed by the second exposure unit 20 ₀₂ and the third strip-shaped region Ra ₀₃ that is multiple-exposed by the third exposure unit 20 ₀₃ , the second overlapping region Ra ₀₂ is also overlapped. By blurring the boundary region Rb ₀₂ , the second and third exposure units 20 ₀₂ , 200 ₃
It is possible to prevent the generation of clear streaks due to the difference in optical characteristics and the slight deviation of the mounting position, and the circuit patterns are continuously and integrally connected.

In the entire exposure area U ₀₁ of the first exposure unit ₂₀₀₀₁ located at the end in the Y direction,
The triangular area is not provided because it is not necessary to connect the lower sides in the figure. Similarly, with respect to the entire surface exposure area U ₁₅ of the fifteenth exposure unit 20 ₁₅ provided at the opposite end, no triangular area is provided on the side that should be the edge of the drawing area. The remaining exposure unit 20 _{04-20 14,} the same joining the second and third exposure unit 20 _02, 20 _03.

Referring to FIG. 11, second exposure unit 20
Procedure to operate only micro mirrors corresponding to the parallelogram Ub ₀₂ is described in _02. Figure 11
As (a), the exposure point corresponding to the micromirrors of the second exposure unit 20 ₀₂ is distributed in the overall exposure area U ₀₂ rectangular, any exposure point CN (m, n)
The relative position of (1 ≦ m ≦ 1024, 1 ≦ n ≦ 1280) is two-dimensional coordinates with the exposure point CN (1,1) as the origin, that is, exposure point coordinate data [Xp (m, n), Yp (m ，
n)].

Here, the Y component Yp of the exposure point coordinate data
The predetermined value yd shown in the equation (9) is added to (m, n), and the coordinate conversion of the exposure point CN (m, n) is performed. By this coordinate conversion, the distribution shape of the exposure points is changed from the rectangular shape to that shown in FIG.
It transforms into a parallelogram as shown in (b). D2 is the boundary width. yd (m, n) = (m / 1024) × D2 (9)

Then, the value of the Y component {Yp (m, n) + y
d (m, n)} is the boundary width D2 or more and the exposure width D
The exposure points of 1 or less are defined in the exposure execution group, and the exposure points in which the value of the Y component is smaller than the boundary width D2 or larger than the exposure width D1 are defined in the exposure stop group to be divided into two groups. In FIG. 11C, the area including the exposure point of the exposure execution group is hatched. Figure 11
(C) shows a case where an arbitrary exposure point CN (m, n) is included in the exposure execution group, and at this time, it corresponds to the exposure point CN (m, n) in the second exposure unit ₂₀₀₂ . The micromirror (M (m, n)) is determined as the micromirror to be exposed. On the other hand, the dummy data "0" is given to the micromirrors corresponding to the exposure points of the exposure stop group, so that these micromirrors do not perform the exposure operation.

Therefore, as shown in FIG. 11D, the distribution shape (indicated by hatching) of the micromirrors corresponding to the exposure points of the exposure execution group, that is, the shape of the area actually exposed on the drawing surface 32 is , It becomes a parallelogram with the side inclined upward to the right. The hatched area in FIG. 11D corresponds to the parallelogram area Ub ₀₂ in FIG. As described above, in the present embodiment, only the exposure point coordinate data [Xp (m, n), Yp (m, n)] is used to determine the micromirror to be operated. In addition,
In the second exposure unit ₂₀₀₂ , the upper limit value of the Y coordinate for grouping is D1 and the lower limit value is D2. However, when exposing the most negative side in the Y direction like the first exposure unit _20001. The upper limit is D1 and the lower limit is 0. When the most positive side in the Y direction is exposed as in the fifteenth exposure unit ₂₀₀₀₁ , the upper limit is (D1 + D2) and the lower limit is D2.

FIG. 12 is a block diagram showing the structure of the first exposure data generation circuit 54 ₀₁ shown in FIG. 7 in more detail. In FIG. 12, the remaining 14 exposure data generation circuits 54 _{02 to} 54 ₁₅ are the same as the first exposure data generation circuit 54 _01.
It has the same configuration as the above, and the description thereof is omitted here.

[0116] The first exposure data generating circuit 54 ₀₁ is to draw a circuit pattern on the first exposure area Ra _01, the first exposure area comprises Ra ₀₁ and the first exposure area larger region than Ra ₀₁ (hereinafter, The exposure data to be provided to the first exposure unit ₂₀₀₀₁ by reading the raster data of the circuit pattern corresponding to the first divided area), that is, the raster data of the first group shown in FIG. 8 from the bitmap memory 52. To generate.

More specifically, the first exposure data generation circuit 54
_{Reference numeral 01} includes a divided area check circuit 72 and a divided area memory 74. In the divided area check circuit 72, address data of raster data corresponding to the first divided area by the system control circuit 34 (hereinafter referred to as divided area data). ) Is given, only the raster data corresponding to the first divided area is extracted from the raster data sequentially read from the bitmap memory 52, and the divided area memory 74
To store.

The first exposure data generation circuit 54 ₀₁ is provided with an exposure point coordinate data memory 76, and the exposure point coordinate data memory 76 has micromirrors M (m, n) arranged in a matrix of 1024 × 1280. Exposure point coordinate data [Xp (m, n), Yp (m, n)] (1
≦ m ≦ 1024, 1 ≦ n ≦ 1280) is stored. This exposure point coordinate data [Xp (m, n), Yp (m,
n)] is reviewed every time the entire drawing surface 32 is drawn, and given from the system control circuit 34 as needed and updated.

In the counter 82 of the first exposure data generation circuit 54 ₀₁ , the system control circuit 34 supplies the basic control clock pulse CLK1 and the exposure clock pulse E_.
CLK is input, and its output is input to the exposure point coordinate data memory 76 and the exposure data memory 92.

The basic control clock pulse CLK1 is 13
The exposure clock pulse E is a pulse for controlling the timing of sequentially operating each of the 10720 micromirrors.
_CLK is a pulse that controls the exposure start timing. The cycle of the exposure clock pulse E_CLK is 1310720 times or more the cycle of the clock pulse CLK1.

The counter 82 uses the basic control clock pulse C
The number of LK1 pulses is counted and the count value is output. This count value is the exposure clock pulse E_CLK
Is reset to the initial value 0 each time. Therefore, the output from the counter 82 corresponds to the address data indicating the reading order of the bit data to be given to each micromirror from the exposure point coordinate data memory 76 or the exposure data memory 92.

[0122] Also in the first exposure data generating circuit 54 ₀₁ is provided an exposure position data memory 86, the first exposure unit 20 ₀₁ of the exposure position data [Xs that changes for each of the exposure operation in the exposure position data memory 86 ( i), Ys (i)]
(I is the number of exposures) is stored. Exposure position data [Xs
(I), Ys (i)] is given from the system control circuit 34 and updated every drawing operation, that is, every time the parameter i is updated.

The exposure clock pulse E_CLK is input from the system control circuit 34 to the counter 84 of the first exposure data generation circuit 54 ₀₁ , and the number of pulses is counted. The count value (i) is the exposure position data [Xs (i), Ys (i)] from the exposure position data memory 86.
Is output to the exposure position data memory 86 as address data for reading.

The exposure point coordinate data memory 76 operates in synchronization with the basic control clock pulse CLK1 and sequentially exposes the gradient processing circuit 78 and the adder 88 each time the values of the parameters m and n, which are address data, are updated. The point coordinate data [Xp (m, n), Yp (m, n)] is output.
The exposure position data memory 86 uses the exposure clock pulse E_
Each time the parameter i which is the address data is changed in synchronization with CLK, the exposure position data [Xs
(I), Ys (i)] is output.

In the gradient processing circuit 78, the gradient data, that is, yd (m, n) (see the equation (9)) to be added to the Y component Yp (m, n) of the individual exposure point coordinate data is the system control circuit. 34, the inclination data yd (m, n) is the Y component Yp (m, n of the exposure point coordinate data sequentially read from the exposure point coordinate data memory 76.
n) are sequentially added.

The exposure width check circuit 80 sums the Y component of each exposure point coordinate data [Xp (m, n), Yp (m, n)] and the tilt data {Yp (m, n) + yd (m). ，
n)} is a circuit for dividing the exposure point CN (m, n) into the exposure execution group or the exposure stop group described above, and the upper limit value (D1) for determining each group.
And the lower limit value (0) are given by the system control circuit 34 as exposure width data. Y component {Yp
When (m, n) + yd (m, n)} is within the range of the lower limit value and the upper limit value, data “1” is output to set the corresponding exposure point CN (m, n) to the exposure execution group. , Y
When the component is out of the range between the lower limit value and the upper limit value, data "0" is output to set the corresponding exposure point CN (m, n) to the exposure stop group.

The individual exposure point coordinate data [Xp (m, n), Yp (m, n)] and the current exposure position data [Xs (i), Ys (i)] are input to the adder 88. If the output of the exposure width check circuit 80 is "1", the relative position coordinate data [x (m,
n), y (m, n)] is output to the pixel processing circuit 90, and when the output of the exposure width check circuit 80 is “0”, “0” is output. Exposure position data [Xp (m,
n), Yp (m, n)] and exposure point coordinate data [Xs
(I), Ys (i)] is a value expressed in μm unit, so that the pixel processing circuit 90 displays relative position coordinate data [x (m, n), y (m, n) in μm unit. ] To data based on the pixel size PS of the raster data to be drawn. This data becomes read address data [L _x , R _y ] when reading raster data from the divided area memory 74. When the value output from the adder 88 is "0", there is no corresponding address, that is, it is considered that the exposure point CN (m, n) corresponds to the exposure stop group, and the exposure data memory 92 stores the dummy data " 0 ”is given.

The raster data read from the divided area memory 74 is temporarily stored in the exposure data memory 92,
The exposure data is read out based on the output from the counter 82, that is, the address data indicating the reading order of the bit data to be given to each micromirror, and is output to the DMD drive circuit 56. It should be noted that when the coordinate conversion of the circuit pattern is performed, the exposure point coordinate data [Xs (i), Ys (i)] or the exposure position coordinate data [Xp (m, n), Yp (m, n)]
The coordinates of the raster data to be read may be changed according to the coordinate conversion.

As described above, in the first exposure unit ₂₀₀₀ , (1280 + β) -bit raster data corresponding to a divided area which is longer than the exposure width D1 by a predetermined length is read and included in this divided area. Exposure data for multiple exposure of the band-shaped region Ra ₀₁ is generated. In the present embodiment, since the raster data corresponding to the divided area wider than the strip-shaped area is read to generate the exposure data, when the strip-shaped area is shifted in the Y direction as described above or when the circuit pattern is coordinate-converted (rotated, Even when drawing by enlarging, reducing, moving, etc.), it is possible to sufficiently deal with it. In addition,
It goes without saying that the exposure data is similarly generated in the second to fifteenth exposure data generation circuits 54 _{02 to} 54 ₁₅ .

[0130]

As described above, the multiple-exposure drawing apparatus of the present invention is such that the partial patterns drawn by the individual exposure units are partially overlapped and connected to each other, and the modulation element corresponding to the boundary region where the partial patterns overlap. In order to gradually change the number to be driven along the relative movement direction of the drawing surface,
The advantage is that the entire pattern having good continuity and integrity can be obtained.

[Brief description of drawings]

FIG. 1 is a schematic perspective view of a multiple exposure drawing apparatus according to the present invention.

FIG. 2 is a schematic conceptual diagram for explaining a function of an exposure unit used in the multiple exposure drawing apparatus according to the present invention.

3 is a plan view for explaining a drawing surface of an object to be drawn on a drawing table of the multiple-exposure drawing device shown in FIG. 1 and an exposure area by each exposure unit.

FIG. 4 is a schematic diagram for explaining the principle of a multiple-exposure drawing method executed by the multiple-exposure drawing apparatus according to the present invention, in which exposure units are provided at a plurality of exposure positions along the X axis of the XY coordinate system. It is a figure which shows the state moved sequentially.

FIG. 5 is a schematic view similar to FIG. 4, in which the exposure unit is moved a predetermined distance along the Y axis when the exposure unit is sequentially moved to a plurality of exposure positions along the X axis of the XY coordinate system. It is a figure which shows the state displaced only by time.

FIG. 6 shows how the center of a unit exposure area obtained by a predetermined micromirror of the exposure unit when the exposure unit is sequentially moved to a plurality of exposure positions according to the multiple exposure method of the present invention is distributed within the predetermined area. It is explanatory drawing which shows whether it does.

FIG. 7 is a block diagram of a multiple exposure drawing apparatus according to the present invention.

FIG. 8 is a schematic diagram showing a part of raster data of a circuit pattern to be drawn by the multiple-exposure drawing apparatus according to the present invention in a state of being expanded on a bitmap memory.

9 is a schematic diagram showing a relationship between a part of the bit data shown in FIG. 8 and its read address data.

FIG. 10 is a diagram for explaining superposition of strip-shaped regions drawn by individual exposure units.

FIG. 11 is a schematic diagram showing a procedure for controlling the number of micromirrors that draw a boundary area in which strip-shaped areas overlap.

12 is a block diagram showing in detail the inside of a first exposure data generation circuit shown in FIG. 7. FIG.

[Explanation of symbols]

10 Multiple-exposure drawing apparatus 20 ₀₁ , ... 20 ₁₅ Exposure unit 27 DMD elements M (m, n), M (1,1), ... M (1024,128)
0) Micromirror (modulation element) 30 Object to be drawn 32 Drawing surface 34 System control circuit 54 ₀₁ , ... 54 ₁₅ Exposure data generation circuit

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) H01L 21/30 529

Claims (7)

[Claims] 1. A plurality of partial patterns lined up along a first direction are drawn on a drawing surface by multiple exposure,
A multiple-exposure drawing apparatus for obtaining the entire pattern in which the partial patterns are connected to each other, wherein the multiple-exposure drawing apparatus has a large number of modulation elements arranged in a matrix and drives the modulation elements based on raster data of the partial patterns. A unit, an array unit that arranges the exposure units by the same number as the number of the partial patterns along the first direction, and the drawing surface with respect to the exposure unit along a second direction different from the first direction. With respect to the moving unit that relatively moves and each exposure unit that draws two adjacent partial patterns, the number of modulators to be driven corresponding to the boundary region where the partial patterns overlap is fixed at a constant rate along the second direction. A multiple-exposure drawing apparatus, comprising: a modulation element selecting unit that gradually decreases or gradually increases. 2. The multiple-exposure drawing apparatus according to claim 1, wherein the area of the boundary region occupies 5 to 10% of the area that can be drawn by one exposure unit. 3. Memory means for holding raster data of the entire pattern, first coordinate data indicating a relative position of the exposure unit with respect to the drawing surface, and first relative data indicating a relative position of each of the modulation elements in the exposure unit. The two coordinates are added to calculate the relative position coordinate data of each of the modulation elements with respect to the drawing surface, and the address data corresponding to the pixel size of the raster data is calculated for each of the modulation elements based on the relative position coordinate data. And an exposure data generation unit that reads raster data corresponding to the address data from the memory unit and generates exposure data for instructing each modulation element to perform an exposure operation or an exposure operation stop. Further comprising: 2. The multiple-exposure drawing according to claim 1, wherein the address data obtained from the calculating means is given to the exposure data generating means, and the dummy data of the modulation element to be stopped in exposure operation is given to the exposure data generating means. apparatus. 4. The overall exposure region exposed by one exposure of each of the exposure units has a rectangular shape having a length D1 in the first direction, and two overall exposure regions adjacent in the first direction have a length D2 ( The multiple-exposure drawing apparatus according to claim 1, wherein D2 <D1) is overlapped. 5. The first-direction length D2 at which two adjacent whole-surface exposure regions overlap is 5 to 10% of the first-direction length D1 of the whole-surface exposure region.
The multiple-exposure drawing apparatus according to item 1. 6. One of two adjacent whole surface exposure regions is located on the side of the other whole surface exposure region and has a length D in the first direction.
A triangular area having a length of 2 in the second direction equal to the length of the entire surface exposure area in the second direction is defined as the first exposure stop area. A triangular region located on the region side and having a first-direction length D2 and a second-direction length equal to the second-direction length of the entire-surface exposure region is defined as the second exposure stop region, and The multiple exposure drawing apparatus according to claim 4, wherein the exposure operation of the modulation element corresponding to the second exposure stop region is stopped. 7. A plurality of partial patterns arranged along the first direction are drawn on a drawing surface by multiple exposure,
A multiple-exposure drawing method for obtaining an entire pattern in which the partial patterns are connected to each other, wherein the exposure has a plurality of modulation elements arranged in a matrix and drives the modulation elements based on raster data of the partial patterns. The units are arranged along the first direction by the same number as the number of the partial patterns, and the drawing surface is moved relative to the exposure unit along a second direction different from the first direction so that the units are adjacent to each other. In the exposure unit that draws the two partial patterns, the number of modulator elements to be driven corresponding to the boundary region where the partial patterns overlap is gradually decreased or increased at a constant rate along the second direction. Multiple exposure drawing method.