JP2006049971A - Method of manufacturing crystal resonator - Google Patents

Method of manufacturing crystal resonator Download PDF

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Publication number
JP2006049971A
JP2006049971A JP2004224046A JP2004224046A JP2006049971A JP 2006049971 A JP2006049971 A JP 2006049971A JP 2004224046 A JP2004224046 A JP 2004224046A JP 2004224046 A JP2004224046 A JP 2004224046A JP 2006049971 A JP2006049971 A JP 2006049971A
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Japan
Prior art keywords
vibration
etchant
crystal resonator
thin plate
base plate
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Pending
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JP2004224046A
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Japanese (ja)
Inventor
Tomoaki Ogura
友昭 小倉
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Kyocera Kinseki Corp
京セラキンセキ株式会社
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Priority to JP2004224046A priority Critical patent/JP2006049971A/en
Publication of JP2006049971A publication Critical patent/JP2006049971A/en
Pending legal-status Critical Current

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Abstract

【Task】
An object of the present invention is to provide a manufacturing method of a crystal resonator that performs AT-cut thickness sliding vibration in which a vibrating portion of a quartz base plate thin plate and a reinforcing portion of a quartz base plate thick plate surrounding the quartz plate are integrally formed. It is.
[Solution]
In order to achieve the above-mentioned object, the present invention provides an AT-cut thickness-slip vibration in which a vibration part of a quartz base plate thin plate and a reinforcement part of a quartz base plate thick plate surrounding it are integrally formed. The manufacturing method is characterized by having a patterning step for forming a vibration surface, an outer shape processing etching and a vibration surface forming step, a protective film peeling step, and an etchant stop partition portion forming step, Further, the width of the etchant stop partition portion is 200 μm to 300 μm, and the etchant stop partition portion is made of a water-repellent resist.
[Selection] Figure 1

Description

     The present invention relates to a method of manufacturing a crystal resonator that belongs to a crystal device and performs AT-cut thickness-slip vibration used in a crystal oscillator mainly used in a transmission system apparatus in the communication field.
     In the case of an AT-cut thickness-slip vibration that is formed by integrating the vibration part of a conventional quartz base plate thin plate and the reinforcement part of the quartz base plate thick plate that surrounds it, unnecessary spurious vibrations In order to avoid the occurrence, it has been common to make the vibration surface as large as possible with respect to the electrode surface.
     On the other hand, the recent trend is centered on transmission systems in the communication field, etc., and there is a demand for downsizing and lowering of the mounted parts from the market, as well as weight reduction and price reduction.
JP 2000-031769 A JP 2001-168673 A
     The applicant has not found any prior art documents related to the present invention other than the prior art documents specified by the prior art document information described above by the time of filing of the present application.
     However, the thickness of the vibration part of the vibrator described above is a thin plate having a vibration part thickness of about 10 μm, for example, in the case of the main vibration frequency of 150 MHz. The mechanical distortion changes the thickness of the thin plate of the vibration part, resulting in the generation of many unnecessary spurious vibrations other than the main vibration.
     In view of this, the crystal resonator having such a shape is formed by etching, and as described above, includes the vibrating portion of the quartz base plate thin plate and the reinforcing portion of the quartz base plate thick plate surrounding the surrounding portion. In general, a large number of shaped crystal resonators are patterned on a single wafer.
     As described above, in order to adjust the frequency of the thin plate-like vibrating portion of each vibrator in which a large number of crystal vibrators are patterned on a single wafer, it is divided into a desired size by dicing or the like. Then, it is general that the frequency is classified and then etched and adjusted for each classified group.
     However, there is a tendency that the quartz that is handled in recent years with the miniaturization and the high frequency of the mounted components is miniaturized and thinned, and in the method of adjusting by etching for each group described above, There are concerns about loss and damage, and because of the large number of man-hours, it is becoming disadvantageous in terms of cost.
     As a countermeasure against this, a method of performing etching without dividing the wafer is conceivable. However, since the frequency of each vibrator in the wafer is not necessarily uniform, an operation method in which the wafer is immersed in an etchant as in the past. Then, the yield is bad and cannot be applied.
     Therefore, in order to make the frequency of each vibrator in the wafer uniform, a method of dropping the etchant sequentially onto the thin plate-like vibrating portion of the vibrator is taken. However, in the prior art, when an etchant is dropped on a thin plate-like vibrating portion, as shown in FIG. 5, the etching is not yet performed by dropping the etchant, and the crystal resonator having the vibrating portion of a certain thin plate is used. There is a problem that the etchant flows into the vibrating portion of the thin plate of another vibrator adjacent to the other.
     The present invention has been made under the technical background as described above. Accordingly, the object of the present invention is to provide a vibrating portion of the quartz base plate thin plate and a reinforcing portion of the quartz base plate thick plate surrounding the surrounding portion. It is an object to provide a method for manufacturing a quartz crystal resonator that performs AT-cut thickness-slip vibration.
     In order to achieve the above object, the present invention provides an AT-cut thickness-shear vibration unit in which a vibrating part of a quartz base plate thin plate and a reinforcing part of a quartz base plate thick plate surrounding it are integrally formed. In the manufacturing method, a patterning step for forming a vibration surface, an outer shape processing etching and a vibration surface forming step, a protective film peeling step, and an etchant stopper partition portion forming step are characterized. To do.
     Further, the width of the partition portion of the etchant stopper partition portion is 200 μm to 300 μm.
     Further, the etchant stopper partition portion is made of a water-repellent resist.
     According to the method for manufacturing a quartz crystal resonator of the present invention, the inflow of the etchant from the concave portion forming the vibrating portion of the thin plate to which etching is performed by dropping the etchant to the vibrating surface of the vibrating portion of the thin plate of the adjacent vibrator is partitioned. Therefore, the manufacturing yield of the crystal resonator can be remarkably improved.
     The partition portion formed of the water-repellent resist formed according to the present invention is scraped when divided into individual crystal resonators in the dicing step (S111) at the rear of the crystal resonator manufacturing method. Further, it is not necessary to newly add a step for removing the partition portion made of resist, and the productivity can be remarkably increased.
Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
In addition, the same code | symbol in each figure shall show the same object.
     FIG. 1 is a flowchart of a method for manufacturing a crystal resonator according to the present invention. In the flow chart of the method for manufacturing the crystal resonator of FIG. 1, the vibration surfaces of a large number of thin plate-like vibration parts 1 are patterned on a single wafer 6 in step S <b> 103.
     FIG. 2 is a schematic top view showing a state in which a large number of crystal resonators 3 and etchant stopper partitions 4 are formed on a single wafer 6 of the present invention. Forming the vibration surface of the vibration part 1 of the thin plate of each crystal resonator 3 with the etchant stop partitioning part 4 above and below and right and left so as to surround the vibration surface of the vibration part 1 of the thin plate of one crystal resonator 3 ( Subsequently to S104), the protective film is peeled off (S105), and subsequently, a resist having water repellency is applied onto the wafer 6 by a printing technique to form the etchant stopper partition 4 (S106).
     In FIG. 3, a large number of crystal resonators 3 and etchant stopper partitions 4 are formed on a single wafer 6 of the present invention, and an etchant 7 is placed on the vibration surface of the vibration portion 1 of the thin plate of the single crystal resonator 3. It is the general | schematic partial side view which showed a mode that it dripped.
     In FIG. 4, a large number of crystal resonators 3 and etchant stopper partitions 4 are formed on a single wafer 6 of the present invention, and an etchant 7 is placed on the vibration surface of the vibration portion 1 of the thin plate of the single crystal resonator 3. It is the schematic side surface figure which showed a mode that it dripped. Since the etchant stop partition 4 is formed between the thin plate vibrating portions 1 of the respective quartz crystal resonators 3, the etchant 7 is dropped from the concave portion forming the vibrating surface of the thin plate vibrating portion 1 where etching is performed. Thus, the etchant 7 is reliably prevented from flowing into the vibrating surface of the vibrating portion 1 of the thin plate of the quartz crystal resonator 3.
     In FIG. 5, a large number of crystal resonators 3 are formed on a conventional wafer 6, and the frequency is adjusted by dropping an etchant 7 on the vibration surface of the vibrating portion 1 of the thin plate of the one crystal resonator 3. It is the schematic side surface figure which showed a mode that it performed. Etchant 7 is dropped sequentially on the vibration surface of vibrating part 1 of the concave thin plate, and etching is performed. However, adjacent vibrator 3 that is not yet etched from the concave portion forming the vibrating surface of vibrating part 1 of the thin plate to be etched. There is a problem that the etchant 7 flows into the vibration surface of the vibration part 1 of the thin plate.
     Further, the width of the etchant stopper partition 4 shown in FIGS. 2, 3 and 4 is required to have a shape in which the etchant flows into the lubrication and the etchant does not overflow. As a result, good results could be obtained when the width of the etchant stopper partition was 200 μm to 300 μm. Further, the length of the etchant stopper partition 4 is the same as that of the adjacent crystal resonators 3 because a large number of crystal resonators 3 and etchant stopper partitions 4 are formed on a single wafer 6.
It is a flowchart of the manufacturing method of the crystal oscillator of this invention. In the step of S106 in FIG. 1, an etchant stop partition portion is formed using a printing technique. FIG. 4 is a schematic top view showing a state in which a large number of crystal resonators and etchant stopper partitions are formed on a single wafer of the present invention. FIG. 6 is a schematic partial side view showing a state in which a large number of crystal resonators and etchant stopper partitions are formed on a single wafer of the present invention, and the etchant is dropped on the vibration portion of a thin plate of the single crystal resonator. is there. FIG. 5 is a schematic side view schematically showing a state in which a large number of crystal resonators and etchant stopper partitions are formed on a single wafer of the present invention, and the etchant is dropped on the vibration portion of a thin plate of the single crystal resonator. is there. This is a schematic side view showing how a large number of quartz resonators are formed on a single conventional wafer and the frequency is adjusted by dropping an etchant on the vibrating part of the thin plate of the single quartz resonator. is there. It is a flowchart of the manufacturing method of the conventional crystal oscillator.
Explanation of symbols
DESCRIPTION OF SYMBOLS 1 Thin plate vibration part 2 Thick plate reinforcement part 3 Crystal oscillator 4 Etchant partition part 5 Partition part width 6 Wafer 7 Etchant

Claims (3)

  1. In the manufacturing method of the crystal resonator that performs AT-cut thickness sliding vibration in which the vibrating portion of the quartz base plate thin plate and the reinforcing portion of the quartz base plate thick plate surrounding the quartz base plate are integrally formed,
    Patterning process for vibration surface formation;
    Steps of outer shape etching and vibration surface formation;
    A protective film peeling process;
    A method of manufacturing a crystal resonator, comprising the step of forming an etchant stop partition.
  2.      2. The method for manufacturing a crystal resonator according to claim 1, wherein the width of the etchant stopper partition portion is 200 μm to 300 μm.
  3.      2. The method for manufacturing a crystal resonator according to claim 1, wherein the etchant stopper partition portion is made of a water-repellent resist.
JP2004224046A 2004-07-30 2004-07-30 Method of manufacturing crystal resonator Pending JP2006049971A (en)

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JP2004224046A JP2006049971A (en) 2004-07-30 2004-07-30 Method of manufacturing crystal resonator

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JP2006049971A true JP2006049971A (en) 2006-02-16

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007274348A (en) * 2006-03-31 2007-10-18 Kyocera Kinseki Corp Manufacturing method of lame mode crystal vibrator

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007274348A (en) * 2006-03-31 2007-10-18 Kyocera Kinseki Corp Manufacturing method of lame mode crystal vibrator

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