JP2005065234A - Method for manufacturing quartz oscillator - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a quartz oscillator of AT-cut which performs fundamental wave thickness-shear vibration, wherein a vibrating part of a quartz elementary thin plate and a reinforced part of a quartz elementary thick plate surrounding its periphery are integrated. <P>SOLUTION: The method for manufacturing the quartz oscillator includes the step of patterning a vibration plane, an etchant stopper slit or a groove, and the steps of outer form working etching and vibration plane formation. The width of the etchant stopper slit or of the groove is 200 to 300 μm. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

     The present invention relates to a crystal device and a method for manufacturing a crystal resonator that performs AT-cut fundamental wave thickness shear vibration used in a crystal oscillator mainly used in a transmission system apparatus in the communication field.

     In the case of a quartz crystal resonator that has an AT-cut fundamental-wave thickness-slip vibration in which the vibration part of the conventional quartz base plate thin plate and the reinforcement part of the quartz base plate thick plate surrounding it are integrated, unnecessary spurious In order to avoid the occurrence of vibrations, it has been common to make the size of the vibration surface as large as possible with respect to the size of the electrode surface.

     On the other hand, the recent trend is centered on transmission systems in the communication field, etc., and there is a demand for downsizing and lowering of the mounted parts from the market, as well as weight reduction and price reduction.

JP 2000-031769 A JP 2001-168673 A

     The applicant has not found any prior art documents related to the present invention other than the prior art documents specified by the prior art document information described above by the time of filing of the present application.

     However, the thickness of the vibration part of the vibrator described above is a thin plate having a vibration part thickness of about 10 μm, for example, in the case of the main vibration frequency of 150 MHz. The mechanical distortion changes the thickness of the thin plate of the vibration part, resulting in the generation of many unnecessary spurious vibrations other than the main vibration.

     In view of this, the crystal resonator having such a shape is formed by etching, and as described above, includes the vibrating portion of the quartz base plate thin plate and the reinforcing portion of the quartz base plate thick plate surrounding the surrounding portion. In general, a large number of crystal resonators having a shape are patterned on a single wafer.

     As described above, in order to adjust the frequency of the thin plate-like vibrating portion of each vibrator in which a large number of crystal vibrators are patterned on a single wafer, the individual pieces are adjusted to a desired size by dicing or the like. In general, the frequency is classified and then etched and adjusted for each classified group.

     However, there is a tendency that the crystal to be handled is miniaturized and thinned with the above-mentioned recent miniaturization and high frequency, and in the method of adjusting by etching for each group described above, the vibrator piece is lost or damaged. Concerns are being raised and the number of man-hours is increasing, which is becoming a disadvantage in cost.

     As a countermeasure against this, an etching method without dividing the wafer may be considered. However, since the frequencies of the respective vibrators in the wafer are not necessarily uniform, an operation method in which the wafer is immersed in an etchant as in the past. Then, the yield is bad and cannot be applied.

     Therefore, in order to make the frequency of each vibrator in the wafer uniform, a method of dropping the etchant sequentially onto the thin plate-like vibrating portion of the vibrator is taken. However, in the prior art, when an etchant is dropped on a thin plate-like vibrating portion, as shown in FIG. 6, the etching of the crystal resonator having the vibrating portion of the thin plate is not performed yet by etching the etchant. There is a problem that the etchant flows into the vibrating portion of the thin plate of another vibrator adjacent to the other.

The present invention has been made under the technical background as described above. Accordingly, the object of the present invention is to provide a vibrating portion of the quartz base plate thin plate and a reinforcing portion of the quartz base plate thick plate surrounding the surrounding portion. Became one
The object of the present invention is to provide a method of manufacturing a quartz resonator that performs AT-cut fundamental thickness sliding vibration.

     In order to achieve the above object, the present invention provides an AT-cut fundamental wave thickness sliding vibration in which a vibrating portion of a quartz base plate thin plate and a reinforcing portion of a quartz base plate thick plate surrounding the quartz plate are integrally formed. The method for manufacturing a vibrator includes a patterning process of a vibration surface and an etchant stop slit or groove, a contour processing etching and a vibration surface forming process, and a protective film peeling process.

     In addition, the width of the etchant stop slit or groove is 200 μm to 300 μm.

     According to the method for manufacturing a crystal resonator of the present invention, the etchant surely flows into the vibration surface of the vibrating portion of the thin plate of the adjacent vibrator from the concave portion that forms the vibrating portion of the thin plate that is etched by dropping the etchant. As a result, the manufacturing yield of the crystal resonator can be remarkably improved.

     In addition, according to the method for manufacturing a crystal resonator of the present invention, when dividing a large number of crystal resonators formed on one wafer, there is an etchant stop slit or groove, so that the etchant stop slit Alternatively, it can be easily divided into each crystal resonator at the groove portion.

     In addition, according to the method for manufacturing a crystal resonator of the present invention, since the etchant stop slit or groove is formed simultaneously with the patterning for forming the vibration part, the yield is increased without increasing the number of processes compared to the conventional method. Crystal units can be manufactured.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
In addition, the same code | symbol in each figure shall show the same object.

     FIG. 1 is a flowchart of a method for manufacturing a crystal resonator according to the present invention. In the flow chart of the crystal resonator manufacturing method of FIG. 1, the vibration surface of the thin plate-like vibrating portion 1 and the etchant stop slit 4 or the groove 8 are simultaneously patterned on one wafer 6 in the process of S103. . The groove 8 can be formed by patterning and subsequent etching, or can be formed by using a dicing machine.

     FIG. 2 is a schematic top view showing a state in which a large number of crystal resonators 3 and etchant stop slits 4 are formed on a single wafer 6 of the present invention. Etchant stop slits 4 on the upper and lower sides and the right and left sides of the vibrating plate 1 of the thin plate of one crystal unit 3 are simultaneously formed with the vibrating surface of the vibrating unit 1 of the thin plate of the crystal unit 3 and the wafer. 6 is patterned. 3 and FIG. 4 including FIG. 2, the etchant stop slit 4 is illustrated, but this may be used as the groove 8, and this case is also included in the technical scope of the present invention. Not too long.

     In FIG. 3, a large number of crystal resonators 3 and etchant stop slits 4 are formed on a single wafer 6 of the present invention, and an etchant 7 is dropped on the vibration surface of the vibrating portion 1 of the thin plate of the single crystal resonator 3. It is the general | schematic partial side view which showed a mode to do.

     In FIG. 4, a large number of crystal resonators 3 and etchant stop slits 4 are formed on a single wafer 6 of the present invention, and an etchant 7 is dropped on the vibration surface of the vibrating portion 1 of the thin plate of the single crystal resonator 3. It is the outline side surface schematic diagram which showed a mode to do. Since the etchant stop slits 4 are formed between the thin plate vibrating portions 1 of the respective quartz crystal resonators 3, the etchant 7 is dropped from the concave portion forming the vibrating surface of the thin plate vibrating portion 1 to be etched. The etchant 7 is reliably prevented from flowing into the vibration surface of the vibration part 1 of the thin plate of the crystal resonator 3.

     In FIG. 5, a large number of crystal resonators 3 and etchant stop grooves 8 are formed on a single wafer 6 of the present invention, and an etchant 7 is dropped on the vibration surface of the vibration portion 1 of the thin plate of the single crystal resonator 3. It is the outline side surface schematic diagram which showed a mode to do. Since the etchant stop groove 8 is formed between the vibration parts 1 of the thin plate of each crystal resonator 3, the etchant 7 is dropped and etched as in the case of forming the etchant stop slit 4 described above. The etchant 7 is reliably prevented from flowing from the concave portion forming the vibration surface of the vibration unit 1 into the vibration surface of the vibration unit 1 of the thin plate of the adjacent crystal unit 3.

     In FIG. 6, a large number of crystal resonators 3 are formed on a conventional wafer 6, and the frequency is adjusted by dropping an etchant 7 on the vibration surface of the vibrating portion 1 of the thin plate of the one crystal resonator 3. It is the schematic side surface figure which showed a mode that it performed. Etchant 7 is dropped sequentially on the vibration surface of vibrating part 1 of the concave thin plate, and etching is performed. There is a problem that the etchant 7 flows into the vibration surface of the vibration part 1 of the thin plate.

     Also, the width of the etchant stop slit 4 shown in FIGS. 2, 3 and 4 and the width of the etchant stop groove 8 of FIG. 5 must be such that the etchant flows into the lubrication and does not overflow. As a result of the trial, good results were obtained when the width of the etchant stop slit or the etchant stop groove 8 was 200 μm to 300 μm. Further, the length of the etchant stop slit 4 or the groove 8 is the same as the size of the crystal resonators 3 that are adjacent to each other because a large number of crystal resonators 3 and etchant stop slits 4 are formed on one wafer 6. It is preferable to set the degree.

It is a flowchart of the manufacturing method of the crystal oscillator of this invention. In the process of S103 in FIG. 1, the vibrating portion of the thin plate and the etchant stop slit or groove are patterned simultaneously. FIG. 3 is a schematic top view showing a state in which a large number of crystal resonators and etchant stop slits are formed on a single wafer of the present invention. FIG. 5 is a schematic partial side view showing a state in which a large number of crystal resonators and etchant stop slits are formed on a single wafer of the present invention, and the etchant is dropped on a vibration portion of a thin plate of the single crystal resonator. . FIG. 6 is a schematic side view schematically showing a state in which a large number of crystal resonators and etchant stop slits are formed on a single wafer of the present invention, and the etchant is dropped on a vibrating portion of a thin plate of the single crystal resonator. . FIG. 3 is a schematic side view schematically showing a state in which a large number of crystal resonators and etchant stop grooves are formed on a single wafer of the present invention, and an etchant is dropped on a vibration portion of a thin plate of the single crystal resonator. . This is a schematic side view showing how a large number of quartz resonators are formed on a single conventional wafer and the frequency is adjusted by dropping an etchant on the vibrating part of the thin plate of the single quartz resonator. is there. It is a flowchart of the manufacturing method of the conventional crystal oscillator.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Thin plate vibration part 2 Thick plate reinforcement part 3 Crystal oscillator 4 Etchant stop slit 5 Slit width 6 Wafer 7 Etchant 8 Groove

Claims (2)

The vibrating part of the quartz base plate thin plate and the reinforcing part of the quartz base plate thick plate surrounding it are integrated.
In the manufacturing method of quartz crystal that performs AT-cut fundamental wave thickness sliding vibration,
Patterning the vibrating surface and the etchant stop slit or groove;
Steps of outer shape etching and vibration surface formation;
A method for manufacturing a crystal resonator, comprising a step of removing a protective film.      2. The method for manufacturing a crystal resonator according to claim 1, wherein the width of the etchant stop slit or groove is 200 μm to 300 μm.

Images