JP2006049417A - Semiconductor device, device and method for mounting the same, and electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a device and a method for mounting semiconductor device by which the wet-leakage of a bonding agent caused when a semiconductor chip is heated and pressurized can be prevented at the time of mounting the semiconductor chip, and also to provide a semiconductor device and electronic equipment. <P>SOLUTION: The device for mounting semiconductor device mounts one of paired semiconductor chips arranged with their electrodes being faced to each other on the other semiconductor chip. The device is provided with a pair of pressing means which press the paired semiconductor chips by relatively moving upward and downward by pinching the chips between them, a semiconductor chip holding means provided to at least one of the paired pressing means, and an interval holding means which is inserted between the paired semiconductor chips to hold a prescribed interval between the chips at the time of pressing the semiconductor chips. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a semiconductor device mounting apparatus and method, a semiconductor device, and an electronic apparatus.

In the field of portable electronic devices such as mobile phones, notebook personal computers, and personal data assistance (PDA), devices are becoming smaller and lighter. Along with this, high-density mounting of semiconductor components and the like on a wiring board built in the electronic device has been promoted. Therefore, high-density mounting methods such as flip-chip mounting have been proposed by using many small semiconductor components (semiconductor devices) instead of conventional package-type semiconductor components such as plastic and ceramic.
In recent years, there has been a demand for further thinning and miniaturization of electronic devices, and the space for mounting the above-described semiconductor components is extremely limited. For this reason, for example, in a semiconductor chip (semiconductor device), the packaging method has been devised, and a technique for performing ultra-small packaging called CSP (Chip Scale Package) and a three-dimensional packaging technique have been devised. Yes. A semiconductor chip manufactured by using the CSP technology can be mounted at a high density because the mounting area may be approximately the same as the area of the semiconductor chip.
Here, three-dimensional mounting means forming bumps on the electrode terminals of a pair of semiconductor chips, aligning them, mounting one semiconductor chip on the other semiconductor chip, and further interlayer insulating on the mounted semiconductor chip. This is a technique in which a plurality of semiconductor chips are stacked via a film. The conduction between the stacked semiconductor chips is achieved by forming a through electrode between the semiconductor chips, thereby establishing conduction between the stacked semiconductor chips.

By the way, in the above-described three-dimensional mounting, solder is formed on the bumps of the semiconductor chip to connect the semiconductor chips, and the solder is melted by solder reflow or ultrasonic vibration by heat to electrically connect the semiconductor chips to each other. Connected.
As such a three-dimensional mounting method, the solder of the semiconductor chips facing each other is activated, the semiconductor chips facing each other are aligned, and the semiconductor chips facing each other by pressing are formed without forming a solder bonding layer. A method of forming a solder bonding layer by heating the semiconductor chip group collectively after the lamination bonding and the lamination bonding of all the semiconductor chips is completed is disclosed (for example, Patent Document 1).
JP 2002-170919 A

  However, in the semiconductor chip laminating method of Patent Document 1, solder is used as an adhesive for bumps formed on the bonding electrode terminals of the semiconductor chip. And in order to ensure electrical connection between semiconductor chips, the semiconductor chips are mounted by heating and pressing. At this time, when the semiconductor chip is heated and pressurized, excessive pressure is applied to the semiconductor chip, and there is a problem that the solder leaks out from the bonded portion. As a result, there is a problem that a semiconductor device having desired electrical characteristics cannot be obtained due to a short circuit between adjacent electrodes of the semiconductor chip.

  SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and an object of the present invention is to provide a semiconductor device mounting apparatus and mounting method for preventing adhesive wetting by heating and pressurizing the semiconductor chip during mounting of the semiconductor chip, An object is to provide a semiconductor device and an electronic device.

  In order to solve the above-described problem, the present invention provides a mounting apparatus for a semiconductor device in which one semiconductor chip is mounted on the other semiconductor chip among a pair of semiconductor chips in which electrodes are arranged to face each other. A pair of pressing means for pressing the pair of semiconductor chips by relatively moving up and down with the semiconductor chip interposed therebetween, and the semiconductor chip provided on at least one of the pair of pressing means And holding means for holding at a predetermined interval by being inserted between the pair of semiconductor chips when the pair of semiconductor chips are pressed.

According to this configuration, since it is provided with the interval holding means that is inserted between the semiconductor chips and held at a predetermined interval, even if the semiconductor chip is pressed down too much during mounting, the interval holding inserted between the pair of semiconductor chips is maintained. The means becomes a stopper, and the semiconductor chip cannot be pressed within a predetermined interval. Therefore, it is possible to maintain the optimum thickness between the semiconductor chips so that the adhesive between the pair of semiconductor chips does not leak out, and even if there is excessive pressing on the semiconductor chip, it is formed at the tip of the protruding electrode. It is possible to avoid leakage of the adhesive. As a result, a short circuit between electrodes provided on the semiconductor chip can be prevented, and a semiconductor device having desired electrical characteristics can be realized.
Further, the distance between the pair of semiconductor chips can be controlled by adjusting the thickness of the interval holding means inserted between the pair of semiconductor chips. As a result, it is possible to realize a stacked semiconductor device corresponding to various purposes (for example, reduction in thickness and size) of the semiconductor package.

It is also preferable that the interval holding means of the semiconductor device mounting apparatus includes a temperature control means for controlling the temperature of the semiconductor chip.
Generally, an adhesive using a solder such as Cu is formed at the tip of the protruding electrode of the semiconductor chip. And heat is conducted in the thickness direction of the semiconductor chip by the heating at the time of mounting. Therefore, before bonding the pair of protruding electrodes, the adhesive at the tip of the protruding electrode and a metal such as Cu of the protruding electrode cause a chemical reaction, and the tip of both protruding electrodes functions as an adhesive. Will disappear. According to the present invention, the interval holding means provided between the pair of semiconductor chips includes the temperature control means. Therefore, in addition to the heat conducted in the thickness direction of the protruding electrode, the heat is also conducted from the length direction of the semiconductor chip to the adhesive, so that the heat can be dispersed and uniformly applied to the adhesive. Therefore, a semiconductor device that maintains the electrical characteristics of the adhesive and the protruding electrode can be realized.

Moreover, it is also preferable that the said space | interval holding means of the mounting apparatus of the said semiconductor device is comprised including a heat conductive metal or ceramics.
According to this configuration, the heat supplied from the temperature control means can be efficiently conducted to the semiconductor chip. Therefore, heat supplied to the tip of the protruding electrode of the semiconductor chip can be distributed and supplied, and a semiconductor device that maintains the electrical characteristics of the adhesive and the protruding electrode can be realized.

It is also preferable that the interval holding means of the semiconductor device mounting apparatus is provided so as to be divided corresponding to the number of sides of the planar shape when the semiconductor chip is viewed in plan view.
According to this configuration, the interval holding means can be inserted into all the sides of the semiconductor chip. As a result, when the pair of semiconductor chips are pressed, since the gap holding means is not inserted, it is possible to prevent leakage of the adhesive due to excessive pressure acting on the other sides.

Further, the interval holding means of the mounting apparatus for a semiconductor device has an opening smaller than the entire shape of the semiconductor chip at a central portion of the interval holding means, and the diagonal line of the semiconductor chip and an extension of the diagonal line It is also preferable that they are provided along the line.
According to this configuration, the interval holding means is divided into two along the diagonal line of the semiconductor chip and the extension line thereof. Therefore, the number of the interval holding means can be reduced as compared with the case where the interval holding means is provided for all the sides of the semiconductor chip. Further, the contact area between the semiconductor chip and the interval holding means at the time of insertion can be reduced.

The present invention is also a semiconductor device mounting apparatus in which at least one or more semiconductor chips are further mounted on the pair of semiconductor chips, wherein the interval holding means is mounted on the pair of semiconductor chips. It is also preferable that the same number is provided.
When a plurality of semiconductor chips are stacked, heat and pressure are performed every time the semiconductor chips are mounted or after the mounting of the plurality of semiconductor chips is completed, in order to ensure the bonding between the semiconductor chips. At this time, when the semiconductor chips are stacked in two or three stages, pressure due to the pressure acts on the space between the semiconductor chips, and adhesive leakage or the like occurs. According to the configuration of the present invention, the interval holding unit is inserted and mounted between the semiconductor chips to be mounted, and the state where the interval holding unit is inserted is maintained after the mounting is completed, and the next semiconductor chip is mounted. can do. Thereby, since everything between semiconductor chips is maintained by the space | interval holding | maintenance means at a fixed space | interval, the leak at the time of a press etc. can be avoided.

The present invention relates to a semiconductor chip mounting method for mounting one semiconductor chip on a semiconductor chip among a pair of semiconductor chips arranged to face each other, wherein the one semiconductor chip and the other semiconductor chip are arranged to face each other. A step of inserting a gap holding means between the one semiconductor chip and the other semiconductor chip, and a step of pressing the one semiconductor chip against the other semiconductor chip. And
According to this method, since the gap holding means is provided which is inserted between the semiconductor chips and held at a predetermined gap, even if the semiconductor chip is pressed too much during mounting, the gap holding between the pair of semiconductor chips is maintained. The means becomes a stopper, and the semiconductor chip cannot be pressed within a predetermined interval. Therefore, it is possible to maintain the optimum thickness between the semiconductor chips so that the adhesive between the pair of semiconductor chips does not leak out, and even if there is excessive pressing on the semiconductor chip, it is formed at the tip of the protruding electrode. It is possible to avoid leakage of the adhesive. As a result, a short circuit between electrodes provided on the semiconductor chip can be prevented, and a semiconductor device having desired electrical characteristics can be realized.
Further, the distance between the pair of semiconductor chips can be controlled by adjusting the thickness of the interval holding means inserted between the pair of semiconductor chips. As a result, it is possible to realize a stacked semiconductor device corresponding to various purposes (for example, reduction in thickness and size) of the semiconductor package.

In the semiconductor device mounting method, it is also preferable to insert the gap holding means up to a region between the outer peripheral portion of the pair of semiconductor chips and the electrode.
According to this configuration, the interval holding means can be inserted between the pair of semiconductor chips without affecting the protruding electrodes formed on the peripheral edge of the semiconductor chip. As an influence, for example, when the interval holding means comes into contact with the protruding electrode, the adhesive formed at the tip of the protruding electrode adheres to the interval holding means, reducing the amount of adhesive, and the semiconductor chip and the protruding electrode. This is a case where the adhesive strength is weakened.

The present invention is also a mounting method of a semiconductor device in which at least one or more semiconductor chips are further mounted on the pair of semiconductor chips, wherein the interval holding means is mounted on the pair of semiconductor chips. It is also preferable to insert everything in between.
When a plurality of semiconductor chips are stacked, heat and pressure are performed every time the semiconductor chips are mounted or after the mounting of the plurality of semiconductor chips is completed, in order to ensure the bonding between the semiconductor chips. At this time, when the semiconductor chips are stacked in two or three stages, pressure due to the pressure acts on the space between the semiconductor chips, and adhesive leakage or the like occurs. According to the configuration of the present invention, the interval holding unit is inserted and mounted between the semiconductor chips to be mounted, and the state where the interval holding unit is inserted is maintained after the mounting is completed, and the next semiconductor chip is mounted. can do. Thereby, since everything between semiconductor chips is maintained by the space | interval holding | maintenance means at a fixed space | interval, the leak at the time of a press etc. can be avoided.

The present invention is a semiconductor device mounted by the above semiconductor device mounting method. Moreover, this invention is an electronic device provided with the said semiconductor device.
According to the present invention, it is possible to manufacture a semiconductor device and an electronic device with high yield and high productivity by preventing leakage of the adhesive of the semiconductor chip.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, an embodiment of the invention will be described with reference to the drawings. In addition, embodiment described below shows the one part aspect of this invention, and does not limit this invention. In each drawing used for the following description, the scale is appropriately changed for each layer and each member so that each layer and each member can be recognized on the drawing. Further, the XYZ orthogonal coordinate system shown in FIG. 1 is set so that the X coordinate and the Y coordinate are parallel to the paper surface, and the Z axis is set to a direction perpendicular to the paper surface. Further, the number of through-electrodes 12 of the semiconductor chip shown in FIG. 1 and the like and FIG. 2 (c) are shown differently for easy understanding of the invention.

[First Embodiment]
(Semiconductor mounting equipment)
FIG. 1 is a diagram schematically showing an external configuration of a semiconductor device mounting apparatus (hereinafter referred to as a semiconductor mounting apparatus) in the present embodiment. 2A and 2B are top views of the spacer mechanism in the present embodiment. FIG. 2C is a diagram schematically showing the mounting surface of the semiconductor chip.
As shown in FIG. 1, the semiconductor mounting apparatus 50 has an upper pressure plate 14 (pressing means), a lower pressure plate 16 (pressing means) disposed opposite to the upper pressure plate 14, and a semiconductor chip at a predetermined interval. Holding spacer mechanism.

  The upper pressure plate 14 is formed in a substantially rectangular parallelepiped shape, and includes a suction tool (holding means) for sucking and holding the semiconductor chip 30 to be mounted, and a heating mechanism (not shown) such as a heater for heating the semiconductor chip 30 sucked and held by the suction tool. ).

The suction tool includes a plurality of openings that are opened in a circular shape on the lower surface of the upper pressure plate 14 and through holes that penetrate the inside of the upper pressure plate 14 from the openings. A vacuum pump (not shown) and the opening communicate with each other through the through-hole, and by driving the vacuum pump, the inside of the through-hole is evacuated and the semiconductor chip 30 can be vacuum-sucked. Yes. Here, the nozzle opening part which comprises an adsorption | suction tool is formed in the diameter of about 6.5 mm.
The heater which comprises a heating mechanism is provided in the inside of the upper pressurizing plate 14, and arbitrary temperature settings are possible in the temperature range of about 200-450 degreeC. In the present embodiment, the suction tool is raised to around 260 ° C. by the heater.

The upper pressure plate 14 is connected to a vertical movement mechanism (not shown), and can move up and down in the Z-axis direction by driving the vertical movement mechanism.
Further, the vertical movement mechanism is connected to an XY movement mechanism (not shown), and can be moved in the X-axis direction and the Y-axis direction by driving the XY movement mechanism. Accordingly, the upper pressure plate 14 connected to the vertical movement mechanism can be moved in the X-axis direction and the Y-axis direction in accordance with the movement of the XY movement mechanism. Thus, the upper pressure plate 14 is constructed to be movable in the XYZ axial directions.

  The lower pressure plate 16 is installed facing the upper pressure plate 14 and is formed in a substantially rectangular parallelepiped shape. Similarly to the upper pressure plate 14, the lower pressure plate 16 includes a suction tool that sucks and holds the semiconductor chip 30 to be mounted, and a heating mechanism such as a heater that heats the semiconductor chip 30 sucked and held by the suction tool. Yes.

The suction tool is composed of a plurality of openings opened in a circular shape on the upper surface of the lower pressure plate 16 and through holes penetrating the inside of the upper pressure plate 14 from the openings. The pressure reducing pump (not shown) and the opening are communicated with each other through the through hole. By driving the pressure reducing pump, the inside of the through hole is evacuated and the semiconductor chip 30 can be vacuum-sucked. Yes. The nozzle opening constituting the suction tool has a diameter of about 6.5 μm.
The heater which comprises a heating mechanism is provided in the inside of the upper pressurizing plate 14, and arbitrary temperature settings are possible in the temperature range of about 200-450 degreeC. In the present embodiment, the suction tool is raised to around 260 ° C. by the heater. Thus, the pair of semiconductor chips sandwiched between the upper pressure plate 14 and the lower pressure plate 16 can be heated from both (up and down) directions.

Next, the spacer mechanism will be described in detail with reference to FIGS. 1 and 2A to 2C.
As shown in FIGS. 1 and 2A, the spacer mechanism is installed adjacent to the lower pressure plate 16 formed in a substantially rectangular parallelepiped shape. Specifically, the spacer mechanism is provided corresponding to the number of sides of the planar shape of the semiconductor chip placed on the lower pressure plate 16. Therefore, in this embodiment, since the semiconductor chip is formed in a rectangular shape having four sides, the four spacer mechanisms are disposed in parallel to the planar side of the semiconductor chip so as to surround the semiconductor chips 30 and 40. ing.

The spacer mechanism includes a base 26, a spacer support base 34, a spacer drive motor 24 installed on the spacer support base 34, a ball screw 28, and a spacer 22 (interval holding means).
A spacer support base 34 having the same shape as the base 26 is placed on the base 26. A vertical movement mechanism 42 is erected and attached to the rear side surfaces of the base 26 and the spacer support base 34. By driving the vertical movement mechanism 42, the spacer support base 34 can be moved up and down in the Z-axis direction. It has become.
A spacer drive motor 24 is installed behind the spacer support 34. A spacer 22 is installed in front of the spacer drive motor 24 via a ball screw 28.

The spacer 22 is made of a heat conductive metal or ceramic or a material containing these. Examples of the thermally conductive metal include metals such as Au, Ag, and Cu.
Each of the spacers 22 is formed in a trapezoidal shape as shown in FIG. 2A, and one side of the insertion side provided in parallel with the trapezoidal shape is slightly larger than the side of the planar shape of the semiconductor chip 30. It is short. On the other hand, two opposing sides of the trapezoidal shape that are not parallel are tapered toward the insertion side. In this way, by setting one side of the insertion side of the spacer 22 to be shorter than the side corresponding to the region into which the semiconductor chip is inserted, when four spacers are simultaneously inserted into the insertion region 32 of the semiconductor chip 30, the adjacent spacers The insertion region 32 can be inserted without contacting the 22. Further, by forming the two opposite sides of the spacer 22 that are not parallel to each other in a tapered shape, the contact area between the spacer 22 and the insertion region 32 can be increased compared to the case where the spacers 22 are formed in parallel. Yes.

Next, the operation of the spacer mechanism will be described.
First, the spacer drive motor 24 installed on the spacer support base of the spacer mechanism is driven, and the ball screw 28 connected to the spacer drive motor is extended. As a result, the spacer 22 connected to the tip of the ball screw 28 can move in the Y-axis direction. Specifically, as shown in FIGS. 2B and 2C, the spacer can move to the insertion region 32 between the through electrode 36 provided on the semiconductor chip 30 and the outer periphery of the semiconductor chip 30. As a result, the first semiconductor chip 30 and the semiconductor chip 40 to be mounted can be maintained at a predetermined interval. At this time, it is preferable that the spacer 22 to be inserted is inserted up to a region that is not in direct contact with the through electrode 36 of the semiconductor chip 30. In addition, a heater is provided in the spacer support base, and at the stage where the spacer is inserted into the insertion region 32 between the semiconductor chips 30 and 40, the tip of the through electrode 12 of the semiconductor chip 30 extends from the tip of the spacer 22. Heat is conducted to lead-free solder 5 (adhesive) formed on the part. Accordingly, the adhesive 5 can be melted not only by heat conduction in the Z-axis direction by the heaters of the upper pressure plate 14 and the lower pressure plate 16 but also by heat conduction from the Y-axis direction by the heater 46 of the spacer 22. It has become.
On the other hand, the spacer can be moved in the Y-axis direction by reversing the spacer drive motor and extending and retracting the ball screw 28. As a result, the spacer 22 inserted between the semiconductor chips 30 and 40 can be stored in the spacer support base 34.

Thus, when the mounting of the first-stage semiconductor chip is completed, the process proceeds to the mounting process of the second-stage semiconductor chip. First, by driving the vertical movement mechanism 42 erected on the rear side surface of the spacer mechanism, the spacer support 34 attached to the vertical movement mechanism 42 is raised in the Z-axis direction. Specifically, the spacer 22 is moved to a height at which the mounting surface 30a (see FIG. 4A) of the first-stage semiconductor chip 30 already mounted and the lower surface of the spacer 22 to be inserted are substantially the same. Raise. As a result, even when the semiconductor chip is mounted in the second axis, the third stage, etc. in the Z-axis direction, the spacer 22 can be inserted in accordance with the height of the semiconductor chip to be mounted. Subsequently, the spacer 22 is inserted between the second-stage semiconductor chips by the same operation as that of the spacer 22 when the first-stage semiconductor chip is mounted.
When the spacer mechanism repeats such an operation, the spacer mechanism can be mounted in a state where the distance from the semiconductor chip mounted in the third stage, the fourth stage,.

As described above, in this embodiment, the spacer 22 inserted between the pair of semiconductor chips 30 and 40 has a predetermined thickness. The thickness of the spacer 22 is set on the basis of the opposing penetration electrode 12 between the pair of semiconductor chips 30 and 40 and the thickness of the lead-free solder 5 formed at the tip of the penetration electrode 12 when mounted. That is, the lead-free solder 5 has a thickness that does not leak even when the semiconductor chip 30 is excessively pressed during mounting. According to the present embodiment, even when the semiconductor chip 30 is pressed too much during mounting, the spacer 22 inserted between the pair of semiconductor chips 30 and 40 serves as a stopper, and the semiconductor chip 30 is pressed below the thickness of the spacer 22. I can't. Therefore, the optimal thickness between the semiconductor chips 30 and 40 where the lead-free solder 5 between the pair of semiconductor chips 30 and 40 does not leak can be maintained, and even if there is excessive pressing on the semiconductor chip 30, the penetration Leakage of the lead-free solder 5 formed at the tip of the electrode 12 can be avoided. As a result, a short circuit between the through electrodes 12 provided in the semiconductor chip 30 can be prevented, and a semiconductor device having desired electrical characteristics can be realized.
Further, the distance between the pair of semiconductor chips 30 and 40 can be controlled by adjusting the thickness of the spacer 22 inserted between the pair of semiconductor chips 30 and 40. As a result, it is possible to realize a stacked semiconductor device corresponding to various purposes (for example, reduction in thickness and size) of the semiconductor package.

(Semiconductor device mounting method)
A method for mounting the semiconductor device of this embodiment will be described below with reference to FIGS.
3 and 4, the interposer 1 is disposed on the lower pressure plate 16 and the semiconductor chip 40 is mounted on the interposer 1, but the formation process is omitted. In the present embodiment, the spacers 22 are inserted into the pair of semiconductor chips 30 and 40 from four directions. Since the four spacers 22 operate in the same manner, one spacer is used in the following description. The operation of only 22 is described.

  First, the upper pressure plate 14 is moved to the semiconductor chip supply unit provided in the semiconductor mounting apparatus 50 by the XY movement mechanism, and the plurality of semiconductor chips 30 mounted on the semiconductor chip supply unit are adsorbed by the adsorption tool. Hold (not shown). Then, as shown in FIG. 3A, the upper pressure plate 14 is moved to the mounting position in a state where the semiconductor chip 30 is sucked and held to perform alignment. Here, the mounting position is a position in which each of the through electrodes 12 of the semiconductor chip 40 held by suction is associated with each of the through electrodes 12 of the semiconductor chip 40 mounted on the interposer 1 substrate.

Next, the spacer 22 is moved to the insertion region 32 on the semiconductor chip 40 by driving the spacer driving motor 24 as shown in FIG. At this time, the spacer 22 is inserted up to the insertion region 32 so as not to contact the through electrode 12 formed in the semiconductor chip 40. In addition, the spacer 22 corresponding to the side where the through electrode 12 of the semiconductor chip 30 is not formed can be inserted to the center of the semiconductor chip 30 beyond the insertion region 32. The spacer 22 is inserted into the planar sides of the semiconductor chips 30 and 40 from the substantially vertical direction, and further inserted so as to be horizontal to the plane of the semiconductor chips 30 and 40. It is preferable to do.
Next, as shown in FIG. 3B, the upper pressure plate 14 set at the mounting position is lowered toward the semiconductor chip 40 placed on the lower pressure plate 16 by driving the vertical movement mechanism.

  Next, as shown in FIG. 3C, lead-free solder 5 formed at the tip of the through electrode 12 of the semiconductor chip 30 is replaced with the corresponding through electrode of the semiconductor chip 40 placed on the lower pressure plate 16. 12 are brought into contact with each other. Further, the upper pressure plate 14 is further lowered, that is, the semiconductor chip 30 is pressurized in the Z-axis direction, and the lead-free solder 5 formed at the tip of the through electrode 12 of the semiconductor chip 30 and the semiconductor chip 40 penetrate. The electrode 12 is crimped. At this time, the spacer 22 is sandwiched between the semiconductor chip 30 and the semiconductor chip 40 as shown in FIG. In addition, the pressurizing method is a pressurizing method that applies a pressing force in a lump, a pressurizing method that increases the pressing force in stages, a pressurizing method that continuously increases the pressing force, and presses and temporarily holds the pressing force. Then, it is also preferable to pressurize by various pressurizing methods such as S-shaped pressurization for increasing the pressing force.

  Simultaneously with the pressurization, the through electrodes 12 of the semiconductor chips 30 and 40 are heated by the heaters provided in the upper press plate 14 and the lower press plate 16, whereby the lead-free solder 5 formed on the through electrodes 12. Melt. Furthermore, in the present embodiment, the heater 46 is also provided in the spacer mechanism, and the lead-free solder formed on the tip of the through electrode 12 of the semiconductor chip 30 by the spacer 22 when the insertion region 32 of the semiconductor chip 40 is inserted. Heat and melt. In this way, the pair of semiconductor chips 30 and 40 are fixed by the pressurization and heating process.

Next, as shown in FIG. 3D, after a pair of semiconductor chips are pressurized and heated and the mounting is completed, the upper pressure plate 14 first causes the semiconductor chip 30 held by suction to be detached. Then, by driving the vertical movement mechanism, the upper pressure plate 14 is raised, and the semiconductor chip 30 is separated from the upper pressure plate 14.
Subsequently, after the upper pressure plate 14 is lifted, the pressure state of the semiconductor chips 30 and 40 is released, and then the spacer 22 is moved in the Y-axis direction by driving the spacer driving motor 24. That is, the spacer 22 sandwiched between the semiconductor chips 30 and 40 is separated and stored in the spacer mechanism. The timing for retracting the spacer 22 from between the semiconductor chips 30 and 40 to the spacer mechanism may be performed before the upper pressure plate 14 is raised, that is, in a state where the spacer 22 is sandwiched between the semiconductor chips 30 and 40. Is possible.

Next, in order to further stack the semiconductor chip on the semiconductor chip 30, the semiconductor chip is replenished. As shown in FIG. 4A, the semiconductor chip 20 placed on the semiconductor chip supply unit is sucked and held (not shown) by the suction tool of the upper pressure plate 14, and the upper pressure plate 14 is moved to the mounting position. .
Subsequently, the spacer support base 34 is raised to a predetermined height by the vertical movement mechanism 42 provided in the spacer mechanism. Here, the predetermined height is a height that is the same as the mounting surface 30 a of the semiconductor chip 30 stacked on the semiconductor chip 40.
Next, the spacer 22 is moved to the insertion region 32 on the semiconductor chip 30 by driving the spacer driving motor 24 as shown in FIG.

Next, as shown in FIG. 4B, the lower pressure plate 16 is lowered toward the semiconductor chip 30 by driving the upper pressure plate 14 installed at the mounting position by the vertical movement mechanism.
Next, as shown in FIG. 4B, lead-free solder 5 formed at the tip of the through electrode 12 of the semiconductor chip 30 is replaced with the corresponding through electrode of the semiconductor chip 40 placed on the lower pressure plate 16. 12 are brought into contact with each other. Further, the upper pressure plate 14 is further lowered, that is, the semiconductor chip 20 is pressurized in the Z-axis direction, and the lead-free solder 5 formed at the tip of the through electrode 12 of the semiconductor chip 20 and the semiconductor chip 30 penetrate. The electrode 12 is crimped. At this time, the spacer 22 is sandwiched between the semiconductor chip 20 and the semiconductor chip 30 as shown in FIG.
The other steps are the same as the steps described when the semiconductor chip 20 is mounted on the semiconductor chip 30, and thus description thereof is omitted. Thus, by repeating the above steps, a three-dimensionally mounted semiconductor device in which a plurality of semiconductor chips are stacked can be formed.

[Second Embodiment]
Next, the present embodiment will be described with reference to the drawings.
In the first embodiment, the spacer 22 is inserted between the semiconductor chips, and after the heating and pressurization, the spacer 22 is extracted from between the pair of semiconductor chips. The present embodiment is different in that the state in which the spacer 22 is inserted is maintained, a new spacer 22 is continuously supplemented, and the new spacer 22 is inserted between semiconductor chips to be mounted next. In addition, when going through the process similar to the said 1st Embodiment, description of this process is abbreviate | omitted, and attaches | subjects and demonstrates the same code | symbol to a common component.

First, returning to the process of FIGS. 3A to 3C of the first embodiment, the semiconductor chip 30 is mounted on the semiconductor chip 40. Next, after separating the spacer 22 from the ball screw 28 of the spacer mechanism, the semiconductor chip 30 held by suction is detached from the upper pressure plate 14 with the spacer 22 inserted between the semiconductor chips 30 and 40. Then, by driving the vertical movement mechanism, the upper pressure plate 14 is raised and the semiconductor chip 30 is separated from the upper pressure plate 14. Thus, even after the mounting of the semiconductor chip 30 to the semiconductor chip 40 is completed, the spacer 22 is maintained in a state of being sandwiched between the semiconductor chips 30 and 40.
At this time, the spacer 22 mechanism replenishes the spacer 22 in the spacer supply unit mounted on the semiconductor mounting apparatus 50 in order to replenish the separated spacer 22 (not shown).

  Next, as shown in FIG. 5A, the semiconductor chip 20 is sucked and held by the suction tool of the upper pressure plate 14 from the semiconductor chip supply unit by the XY movement mechanism (not shown), and the upper pressure plate is moved to the mounting position. 14 is moved. Subsequently, the spacer support base 34 is raised to a predetermined height by driving the vertical movement mechanism 42 provided in the spacer mechanism. Here, the predetermined height is a height that is the same as the mounting surface 30 a of the semiconductor chip 30 stacked on the semiconductor chip 40.

  Next, the spacer 22 is moved to the insertion region 32 on the semiconductor chip 30 by driving the spacer driving motor 24 as shown in FIG. Next, as shown in FIG. 5B, the upper pressure plate 14 set at the mounting position is lowered toward the semiconductor chip 30 placed on the lower pressure plate 16 by driving the vertical movement mechanism.

  Next, as shown in FIG. 5 (b), lead-free solder 5 formed at the tip of the through electrode 12 of the semiconductor chip 20 is replaced with a corresponding through electrode of the semiconductor chip 30 placed on the lower pressure plate 16. 12 are brought into contact with each other. Then, the upper pressure plate 14 is further lowered, that is, the semiconductor chip 20 is pressed downward, and the lead-free solder 5 formed at the tip of the through electrode 12 of the semiconductor chip 20 and the through electrode of the semiconductor chip 30 12 is crimped. At this time, the spacer 22 is sandwiched between the semiconductor chip 20 and the semiconductor chip 30 as shown in FIG.

  Simultaneously with the pressurization, the through electrodes 12 of the semiconductor chips 30 and 40 are heated by the heaters provided in the upper press plate 14 and the lower press plate 16, whereby lead-free solder formed on the through electrodes 12 is removed. Melt. Further, in the present embodiment, the spacer 46 is also provided with a heater 46, and when the insertion region 32 of the semiconductor chip 30 is inserted, lead-free solder formed on the tip of the through electrode 12 of the semiconductor chip 20 by the spacer 22 is used. Heat and melt. In this manner, the pair of semiconductor chips 20 and 30 are fixed by the pressurization and heating process.

  Next, as shown in FIG. 5B, after separating the spacer 22 from the ball screw 28 of the spacer mechanism, the upper pressure plate 14 is held by suction with the spacer 22 inserted between the semiconductor chips 20 and 30. The semiconductor chip 20 is removed. Then, by driving the vertical movement mechanism, the upper pressure plate 14 is raised from the semiconductor chip 20, and the semiconductor chip 20 is separated from the upper pressure plate 14. Thus, even after the mounting of the semiconductor chip 20 to the semiconductor chip 30 is completed, the spacer 22 is maintained in a state of being sandwiched between the semiconductor chips 20 and 30.

The other steps are the same as the steps described when the semiconductor chip 20 is mounted on the semiconductor chip 30, and thus the description thereof is omitted. Thus, by repeating the above steps, a three-dimensionally mounted semiconductor device in which a plurality of semiconductor chips are stacked can be formed.
According to the present embodiment, the spacer 22 is inserted and mounted between the semiconductor chips to be mounted, and the state where the spacer 22 is inserted is maintained after the mounting is completed, and the next semiconductor chip can be mounted. . Thereby, since everything between the semiconductor chips is maintained at a constant interval by the spacer 22, leakage during pressing can be avoided.

[Semiconductor device]
FIG. 6 is a schematic cross-sectional view showing the semiconductor device in the present embodiment.
The semiconductor device 60 includes an interposer 1 and a plurality of semiconductor chips 40, 30, 20, 10 stacked on the interposer 1.
The semiconductor chips 40, 30, 20, 10 have a semiconductor chip body 11 and a plurality of through electrodes 12 formed in the semiconductor chip body 11. Each of the plurality of through-electrodes 12 is formed so as to penetrate the semiconductor chip body 11 and project the tip portion toward the active surface 18 side of the semiconductor chips 40, 30, 20, 10. A lead-free solder 5 (adhesive) is formed at the tip of the through electrode 12 formed to protrude toward the active surface 18 side.
Each of the through electrodes 12 of the semiconductor chips 40, 30, 20, 10 with the active surface 18 side of each of the semiconductor chips 40, 30, 20, 10 having such a structure down, with the lead-free solder 5 interposed therebetween. Is electrically connected.
In the above-described semiconductor device 60, the form in which the semiconductor chips are stacked in four layers has been described. However, this stack may have any number of layers.

[Electronics]
Next, an example of an electronic device including the semiconductor device 60 described above will be described with reference to FIGS. FIG. 7 is a perspective view of the mobile phone 2000. The semiconductor device 60 described above includes an operation unit 2001 and a display unit 2002, and a circuit board 2100 is disposed inside the display unit 2002. The liquid crystal device 100 is mounted on the circuit board 2100. The liquid crystal panel 110 is visible on the surface of the display unit 2002.

  Note that the semiconductor device 60 described above can be applied to various electronic devices other than the mobile phone 2000. For example, a liquid crystal projector, a multimedia-compatible personal computer (PC) and an engineering workstation (EWS), a pager, a word processor, a television, a viewfinder type or a monitor direct view type video recorder, an electronic notebook, an electronic desk calculator, a car navigation device It can be applied to electronic devices such as a POS terminal and a device provided with a touch panel.

It should be noted that the technical scope of the present invention is not limited to the above-described embodiments, and includes those in which various modifications are made to the above-described embodiments without departing from the spirit of the present invention.
For example, as shown in FIG. 8, the spacer 22 is formed in a rectangular shape, an opening smaller than the entire shape of the semiconductor chip 30 is provided in the center, and the spacer 22 is divided into two along the extension including the diagonal line of the semiconductor chip 30. It is also preferable to divide and form.
In the above embodiment, each time a semiconductor chip is mounted, heating and pressurization are performed to mount the semiconductor chip. However, after mounting all the semiconductor chips, heating and pressurization are performed collectively. Is also preferable. According to this, since heating and pressurization are performed collectively, the manufacturing process can be simplified and the manufacturing cost can be reduced.
Further, in the above embodiment, spacers are provided corresponding to each side of the semiconductor chip, and the semiconductor chips are held at a predetermined interval. However, by using at least one spacer, the interval between the semiconductor chips is reduced. It is also possible to keep it constant. When a plurality of spacers are provided, it is also preferable that the spacers are inserted between the semiconductor chips with different timings.
In this embodiment, lead-free solder is used as the conductive adhesive, but various adhesives such as a resin-based anisotropic conductive film can be used.
Furthermore, in the present embodiment, the case where the through electrode of the semiconductor chip is a peripheral type has been described, but it is needless to say that the present invention can also be applied to a full grid type.

It is a figure which shows typically the external appearance structure of the mounting apparatus of the semiconductor device which concerns on this invention. It is the figure which showed the spacer mechanism from the upper surface similarly. It is a figure which shows the mounting method of the semiconductor device in 1st Embodiment. It is a figure which shows the mounting method of the semiconductor device in 1st Embodiment. It is a figure which shows the mounting method of the semiconductor device in 2nd Embodiment. It is a figure which shows typically the external appearance structure of the semiconductor device which concerns on this invention. It is a figure which shows an example of the electronic device which concerns on this invention. It is the figure which showed the spacer mechanism from the upper surface.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10, 20, 30, 40 ... Semiconductor chip, 12 ... Through-electrode (electrode), 14 ... Upper pressurization plate (pressing means), 16 ... Lower pressurization plate (pressing means), 22 ... Spacer (space | interval holding means), 32 ... Insertion region, 50 ... Semiconductor device mounting device, 60 ... Semiconductor device

Claims (11)

A mounting device for a semiconductor device that mounts one semiconductor chip on the other semiconductor chip among a pair of semiconductor chips arranged with electrodes facing each other,
A pair of pressing means for pressing the pair of semiconductor chips by relatively moving up and down with the pair of semiconductor chips interposed therebetween;
Holding means for holding the semiconductor chip provided in at least one of the pair of pressing means;
An interval holding means that is inserted between the pair of semiconductor chips and holds at a predetermined interval when the pair of semiconductor chips are pressed;
An apparatus for mounting a semiconductor device, comprising: The semiconductor device mounting apparatus according to claim 1, wherein the interval holding unit includes a temperature control unit that controls a temperature of the semiconductor chip. 3. The semiconductor device mounting apparatus according to claim 1, wherein the gap holding unit includes a heat conductive metal or a ceramic. 4. 4. The semiconductor device mounting apparatus according to claim 1, wherein the interval holding unit is divided and provided corresponding to the number of sides constituting the semiconductor chip. 5. The interval holding means has an opening smaller than the entire shape of the semiconductor chip at the center of the interval holding means, and is provided by being divided along the diagonal of the semiconductor chip and the extension of the diagonal. The semiconductor device mounting apparatus according to claim 1, wherein the mounting apparatus is a semiconductor device mounting apparatus. A mounting device for a semiconductor device, wherein at least one semiconductor chip is further mounted on the pair of semiconductor chips,
6. The semiconductor device mounting apparatus according to claim 1, wherein the space holding means is provided by the number of the semiconductor chips mounted on the pair of semiconductor chips. 7. A semiconductor chip mounting method for mounting one semiconductor chip on the other semiconductor chip among a pair of semiconductor chips arranged with electrodes facing each other,
Placing the one semiconductor chip and the other semiconductor chip opposite to each other;
Inserting a gap holding means between the one semiconductor chip and the other semiconductor chip;
Pressing the one semiconductor chip against the other semiconductor chip;
A method for mounting a semiconductor device, comprising: 8. The method of mounting a semiconductor device according to claim 7, wherein the gap holding means is inserted up to a region between an outer peripheral portion of the pair of semiconductor chips and the electrode. A method of mounting a semiconductor device, wherein at least one semiconductor chip is further mounted on the pair of semiconductor chips,
8. The method of mounting a semiconductor device according to claim 7, wherein the gap holding means is inserted between all the semiconductor chips mounted on the pair of semiconductor chips. A semiconductor device mounted by the semiconductor device mounting method according to claim 7.   An electronic apparatus comprising the semiconductor device according to claim 10.

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