JP2006049185A - Flat cable and its manufacturing method - Google Patents

Flat cable and its manufacturing method Download PDF

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JP2006049185A
JP2006049185A JP2004230646A JP2004230646A JP2006049185A JP 2006049185 A JP2006049185 A JP 2006049185A JP 2004230646 A JP2004230646 A JP 2004230646A JP 2004230646 A JP2004230646 A JP 2004230646A JP 2006049185 A JP2006049185 A JP 2006049185A
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plating
flat
copper conductor
insulating film
connection terminal
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JP4207862B2 (en
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Toshinori Yoshiba
利紀 吉羽
Keiichi Tanaka
啓一 田中
Takehiro Hosokawa
武広 細川
Satoshi Yadoshima
悟志 宿島
Takayoshi Koinuma
孝佳 鯉沼
Masaru Yanagida
賢 柳田
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Sumitomo Electric Industries Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a flat cable with high reliability in which the conductor portion of the cable has flexibility and is prevented from the occurrence of migration and the conductor portion of a connecting terminal is applied with gold plating effectively, and its manufacturing method. <P>SOLUTION: This flat cable has plurality of flat copper conductors 7 applied with tin plating 7b arranged in parallel and covered with an insulating film 8, and a connecting terminal 3 for being connected to an electric connector 6 formed at least at one end. The flat copper conductor 7 of the connecting terminal 3 to become a contact conductor 4 is removed in tin plating 7b and gold plating is applied to the portion removed of tin plating by nickel plating. Furthermore, the connecting terminal 3 is exposed from the insulating film 8 on both sides of the flat copper conductor 7 and reinforced by jointing a reinforcement plate 5 on one side, or exposed from the insulating film 8 on one side of the flat copper conductor 7 and reinforced by jointing the reinforcement plate 5 on the insulating film face on the side not exposed in the flat copper conductor 7. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、複数本の平型銅導体を平行に並べて絶縁フィルムで被覆し、少なくとも一方の端部に接続端末部を形成したフラットケーブルとその製造方法に関する。   The present invention relates to a flat cable in which a plurality of flat copper conductors are arranged in parallel and covered with an insulating film, and a connection terminal portion is formed on at least one end, and a method for manufacturing the same.

通信機器、電子機器の小型化、軽量化に伴い、これらに搭載される電子部品や配線部品等の小型化が進んでいる。特に電気配線のための配線部材には、限られたスペース内で高密度化、高信頼性化の実装が求められている。このような配線部材として、複数本の平型銅導体を平行に並べて絶縁フィルムで被覆し、両端に電気接続用の接続端末部を形成した可撓性のフラットケーブルがある。   As communication devices and electronic devices become smaller and lighter, electronic components and wiring components mounted on these devices are becoming smaller. In particular, wiring members for electrical wiring are required to be mounted with high density and high reliability within a limited space. As such a wiring member, there is a flexible flat cable in which a plurality of flat copper conductors are arranged in parallel and covered with an insulating film, and connection terminal portions for electrical connection are formed at both ends.

この種のフラットケーブルは、可撓性と導電性に優れた平型銅導体が用いられるが、裸銅のままで使用すると、高温、多湿下においてマイグレーションが発生しやすく、隣接する導体間の絶縁抵抗を低下させ、電気的短絡を起こしやすい。また、裸銅は酸化しやすく、絶縁フィルムで被覆する前に平型銅導体が酸化していると、絶縁フィルムとの接着性が低下する。このような不具合を解消し、併せて耐腐食性、半田付け性を高めるために、平型銅導体表面に錫メッキを施したものが用いられている(例えば、特許文献1参照)。   This type of flat cable uses flat copper conductors with excellent flexibility and conductivity, but when used with bare copper, migration tends to occur at high temperatures and high humidity, and insulation between adjacent conductors Reduces resistance and easily causes electrical short circuit. Bare copper is easily oxidized, and if the flat copper conductor is oxidized before being covered with the insulating film, the adhesiveness with the insulating film is lowered. In order to eliminate such problems and improve corrosion resistance and solderability, a flat copper conductor surface with tin plating is used (for example, see Patent Document 1).

しかし、錫メッキは、通常、電気メッキにより形成されるが、この電気錫メッキの表面に針状結晶体(以下、ホイスカという)が発生することが知られている。これは、銅系の金属材料に錫メッキを施すと、銅原子が錫メッキ膜中に拡散して、銅−錫金属間化合物を作る。この金属間化合物は、錫と結晶構造が異なり格子間隔に歪みができるため、錫メッキ膜中に圧縮応力が生じる。この圧縮応力がホイスカ成長の駆動力となるので、銅系材料上に錫メッキを施した場合は、ホイスカが発生しやすいとも言われている。   However, although tin plating is usually formed by electroplating, it is known that acicular crystals (hereinafter referred to as whiskers) are generated on the surface of this electrotin plating. This is because, when tin plating is applied to a copper-based metal material, copper atoms diffuse into the tin plating film to form a copper-tin intermetallic compound. Since this intermetallic compound has a crystal structure different from that of tin and can be distorted in the lattice spacing, compressive stress is generated in the tin plating film. Since this compressive stress is a driving force for whisker growth, it is said that whisker is likely to occur when tin plating is applied to a copper-based material.

錫メッキに鉛を添加することでホイスカ発生を抑制することはよく知られているが、鉛化合物には毒性があるため、環境対策の問題から好ましくなく、最近は、鉛を添加しない鉛フリーの配線部材が要望されている。電気接続部分に鉛フリーの錫メッキを施し、錫メッキを熱処理することにより、ある程度はホイスカの発生を抑制することが可能である(例えば、特許文献2参照)。しかし、挿抜タイプの電気コネクタとの接続に用いると、接点部分でホイスカが発生しやすくなって、電極間短絡が生じている。これは、電気コネクタの接触片によって錫メッキの表面に外部応力を受けることに起因するものと思われる。   Although it is well known that whisker generation is suppressed by adding lead to tin plating, lead compounds are toxic and are not preferable due to environmental problems. A wiring member is desired. It is possible to suppress the generation of whiskers to some extent by performing lead-free tin plating on the electrical connection portion and heat-treating the tin plating (see, for example, Patent Document 2). However, when used for connection with an insertion / extraction type electrical connector, whiskers are likely to occur at the contact portion, causing a short circuit between the electrodes. This is considered to be caused by the external stress applied to the surface of the tin plating by the contact piece of the electrical connector.

また、平型銅導体を用いたフラットケーブルで、錫メッキに代えてニッケルメッキを施し、その上から接続端末部のみに金メッキを施し、高信頼性を高めることが知られている(例えば、特許文献3参照)。平型銅導体全体にニッケルメッキを施す理由として、銅導体や錫メッキ銅導体上に直接金メッキすると長期の使用に耐えられず、また、錫メッキの上からニッケルメッキを施し、次いで金メッキすると工程が煩雑で実用的でないとされている。
特開平7−99012号公報 特開2001−73186号公報 特開平8−293214号公報
Further, it is known that a flat cable using a flat copper conductor is subjected to nickel plating instead of tin plating, and gold plating is applied only to the connection terminal portion from the top to improve high reliability (for example, patents) Reference 3). The reason why nickel plating is applied to the entire flat copper conductor is that the gold plating directly on the copper conductor or tin plating copper conductor cannot withstand long-term use. It is complicated and impractical.
Japanese Unexamined Patent Publication No. 7-99012 JP 2001-73186 A JP-A-8-293214

特許文献3に開示のように、銅導体の全体にニッケルメッキを施すと、ニッケルは銅に比べて硬く、このためフラットケーブルとしての柔軟性が減じられ、ケーブル特性が低下する。また、ニッケルメッキは、絶縁体や被覆テープとの接着性が悪く平型銅導体との接着力が低下し、さらに、ニッケルは酸化しやすくメッキ表面に酸化膜が生じると金メッキがしにくくなるという問題がある。この点から、フラットケーブルとしては、錫メッキした平型銅導体を用いる方が適しているが、接続端末部でのホイスカ発生の問題と高信頼性の点から、少なくとも接続端末部は、金メッキが施されていることが要望される。   As disclosed in Patent Document 3, when nickel plating is applied to the entire copper conductor, nickel is harder than copper, so that flexibility as a flat cable is reduced and cable characteristics are deteriorated. Nickel plating also has poor adhesion to insulators and covering tapes, resulting in poor adhesion to flat copper conductors. Furthermore, nickel is easily oxidized and an oxide film is formed on the plating surface, making gold plating difficult. There's a problem. From this point, it is more suitable to use a tin-plated flat copper conductor as a flat cable, but from the point of whisker generation at the connection terminal part and high reliability, at least the connection terminal part is gold-plated. It is requested that it is given.

しかし、錫メッキした平型銅導体に対して直接に金メッキを施すと、金メッキと錫メッキとの異種金属接触による電食が生じる。そこで、金メッキの下地金属として通常用いられているニッケルメッキを介して金メッキを行なうことが考えられるが、錫メッキ上にニッケルメッキを施すと、メッキ層間に割れが発生するという問題がある。
本発明は、上述した実情に鑑みてなされたもので、ケーブル部の導体部分は柔軟性を有しマイグレーション発生がないようにするとともに、接続端末部の導体部分は金メッキが効果的に施された高信頼性のあるフラットケーブルとその製造方法の提供を課題とする。
However, when gold plating is applied directly to a tin-plated flat copper conductor, electrolytic corrosion due to contact between different metals of gold plating and tin plating occurs. Therefore, it is conceivable to perform gold plating through nickel plating that is usually used as a base metal for gold plating. However, when nickel plating is applied on tin plating, there is a problem that cracks occur between the plating layers.
The present invention has been made in view of the above-described circumstances. The conductor portion of the cable portion is flexible so that no migration occurs, and the conductor portion of the connection terminal portion is effectively plated with gold. It is an object to provide a highly reliable flat cable and a manufacturing method thereof.

本発明によるフラットケーブルは、錫メッキが施された複数本の平型銅導体を平行に並べて絶縁フィルムで被覆し、少なくとも一方の端部に電気コネクタと接続する接続端末部を形成したフラットケーブルである。接続端末部の接点導体とされる平型銅導体部分は、錫メッキが除去され、この錫メッキが除去された部分にニッケルメッキを介して金メッキが施される。また、接続端末部は、絶縁フィルムから平型銅導体の両面が露出され、片面側を補強プレートに接合して補強するか、又は、絶縁フィルムから平型銅導体の片面が露出され、平型銅導体の露出されていない側の絶縁フィルム面に補強プレートを接合して補強する。   A flat cable according to the present invention is a flat cable in which a plurality of flat copper conductors plated with tin are arranged in parallel and covered with an insulating film, and a connection terminal portion connected to an electrical connector is formed on at least one end portion. is there. The flat copper conductor portion used as the contact conductor of the connection terminal portion is removed from the tin plating, and the portion from which the tin plating is removed is subjected to gold plating via nickel plating. Further, the connection terminal portion is reinforced by exposing both sides of the flat copper conductor from the insulating film and joining one side to the reinforcing plate, or by exposing one side of the flat copper conductor from the insulating film. A reinforcing plate is joined to the insulating film surface of the copper conductor that is not exposed to reinforce.

また、本発明によるフラットケーブルの製造方法は、錫メッキが施された複数本の平型銅導体を平行に並べて絶縁フィルムで被覆し、少なくとも一方の端部に電気コネクタと接続する接続端末部を形成するフラットケーブルの製造方法である。接続端末部の接点導体とされる平型銅導体部分の錫メッキを除去し、錫メッキが除去された部分にニッケルメッキを施し、このニッケルメッキに引続いて金メッキを行なう。なお、金メッキの際のメッキ浴は、pHを9以下とする。   The flat cable manufacturing method according to the present invention includes a plurality of tin-plated flat copper conductors arranged in parallel and covered with an insulating film, and at least one end thereof has a connection terminal portion connected to an electrical connector. It is a manufacturing method of the flat cable to form. The tin plating of the flat copper conductor portion, which is the contact conductor of the connection terminal portion, is removed, nickel plating is applied to the portion from which the tin plating has been removed, and gold plating is subsequently performed. The plating bath used for gold plating has a pH of 9 or less.

本発明によれば、従来の錫メッキ平型銅導体をそのまま用いるので、マイグレーションによる導体間短絡は発生せず、フラットケーブルの可撓性及び絶縁テープとの接着力を従来通りに確保できる。接続端末部の接点導体となる部分は、錫メッキが除去された銅導体の表面に、金メッキの下地としてのニッケルメッキが施されるので、錫メッキとニッケルメッキ間での割れが発生せず、良好な状態で金メッキされた接続端末部とすることができる。この結果、挿抜型コネクタとの接続でホイスカの発生がなく、電気的にも長期信頼性に優れたものとすることができる。   According to the present invention, since the conventional tin-plated flat copper conductor is used as it is, no short circuit between the conductors due to migration occurs, and the flexibility of the flat cable and the adhesive force with the insulating tape can be ensured as usual. Since the nickel plating as the base of the gold plating is applied to the surface of the copper conductor from which the tin plating is removed, the portion that becomes the contact conductor of the connection terminal portion does not cause a crack between the tin plating and the nickel plating, It can be set as the connection terminal part gold-plated in a favorable state. As a result, whisker is not generated in connection with the insertion / extraction type connector, and it can be electrically excellent in long-term reliability.

図により本発明の実施形態を説明する。図1(A)は本発明によるフラットケーブルの概略を説明する図、図1(B)はケーブル部のa−a部断面を示す図、図1(C)は接続端末部のb部断面を示す図である。図中、1はフラットケーブル、2はケーブル部、3は接続端末部、4は接点導体、5は補強プレート、6は電気コネクタ、6aはコネクタ接触片、7は平型銅導体、7aは銅導体、7bは錫メッキ、8は絶縁フィルム、8aはフィルム材、8bは接着剤層を示す。   An embodiment of the present invention will be described with reference to the drawings. FIG. 1 (A) is a diagram for explaining the outline of a flat cable according to the present invention, FIG. 1 (B) is a diagram showing a cross section of the cable part aa, and FIG. 1 (C) is a cross section of part b of the connection terminal part. FIG. In the figure, 1 is a flat cable, 2 is a cable part, 3 is a connection terminal part, 4 is a contact conductor, 5 is a reinforcing plate, 6 is an electrical connector, 6a is a connector contact piece, 7 is a flat copper conductor, and 7a is copper. Conductor, 7b is tin-plated, 8 is an insulating film, 8a is a film material, and 8b is an adhesive layer.

本発明によるフラットケーブル1は、図1(A)に示すように、複数本の平型銅導体を平行に並べて絶縁フィルムで被覆したケーブル部2の両端に、挿抜型の電気コネクタ6等に着脱可能に接続される接続端末部3を備えている。接続端末部3は、ケーブル端部から露出された平型銅導体部分を金メッキ処理して接点導体4とされ、反対側に補強プレート5を接合して構成される。   As shown in FIG. 1A, a flat cable 1 according to the present invention is attached to and detached from a pluggable electrical connector 6 or the like at both ends of a cable portion 2 in which a plurality of flat copper conductors are arranged in parallel and covered with an insulating film. A connection terminal unit 3 that can be connected is provided. The connection terminal portion 3 is formed by gold plating the flat copper conductor portion exposed from the cable end portion to form a contact conductor 4, and a reinforcing plate 5 is joined to the opposite side.

ケーブル部2は、図1(B)に示すように、断面が扁平状の銅導体7aの表面に錫メッキ7bを施してなる平型銅導体7を平行一列に並べ配列し、両面から絶縁フィルム8で挟んで接着一体化して構成される。以下、銅導体7aに錫メッキ7bが施された状態のものを平型銅導体7という。この平型銅導体7は、例えば、丸導体に電気メッキによる錫メッキを施した後、これを延伸、圧延して平型形状としたものを用いることができる。   As shown in FIG. 1 (B), the cable portion 2 is formed by arranging flat copper conductors 7 formed by applying tin plating 7b on the surface of a copper conductor 7a having a flat cross section in a parallel row, and insulating film from both sides. 8 is formed by being bonded and integrated. Hereinafter, the state in which the tin plating 7b is applied to the copper conductor 7a is referred to as a flat copper conductor 7. As the flat copper conductor 7, for example, a round conductor is subjected to tin plating by electroplating, and then stretched and rolled to form a flat shape.

絶縁フィルム8は、平型銅導体7を両面から挟み、接着剤層8bを互いに圧接又は溶融して接着一体化して、高密度に配列された平型銅導体7間を電気的に絶縁する。この絶縁フィルム8は、例えば、ポリエステル樹脂系のフィルム材8aと、そのフィルム内面に熱可塑性樹脂又は熱硬化性樹脂の接着剤層8bを塗布形成して積層一体化したものが用いられる。以下、フィルム材8aと接着剤層8bとを含めて絶縁フィルム8という。また、補強プレート5もポリエステル樹脂系のフィルム材を用いることができ、この場合、絶縁フィルム8より、例えば、5倍程度の厚さのフィルムが用いられる。   The insulating film 8 sandwiches the flat copper conductors 7 from both sides and presses or melts the adhesive layer 8b to bond and integrate them, thereby electrically insulating the flat copper conductors 7 arranged at high density. As the insulating film 8, for example, a polyester resin film material 8a and a thermoplastic resin or thermosetting resin adhesive layer 8b formed on the inner surface of the film and laminated and integrated are used. Hereinafter, the film material 8a and the adhesive layer 8b are referred to as an insulating film 8. The reinforcing plate 5 can also be a polyester resin film material. In this case, for example, a film about 5 times thicker than the insulating film 8 is used.

接続端末部3は、図1(C)に示すように、ケーブル部2の端部で、少なくとも平型銅導体7の片面側の絶縁フィルム8が除去され、導体表面が露出される。露出された導体表面は、後述するように銅導体の表面に施されている錫メッキが除去され、錫メッキが除去された銅導体表面にニッケルメッキを介して金メッキされた接点導体4とされる。接点導体4の反対側は、補強プレート5が接合されて硬直な基板状とされ、挿抜型の電気コネクタ6に着脱可能な形状とされる。電気コネクタ6は、例えば、プリント回路板のエッジ等が挿入されるジャック型、或いは、雌型といわれているもので、コネクタ接触片6aが接点導体4の表面に圧接して電気接続が形成される。   As shown in FIG. 1 (C), at least one insulating film 8 on one side of the flat copper conductor 7 is removed from the connection terminal portion 3 at the end of the cable portion 2 to expose the conductor surface. As will be described later, the exposed conductor surface is formed by removing the tin plating applied to the surface of the copper conductor, and the contact conductor 4 is gold-plated via nickel plating on the copper conductor surface from which the tin plating has been removed. . On the opposite side of the contact conductor 4, the reinforcing plate 5 is joined to form a rigid substrate, and the shape is detachable from the insertion / removal type electrical connector 6. The electrical connector 6 is, for example, a jack type or a female type into which an edge of a printed circuit board is inserted, and the connector contact piece 6a is pressed against the surface of the contact conductor 4 to form an electrical connection. The

図2は、平型銅導体7の片面を補強プレート5に直接接合した接続端末部の構成例を示す図である。図2(A)はケーブル全体を示す図、図2(B)は接続端末部のc−c部断面を示す図である。図中、3aは接続端末部、5aは補強プレート、9はニッケルメッキ、10は金メッキを示し、その他の符号は、図1で用いたのと同じ符号を用いることにより説明を省略する。   FIG. 2 is a diagram illustrating a configuration example of a connection terminal portion in which one side of the flat copper conductor 7 is directly joined to the reinforcing plate 5. 2A is a diagram showing the entire cable, and FIG. 2B is a diagram showing a cross section of the connection terminal portion taken along the line cc. In the figure, reference numeral 3a denotes a connection terminal portion, 5a denotes a reinforcing plate, 9 denotes nickel plating, 10 denotes gold plating, and the other reference numerals are the same as those used in FIG.

図2(A)に示す実施形態は、ケーブル部2の両端における接続端末部3aに関して、平型銅導体7の端部分を覆う絶縁フィルム8を剥離して、平型銅導体7の両面を露出させる。両面が露出された平型銅導体7の片面は、絶縁材からなる補強プレート5aに直接接合して、平型銅導体7の配列を固定するとともに、挿抜型の電気コネクタに着脱可能な硬直な接続端末部とされる。なお、ケーブル部2の少なくとも一方の端部が、電気コネクタに着脱可能な接続端末部とされていればよく、もう一方の端部は、例えば、はんだ付け接続が可能な接続端末部(金メッキ不要)であってもよい。   In the embodiment shown in FIG. 2A, with respect to the connection terminal portion 3a at both ends of the cable portion 2, the insulating film 8 covering the end portion of the flat copper conductor 7 is peeled off to expose both surfaces of the flat copper conductor 7. Let One side of the flat copper conductor 7 exposed on both sides is directly joined to a reinforcing plate 5a made of an insulating material to fix the arrangement of the flat copper conductors 7 and is rigid so that it can be attached to and removed from an insertion / removal type electrical connector. The connection terminal unit. Note that it is only necessary that at least one end portion of the cable portion 2 be a connection terminal portion that can be attached to and detached from the electrical connector, and the other end portion is, for example, a connection terminal portion that can be connected by soldering (no gold plating is required) ).

次いで、図2(B)に示すように、補強プレート5a上に露出された平型銅導体7が接着固定された後、露出面側の錫メッキ7bがエッチング等により除去される。なお、補強プレート5aに接着された側の錫メッキ7bは、除去されずに残る。しかし、補強プレート5aを接着する前に錫メッキの除去処理を行なうことで、両面の錫メッキを除去することはできる。錫メッキ7bが除去された後の銅導体7aには、ニッケルメッキ9を介して金メッキ10が施される。これにより、ケーブル部2は、錫メッキが施された複数本の平型銅導体7を絶縁フィルム8で被覆して形成され、接続端末部3aは、銅導体7a上にニッケルメッキ9を介して金メッキ10が施された接点導体4を備えた構成のフラットケーブルが得られる。   Next, as shown in FIG. 2B, after the flat copper conductor 7 exposed on the reinforcing plate 5a is adhered and fixed, the tin plating 7b on the exposed surface side is removed by etching or the like. The tin plating 7b on the side bonded to the reinforcing plate 5a remains without being removed. However, the tin plating on both sides can be removed by performing the tin plating removal process before bonding the reinforcing plate 5a. The copper conductor 7a after the tin plating 7b is removed is subjected to gold plating 10 via nickel plating 9. Thereby, the cable part 2 is formed by covering a plurality of flat copper conductors 7 plated with tin with the insulating film 8, and the connection terminal part 3 a is connected to the copper conductor 7 a via the nickel plating 9. A flat cable having a contact conductor 4 provided with gold plating 10 is obtained.

図3は、平型銅導体の露出されていない側の絶縁フィルム面に補強プレートを接合した接続端末部の構成例を示す図である。図3(A)はケーブル全体を示す図、図3(B)は接続端末部のd−d部断面を示す図である。図中、3bは接続端末部、5bは補強プレートを示し、その他の符号は、図1及び図2で用いたのと同じ符号を用いることにより説明を省略する。   FIG. 3 is a diagram illustrating a configuration example of a connection terminal portion in which a reinforcing plate is bonded to an insulating film surface of a flat copper conductor that is not exposed. FIG. 3A is a diagram illustrating the entire cable, and FIG. 3B is a diagram illustrating a cross section of the connection terminal portion taken along line dd. In the figure, 3b represents a connection terminal portion, 5b represents a reinforcing plate, and the other reference numerals are the same as those used in FIGS.

図3(A)に示す実施形態は、ケーブル部2の両端における接続端末部3bに関して、平型銅導体7の端部分を覆う絶縁フィルム8を片面側(図では上面側)のみ剥離して、平型銅導体7の上面を露出させる。反対側の平型銅導体7が露出されていない面側(図では下面側)は、剥離されずに残っている絶縁フィルム8の上から補強プレート5bを接合し、挿抜型の電気コネクタに着脱可能な硬直な接続端末部とされる。この場合の補強プレート5bは、複数本の平型銅導体7が絶縁フィルム8上で配列が保持され、電気的に絶縁されているので金属で形成されていてもよい。なお、この実施形態においても、図2(A)と同様に、一方の端部は、例えば、はんだ付け接続が可能な接続端末部(金メッキ不要)であってもよい。   In the embodiment shown in FIG. 3A, with respect to the connection terminal portion 3b at both ends of the cable portion 2, the insulating film 8 covering the end portion of the flat copper conductor 7 is peeled only on one side (the upper surface side in the figure), The upper surface of the flat copper conductor 7 is exposed. On the surface side (the lower surface side in the figure) where the flat copper conductor 7 on the opposite side is not exposed, the reinforcing plate 5b is joined from above the insulating film 8 which remains without being peeled off, and is attached to and detached from the pluggable electrical connector. Possible rigid connection terminal. In this case, the reinforcing plate 5b may be formed of metal since a plurality of flat copper conductors 7 are arranged on the insulating film 8 and electrically insulated. In this embodiment, as in FIG. 2A, one end may be, for example, a connection terminal portion (no gold plating is required) capable of soldering connection.

次いで、図3(B)に示すように、露出された片面側の平型銅導体7の錫メッキ7bがエッチング等により除去される。なお、補強プレート5bに接着された側の錫メッキ7bは、除去されずに残る。錫メッキ7bが除去された銅導体7aには、ニッケルメッキ9を介して金メッキ10が施される。これにより、ケーブル部2は、錫メッキが施された複数本の平型銅導体7を絶縁フィルム8で被覆して形成され、接続端末部3bは、銅導体7a上にニッケルメッキ9を介して金メッキ10が施された接点導体4を備えた構成のフラットケーブルが得られる。なお、この実施形態では、平型銅導体7は、片面側に絶縁フィルム8で接着されたままで配列が保持されているので、補強プレート5bの接合前に錫メッキ7bの除去、ニッケルメッキ9及び金メッキ10を施してもよい。   Next, as shown in FIG. 3B, the exposed tin plating 7b of the flat copper conductor 7 on one side is removed by etching or the like. The tin plating 7b on the side bonded to the reinforcing plate 5b remains without being removed. The copper conductor 7a from which the tin plating 7b has been removed is subjected to a gold plating 10 via a nickel plating 9. As a result, the cable portion 2 is formed by covering a plurality of flat copper conductors 7 plated with tin with the insulating film 8, and the connection terminal portion 3 b is formed on the copper conductor 7 a via the nickel plating 9. A flat cable having a contact conductor 4 provided with gold plating 10 is obtained. In this embodiment, since the flat copper conductor 7 is held in alignment with the insulating film 8 adhered to one side, the removal of the tin plating 7b, nickel plating 9 and Gold plating 10 may be applied.

上述した図1〜図3の構成によれば、フラットケーブルのケーブル部は、断面が扁平状の銅導体の表面に錫メッキが施されているので、ケーブルの可撓性を確保することができる。また、平型銅導体を高密度で配列した場合においても、銅導体間でのマイグレーションの発生を抑制することができ、これによる電気絶縁特性の低下を防止することができる。さらに、平型銅導体は、酸化が抑制されて絶縁フィルムとの接着性が低下するのを防止することができる。   According to the configuration of FIGS. 1 to 3 described above, the cable portion of the flat cable is secured to the surface of the copper conductor having a flat cross section, so that the flexibility of the cable can be ensured. . Moreover, even when flat copper conductors are arranged at a high density, the occurrence of migration between copper conductors can be suppressed, and the deterioration of the electrical insulation characteristics due to this can be prevented. Furthermore, the flat copper conductor can prevent the oxidation from being suppressed and the adhesiveness with the insulating film from being lowered.

接続端末部は、錫メッキが除去された銅導体に対して下地のニッケルメッキを介して金メッキが施されているので、錫メッキとニッケルメッキの層間での割れが発生せず、錫メッキと金メッキの異種金属接触による電食の発生もない。また、電気コネクタによる接触圧力を受けても、錫メッキが除去されニッケルメッキと金メッキが施されているので、ホイスカ発生が抑制され、高信頼性のあるフラットケーブルとすることができる。   The connection terminal is plated with gold through the underlying nickel plating on the copper conductor from which the tin plating has been removed, so there is no crack between the tin plating and nickel plating layers, and the tin plating and gold plating. There is no generation of electrolytic corrosion due to contact with different metals. Moreover, even if it receives the contact pressure by an electrical connector, since tin plating is removed and nickel plating and gold plating are performed, whisker generation is suppressed and a highly reliable flat cable can be obtained.

図4は、上述したフラットケーブルの製造方法の一例を示す図である。図中、11a,11bはテープ状フィルム、12a,12bは開口、13はラミネート幅広テープ、14はラミネート細幅テープ、15はラミネートローラ、16はスリッタ、17はカッタを示す。その他の符号は図1で用いたのと同じ符号を用いることにより説明を省略する。   FIG. 4 is a diagram illustrating an example of the flat cable manufacturing method described above. In the figure, 11a and 11b are tape-like films, 12a and 12b are openings, 13 is a wide laminated tape, 14 is a laminated thin tape, 15 is a laminating roller, 16 is a slitter, and 17 is a cutter. Description of other reference numerals is omitted by using the same reference numerals as those used in FIG.

図1〜図3で説明したフラットケーブルは、例えば、図4に示すような方法で作製される。ケーブル部2の絶縁フィルムは、図4(A)に示すように、内側に接着剤層を有するテープ状フィルム11a,11bの形態で連続供給される。一方のテープ状フィルム11aには、例えば、予め開口12aが所定の間隔で形成される。他方のテープ状フィルム11bには、テープ状フィルム11aの開口12aと一致するように開口12bを形成する場合(図2の実施形態の場合)と、この開口12bを形成しない場合(図3の実施形態の場合)がある。また、テープ状フィルム11bには、開口12bを形成した段階で開口12bの部分を塞ぐように補強プレート5を予め接合させるようにしてもよい。   The flat cable described with reference to FIGS. 1 to 3 is manufactured by a method as shown in FIG. 4, for example. As shown in FIG. 4A, the insulating film of the cable portion 2 is continuously supplied in the form of tape-like films 11a and 11b having an adhesive layer on the inside. On one tape-like film 11a, for example, openings 12a are formed in advance at predetermined intervals. In the other tape-shaped film 11b, when the opening 12b is formed so as to coincide with the opening 12a of the tape-shaped film 11a (in the case of the embodiment of FIG. 2), when the opening 12b is not formed (implementation of FIG. 3) In the case of form). Further, the reinforcing plate 5 may be bonded to the tape-shaped film 11b in advance so as to block the portion of the opening 12b when the opening 12b is formed.

多数本の平型銅導体7は、テープ状フィルム11a,11bで上下面から挟まれ、ラミネートローラ15により接着一体化され、開口12の部分で部分的に露出された状態でラミネート幅広テープ13とされる。ラミネートローラ15は、テープ状フィルム11a,11bに付与されている接着剤層の種類に応じて加熱ローラを用いることもできる。次いで、接着一体化されたラミネート幅広テープ13は、スリッタ16により長手方向に沿って分断され、所定の導体数を有するラミネート細幅テープ14とされ、一旦巻取られて巻取り体とされる。   A large number of flat copper conductors 7 are sandwiched from upper and lower surfaces by tape-like films 11 a and 11 b, bonded and integrated by a laminating roller 15, and partially laminated at a portion of the opening 12. Is done. The laminating roller 15 can also be a heating roller depending on the type of adhesive layer applied to the tape-like films 11a and 11b. Next, the laminated wide laminated tape 13 is divided along the longitudinal direction by a slitter 16 to form a laminated thin tape 14 having a predetermined number of conductors, and is wound up once to be a wound body.

次に、図4(B)に示すように、ラミネート細幅テープ14の巻取り体を巻戻し、図4(A)の製造工程で補強プレート5が接合されていない場合は、この工程で補強プレート5を接合し、開口部分を補強する。次いで、開口12aの中心でラミネート細幅テープ14をカッタ17で切断し、両端に平型銅導体が露出するようにする。この後、図1〜図3で説明したように、ケーブル部2の両端から露出されている部分の平型銅導体の表面の錫メッキを除去する。次いでニッケルメッキ、金メッキを施して接点導体4とし、補強プレート5で補強された接続端末部3を有するフラットケーブルが得られる。   Next, as shown in FIG. 4 (B), the winding body of the laminated thin tape 14 is rewound, and if the reinforcing plate 5 is not joined in the manufacturing process of FIG. The plate 5 is joined and the opening is reinforced. Next, the laminated narrow tape 14 is cut with a cutter 17 at the center of the opening 12a so that the flat copper conductor is exposed at both ends. Thereafter, as described with reference to FIGS. 1 to 3, the tin plating on the surface of the flat copper conductor in the portion exposed from both ends of the cable portion 2 is removed. Next, nickel plating and gold plating are applied to form a contact conductor 4 and a flat cable having a connection terminal portion 3 reinforced by a reinforcing plate 5 is obtained.

図5は、上述したフラットケーブルの製造方法のフロー図である。上述したように、ステップS1で錫メッキされた多数本の平型銅導体を平行に並べ、接着剤付きのテープ状フィルムで両面から挟むようにしてラミネートし接着一体化する。テープ状フィルムには、接続端末部となる部分に平型銅導体の少なくとも片面が露出するような開口が設けられている。次のステップS2では、開口が設けられている反対側の部分に、補強プレートが接合され、この部分を硬直化するとともに平型銅導体の両面が開口されている場合は、片面を補強プレートに接合して平型銅導体を接着固定する。   FIG. 5 is a flowchart of the above-described flat cable manufacturing method. As described above, a large number of flat copper conductors tin-plated in step S1 are arranged in parallel, laminated and adhered and integrated by being sandwiched from both sides by a tape-like film with an adhesive. The tape-like film is provided with an opening that exposes at least one surface of the flat copper conductor at a portion to be a connection terminal portion. In the next step S2, a reinforcing plate is joined to the opposite portion where the opening is provided, and when this portion is hardened and both sides of the flat copper conductor are opened, one side is used as the reinforcing plate. Bond and fix the flat copper conductor.

ステップS3では、開口された部分で露出された平型銅導体部分を2分するように切断し、両端に接続端末部を有するフラットケーブルとする。次いで、ステップS4で、フラットケーブルの両端で露出されている平型銅導体の錫メッキ部分を除去する。錫メッキの除去には、サンドブラスト、研磨等の物理的な方法やエッチング等の化学的な方法を用いることができる。   In step S3, the flat copper conductor portion exposed at the opened portion is cut into two portions to form a flat cable having connection terminal portions at both ends. Next, in step S4, the tin-plated portions of the flat copper conductor exposed at both ends of the flat cable are removed. For removing the tin plating, a physical method such as sand blasting or polishing, or a chemical method such as etching can be used.

ステップS5において、錫メッキが除去された銅導体部分に下地金属としてのニッケルメッキを施す。このニッケルメッキを施した後、長時間放置しておくとニッケルメッキに酸化被膜が生じ下地金属としての性能が劣化する。したがって、次のステップS6では、ニッケルメッキに引続いて、金メッキを直ちに行なうのが望ましい。なお、この時のメッキ浴がアルカリ性であると、絶縁フィルムと平型銅導体との接着性を低下させる。このため、本発明においては、弱アルカリ性から酸性(pH9以下、好ましくはpH7以下)のメッキ浴でメッキ処理を行なうのが望ましい。   In step S5, nickel plating as a base metal is applied to the copper conductor portion from which the tin plating has been removed. If the nickel plating is left for a long time after the nickel plating, an oxide film is formed on the nickel plating and the performance as a base metal deteriorates. Therefore, in the next step S6, it is desirable to perform gold plating immediately after nickel plating. If the plating bath at this time is alkaline, the adhesiveness between the insulating film and the flat copper conductor is lowered. For this reason, in the present invention, it is desirable to perform the plating process in a weakly alkaline to acidic (pH 9 or less, preferably pH 7 or less) plating bath.

なお、図4及び図5に示した製造方法の例は、それぞれのフラットケーブルに切断した後に、錫メッキの除去、ニッケルメッキ、金メッキの処理を行なう形態であるが、フラットケーブルに切断する前にこれらの処理を行なうようにしてもよい。すなわち、図4の所定の導体数を有するラミネート細幅テープ14とされ、巻取られた状態でエッチング液に浸して、開口12a,12bから露出されている平型銅導体上の錫メッキを除去する。次いで、ニッケルメッキ浴に浸してニッケルメッキを行ない、引続いて金メッキ浴に浸して金メッキを施し、この後、所定のフラットケーブルに切断する。なお、この場合、ラミネート細幅テープ14は、巻取り層間にメッキ液等が浸透しやすいように十分な間隙を有する形態で巻取られるようにする。   The example of the manufacturing method shown in FIGS. 4 and 5 is a form in which the tin plating is removed, the nickel plating, and the gold plating are performed after cutting into the respective flat cables, but before the cutting into the flat cables. These processes may be performed. That is, the thin laminated tape 14 having the predetermined number of conductors shown in FIG. 4 is immersed in an etching solution in a wound state, and the tin plating on the flat copper conductor exposed from the openings 12a and 12b is removed. To do. Next, it is immersed in a nickel plating bath to perform nickel plating, and subsequently immersed in a gold plating bath for gold plating, and then cut into a predetermined flat cable. In this case, the laminated narrow tape 14 is wound in a form having a sufficient gap so that the plating solution or the like can easily penetrate between the winding layers.

本発明によるフラットケーブルの概略を説明する図である。It is a figure explaining the outline of the flat cable by this invention. 本発明による接続端末部の構成例を示す図である。It is a figure which shows the structural example of the connection terminal part by this invention. 本発明による接続端末部の他の構成例を示す図である。It is a figure which shows the other structural example of the connection terminal part by this invention. 本発明によるフラットケーブルの製造方法の一例を説明する図である。It is a figure explaining an example of the manufacturing method of the flat cable by this invention. 本発明によるフラットケーブルの製造フローの一例を説明する図である。It is a figure explaining an example of the manufacturing flow of the flat cable by this invention.

符号の説明Explanation of symbols

1…フラットケーブル、2…ケーブル部、3,3a,3b…接続端末部、4…接点導体、5,5a,5b…補強プレート、6…電気コネクタ、6a…コネクタ接触片、7…平型銅導体、7a…銅導体、7b…錫メッキ、8…絶縁フィルム、8a…フィルム材、8b…接着剤層、9…ニッケルメッキ、10…金メッキ、11a,11b…テープ状フィルム、12a,12b…開口、13…ラミネート幅広テープ、14…ラミネート細幅テープ、15…ラミネートローラ、16…スリッタ、17…カッタ。 DESCRIPTION OF SYMBOLS 1 ... Flat cable, 2 ... Cable part, 3, 3a, 3b ... Connection terminal part, 4 ... Contact conductor, 5, 5a, 5b ... Reinforcement plate, 6 ... Electrical connector, 6a ... Connector contact piece, 7 ... Flat copper Conductor, 7a ... Copper conductor, 7b ... Tin plating, 8 ... Insulating film, 8a ... Film material, 8b ... Adhesive layer, 9 ... Nickel plating, 10 ... Gold plating, 11a, 11b ... Tape-like film, 12a, 12b ... Opening , 13 ... Laminated wide tape, 14 ... Laminated thin tape, 15 ... Laminated roller, 16 ... Slitter, 17 ... Cutter.

Claims (5)

錫メッキが施された複数本の平型銅導体を平行に並べて絶縁フィルムで被覆し、少なくとも一方の端部に電気コネクタと接続する接続端末部を形成したフラットケーブルであって、
前記接続端末部の接点導体とされる前記平型銅導体部分は、錫メッキが除去され、錫メッキが除去された部分にニッケルメッキを介して金メッキが施されていることを特徴とするフラットケーブル。
A flat cable in which a plurality of flat copper conductors plated with tin are arranged in parallel and covered with an insulating film, and a connection terminal portion connected to an electrical connector is formed on at least one end,
The flat copper conductor portion used as the contact conductor of the connection terminal portion is a flat cable in which tin plating is removed and gold plating is applied to the portion from which the tin plating is removed through nickel plating. .
前記接続端末部は、前記絶縁フィルムから前記平型銅導体の両面が露出され、片面側を補強プレートに直接接合して補強されていることを特徴とする請求項1に記載のフラットケーブル。   2. The flat cable according to claim 1, wherein the connection terminal portion is reinforced by exposing both sides of the flat copper conductor from the insulating film and directly joining one side to a reinforcing plate. 前記接続端末部は、前記絶縁フィルムから前記平型銅導体の片面が露出され、前記平型銅導体が露出されていない側の前記絶縁フィルム面に補強プレートを接合して補強されていることを特徴とする請求項1に記載のフラットケーブル。   The connection terminal portion is reinforced by bonding one side of the flat copper conductor from the insulating film and bonding a reinforcing plate to the insulating film surface on the side where the flat copper conductor is not exposed. The flat cable according to claim 1. 錫メッキが施された複数本の平型銅導体を平行に並べて絶縁フィルムで被覆して、少なくとも一方の端部に電気コネクタと接続する接続端末部を形成するフラットケーブルの製造方法であって、
前記接続端末部の接点導体とされる前記平型銅導体部分の錫メッキを除去し、錫メッキが除去された部分にニッケルメッキを施し、ニッケルメッキに引続いて金メッキを行なうことを特徴とするフラットケーブルの製造方法。
A method for producing a flat cable in which a plurality of flat copper conductors subjected to tin plating are arranged in parallel and covered with an insulating film to form a connection terminal portion connected to an electric connector at least at one end portion,
Removing the tin plating of the flat copper conductor portion to be the contact conductor of the connection terminal portion, applying nickel plating to the portion from which the tin plating has been removed, and subsequently performing gold plating after the nickel plating; Flat cable manufacturing method.
前記金メッキのメッキ浴のpHを9以下とすることを特徴とする請求項4に記載のフラットケーブルの製造方法。   The flat cable manufacturing method according to claim 4, wherein a pH of the gold plating bath is 9 or less.
JP2004230646A 2004-08-06 2004-08-06 Flat cable and manufacturing method thereof Expired - Fee Related JP4207862B2 (en)

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009176646A (en) * 2008-01-28 2009-08-06 Sumitomo Electric Ind Ltd Foil-shaped conductor, wiring member, and manufacturing method of wiring member conductor
JP2009211979A (en) * 2008-03-05 2009-09-17 Sumitomo Electric Ind Ltd Method of manufacturing flat cable
KR100942056B1 (en) 2007-07-30 2010-02-11 임은종 A plating system for a flexible flat cable
KR100949795B1 (en) 2007-07-30 2010-03-30 임은종 A plating device for a flexible flat cable and the using method thereof
JP2012038480A (en) * 2010-08-05 2012-02-23 Sumitomo Electric Ind Ltd Flat cable and manufacturing method thereof
JP2012059623A (en) * 2010-09-10 2012-03-22 Yazaki Corp Method of manufacturing connector terminal and connector terminal

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100942056B1 (en) 2007-07-30 2010-02-11 임은종 A plating system for a flexible flat cable
KR100949795B1 (en) 2007-07-30 2010-03-30 임은종 A plating device for a flexible flat cable and the using method thereof
JP2009176646A (en) * 2008-01-28 2009-08-06 Sumitomo Electric Ind Ltd Foil-shaped conductor, wiring member, and manufacturing method of wiring member conductor
JP2009211979A (en) * 2008-03-05 2009-09-17 Sumitomo Electric Ind Ltd Method of manufacturing flat cable
JP2012038480A (en) * 2010-08-05 2012-02-23 Sumitomo Electric Ind Ltd Flat cable and manufacturing method thereof
JP2012059623A (en) * 2010-09-10 2012-03-22 Yazaki Corp Method of manufacturing connector terminal and connector terminal

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