JP4775127B2 - Flat cable electroplating method and flat cable manufacturing method - Google Patents

Flat cable electroplating method and flat cable manufacturing method Download PDF

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JP4775127B2
JP4775127B2 JP2006164215A JP2006164215A JP4775127B2 JP 4775127 B2 JP4775127 B2 JP 4775127B2 JP 2006164215 A JP2006164215 A JP 2006164215A JP 2006164215 A JP2006164215 A JP 2006164215A JP 4775127 B2 JP4775127 B2 JP 4775127B2
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JP2007335176A (en
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賢 柳田
利紀 吉羽
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Sumitomo Electric Industries Ltd
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Description

本発明は、平面上に配列された複数本の導体の両面が絶縁材で被覆され、長手方向に複数の導体露出部を有する長尺のフラットケーブルに電気メッキを施す方法及びそれを用いたフラットケーブルの製造方法に関する。   The present invention relates to a method of electroplating a long flat cable having a plurality of exposed conductor portions in the longitudinal direction, in which both surfaces of a plurality of conductors arranged on a plane are covered with an insulating material, and a flat using the same The present invention relates to a method for manufacturing a cable.

携帯電話やビデオカメラ等の小型通信機器内の電気配線に用いられるフラットケーブルは、機器内の限られたスペース内で高密度、高信頼性が要求されている。このための配線部材としては、複数本の平形導体を平面上に配列し、その配列面の両面を絶縁樹脂フィルム等で被覆し、両端に電気接続用の端末を形成したフラットケーブルが多用されている。この種のフラットケーブルには、可撓性と導電性に優れた平形銅導体が用いられるが、裸の銅導体のままで使用すると、高温、多湿環境下でマイグレーションが発生しやすく、隣接する導体間の電気絶縁性を低下させ、電気的短絡を発生しやすい。また、裸の銅導体は酸化しやすく絶縁フィルムとの接着性が低下する。このため、通常は、平型銅導体の表面に錫メッキを施したものが用いられている。   Flat cables used for electrical wiring in small communication devices such as mobile phones and video cameras are required to have high density and high reliability in a limited space in the device. As a wiring member for this purpose, a flat cable in which a plurality of flat conductors are arranged on a plane, both surfaces of the arrangement surface are covered with an insulating resin film, etc., and terminals for electrical connection are formed at both ends is often used. Yes. This type of flat cable uses a flat copper conductor with excellent flexibility and conductivity. However, when used as a bare copper conductor, migration tends to occur in high temperature and high humidity environments. The electrical insulation between them is lowered, and an electrical short circuit is likely to occur. Also, bare copper conductors are easily oxidized and their adhesion to the insulating film is reduced. For this reason, the surface of a flat copper conductor with tin plating is usually used.

また、銅導体に電気メッキで錫メッキを施したフラットケーブルは、その両端の端末部分は電気接触のための圧縮応力を受けることに起因して針状結晶体(ホイスカ)が発生する。この端末部分でのホイスカの発生を抑制することと、端末導体と電気コネクタとの電気接続の信頼性を高めるために、端末導体に金メッキを施すことが開示されている(例えば、特許文献1参照)。
特開2006−49185号公報
Further, in a flat cable in which a copper conductor is tin-plated by electroplating, needle-like crystals (whiskers) are generated due to the end portions at both ends receiving compressive stress for electrical contact. In order to suppress the occurrence of whiskers in the terminal portion and to improve the reliability of electrical connection between the terminal conductor and the electrical connector, it is disclosed that the terminal conductor is plated with gold (for example, see Patent Document 1). ).
JP 2006-49185 A

フラットケーブルの端末導体に金メッキを施す方法について、上記特許文献1には具体的には開示されていないが、通常は、図3(A)に示すような方法が用いられる。すなわち、両端に端末部分を有するフラットケーブルは、連続形成された長尺のフラットケーブル1の絶縁体2に所定の間隔で導体露出部3を設けておき、長尺のフラットケーブル1は、メッキ液槽5に間欠的に送られて浸漬され、メッキ電源8によりメッキ液に電界を加えることにより、導体露出部3の導体4に順次メッキが施される。そして、この導体露出部3で露出する導体4を分断することにより短尺で単体形状のフラットケーブルとされる。   Although the method of applying gold plating to the terminal conductor of the flat cable is not specifically disclosed in the above-mentioned Patent Document 1, a method as shown in FIG. 3A is usually used. That is, a flat cable having terminal portions at both ends has conductor exposed portions 3 provided at predetermined intervals on an insulator 2 of a long flat cable 1 that is continuously formed. The conductor 4 of the conductor exposed portion 3 is sequentially plated by being intermittently sent to the bath 5 and immersed therein and applying an electric field to the plating solution by the plating power source 8. Then, the conductor 4 exposed at the conductor exposed portion 3 is divided to form a short single-unit flat cable.

この場合、長尺のフラットケーブル1の導体露出部2で露出する導体4メッキ液槽5の外に出ている部分に電極ローラ6等の給電電極を接触させてメッキ電源8の負電位が与えられ、メッキ金属材7には正電位が与えられる。複数本の導体4は、図3(B)に示すように電極ローラ6等の給電電極に電気的に接触されるように形成されている。しかし、ケーブル繰り出し張力や絶縁体2の樹脂フィルムのラミネート状態によっては、図3(C)に示すように、導体4の配列が湾曲した状態となって、電極ローラ6等の給電電極に接触されない導体が生じる場合がある。また、導体露出部3の露出面積が小さいと、電極ローラ6等の給電電極が導体4に接触されない場合もある。   In this case, the conductor 4 exposed at the conductor exposed portion 2 of the long flat cable 1 is brought into contact with the power supply electrode such as the electrode roller 6 at a portion outside the plating solution tank 5 to give a negative potential of the plating power source 8. A positive potential is applied to the plated metal material 7. The plurality of conductors 4 are formed so as to be in electrical contact with a power feeding electrode such as an electrode roller 6 as shown in FIG. However, depending on the cable drawing tension and the laminated state of the resin film of the insulator 2, the arrangement of the conductors 4 is curved as shown in FIG. 3C and is not in contact with the power supply electrode such as the electrode roller 6. Conductors may occur. In addition, when the exposed area of the conductor exposed portion 3 is small, the feeding electrode such as the electrode roller 6 may not be in contact with the conductor 4.

なお、上記の問題を回避するために、導体4の上下両面に電極ローラ6を配して導体4を挟むようにして接触させる方法も考えられるが、電極ローラ6の支持軸が傾いていたりすると、やはり電極ローラ6に接触されない導体が生じる場合があり完全ではない。電極ローラ6に接触しない導体があると、メッキが施されない導体が生じ、電気コネクタとの接続不良やホイスカ発生による電気的短絡が生じやすくなる。   In order to avoid the above problem, a method of arranging the electrode rollers 6 on both upper and lower surfaces of the conductor 4 so as to sandwich the conductor 4 is also conceivable. However, if the support shaft of the electrode roller 6 is inclined, A conductor that does not come into contact with the electrode roller 6 may be generated, which is not perfect. If there is a conductor that does not come into contact with the electrode roller 6, a conductor that is not plated is generated, and an electrical short circuit due to poor connection with the electrical connector or whisker generation is likely to occur.

本発明は、上述した実情に鑑みてなされたもので、長尺のフラットケーブルの導体露出部に露出する複数本の導体が確実にメッキ電源に接続され、メッキ洩れ導体が生じないフラットケーブルの電気メッキ方法とフラットケーブルの製造方法の提供を目的とする。   The present invention has been made in view of the above-described situation, and a plurality of conductors exposed at a conductor exposed portion of a long flat cable are securely connected to a plating power source, and no electric leakage of a plating cable is generated. It aims at providing the plating method and the manufacturing method of a flat cable.

本発明によるフラットケーブルの電気メッキ方法は、複数本の導体を平面上に配列して、導体の配列面の両面を絶縁樹脂で被覆した長尺のフラットケーブルの長手方向に、所定の間隔で複数の導体露出部を設け、この導体露出部の導体に電気メッキ施す方法である。長尺のフラットケーブルの少なくとも1個所の導体露出部で、露出する複数本の導体を導電部材で接続一体化して電気的に接続し、フラットケーブルをメッキ液に浸す。また、前記の導体露出部の露出する導体は、導電部材で接続一体化した部分を切断除去する切断代を有する。   The method for electroplating a flat cable according to the present invention includes a plurality of conductors arranged on a plane, and a plurality of conductors arranged at predetermined intervals in the longitudinal direction of a long flat cable in which both surfaces of the conductor are covered with an insulating resin. The conductor exposed portion is provided, and the conductor of the exposed conductor portion is electroplated. A plurality of exposed conductors are connected and integrated by a conductive member at at least one conductor exposed portion of a long flat cable, and the flat cable is immersed in a plating solution. Further, the exposed conductor of the exposed conductor portion has a cutting allowance for cutting and removing a portion integrated and connected by the conductive member.

本発明によれば、導体露出部に露出する全導体を電気的に接続して、全導体をメッキ電源に確実に接続することができ、フラットケーブルの端末導体にメッキ抜けが生じるのを防止することができる。また、導体に切断代を設けておき、そこに導電部材を接続し、その切断代を除去して導電部材を取り除くことにより、製品を無駄にすることなく、短尺に切断したフラットケーブルの全数を使用可能とすることができる。   According to the present invention, all the conductors exposed to the conductor exposed portion can be electrically connected, and all the conductors can be reliably connected to the plating power source, thereby preventing the plating conductor from being unplated. be able to. In addition, by providing a conductor with a cutting margin, connecting a conductive member to the conductor, and removing the conductive member by removing the cutting margin, the total number of flat cables cut in a short length can be reduced without wasting the product. Can be usable.

図1により本発明の実施の形態を説明する。図1(A)はフラットケーブルをメッキ液槽で電気メッキする状態を説明する図、図1(B)及び図1(C)は導体露出部の導体を導電部材で接続一体化した状態を示す図である。図中、1は長尺のフラットケーブル、2は絶縁体、3は導体露出部、4は導体、5はメッキ液槽、7はメッキ金属材、8はメッキ電源、9は端末補強テープ、10は導電部材、11は半田剤を示す。   An embodiment of the present invention will be described with reference to FIG. FIG. 1A is a diagram for explaining a state in which a flat cable is electroplated in a plating bath, and FIGS. 1B and 1C show a state in which the conductors of the conductor exposed portions are connected and integrated by a conductive member. FIG. In the figure, 1 is a long flat cable, 2 is an insulator, 3 is a conductor exposed portion, 4 is a conductor, 5 is a plating bath, 7 is a plating metal material, 8 is a plating power source, 9 is a terminal reinforcing tape, 10 Indicates a conductive member, and 11 indicates a soldering agent.

本発明によるフラットケーブルの電気メッキ方法は、図1(A)に示すように、メッキ液槽5に、長尺のフラットケーブル1を間欠的に送りこんで浸漬させ、フラットケーブル1の導体露出部3の部分に露出する導体に電気メッキを施している。露出する導体にメッキ金属を付着させるために、少なくとも1個所の導体露出部3で、露出する全導体と交差する導電部材10で接続一体化して電気的に接続する。フラットケーブル1をメッキ液に漬けたときに導電部材10がメッキ液の外に出るときは、導電部材10を電気クリップ等でメッキ電源8の負電位側に接続し、メッキ液に浸したメッキ金属材7をメッキ電源8の正電位側に接続する。導電部材10がメッキ液に漬かる場合は、メッキ液の外に外に出ている導体の何れかをメッキ電源8の負電位側に接続する。   In the flat cable electroplating method according to the present invention, as shown in FIG. 1 (A), a long flat cable 1 is intermittently fed and immersed in a plating bath 5 to expose a conductor exposed portion 3 of the flat cable 1. The conductor exposed in this part is electroplated. In order to attach the plated metal to the exposed conductor, at least one conductor exposed portion 3 is connected and integrated by the conductive member 10 intersecting with all the exposed conductors to be electrically connected. When the conductive member 10 comes out of the plating solution when the flat cable 1 is immersed in the plating solution, the conductive member 10 is connected to the negative potential side of the plating power source 8 with an electric clip or the like, and the plating metal immersed in the plating solution The material 7 is connected to the positive potential side of the plating power source 8. When the conductive member 10 is immersed in the plating solution, one of the conductors outside the plating solution is connected to the negative potential side of the plating power source 8.

長尺のフラットケーブル1は、図1(B)又は図1(C)に示すように、通常、複数本の導体4(例えば、軟銅の丸線を押し潰して断面を平坦にした平型銅導体)を平面上に一列に配列し、その配列面の両面(上下面)を絶縁樹脂等の絶縁体2で被覆されている。また、導体4を裸銅のままで使用すると、高温、多湿下においてマイグレーションが発生しやすく、隣接する導体間の絶縁抵抗を低下させ、電気的短絡を起こしやすい。さらに、裸銅は酸化しやすく絶縁体2で被覆する前に酸化が生じていると絶縁体2と接着性が低下する。このため、通常は、導体表面に錫メッキを施したものが用いられている。   As shown in FIG. 1 (B) or FIG. 1 (C), the long flat cable 1 is usually a flat copper whose cross section is flattened by crushing a plurality of conductors 4 (for example, round copper wire). Conductors) are arranged in a line on a plane, and both surfaces (upper and lower surfaces) of the arrangement surface are covered with an insulator 2 such as an insulating resin. Further, when the conductor 4 is used as bare copper, migration is likely to occur under high temperature and high humidity, and the insulation resistance between adjacent conductors is lowered, and an electrical short circuit is likely to occur. Further, bare copper is easily oxidized, and if it is oxidized before being coated with the insulator 2, its adhesion to the insulator 2 is lowered. For this reason, a conductor surface that is tin-plated is usually used.

複数本の導体4を被覆し絶縁する絶縁体2は、例えば、接着樹脂層を有する絶縁フィルムを導体4の配列面の上下両面からラミネートするか、又は、押出機により導体上に成形することにより形成される。そして、短尺で単体状のフラットケーブルは、前記の長尺のフラットケーブル1の絶縁体2を所定の間隔で除去して導体4を露出させた導体露出部3を形成しておき、この導体露出部3の導体4を分断して形成される。こうして、両端末に導体4が露出したフラットケーブルが得られる。なお、導体露出部3は、例えば、一方の面側の絶縁体を除去し、反対の面側の絶縁体を残して絶縁端部2aとし、ここに端末補強テープ9を接合している。   The insulator 2 that covers and insulates the plurality of conductors 4 is obtained by, for example, laminating an insulating film having an adhesive resin layer from the upper and lower surfaces of the arrangement surface of the conductors 4 or by molding the insulating film on the conductors by an extruder. It is formed. The short flat cable has a conductor exposed portion 3 in which the conductor 2 is exposed by removing the insulator 2 of the long flat cable 1 at a predetermined interval. It is formed by dividing the conductor 4 of the portion 3. In this way, a flat cable with the conductor 4 exposed at both ends is obtained. For example, the conductor exposed portion 3 is formed by removing the insulator on one surface side and leaving the insulator on the opposite surface side as the insulating end portion 2a, to which the terminal reinforcing tape 9 is joined.

導電部材10は、例えば、断面が丸形又は矩形の棒状体で形成され、導体露出部3から露出する全導体4に交差する十分な長さを有し、半田剤又は導電接着剤を用いて導体4に接続され、全導体を電気的に短絡する。この導電部材10は、全ての導体露出部3に設けなくてもよく、長尺のフラットケーブル1の任意の位置の導電露出部3に設けることでもよい。例えば、図1(A)に示すようにメッキ液槽5に一度に浸漬することができるフラットケーブル長さ毎の導電露出部3(図では、2つおき)に設ける。   The conductive member 10 is formed of, for example, a rod-shaped body having a round or rectangular cross section, has a sufficient length that intersects all the conductors 4 exposed from the conductor exposed portion 3, and uses a soldering agent or a conductive adhesive. It is connected to the conductor 4 and electrically shorts all conductors. The conductive member 10 may not be provided in all the conductor exposed portions 3, but may be provided in the conductive exposed portions 3 at arbitrary positions of the long flat cable 1. For example, as shown in FIG. 1A, the conductive exposed portions 3 (every two in the drawing) are provided for each flat cable length that can be immersed in the plating solution tank 5 at one time.

また、本発明では、隣接して接合される端末補強テープ9間にスペースdを設けておき、このスペース部分では両面の絶縁フィルムを除去し、導電部材10をスペースdの端末補強テープ側部分で半田付け又は導電接着剤で固定するようにしてもよい。スペースd部分は、後に導体露出部3を分断する際に切断除去するもので、切断代として形成される。この構成によれば、導電部材10を固定する半田剤11は、導体4の長手方向い沿って流れようとするが、スペースdの両側の端末補強テープ9のエッジにより半田剤11の流れが止められる。そして、半田剤11が付着した部分は、後に切断除去することで電気接続面となる端末導体としての状態を維持することができ、廃棄することなく製品として使用することができる。   Moreover, in this invention, the space d is provided between the terminal reinforcement tapes 9 adjoined adjacently, the insulating film of both surfaces is removed in this space part, and the electrically-conductive member 10 is the terminal reinforcement tape side part of the space d. You may make it fix with soldering or a conductive adhesive. The space d is cut and removed when the conductor exposed portion 3 is divided later, and is formed as a cutting allowance. According to this configuration, the solder agent 11 for fixing the conductive member 10 tends to flow along the longitudinal direction of the conductor 4, but the flow of the solder agent 11 is stopped by the edges of the terminal reinforcing tape 9 on both sides of the space d. It is done. And the part to which the soldering agent 11 adheres can maintain the state as a terminal conductor used as an electrical connection surface by cutting and removing later, and can be used as a product without discarding.

この導電部材10は、メッキ液槽5の外部でメッキ電源に接続するが、メッキ液に浸されている部分の導体露出部3に電気メッキが施されるようにするもので、導体4の電気抵抗を考慮してできるだけメッキ液槽5の近くでメッキ電源8に接続されるようにするのが好ましい。また、メッキ液に浸されているケーブル部分の一方の導体露出部3のみにメッキ電源8を接続する例で示したが、メッキ液に浸されているケーブル部分の両側の導体露出部3にメッキ電源8を接続するようにしてもよい。なお、長尺のフラットケーブル1は、メッキ液槽内に連続的に送り込んで浸漬させる他に、メッキ液槽5に収まる程度の長さに分断して浸漬させるようにしてもよい。   The conductive member 10 is connected to a plating power source outside the plating solution tank 5, and is adapted to perform electroplating on the conductor exposed portion 3 in the portion immersed in the plating solution. In consideration of resistance, it is preferable to connect to the plating power source 8 as close to the plating bath 5 as possible. Moreover, although the example which connects the plating power supply 8 only to one conductor exposed part 3 of the cable part immersed in plating liquid was shown, it plating on the conductor exposed part 3 of the both sides of the cable part immersed in plating liquid A power supply 8 may be connected. In addition, the long flat cable 1 may be divided into a length that can be accommodated in the plating solution tank 5 in addition to being continuously fed into the plating solution tank and immersed therein.

露出導体部3に施すメッキは、この端末部分でのホイスカの発生を抑制することと、或いは端末導体と電気コネクタとの電気接続の信頼性を高めるためのもので、好ましくは金メッキが施される。ただ、錫メッキ上に直接金メッキを施すと、異種金属接触による電食が生じ、長期の使用に耐えられない恐れがある。このため、下地金属としてニッケルメッキを施してから金メッキを施すようにしてもよい。   The plating applied to the exposed conductor portion 3 is for suppressing the generation of whiskers at the terminal portion, or for improving the reliability of the electrical connection between the terminal conductor and the electric connector, and is preferably plated with gold. . However, if gold plating is directly applied on tin plating, electrolytic corrosion due to contact with dissimilar metals may occur and it may not be able to withstand long-term use. For this reason, gold plating may be applied after nickel plating as the base metal.

図2は、上述した長尺のフラットケーブルを、各導体露出部で切断して両側に接続端末12を有する短尺で単体状のフラットケーブル1’とした一例を説明する図である。接続端末12は、図1(A)の方法で電気メッキされた導体露出部3を2つに切断して形成するもので、具体的には、図1(C)の導電部材10を半田付けした切断代(スペースd部分)を除去して形成される。また、実際には導電部材10を接続しなかった導体露出部3についても、切断代を有している場合は同様に切断除去する。   FIG. 2 is a diagram for explaining an example in which the above-described long flat cable is cut at each conductor exposed portion to form a short single flat cable 1 ′ having connection terminals 12 on both sides. The connection terminal 12 is formed by cutting the conductor exposed portion 3 electroplated by the method of FIG. 1 (A) into two. Specifically, the conductive member 10 of FIG. 1 (C) is soldered. It is formed by removing the cut margin (space d portion). In addition, the conductor exposed portion 3 to which the conductive member 10 is not actually connected is also cut and removed in the same manner if it has a cutting allowance.

単体状のフラットケーブル1’の接続端末12は、導体4の配列面を被覆している絶縁体2の片面側を除去して導体4の片面側を露出し、反対側の絶縁端部2aを残し、この部分に端末補強テープ9を貼り付けた形状となる。片面側が露出された複数本の導体4の露出面は、前述した電気メッキ方法により、確実にメッキ処理された端末導体で形成される。接続端末12は、電気コネクタ13の弾性接触子13aに挿入されて、確実で良好な電気接続を得ることができる。なお、導体4の露出する面は、両端の接続端子で同じ側となる場合もあるが、異なる側となる場合もある。   The connection terminal 12 of the unitary flat cable 1 ′ removes one side of the insulator 2 covering the arrangement surface of the conductors 4 to expose one side of the conductors 4, and connects the insulating end 2 a on the opposite side. It leaves and becomes the shape which affixed the terminal reinforcement tape 9 on this part. The exposed surfaces of the plurality of conductors 4 whose one side is exposed are formed of terminal conductors that have been reliably plated by the electroplating method described above. The connection terminal 12 can be inserted into the elastic contact 13a of the electrical connector 13 to obtain a reliable and good electrical connection. Note that the exposed surface of the conductor 4 may be on the same side in the connection terminals at both ends, but may be on a different side.

本発明の概略を説明する図である。It is a figure explaining the outline of the present invention. 本発明によって作製される単体状のフラットケーブルの一例を説明する図である。It is a figure explaining an example of the unitary flat cable produced by this invention. 従来技術を説明する図である。It is a figure explaining a prior art.

符号の説明Explanation of symbols

1…長尺のフラットケーブル、1’…単体状のフラットケーブル、2…絶縁体、2a…絶縁端部、3…導体露出部、4…導体、5…メッキ液槽、6…電極ローラ、7…メッキ金属材、8…メッキ電源、9…端末補強テープ、10…導電部材、11…半田剤、12…接続端末、13…電気コネクタ、13a…弾性接触子。 DESCRIPTION OF SYMBOLS 1 ... Long flat cable, 1 '... Single-piece | unit flat cable, 2 ... Insulator, 2a ... Insulation end part, 3 ... Conductor exposure part, 4 ... Conductor, 5 ... Plating bath, 6 ... Electrode roller, 7 DESCRIPTION OF SYMBOLS ... Metal plating material, 8 ... Plating power supply, 9 ... Terminal reinforcement tape, 10 ... Conductive member, 11 ... Solder agent, 12 ... Connection terminal, 13 ... Electrical connector, 13a ... Elastic contactor.

Claims (3)

複数本の導体を平面上に配列して、前記導体の配列面の両面を絶縁樹脂で被覆した長尺のフラットケーブルの長手方向に所定の間隔で複数の導体露出部を設け、前記導体露出部の導体に電気メッキを施すフラットケーブルの電気メッキ方法であって、
前記長尺のフラットケーブルの少なくとも1個所の導体露出部で露出する複数本の導体を導電部材で接続一体化して電気的に接続し、前記フラットケーブルをメッキ液に浸すことを特徴とするフラットケーブルの電気メッキ方法。
A plurality of conductor exposed portions are provided at predetermined intervals in a longitudinal direction of a long flat cable in which a plurality of conductors are arranged on a plane and both surfaces of the conductor arrangement surface are covered with an insulating resin. A flat cable electroplating method for electroplating a conductor of
A flat cable characterized in that a plurality of conductors exposed at a conductor exposed portion of at least one portion of the long flat cable are connected and integrated by a conductive member to be electrically connected, and the flat cable is immersed in a plating solution. Electroplating method.
前記導体露出部で露出する導体は、前記導電部材で電気的に接続一体化した部分を切断除去する切断代を有していることを特徴とする請求項1に記載のフラットケーブルの電気メッキ方法。   2. The method of electroplating a flat cable according to claim 1, wherein the conductor exposed at the conductor exposed portion has a cutting allowance for cutting and removing a portion electrically connected and integrated by the conductive member. . 複数本の導体を平面上に配列して、前記導体の配列面の両面を絶縁樹脂で被覆した長尺のフラットケーブルの長手方向に所定の間隔で複数所の導体露出部を設け、前記導体露出部の導体に電気メッキを施した後、前記導体露出部の導体を切断するフラットケーブルの製造方法であって、
前記長尺のフラットケーブルの少なくとも1個所の導体露出部で、露出する前記複数本の導体を導電部材で接続一体化して電気的に接続し、前記フラットケーブルをメッキ液に浸して前記導体露出部の導体に電気メッキを施すことを特徴とするフラットケーブルの製造方法。
A plurality of conductor exposed portions are arranged at predetermined intervals in the longitudinal direction of a long flat cable in which a plurality of conductors are arranged on a plane and both surfaces of the conductor arrangement surface are covered with insulating resin, A method of manufacturing a flat cable, after electroplating the conductor of the part, cutting the conductor of the exposed conductor part,
The exposed conductors in at least one portion of the long flat cable are electrically connected by connecting and integrating the exposed conductors with a conductive member, and the flat cable is immersed in a plating solution to expose the conductor. A method for producing a flat cable, characterized in that electroplating is applied to the conductor of the cable.
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