JP2006041372A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2006041372A5 JP2006041372A5 JP2004221998A JP2004221998A JP2006041372A5 JP 2006041372 A5 JP2006041372 A5 JP 2006041372A5 JP 2004221998 A JP2004221998 A JP 2004221998A JP 2004221998 A JP2004221998 A JP 2004221998A JP 2006041372 A5 JP2006041372 A5 JP 2006041372A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- processing unit
- drying
- processing
- supply
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Claims (11)
前記液処理部の上側に設けられ、前記基板を乾燥させる乾燥処理部と、
前記液処理部と前記乾燥処理部との間で基板を搬送する基板搬送装置と、
前記液処理部と前記乾燥処理部との間を開閉することができるように水平方向に移動自在であり、排液口が形成されたシャッタと、
前記排液口に接続された吸引機構と、
前記排液口の開口上に設けられ、前記吸引機構を動作させた際に、前記シャッタの上面に沿って流れて前記排液口に流入する流体流れを生じさせる吸引制御部材と、
を具備することを特徴とする基板処理装置。 A liquid processing section for processing the substrate with the processing liquid;
A drying processing unit provided on the liquid processing unit and drying the substrate;
A substrate transfer device for transferring a substrate between the liquid processing unit and the drying processing unit;
A shutter that is movable in a horizontal direction so as to be able to open and close between the liquid processing unit and the drying processing unit, and has a drain port formed therein;
A suction mechanism connected to the drainage port;
A suction control member that is provided on the opening of the drainage port and generates a fluid flow that flows along the upper surface of the shutter and flows into the drainage port when the suction mechanism is operated;
A substrate processing apparatus comprising:
前記乾燥処理部へ処理ガスの供給を開始し、所定時間が経過した後に前記排液口からの排液を開始し、その後所定時間経過後に前記処理ガスの供給を停止し、その後前記排液口からの排液を停止するように、前記処理ガス供給機構と前記吸引機構とを制御する制御装置と、
をさらに具備することを特徴とする請求項1から請求項7のいずれか1項に記載の基板処理装置。 A processing gas supply mechanism for supplying a processing gas to the drying processing unit;
The supply of the processing gas to the drying processing unit is started, the drainage from the drainage port is started after a predetermined time has elapsed, and then the supply of the processing gas is stopped after the predetermined time has passed, and then the drainage port A control device for controlling the processing gas supply mechanism and the suction mechanism so as to stop drainage from
The substrate processing device according to claim 1, wherein any one of claims 7, further comprising a.
前記制御装置は、前記乾燥処理部への処理ガスの供給開始と実質的に同時に前記乾燥処理部へ不活性ガスの供給を開始し、前記排液口からの排液を停止した後に前記不活性ガスの前記乾燥処理部への供給を停止するように、前記不活性ガス供給機構を制御し、
前記液処理部では基板の薬液処理および水洗処理が行われ、前記乾燥処理部では前記水洗処理後の基板の乾燥処理が前記処理ガスとしてイソプロピルアルコール蒸気を用いて行われることを特徴とする請求項8に記載の基板処理装置。 An inert gas supply mechanism for supplying an inert gas to the drying processing unit;
The control device starts supplying inert gas to the drying processing unit substantially simultaneously with the start of supply of processing gas to the drying processing unit, and stops the drainage from the drainage port, and then deactivates the inert gas. Controlling the inert gas supply mechanism so as to stop the supply of gas to the drying processing unit;
The chemical treatment and water washing treatment of the substrate is performed in the liquid treatment section, and the drying treatment of the substrate after the water washing treatment is performed using isopropyl alcohol vapor as the processing gas in the drying treatment section. 9. The substrate processing apparatus according to 8 .
前記液処理が終了した基板を前記液処理部の上方に設けられた乾燥処理部に引き上げる工程と、
前記液処理部と前記乾燥処理部との間をシャッタにより隔離する工程と、
前記乾燥処理部において前記基板を乾燥させる工程と、を有し、
前記基板の乾燥工程は、
前記乾燥処理部へ処理ガスの供給を開始する工程と、
前記処理ガスの供給を開始してから一定時間経過後に、前記シャッタに設けられた排液口を通して前記シャッタに落下した液体の吸引排液を開始する工程と、
前記排液口からの排液を開始してから所定時間経過後に前記処理ガスの供給を停止する工程と、
前記処理ガスの供給を停止してから所定時間経過後に前記排液口からの吸引排液を停止する工程と、
を有することを特徴とする基板処理方法。 A step of liquid-treating the substrate in a liquid treatment section for treating the substrate with a predetermined treatment liquid;
A step of pulling up the substrate after the liquid processing to a drying processing unit provided above the liquid processing unit;
Isolating the liquid processing unit and the drying processing unit with a shutter;
Drying the substrate in the drying processing unit,
The substrate drying process includes:
Starting the supply of processing gas to the drying processing unit;
Starting suction and drainage of the liquid that has fallen to the shutter through a drainage port provided in the shutter after a lapse of a certain time from the start of supply of the processing gas;
A step of stopping the supply of the processing gas after elapse of a predetermined time after starting drainage from the drainage port;
A step of stopping suction and drainage from the drainage port after a lapse of a predetermined time after stopping the supply of the processing gas;
A substrate processing method comprising:
前記乾燥工程においては、前記処理ガスとしてイソプロピルアルコール蒸気を用い、前記乾燥処理部へのイソプロピルアルコール蒸気の供給開始と実質的に同時に前記乾燥処理部への不活性ガスの供給をさらに開始し、前記排液口からの吸引排液を停止した後に、前記乾燥処理部への不活性ガスの供給を停止することを特徴とする請求項10に記載の基板処理方法。 The liquid treatment of the substrate includes a water washing treatment with pure water,
In the drying step, isopropyl alcohol vapor is used as the processing gas, and the supply of the inert gas to the drying processing unit is further started substantially simultaneously with the start of the supply of isopropyl alcohol vapor to the drying processing unit, The substrate processing method according to claim 10 , wherein the supply of the inert gas to the drying processing unit is stopped after the suction and drainage from the drainage port is stopped.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004221998A JP4421967B2 (en) | 2004-07-29 | 2004-07-29 | Substrate processing apparatus and substrate processing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004221998A JP4421967B2 (en) | 2004-07-29 | 2004-07-29 | Substrate processing apparatus and substrate processing method |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2006041372A JP2006041372A (en) | 2006-02-09 |
JP2006041372A5 true JP2006041372A5 (en) | 2008-02-07 |
JP4421967B2 JP4421967B2 (en) | 2010-02-24 |
Family
ID=35906013
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004221998A Expired - Fee Related JP4421967B2 (en) | 2004-07-29 | 2004-07-29 | Substrate processing apparatus and substrate processing method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4421967B2 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4931042B2 (en) * | 2006-04-10 | 2012-05-16 | 株式会社ジェイ・イー・ティ | Substrate processing equipment |
JP2013089699A (en) * | 2011-10-14 | 2013-05-13 | Tokyo Electron Ltd | Substrate processing apparatus, substrate processing method, and computer readable storage medium storing substrate processing program |
JP5715547B2 (en) * | 2011-10-31 | 2015-05-07 | 東京エレクトロン株式会社 | Substrate processing apparatus, substrate processing method, and computer-readable storage medium storing substrate processing program |
JP7535890B2 (en) | 2020-08-27 | 2024-08-19 | 東京エレクトロン株式会社 | Substrate Processing Equipment |
CN116598221A (en) * | 2022-09-08 | 2023-08-15 | 上海至纯洁净系统科技股份有限公司 | Integrated wafer drying method, system, terminal and storage medium |
-
2004
- 2004-07-29 JP JP2004221998A patent/JP4421967B2/en not_active Expired - Fee Related
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2004006620A5 (en) | ||
TWI388007B (en) | Liquid processing method, liquid processing device and memory medium | |
JP2007005478A5 (en) | ||
JP2008235813A (en) | Substrate treatment apparatus | |
US20210252560A1 (en) | Substrate processing device and substrate processing method | |
JP2007157898A (en) | Substrate cleaning method, substrate cleaning device, control program, and computer readable storage medium | |
US20060219260A1 (en) | Substrate treatment apparatus and substrate treatment method | |
TW201032268A (en) | Liquid processing method and liquid processing apparatus | |
TWI692831B (en) | Treatment liquid supply device and degassing method | |
JP2001028358A (en) | Apparatus and method for cleaning and drying | |
JP2006041372A5 (en) | ||
JP5977058B2 (en) | Treatment liquid supply apparatus and treatment liquid supply method | |
JP2004327826A (en) | Substrate processor | |
TW202131437A (en) | Substrate processing apparatus | |
JP2013015279A (en) | Hot water storage type water heater | |
KR101426585B1 (en) | Automatic Water Supply Apparatus for Bathtub and Control method thereof | |
CN207834261U (en) | Substrate board treatment | |
JP2007155251A (en) | Bath device | |
JP2004313933A (en) | Spraying washing machine | |
JP2006181426A (en) | Apparatus and method for treatment of substrate | |
TW202328828A (en) | Substrate processing method and substrate processing apparatus | |
DE602006002747D1 (en) | Water circulation device and method for swimming pools | |
KR20090047262A (en) | Apparatus for supplying chemicals | |
JP4421967B2 (en) | Substrate processing apparatus and substrate processing method | |
JP4036331B2 (en) | Treatment liquid supply nozzle, treatment liquid supply apparatus, and nozzle cleaning method |