JP2006041372A5 - - Google Patents

Download PDF

Info

Publication number
JP2006041372A5
JP2006041372A5 JP2004221998A JP2004221998A JP2006041372A5 JP 2006041372 A5 JP2006041372 A5 JP 2006041372A5 JP 2004221998 A JP2004221998 A JP 2004221998A JP 2004221998 A JP2004221998 A JP 2004221998A JP 2006041372 A5 JP2006041372 A5 JP 2006041372A5
Authority
JP
Japan
Prior art keywords
substrate
processing unit
drying
processing
supply
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2004221998A
Other languages
Japanese (ja)
Other versions
JP2006041372A (en
JP4421967B2 (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2004221998A priority Critical patent/JP4421967B2/en
Priority claimed from JP2004221998A external-priority patent/JP4421967B2/en
Publication of JP2006041372A publication Critical patent/JP2006041372A/en
Publication of JP2006041372A5 publication Critical patent/JP2006041372A5/ja
Application granted granted Critical
Publication of JP4421967B2 publication Critical patent/JP4421967B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Claims (11)

基板を処理液により処理する液処理部と、
前記液処理部の上側に設けられ、前記基板を乾燥させる乾燥処理部と、
前記液処理部と前記乾燥処理部との間で基板を搬送する基板搬送装置と、
前記液処理部と前記乾燥処理部との間を開閉することができるように水平方向に移動自在であり、排液口が形成されたシャッタと、
前記排液口に接続された吸引機構と、
前記排液口の開口上に設けられ、前記吸引機構を動作させた際に、前記シャッタの上面に沿って流れて前記排液口に流入する流体流れを生じさせる吸引制御部材と、
を具備することを特徴とする基板処理装置。
A liquid processing section for processing the substrate with the processing liquid;
A drying processing unit provided on the liquid processing unit and drying the substrate;
A substrate transfer device for transferring a substrate between the liquid processing unit and the drying processing unit;
A shutter that is movable in a horizontal direction so as to be able to open and close between the liquid processing unit and the drying processing unit, and has a drain port formed therein;
A suction mechanism connected to the drainage port;
A suction control member that is provided on the opening of the drainage port and generates a fluid flow that flows along the upper surface of the shutter and flows into the drainage port when the suction mechanism is operated;
A substrate processing apparatus comprising:
前記排液口は、前記シャッタの略中心に形成されていることを特徴とする請求項1に記載の基板処理装置。  The substrate processing apparatus according to claim 1, wherein the drain port is formed substantially at the center of the shutter. 前記吸引制御部材は略円錐形状であることを特徴とする請求項1または請求項2に記載の基板処理装置。 The suction control member substrate processing apparatus according to claim 1 or claim 2, characterized in that a substantially conical shape. 前記略円錐形状の吸引制御部材の外周端と前記シャッタの上面との間に形成される隙間は0.5mm以上1.0mm以下であることを特徴とする請求項に記載の基板処理装置。 4. The substrate processing apparatus according to claim 3 , wherein a gap formed between an outer peripheral end of the substantially conical suction control member and an upper surface of the shutter is 0.5 mm or more and 1.0 mm or less. 前記排液口の開口径は、前記略円錐形状の吸引制御部材の外径よりも短いことを特徴とする請求項または請求項に記載の基板処理装置。 The opening diameter of the drain port is a substrate processing apparatus according to claim 3 or claim 4, characterized in that shorter than the outer diameter of the suction control members of the substantially conical shape. 前記シャッタの上面は略円錐状の凹面であり、前記排液口は前記凹面の最深部に設けられていることを特徴とする請求項1から請求項のいずれか1項に記載の基板処理装置。 Upper surface of said shutter is substantially conical concave substrate processing according to any one of claims 1 to 5, wherein the drain port is characterized in that provided in the deepest portion of the concave surface apparatus. 前記吸引機構はアスピレータであることを特徴とする請求項1から請求項のいずれか1項に記載の基板処理装置。 The suction mechanism is a substrate processing apparatus according to any one of claims 1 to 6, characterized in that the aspirator. 前記乾燥処理部に処理ガスを供給する処理ガス供給機構と、
前記乾燥処理部へ処理ガスの供給を開始し、所定時間が経過した後に前記排液口からの排液を開始し、その後所定時間経過後に前記処理ガスの供給を停止し、その後前記排液口からの排液を停止するように、前記処理ガス供給機構と前記吸引機構とを制御する制御装置と、
をさらに具備することを特徴とする請求項1から請求項のいずれか1項に記載の基板処理装置。
A processing gas supply mechanism for supplying a processing gas to the drying processing unit;
The supply of the processing gas to the drying processing unit is started, the drainage from the drainage port is started after a predetermined time has elapsed, and then the supply of the processing gas is stopped after the predetermined time has passed, and then the drainage port A control device for controlling the processing gas supply mechanism and the suction mechanism so as to stop drainage from
The substrate processing device according to claim 1, wherein any one of claims 7, further comprising a.
前記乾燥処理部に不活性ガスを供給する不活性ガス供給機構をさらに具備し、
前記制御装置は、前記乾燥処理部への処理ガスの供給開始と実質的に同時に前記乾燥処理部へ不活性ガスの供給を開始し、前記排液口からの排液を停止した後に前記不活性ガスの前記乾燥処理部への供給を停止するように、前記不活性ガス供給機構を制御し、
前記液処理部では基板の薬液処理および水洗処理が行われ、前記乾燥処理部では前記水洗処理後の基板の乾燥処理が前記処理ガスとしてイソプロピルアルコール蒸気を用いて行われることを特徴とする請求項に記載の基板処理装置。
An inert gas supply mechanism for supplying an inert gas to the drying processing unit;
The control device starts supplying inert gas to the drying processing unit substantially simultaneously with the start of supply of processing gas to the drying processing unit, and stops the drainage from the drainage port, and then deactivates the inert gas. Controlling the inert gas supply mechanism so as to stop the supply of gas to the drying processing unit;
The chemical treatment and water washing treatment of the substrate is performed in the liquid treatment section, and the drying treatment of the substrate after the water washing treatment is performed using isopropyl alcohol vapor as the processing gas in the drying treatment section. 9. The substrate processing apparatus according to 8 .
基板を所定の処理液で処理する液処理部において基板を液処理する工程と、
前記液処理が終了した基板を前記液処理部の上方に設けられた乾燥処理部に引き上げる工程と、
前記液処理部と前記乾燥処理部との間をシャッタにより隔離する工程と、
前記乾燥処理部において前記基板を乾燥させる工程と、を有し、
前記基板の乾燥工程は、
前記乾燥処理部へ処理ガスの供給を開始する工程と、
前記処理ガスの供給を開始してから一定時間経過後に、前記シャッタに設けられた排液口を通して前記シャッタに落下した液体の吸引排液を開始する工程と、
前記排液口からの排液を開始してから所定時間経過後に前記処理ガスの供給を停止する工程と、
前記処理ガスの供給を停止してから所定時間経過後に前記排液口からの吸引排液を停止する工程と、
を有することを特徴とする基板処理方法。
A step of liquid-treating the substrate in a liquid treatment section for treating the substrate with a predetermined treatment liquid;
A step of pulling up the substrate after the liquid processing to a drying processing unit provided above the liquid processing unit;
Isolating the liquid processing unit and the drying processing unit with a shutter;
Drying the substrate in the drying processing unit,
The substrate drying process includes:
Starting the supply of processing gas to the drying processing unit;
Starting suction and drainage of the liquid that has fallen to the shutter through a drainage port provided in the shutter after a lapse of a certain time from the start of supply of the processing gas;
A step of stopping the supply of the processing gas after elapse of a predetermined time after starting drainage from the drainage port;
A step of stopping suction and drainage from the drainage port after a lapse of a predetermined time after stopping the supply of the processing gas;
A substrate processing method comprising:
前記基板の液処理には純水による水洗処理が含まれ、
前記乾燥工程においては、前記処理ガスとしてイソプロピルアルコール蒸気を用い、前記乾燥処理部へのイソプロピルアルコール蒸気の供給開始と実質的に同時に前記乾燥処理部への不活性ガスの供給をさらに開始し、前記排液口からの吸引排液を停止した後に、前記乾燥処理部への不活性ガスの供給を停止することを特徴とする請求項10に記載の基板処理方法。
The liquid treatment of the substrate includes a water washing treatment with pure water,
In the drying step, isopropyl alcohol vapor is used as the processing gas, and the supply of the inert gas to the drying processing unit is further started substantially simultaneously with the start of the supply of isopropyl alcohol vapor to the drying processing unit, The substrate processing method according to claim 10 , wherein the supply of the inert gas to the drying processing unit is stopped after the suction and drainage from the drainage port is stopped.
JP2004221998A 2004-07-29 2004-07-29 Substrate processing apparatus and substrate processing method Expired - Fee Related JP4421967B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004221998A JP4421967B2 (en) 2004-07-29 2004-07-29 Substrate processing apparatus and substrate processing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004221998A JP4421967B2 (en) 2004-07-29 2004-07-29 Substrate processing apparatus and substrate processing method

Publications (3)

Publication Number Publication Date
JP2006041372A JP2006041372A (en) 2006-02-09
JP2006041372A5 true JP2006041372A5 (en) 2008-02-07
JP4421967B2 JP4421967B2 (en) 2010-02-24

Family

ID=35906013

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004221998A Expired - Fee Related JP4421967B2 (en) 2004-07-29 2004-07-29 Substrate processing apparatus and substrate processing method

Country Status (1)

Country Link
JP (1) JP4421967B2 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4931042B2 (en) * 2006-04-10 2012-05-16 株式会社ジェイ・イー・ティ Substrate processing equipment
JP2013089699A (en) * 2011-10-14 2013-05-13 Tokyo Electron Ltd Substrate processing apparatus, substrate processing method, and computer readable storage medium storing substrate processing program
JP5715547B2 (en) * 2011-10-31 2015-05-07 東京エレクトロン株式会社 Substrate processing apparatus, substrate processing method, and computer-readable storage medium storing substrate processing program
JP7535890B2 (en) 2020-08-27 2024-08-19 東京エレクトロン株式会社 Substrate Processing Equipment
CN116598221A (en) * 2022-09-08 2023-08-15 上海至纯洁净系统科技股份有限公司 Integrated wafer drying method, system, terminal and storage medium

Similar Documents

Publication Publication Date Title
JP2004006620A5 (en)
TWI388007B (en) Liquid processing method, liquid processing device and memory medium
JP2007005478A5 (en)
JP2008235813A (en) Substrate treatment apparatus
US20210252560A1 (en) Substrate processing device and substrate processing method
JP2007157898A (en) Substrate cleaning method, substrate cleaning device, control program, and computer readable storage medium
US20060219260A1 (en) Substrate treatment apparatus and substrate treatment method
TW201032268A (en) Liquid processing method and liquid processing apparatus
TWI692831B (en) Treatment liquid supply device and degassing method
JP2001028358A (en) Apparatus and method for cleaning and drying
JP2006041372A5 (en)
JP5977058B2 (en) Treatment liquid supply apparatus and treatment liquid supply method
JP2004327826A (en) Substrate processor
TW202131437A (en) Substrate processing apparatus
JP2013015279A (en) Hot water storage type water heater
KR101426585B1 (en) Automatic Water Supply Apparatus for Bathtub and Control method thereof
CN207834261U (en) Substrate board treatment
JP2007155251A (en) Bath device
JP2004313933A (en) Spraying washing machine
JP2006181426A (en) Apparatus and method for treatment of substrate
TW202328828A (en) Substrate processing method and substrate processing apparatus
DE602006002747D1 (en) Water circulation device and method for swimming pools
KR20090047262A (en) Apparatus for supplying chemicals
JP4421967B2 (en) Substrate processing apparatus and substrate processing method
JP4036331B2 (en) Treatment liquid supply nozzle, treatment liquid supply apparatus, and nozzle cleaning method