JP5715547B2 - Substrate processing apparatus, substrate processing method, and computer-readable storage medium storing substrate processing program - Google Patents

Substrate processing apparatus, substrate processing method, and computer-readable storage medium storing substrate processing program Download PDF

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JP5715547B2
JP5715547B2 JP2011238874A JP2011238874A JP5715547B2 JP 5715547 B2 JP5715547 B2 JP 5715547B2 JP 2011238874 A JP2011238874 A JP 2011238874A JP 2011238874 A JP2011238874 A JP 2011238874A JP 5715547 B2 JP5715547 B2 JP 5715547B2
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俊行 塩川
俊行 塩川
野村 毅
毅 野村
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Tokyo Electron Ltd
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Description

本発明は、基板を液処理槽で液処理した後に乾燥処理槽で乾燥処理する基板処理装置及び基板処理方法並びに基板処理プログラムを記憶したコンピュータ読み取り可能な記憶媒体に関するものである。   The present invention relates to a substrate processing apparatus, a substrate processing method, and a computer-readable storage medium that stores a substrate processing program, in which a substrate is subjected to liquid processing in a liquid processing tank and then dried in a drying processing tank.

従来より、半導体部品やフラットパネルディスプレイなどを製造する場合には、各種の基板処理装置を用いて半導体ウエハや液晶用基板などの基板に洗浄処理等の処理を施している。   Conventionally, when manufacturing a semiconductor component, a flat panel display, or the like, a substrate such as a semiconductor wafer or a liquid crystal substrate is subjected to a process such as a cleaning process using various substrate processing apparatuses.

たとえば、特許文献1に開示された基板処理装置では、基板を処理液で液処理する液処理槽を設けるとともに、液処理槽の上方に基板を乾燥処理する乾燥処理槽を設け、液処理槽と乾燥処理槽との間で複数枚の基板を搬送する基板搬送装置を設けている。   For example, in the substrate processing apparatus disclosed in Patent Document 1, a liquid processing tank for processing a substrate with a processing liquid is provided, and a drying processing tank for drying the substrate is provided above the liquid processing tank. A substrate transfer device for transferring a plurality of substrates to and from the drying treatment tank is provided.

そして、上記基板処理装置では、複数枚の基板を基板搬送装置で垂直に保持し、液処理槽に貯留したフッ酸等の処理液に基板を浸漬して基板の液処理を行い、その後、基板を上方の乾燥処理槽に搬送し、乾燥処理槽でIPA(イソプロピルアルコール)蒸気等を用いて基板の乾燥処理を行っている。   In the substrate processing apparatus, a plurality of substrates are vertically held by the substrate transfer device, and the substrate is subjected to liquid processing by immersing the substrate in a processing solution such as hydrofluoric acid stored in a liquid processing tank. Are transported to an upper drying tank, and the substrate is dried using IPA (isopropyl alcohol) vapor or the like in the drying tank.

特開平10−209110号公報JP-A-10-209110

上記従来の基板処理装置では、乾燥処理時に、基板の表面に付着した処理液が基板の表面から下方に流下し、基板の外周縁部から滴下する。   In the conventional substrate processing apparatus, during the drying process, the processing liquid adhering to the surface of the substrate flows down from the surface of the substrate and drops from the outer peripheral edge of the substrate.

そのため、従来の基板処理装置では、処理液が基板の外周縁部から滴下するのに時間を要し、処理時間が長くなり、スループットが低下するおそれがあった。   For this reason, in the conventional substrate processing apparatus, it takes time for the processing liquid to drip from the outer peripheral edge of the substrate, the processing time becomes long, and the throughput may be reduced.

また、全ての処理液が基板から滴下せずに、一部の処理液が表面張力によって基板の外周縁部に付着したまま残留し、基板の外周縁部に塵が付着してウォーターマークが形成されてしまい、基板を良好に乾燥させることができないおそれがあった。   In addition, all the processing liquid does not drip from the substrate, and some processing liquid remains attached to the outer peripheral edge of the substrate due to surface tension, and dust adheres to the outer peripheral edge of the substrate to form a watermark. As a result, the substrate may not be dried well.

そこで、本発明では、基板処理装置において、処理液で基板の液処理を行う液処理槽と、前記液処理槽の上方に設けられ、前記基板の乾燥処理を行う乾燥処理槽と、前記液処理槽と乾燥処理槽との間に設けられ、前記液処理槽と乾燥処理槽とを遮蔽可能な遮蔽扉と、前記液処理槽と乾燥処理槽との間で前記基板の搬送を行う基板搬送手段と、前記液処理を行った前記基板から液滴を除去するために前記基板の外周縁部に対して相対的に接離可能に設けた液滴除去部材とを有することにした。   Therefore, in the present invention, in the substrate processing apparatus, a liquid processing tank that performs liquid processing of the substrate with a processing liquid, a drying processing tank that is provided above the liquid processing tank and that performs the drying processing of the substrate, and the liquid processing A shielding door which is provided between the tank and the drying processing tank and can shield the liquid processing tank and the drying processing tank; and a substrate transfer means for transferring the substrate between the liquid processing tank and the drying processing tank. And a droplet removing member provided so as to be relatively close to and away from the outer peripheral edge of the substrate in order to remove droplets from the substrate subjected to the liquid treatment.

また、前記液滴除去部材は、前記基板搬送手段によって前記基板を前記液処理槽と乾燥処理槽との間で搬送する際に前記基板と干渉しない位置に退避可能に設けることにした。   Further, the droplet removing member is provided so as to be retractable at a position where it does not interfere with the substrate when the substrate transporting means transports the substrate between the liquid processing tank and the drying processing tank.

また、前記液滴除去部材は、前記遮蔽扉に設けることにした。   Further, the droplet removing member is provided on the shielding door.

また、前記液滴除去部材は、前記基板搬送手段によって前記基板を昇降させることで前記基板の外周縁部に接離可能に設けることにした。   Further, the droplet removing member is provided so as to be able to contact and separate from the outer peripheral edge of the substrate by moving the substrate up and down by the substrate transporting means.

また、本発明では、基板処理方法において、液処理槽で基板を液処理する液処理工程と、基板搬送手段で前記基板を前記液処理槽の上方に設けられた乾燥処理槽に搬送する基板搬送工程と、前記乾燥処理槽で前記基板を乾燥処理する乾燥処理工程と、前記液処理工程の後に、液滴除去部材を前記基板の外周縁部に対して相対的に接離させて、前記基板から液滴を除去する液滴除去工程とを有することにした。   Further, in the present invention, in the substrate processing method, a liquid processing step of liquid processing the substrate in the liquid processing tank, and a substrate transfer for transferring the substrate to a drying processing tank provided above the liquid processing tank by the substrate transfer means. After the step, the drying treatment step of drying the substrate in the drying treatment tank, and the liquid treatment step, the droplet removing member is brought into contact with and separated from the outer peripheral edge of the substrate. And a droplet removing step for removing the droplet from the liquid crystal.

また、前記基板搬送工程において、前記液滴除去部材を前記基板と干渉しない位置に退避させることにした。   In the substrate transfer step, the droplet removing member is retracted to a position where it does not interfere with the substrate.

また、前記基板搬送手段によって前記基板を昇降させることで前記液滴除去部材を前記基板の外周縁部に接離させることにした。   Further, the droplet removing member is brought into contact with and separated from the outer peripheral edge of the substrate by moving the substrate up and down by the substrate transfer means.

また、本発明では、基板処理プログラムを記憶したコンピュータ読み取り可能な記憶媒体において、液処理槽に、基板を液処理させる液処理工程と、基板搬送手段に、前記基板を前記液処理槽から上方の乾燥処理槽に搬送させる基板搬送工程と、前記乾燥処理槽に、前記基板を乾燥処理させる乾燥処理工程と、前記液処理工程の後に、液滴除去部材を前記基板の外周縁部に対して相対的に接離させて、前記基板から液滴を除去する液滴除去工程とを有し、前記基板搬送工程において、前記液滴除去部材を前記基板と干渉しない位置に退避させることにした。 According to the present invention, in a computer-readable storage medium storing a substrate processing program, a liquid processing step in which a substrate is liquid processed in a liquid processing tank, and a substrate transport unit, the substrate is placed above the liquid processing tank. After the substrate transporting process for transporting to the drying processing tank, the drying processing process for drying the substrate to the drying processing tank, and the liquid processing process, the droplet removing member is relative to the outer peripheral edge of the substrate. thereby to contact away, it possesses a droplet removing step of removing liquid droplets from the substrate, in the substrate transfer step, and to retract the droplet removing member in a position that does not interfere with the substrate.

本発明によれば、基板の外周縁部から処理液を円滑に滴下させることができ、基板処理装置のスループットを向上させることができるとともに、基板を良好に乾燥させることができる。   According to the present invention, the processing liquid can be smoothly dropped from the outer peripheral edge of the substrate, the throughput of the substrate processing apparatus can be improved, and the substrate can be dried well.

基板処理装置を示す断面説明図。Cross-sectional explanatory drawing which shows a substrate processing apparatus. 液滴除去部材を示す斜視説明図。FIG. 6 is an explanatory perspective view showing a droplet removing member. 基板処理プログラムを示すフローチャート。The flowchart which shows a substrate processing program. 基板処理方法を模式的に示す断面説明図(基板搬入工程)。Cross-sectional explanatory drawing (substrate carrying-in process) which shows a substrate processing method typically. 基板処理方法を模式的に示す断面説明図(液処理工程)。Cross-sectional explanatory drawing (liquid processing process) which shows a substrate processing method typically. 基板処理方法を模式的に示す断面説明図(基板搬送工程)。Cross-sectional explanatory drawing (substrate conveyance process) which shows a substrate processing method typically. 基板処理方法を模式的に示す断面説明図(遮蔽工程)。Cross-sectional explanatory drawing (shielding process) schematically showing a substrate processing method. 基板処理方法を模式的に示す断面説明図(乾燥処理工程)。Cross-sectional explanatory drawing (drying process step) schematically showing a substrate processing method. 基板処理方法を模式的に示す断面説明図(液滴除去工程)。Cross-sectional explanatory drawing (droplet removal process) schematically showing a substrate processing method. 基板処理方法を模式的に示す断面説明図(液滴除去工程)。Cross-sectional explanatory drawing (droplet removal process) schematically showing a substrate processing method. 液滴除去手段を示す断面説明図。Cross-sectional explanatory drawing which shows a droplet removal means. 液滴除去手段を示す断面説明図。Cross-sectional explanatory drawing which shows a droplet removal means. 液滴除去手段を示す断面説明図。Cross-sectional explanatory drawing which shows a droplet removal means. 液滴除去手段を示す断面説明図。Cross-sectional explanatory drawing which shows a droplet removal means.

以下に、本発明に係る基板処理装置及び基板処理方法並びに基板処理プログラムの具体的な構成について図面を参照しながら説明する。   A specific configuration of a substrate processing apparatus, a substrate processing method, and a substrate processing program according to the present invention will be described below with reference to the drawings.

図1に示すように、基板処理装置1は、液処理手段2の上方に乾燥処理手段3を設け、液処理手段2と乾燥処理手段3との間に遮蔽手段4を設けるとともに、液処理手段2及び乾燥処理手段3に基板搬送手段5を設けている。ここで、液処理手段2は、基板6の液処理を行う。乾燥処理手段3は、基板6の乾燥処理を行う。遮蔽手段4は、液処理手段2と乾燥処理手段3とを遮蔽する。基板搬送手段5は、基板6を液処理手段2に搬入し、液処理手段2と乾燥処理手段3との間で基板6を搬送し、乾燥処理手段3から基板6を搬出する。   As shown in FIG. 1, the substrate processing apparatus 1 is provided with a drying processing unit 3 above the liquid processing unit 2, a shielding unit 4 between the liquid processing unit 2 and the drying processing unit 3, and a liquid processing unit. 2 and a drying processing means 3 are provided with a substrate transport means 5. Here, the liquid processing means 2 performs liquid processing on the substrate 6. The drying processing unit 3 performs a drying process on the substrate 6. The shielding unit 4 shields the liquid processing unit 2 and the drying processing unit 3. The substrate transport unit 5 carries the substrate 6 into the liquid processing unit 2, transports the substrate 6 between the liquid processing unit 2 and the drying processing unit 3, and unloads the substrate 6 from the drying processing unit 3.

液処理手段2は、液処理槽7に処理液供給機構8と処理液排出機構9とを接続している。   The liquid processing means 2 connects a processing liquid supply mechanism 8 and a processing liquid discharge mechanism 9 to the liquid processing tank 7.

液処理槽7は、上端部を開口させた貯留槽10の上端外周部に上端部を開口させたオーバーフロー槽11を形成し、オーバーフロー槽11の上端外周部に上端部開口させたシール槽12を形成している。貯留槽10は、処理液を貯留するとともに、貯留した処理液に基板6を浸漬させて、基板6の液処理を行う。オーバーフロー槽11は、貯留槽10からオーバーフローした処理液を貯留する。なお、オーバーフロー槽11に貯留された処理液は、貯留槽10で循環利用したり外部へ排液される。シール槽12は、貯留した純水等で液処理槽7の内部と外部とを遮断する。   The liquid treatment tank 7 is formed with an overflow tank 11 having an upper end opened at an upper end outer periphery of a storage tank 10 having an upper end opened, and a seal tank 12 having an upper end opened at an upper end outer periphery of the overflow tank 11. Forming. The storage tank 10 stores the processing liquid and immerses the substrate 6 in the stored processing liquid to perform liquid processing on the substrate 6. The overflow tank 11 stores the processing liquid that has overflowed from the storage tank 10. The processing liquid stored in the overflow tank 11 is circulated in the storage tank 10 or discharged outside. The seal tank 12 shuts off the inside and the outside of the liquid processing tank 7 with stored pure water or the like.

処理液供給機構8は、貯留槽10の内側底部に左右一対の処理液吐出ノズル13,13を配置し、処理液吐出ノズル13,13に洗浄液供給源14とリンス液供給源15とをそれぞれ流量調整器16,17を介して接続している。洗浄液供給源14は、基板6を洗浄処理するためのフッ酸等の洗浄液を供給する。リンス液供給源15は、基板6をリンス処理するための純水等のリンス液を供給する。流量調整器16,17は、制御手段18に接続しており、制御手段18で開閉制御及び流量制御される。なお、制御手段18は、基板処理装置1の全体を制御する。   The processing liquid supply mechanism 8 has a pair of left and right processing liquid discharge nozzles 13 and 13 disposed at the inner bottom of the storage tank 10, and the cleaning liquid supply source 14 and the rinse liquid supply source 15 are flowed through the processing liquid discharge nozzles 13 and 13, respectively. They are connected via regulators 16 and 17. The cleaning liquid supply source 14 supplies a cleaning liquid such as hydrofluoric acid for cleaning the substrate 6. The rinse liquid supply source 15 supplies a rinse liquid such as pure water for rinsing the substrate 6. The flow rate regulators 16 and 17 are connected to the control means 18, and the control means 18 performs open / close control and flow rate control. The control means 18 controls the entire substrate processing apparatus 1.

この処理液供給機構8は、洗浄液供給源14又はリンス液供給源15から供給される洗浄液又はリンス液のいずれかの処理液を流量調整器16,17で流量調整しながら処理液吐出ノズル13,13から貯留槽10の内部に供給する。   The processing liquid supply mechanism 8 includes a processing liquid discharge nozzle 13, while adjusting the flow rate of the cleaning liquid or the rinsing liquid supplied from the cleaning liquid supply source 14 or the rinsing liquid supply source 15 with the flow rate adjusters 16, 17. Supply from 13 to the inside of the storage tank 10.

処理液排出機構9は、貯留槽10の内側底部中央に排出口19を形成し、排出口19に開閉弁20を介して外部のドレン21に接続している。開閉弁20は、制御手段18に接続しており、制御手段18で開閉制御される。   The treatment liquid discharge mechanism 9 forms a discharge port 19 at the center of the inner bottom of the storage tank 10, and is connected to the external drain 21 through the open / close valve 20 at the discharge port 19. The on-off valve 20 is connected to the control means 18 and is controlled to be opened and closed by the control means 18.

この処理液排出機構9は、開閉弁20を開放することで貯留槽10の内部に貯留した処理液を排出口19から外部のドレン21に排出する。   The processing liquid discharge mechanism 9 discharges the processing liquid stored in the storage tank 10 from the discharge port 19 to the external drain 21 by opening the on-off valve 20.

乾燥処理手段3は、乾燥処理槽22に乾燥流体供給機構23と蓋開閉機構24とを接続している。   In the drying processing means 3, a drying fluid supply mechanism 23 and a lid opening / closing mechanism 24 are connected to the drying processing tank 22.

乾燥処理槽22は、上端部及び下端部を開口させた槽本体25の上端開口部に蓋体26を開閉可能に設けている。   The drying treatment tank 22 is provided with a lid 26 that can be opened and closed at an upper end opening of a tank body 25 having an upper end and a lower end opened.

乾燥流体供給機構23は、乾燥処理槽22の槽本体25の上部に左右一対の乾燥流体吐出ノズル27,27を配置し、乾燥流体吐出ノズル27,27にIPA供給源28と不活性ガス供給源29とをそれぞれ流量調整器30,31を介して接続している。流量調整器30,31は、制御手段18に接続しており、制御手段18で開閉制御及び流量制御される。   The drying fluid supply mechanism 23 includes a pair of left and right drying fluid discharge nozzles 27 and 27 arranged above the tank body 25 of the drying treatment tank 22, and an IPA supply source 28 and an inert gas supply source are connected to the drying fluid discharge nozzles 27 and 27. 29 are connected to each other through flow regulators 30 and 31, respectively. The flow rate adjusters 30 and 31 are connected to the control means 18, and the control means 18 performs open / close control and flow rate control.

この乾燥流体供給機構23は、IPA供給源28から供給されるIPA蒸気や不活性ガス供給源29から供給される不活性ガスを流量調整器30,31で流量調整することでイソプロピルアルコール(IPA)蒸気と不活性ガスの混合流体や加熱された不活性ガスなどからなる乾燥流体を生成し、その乾燥流体を乾燥流体吐出ノズル27,27から乾燥処理槽22の内部に供給する。   The dry fluid supply mechanism 23 adjusts the flow rate of the IPA vapor supplied from the IPA supply source 28 or the inert gas supplied from the inert gas supply source 29 by the flow rate adjusters 30 and 31 to provide isopropyl alcohol (IPA). A dry fluid composed of a mixed fluid of steam and inert gas, a heated inert gas, or the like is generated, and the dry fluid is supplied from the dry fluid discharge nozzles 27 and 27 to the inside of the drying treatment tank 22.

蓋開閉機構24は、乾燥処理槽22の蓋体26に接続されており、蓋体26を上下に昇降させることで蓋体26を開閉する。この蓋開閉機構24は、制御手段18に接続しており、制御手段18で開閉制御される。   The lid opening / closing mechanism 24 is connected to the lid body 26 of the drying treatment tank 22, and opens and closes the lid body 26 by moving the lid body 26 up and down. The lid opening / closing mechanism 24 is connected to the control means 18 and is controlled to be opened and closed by the control means 18.

遮蔽手段4は、中空箱型状のケーシング32の内部に遮蔽扉33を移動(開閉)可能に収容し、遮蔽扉33に遮蔽扉開閉機構34と排液機構35とを接続している。遮蔽扉33には、液処理後の基板6から処理液等の液滴を除去するための液滴除去手段36を設けている。   The shielding means 4 accommodates the shielding door 33 in a hollow box-shaped casing 32 so as to be movable (openable / closable), and connects the shielding door opening / closing mechanism 34 and the drainage mechanism 35 to the shielding door 33. The shielding door 33 is provided with droplet removing means 36 for removing droplets such as processing liquid from the substrate 6 after the liquid processing.

ケーシング32は、液処理槽7と乾燥処理槽22との間に介在して液処理槽7の上端開口部と乾燥処理槽22の下端開口部とを連通させる連通ケーシング37と、遮蔽扉33の開放時に遮蔽扉33を収容する遮蔽扉収容ケーシング38とで構成している。このケーシング32は、下端面に矩形枠状のシール片39を形成している。このシール片39は、シール槽12に貯留した純水に浸漬される。   The casing 32 is interposed between the liquid treatment tank 7 and the drying treatment tank 22 to communicate the upper end opening of the liquid treatment tank 7 and the lower end opening of the drying treatment tank 22, and the shielding door 33. A shielding door housing casing 38 that houses the shielding door 33 when opened is configured. The casing 32 has a rectangular frame-shaped sealing piece 39 formed on the lower end surface. The seal piece 39 is immersed in pure water stored in the seal tank 12.

遮蔽扉33は、矩形平板形状となっており、上面外周端縁部にシール部材40を取付けるとともに、上面の外周端縁部から中央部に向けて下方に傾斜させることで上面を凹状に(上面凹状部41を)形成している。この上面凹状部41は、遮蔽扉33の上面を凹状に形成していればよく、前後左右の4個の傾斜面で形成することもでき、また、下向きに凸状の1個の湾曲面で形成することもできる。   The shielding door 33 has a rectangular flat plate shape, and the seal member 40 is attached to the outer peripheral edge of the upper surface, and the upper surface is concaved by inclining downward from the outer peripheral edge of the upper surface toward the central portion (upper surface A concave portion 41) is formed. The upper surface concave portion 41 only needs to be formed in a concave shape on the upper surface of the shielding door 33, and can be formed with four inclined surfaces on the front, rear, left and right sides, and with one curved surface convex downward. It can also be formed.

遮蔽扉開閉機構34は、遮蔽扉33に接続されており、遮蔽扉33を左右及び上下に移動させることで遮蔽扉33を開閉する。この遮蔽扉開閉機構34は、制御手段18に接続しており、制御手段18で開閉制御される。   The shielding door opening / closing mechanism 34 is connected to the shielding door 33, and opens and closes the shielding door 33 by moving the shielding door 33 left and right and up and down. The shielding door opening / closing mechanism 34 is connected to the control means 18 and is controlled to be opened and closed by the control means 18.

この遮蔽扉開閉機構34は、遮蔽扉33の開放時には、遮蔽扉33を遮蔽扉収容ケーシング38の内部に移動させて、液処理槽7と乾燥処理槽22とが連通した状態にし、遮蔽扉33の閉塞時には、遮蔽扉33を遮蔽扉収容ケーシング38から連通ケーシング37に横方向に移動させるとともに、連通ケーシング37の内部で上方に移動させ、遮蔽扉33と連通ケーシング37とをシール部材40を介して密着させることで、液処理槽7と乾燥処理槽22とを遮蔽し、乾燥処理槽22を密閉した状態にする。   When the shielding door 33 is opened, the shielding door opening / closing mechanism 34 moves the shielding door 33 into the shielding door housing casing 38 so that the liquid treatment tank 7 and the drying treatment tank 22 communicate with each other. When the door is closed, the shielding door 33 is moved laterally from the shielding door housing casing 38 to the communication casing 37 and is moved upward in the communication casing 37 so that the shielding door 33 and the communication casing 37 are connected via the seal member 40. By adhering to each other, the liquid processing tank 7 and the drying processing tank 22 are shielded, and the drying processing tank 22 is sealed.

排液機構35は、遮蔽扉33の上面凹状部41の最下端部に排液口42を形成するとともに、遮蔽扉33の内部に排液口42へと連通する連通路43を形成し、連通路43に外部のドレン44を開閉弁45を介して接続している。開閉弁45は、制御手段18に接続しており、制御手段18で開閉制御される。なお、外部のドレン44は、処理液排出機構9に接続したドレン21と共通でもよい。   The drainage mechanism 35 forms a drainage port 42 at the lowermost end portion of the upper surface concave portion 41 of the shielding door 33, and forms a communication path 43 communicating with the drainage port 42 inside the shielding door 33. An external drain 44 is connected to the passage 43 via an on-off valve 45. The on-off valve 45 is connected to the control means 18 and is controlled to be opened and closed by the control means 18. The external drain 44 may be the same as the drain 21 connected to the processing liquid discharge mechanism 9.

この排液機構35は、基板6の乾燥処理を行う際に基板6から流下する液体を遮蔽扉33の上面凹状部41で収集し外部のドレン44に排出する。   The drainage mechanism 35 collects the liquid flowing down from the substrate 6 when the substrate 6 is dried by the upper surface concave portion 41 of the shielding door 33 and discharges it to the external drain 44.

液滴除去手段36は、図1及び図2に示すように、遮蔽扉33の上面凹状部41の上方に断面を菱形にした先鋭状の液滴除去部材46を取付けている。液滴除去部材46は、基板搬送手段5で保持する複数枚の基板6の配列方向に沿って伸延させた状態で遮蔽扉33の上面凹状部41の前後端部間に跨設している。   As shown in FIGS. 1 and 2, the droplet removing means 36 has a sharp droplet removing member 46 having a diamond-shaped cross section above the concave portion 41 on the upper surface of the shielding door 33. The droplet removing member 46 extends between the front and rear end portions of the upper surface concave portion 41 of the shielding door 33 in a state of being extended along the arrangement direction of the plurality of substrates 6 held by the substrate transport means 5.

この液滴除去手段36は、液滴除去部材46を基板6の外周下端縁部に対して相対的に接離(接近及び離反)させることで、基板6の外周下端縁部から液滴を除去する。すなわち、液滴除去手段36は、基板6の外周下端縁部に液滴除去部材46を接近させることで、液滴除去部材46を液滴に接触させて、液滴を液滴除去部材46に沿って連続して滴下させ、液滴除去部材46を基板6の外周下端縁部から離反させることで、基板6の外周下端縁部から液滴を表面張力によって液滴除去部材46に滴下させ、これにより、基板6の外周下端縁部から液滴を迅速かつ良好に除去する。   The droplet removing means 36 removes droplets from the lower peripheral edge of the outer periphery of the substrate 6 by bringing the droplet removing member 46 into and out of contact with the lower peripheral edge of the outer periphery of the substrate 6 (approaching and separating). To do. That is, the droplet removing means 36 brings the droplet removing member 46 into contact with the droplet by bringing the droplet removing member 46 close to the lower edge of the outer periphery of the substrate 6, so that the droplet becomes the droplet removing member 46. The droplets are continuously dropped along and the droplet removing member 46 is separated from the lower peripheral edge of the outer periphery of the substrate 6, so that the droplet is dropped from the lower peripheral edge of the outer periphery of the substrate 6 onto the droplet removing member 46 by surface tension. As a result, the droplets are quickly and satisfactorily removed from the outer peripheral lower end edge of the substrate 6.

そのため、液滴除去手段36は、液滴除去部材46を基板6の外周端部に対して相対的に接離させるための移動手段を必要とする。ここでは、液滴除去部材46を基板6に対して相対的に移動させる移動手段として基板搬送手段5を用いている。このように、液滴除去手段36は、一部を基板搬送手段5などの他の機構と兼用した構成としてもよく、また、別個独立した機構で構成してもよい。   Therefore, the droplet removing means 36 requires moving means for moving the droplet removing member 46 relative to and away from the outer peripheral end of the substrate 6. Here, the substrate transport means 5 is used as a moving means for moving the droplet removing member 46 relative to the substrate 6. As described above, the droplet removing unit 36 may be configured to partially use another mechanism such as the substrate transport unit 5 or may be configured to be a separate and independent mechanism.

基板搬送手段5は、基板6を保持する保持体47に昇降アーム48を接続し、昇降アーム48に基板搬送機構49を接続している。保持体47は、複数枚の基板6を前後に間隔をあけて平行に下方から保持する。基板搬送機構49は、昇降アーム48を介して保持体47を昇降させることで基板6を上下に搬送する。この基板搬送機構49は、制御手段18に接続しており、制御手段18で搬送制御(昇降制御)される。   In the substrate transfer means 5, a lift arm 48 is connected to a holding body 47 that holds the substrate 6, and a substrate transfer mechanism 49 is connected to the lift arm 48. The holding body 47 holds the plurality of substrates 6 from below in parallel with a gap in the front-rear direction. The substrate transport mechanism 49 transports the substrate 6 up and down by moving the holding body 47 up and down via the lifting arm 48. The substrate transport mechanism 49 is connected to the control means 18 and is transported (elevated / lowered) by the control means 18.

基板処理装置1は、以上に説明したように構成しており、制御手段18(コンピュータ)が読み取り可能な記憶媒体50に記憶した基板処理プログラムにしたがって基板6を処理する。なお、記憶媒体50は、基板処理プログラム等の各種プログラムを記憶できる媒体であればよく、ROMやRAMなどの半導体メモリー型の記憶媒体であってもハードディスクやCD−ROMなどのディスク型の記憶媒体であってもよい。   The substrate processing apparatus 1 is configured as described above, and processes the substrate 6 according to a substrate processing program stored in a storage medium 50 readable by the control means 18 (computer). The storage medium 50 may be any medium that can store various programs such as a substrate processing program. Even if it is a semiconductor memory type storage medium such as a ROM or a RAM, a disk type storage medium such as a hard disk or a CD-ROM. It may be.

まず、基板処理プログラムは、図3及び図4に示すように、基板搬入工程を実行する。この基板搬入工程において、基板処理装置1は、制御手段18によって蓋開閉機構24及び基板搬送機構49を制御して、乾燥処理槽22の内部に保持体47で保持した基板6を搬入する。   First, the substrate processing program executes a substrate carry-in process as shown in FIGS. 3 and 4. In this substrate loading process, the substrate processing apparatus 1 controls the lid opening / closing mechanism 24 and the substrate transport mechanism 49 by the control means 18 and loads the substrate 6 held by the holding body 47 into the drying processing tank 22.

次に、基板処理プログラムは、図3及び図5に示すように、液処理工程を実行する。この液処理工程において、基板処理装置1は、制御手段18によって基板搬送機構49を制御して、予め処理液を貯留した液処理槽7に基板6を搬送し、処理液に基板6を浸漬させる。これにより、基板6は、処理液で液処理される。この液処理工程において、遮蔽扉33は、遮蔽扉収容ケーシング38の内部に収容されている。しかし、処理液の蒸発や拡散などによって処理液が遮蔽扉33の表面に付着することがある。   Next, as shown in FIGS. 3 and 5, the substrate processing program executes a liquid processing step. In this liquid processing step, the substrate processing apparatus 1 controls the substrate transport mechanism 49 by the control means 18, transports the substrate 6 to the liquid processing tank 7 in which the processing liquid is stored in advance, and immerses the substrate 6 in the processing liquid. . Thereby, the substrate 6 is liquid-treated with the treatment liquid. In this liquid treatment process, the shielding door 33 is accommodated inside the shielding door accommodating casing 38. However, the processing liquid may adhere to the surface of the shielding door 33 due to evaporation or diffusion of the processing liquid.

次に、基板処理プログラムは、図3及び図6に示すように、基板搬送工程を実行する。この基板搬送工程において、基板処理装置1は、制御手段18によって基板搬送機構49を制御して、液処理槽7から上方の乾燥処理槽22の内部へ基板6を搬送する。   Next, the substrate processing program executes a substrate transfer process as shown in FIGS. In this substrate transfer process, the substrate processing apparatus 1 controls the substrate transfer mechanism 49 by the control means 18 to transfer the substrate 6 from the liquid processing tank 7 into the upper drying process tank 22.

次に、基板処理プログラムは、図3及び図7に示すように、遮蔽工程を実行する。この遮蔽工程において、基板処理装置1は、制御手段18によって遮蔽扉開閉機構34を制御して、遮蔽扉33を遮蔽扉収容ケーシング38から連通ケーシング37に横方向に移動させるとともに、連通ケーシング37の内部で上方に移動させ、乾燥処理槽22を密閉した状態で液処理槽7と乾燥処理槽22とを遮蔽する。   Next, the substrate processing program executes a shielding process as shown in FIGS. In this shielding step, the substrate processing apparatus 1 controls the shielding door opening / closing mechanism 34 by the control means 18 to move the shielding door 33 laterally from the shielding door housing casing 38 to the communication casing 37. The liquid treatment tank 7 and the drying treatment tank 22 are shielded while moving upward in the interior and sealing the drying treatment tank 22.

次に、基板処理プログラムは、図3及び図8に示すように、乾燥処理工程を実行する。この乾燥処理工程において、基板処理装置1は、制御手段18によって乾燥流体供給機構23を制御して、流量調整器30,31を所定流量で開放する。これにより、IPA供給源28や不活性ガス供給源29から供給される乾燥流体が乾燥流体吐出ノズル27,27から乾燥処理槽22の内部に供給され、乾燥流体によって基板6が乾燥処理される。   Next, the substrate processing program executes a drying process as shown in FIGS. In this drying processing step, the substrate processing apparatus 1 controls the drying fluid supply mechanism 23 by the control means 18 and opens the flow rate adjusters 30 and 31 at a predetermined flow rate. Thereby, the drying fluid supplied from the IPA supply source 28 and the inert gas supply source 29 is supplied from the drying fluid discharge nozzles 27 and 27 to the inside of the drying processing tank 22, and the substrate 6 is dried by the drying fluid.

その際に、基板処理装置1は、制御手段18によって排液機構35を制御して、開閉弁45でドレン44を開放しておく。これにより、基板6の乾燥処理を行う際に基板6から流下した液体が遮蔽扉33の上面凹状部41で収集され、連通路43を介して外部のドレン44に排出される。   At that time, the substrate processing apparatus 1 controls the drainage mechanism 35 by the control means 18 and opens the drain 44 by the opening / closing valve 45. As a result, the liquid flowing down from the substrate 6 when the substrate 6 is dried is collected by the upper surface concave portion 41 of the shielding door 33 and discharged to the external drain 44 through the communication path 43.

次に、基板処理プログラムは、図3及び図9、図10に示すように、液滴除去工程を実行する。この液滴除去工程において、基板処理装置1は、図9に示すように、制御手段18によって基板搬送機構49を制御して、保持体47を降下させて基板6を下方へ移動させ、基板6の外周下端縁部を液滴除去部材46の先端先鋭部に近接させる。これにより、液滴除去部材46の先端先鋭部が基板6の外周下端縁部の液滴に接触し、液滴が液滴除去部材46に沿って連続して遮蔽扉33の上面凹状部41に滴下する。   Next, the substrate processing program executes a droplet removing process as shown in FIGS. 3, 9, and 10. In this droplet removing step, the substrate processing apparatus 1 controls the substrate transport mechanism 49 by the control means 18 to lower the holding body 47 and move the substrate 6 downward as shown in FIG. The lower end edge of the outer periphery of the droplet is brought close to the sharp tip of the droplet removing member 46. As a result, the tip sharpened portion of the droplet removing member 46 comes into contact with the droplet at the lower end edge of the outer periphery of the substrate 6, and the droplet continuously reaches the concave portion 41 on the upper surface of the shielding door 33 along the droplet removing member 46. Dripping.

その後、基板処理装置1は、図10に示すように、制御手段18によって基板搬送機構49を制御して、保持体47を上昇させて基板6を上方へ移動させ、基板6の外周下端縁部を液滴除去部材46の先端先鋭部から離反させる。これにより、液滴が基板6の外周下端縁部から表面張力によって液滴除去部材46に滴下し、液滴除去部材46に沿って遮蔽扉33の上面凹状部41に滴下する。   Thereafter, as shown in FIG. 10, the substrate processing apparatus 1 controls the substrate transport mechanism 49 by the control means 18 to raise the holding body 47 and move the substrate 6 upward. Is separated from the tip of the droplet removing member 46. As a result, a droplet drops from the lower edge of the outer periphery of the substrate 6 to the droplet removing member 46 due to surface tension and drops along the droplet removing member 46 to the upper surface concave portion 41 of the shielding door 33.

このように、液滴除去工程では、液滴除去部材46を基板6の外周下端縁部に対して接近及び離反させることによって、基板6の外周下端縁部から液滴を迅速かつ良好に除去する。   As described above, in the droplet removing step, the droplet removing member 46 is moved toward and away from the lower end edge of the outer periphery of the substrate 6, thereby quickly and satisfactorily removing the droplet from the lower end edge of the outer periphery of the substrate 6. .

なお、この液滴除去工程においても、制御手段18によって排液機構35を制御して、開閉弁45でドレン44を開放しておき、基板6から滴下した液滴を遮蔽扉33の上面凹状部41から外部のドレン44に排出する。   Also in this droplet removing step, the drainage mechanism 35 is controlled by the control means 18, the drain 44 is opened by the opening / closing valve 45, and the droplet dropped from the substrate 6 is allowed to drop on the upper surface of the shielding door 33. Drain from 41 to external drain 44.

この液滴除去工程は、液処理工程よりも後に実行すればよく、乾燥処理工程の後に実行する場合に限られず、乾燥処理工程の開始と同時に実行してもよく、乾燥処理工程の途中から実行してもよい。また、液滴除去部材46を近接させる位置は、基板6の外周下端縁部に限られず、基板6の外周縁部であればよい。さらに、液滴除去部材46を接離させる回数は、1回に限られず、複数回にしてもよい。   This droplet removal step may be performed after the liquid treatment step, and is not limited to the case that it is performed after the drying treatment step, and may be performed simultaneously with the start of the drying treatment step, or from the middle of the drying treatment step. May be. Further, the position where the droplet removing member 46 is brought close is not limited to the outer peripheral lower end edge of the substrate 6, but may be the outer peripheral edge of the substrate 6. Furthermore, the number of times that the droplet removing member 46 is brought into contact with and separated from is not limited to once, and may be a plurality of times.

次に、基板処理プログラムは、図3に示すように、基板搬出工程を実行する。この基板搬出工程において、基板処理装置1は、制御手段18によって蓋開閉機構24及び基板搬送機構49を制御して、保持体47で保持した基板6を乾燥処理槽22の内部から搬出する。   Next, the substrate processing program executes a substrate unloading step as shown in FIG. In this substrate unloading process, the substrate processing apparatus 1 controls the lid opening / closing mechanism 24 and the substrate transport mechanism 49 by the control means 18 and unloads the substrate 6 held by the holding body 47 from the inside of the drying processing tank 22.

以上に説明したように、基板処理装置1では、基板処理プログラムに従って、基板6の処理を行うとともに、基板6の液処理後に基板6から液滴を除去している。   As described above, in the substrate processing apparatus 1, the substrate 6 is processed in accordance with the substrate processing program, and droplets are removed from the substrate 6 after the substrate 6 is subjected to liquid processing.

このように、上記基板処理装置1では、液滴除去部材46を基板6の外周縁部に接離させて液処理を行った基板6から液滴を除去することで、基板6の外周縁部から液滴を円滑に滴下させることができ、基板処理装置1のスループットを向上させることができるとともに、基板6を良好に乾燥させることができる。   As described above, in the substrate processing apparatus 1, the outer peripheral edge portion of the substrate 6 is removed by removing the liquid droplets from the substrate 6 that has been subjected to the liquid treatment by bringing the droplet removing member 46 into and out of contact with the outer peripheral edge portion of the substrate 6. The droplets can be smoothly dropped from the substrate, the throughput of the substrate processing apparatus 1 can be improved, and the substrate 6 can be dried well.

特に上記基板処理装置1では、遮蔽扉33に液滴除去部材46を設け、基板搬送手段5によって液滴除去部材46を基板6の外周縁部に接離させている。そのため、上記基板処理装置1では、液滴除去手段36に専用の移動手段を設ける必要が無くなり、液滴除去手段36の構成を簡素化することができ、液滴除去手段36を設けたことによるコスト増加を抑制することができる。また、基板搬送手段5によって基板6を液処理槽7と乾燥処理槽22との間で搬送する際に、液滴除去部材46を基板6と干渉しない位置に退避させておくことができる。   In particular, in the substrate processing apparatus 1, the droplet removing member 46 is provided on the shielding door 33, and the droplet removing member 46 is brought into contact with and separated from the outer peripheral edge of the substrate 6 by the substrate transport means 5. Therefore, in the substrate processing apparatus 1, it is not necessary to provide a dedicated moving unit for the droplet removing unit 36, the configuration of the droplet removing unit 36 can be simplified, and the droplet removing unit 36 is provided. An increase in cost can be suppressed. Further, when the substrate transporting unit 5 transports the substrate 6 between the liquid processing tank 7 and the drying processing tank 22, the droplet removing member 46 can be retracted to a position where it does not interfere with the substrate 6.

液滴除去手段36は、上記構成に限られず、基板6の外周縁部に接離可能な構成となっていればよい。   The droplet removing means 36 is not limited to the above configuration, and may be configured to be able to come into contact with and separate from the outer peripheral edge of the substrate 6.

たとえば、図11に示す液滴除去手段51では、遮蔽扉33の上面凹状部41の上方に液滴除去部材52を回転軸53を介して上下回動自在に取付けている。この液滴除去手段51では、制御手段18によって基板搬送機構49を制御して保持体47を降下させると、保持体47の下端部が液滴除去部材52に当接し、液滴除去部材52の先端部が上方に回転して基板6の外周縁部に接近する。その後、保持体47を上昇させると、液滴除去部材52の先端部が下方に回転して基板6の外周縁部から離反する。   For example, in the droplet removing means 51 shown in FIG. 11, a droplet removing member 52 is mounted above the upper surface concave portion 41 of the shielding door 33 so as to be pivotable up and down via a rotating shaft 53. In this droplet removing means 51, when the control means 18 controls the substrate transport mechanism 49 to lower the holding body 47, the lower end portion of the holding body 47 comes into contact with the droplet removing member 52, and the droplet removing member 52 The tip portion rotates upward and approaches the outer peripheral edge of the substrate 6. Thereafter, when the holding body 47 is raised, the tip of the droplet removing member 52 rotates downward and separates from the outer peripheral edge of the substrate 6.

また、図12に示す液滴除去手段54では、液滴除去部材55を遮蔽扉33ではなく基板搬送手段5(保持体47)に設けている。すなわち、この液滴除去手段54では、保持体47に液滴除去部材55を傾斜状に移動自在に取付け、液滴除去部材55の下端部に押圧面56を形成している。この液滴除去手段54では、制御手段18によって基板搬送機構49を制御して保持体47を降下させると、液滴除去部材55の押圧面56が遮蔽扉33に当接し、液滴除去部材55の先端部が保持体47に沿って傾斜状に上昇して基板6の外周縁部に接近する。その後、保持体47を上昇させると、液滴除去部材55の先端部が保持体47に沿って傾斜状に下降して基板6の外周縁部から離反する。   In the droplet removing means 54 shown in FIG. 12, the droplet removing member 55 is provided not on the shielding door 33 but on the substrate transport means 5 (holding body 47). That is, in this droplet removing means 54, the droplet removing member 55 is attached to the holding body 47 so as to be movable in an inclined manner, and a pressing surface 56 is formed at the lower end portion of the droplet removing member 55. In the droplet removing unit 54, when the control unit 18 controls the substrate transport mechanism 49 to lower the holding body 47, the pressing surface 56 of the droplet removing member 55 comes into contact with the shielding door 33, and the droplet removing member 55 The tip end of the substrate rises in an inclined manner along the holding body 47 and approaches the outer peripheral edge of the substrate 6. Thereafter, when the holding body 47 is raised, the tip end portion of the droplet removing member 55 descends along the holding body 47 so as to be separated from the outer peripheral edge portion of the substrate 6.

また、図13に示す液滴除去手段57では、液滴除去部材58を遮蔽扉33ではなく基板搬送手段5(昇降アーム48)に設けるとともに、基板搬送手段5とは別の専用の移動手段59を設けている。すなわち、この液滴除去手段57では、昇降アーム48に液滴除去部材58を移動手段59を介して取付けている。この液滴除去手段57では、制御手段18によって移動手段59を制御し、液滴除去部材58を上昇させて基板6の外周縁部に接近させ、その後、液滴除去部材58を降下させて基板6の外周縁部から離反させる。   Further, in the droplet removing means 57 shown in FIG. 13, the droplet removing member 58 is provided not on the shielding door 33 but on the substrate transfer means 5 (lifting arm 48), and a dedicated moving means 59 different from the substrate transfer means 5. Is provided. That is, in the droplet removing means 57, the droplet removing member 58 is attached to the elevating arm 48 via the moving means 59. In this droplet removing means 57, the control means 18 controls the moving means 59 to raise the droplet removing member 58 to approach the outer peripheral edge of the substrate 6, and then lower the droplet removing member 58 to lower the substrate. 6 away from the outer peripheral edge.

さらに、図14に示す液滴除去手段60では、液滴除去部材61を遮蔽扉33や基板搬送手段5ではなく乾燥処理槽22などに独立して設けるとともに、専用の移動手段62を設けている。この液滴除去手段60では、制御手段18によって移動手段62を制御し、液滴除去部材61を左右及び上下或いは回転させて、基板6の外周縁部に液滴除去部材61を近接及び離反させる。
このように、図11〜14に示した構成であっても、液滴除去部材52,55,58,61を基板6の外周縁部に接近及び離反させることができ、基板6の外周縁部から液滴を良好に除去することができる。
Further, in the droplet removing means 60 shown in FIG. 14, the droplet removing member 61 is provided independently in the drying treatment tank 22 and the like instead of the shielding door 33 and the substrate transport means 5, and a dedicated moving means 62 is provided. . In this droplet removing means 60, the moving means 62 is controlled by the control means 18, and the droplet removing member 61 is moved left and right, up and down, or rotated to bring the droplet removing member 61 close to and away from the outer peripheral edge of the substrate 6. .
As described above, even in the configuration shown in FIGS. 11 to 14, the droplet removing members 52, 55, 58, 61 can be moved closer to and away from the outer peripheral edge of the substrate 6. The droplets can be satisfactorily removed from.

1 基板処理装置
5 基板搬送手段
6 基板
7 液処理槽
22 乾燥処理槽
33 遮蔽扉
46 液滴除去部材
DESCRIPTION OF SYMBOLS 1 Substrate processing apparatus 5 Substrate conveyance means 6 Substrate 7 Liquid processing tank
22 Drying tank
33 Shield door
46 Droplet removal member

Claims (6)

処理液で基板の液処理を行う液処理槽と、
前記液処理槽の上方に設けられ、前記基板の乾燥処理を行う乾燥処理槽と、
前記液処理槽と乾燥処理槽との間に設けられ、前記液処理槽と乾燥処理槽とを遮蔽可能な遮蔽扉と、
前記液処理槽と乾燥処理槽との間で前記基板の搬送を行う基板搬送手段と、
前記液処理を行った前記基板から液滴を除去するために前記基板の外周縁部に対して相対的に接離可能に設けた液滴除去部材と、
を有し、
前記液滴除去部材は、前記基板搬送手段によって前記基板を前記液処理槽と乾燥処理槽との間で搬送する際に前記基板と干渉しない位置に退避可能に設けたことを特徴とする基板処理装置。
A liquid processing tank for performing liquid processing of the substrate with the processing liquid;
A drying treatment tank provided above the liquid treatment tank and performing a drying treatment of the substrate;
A shielding door provided between the liquid treatment tank and the drying treatment tank, and capable of shielding the liquid treatment tank and the drying treatment tank;
Substrate transport means for transporting the substrate between the liquid treatment tank and the drying treatment tank;
A droplet removing member provided so as to be able to contact and separate relative to the outer peripheral edge of the substrate in order to remove droplets from the substrate subjected to the liquid treatment;
I have a,
The substrate processing characterized in that the droplet removing member is provided so as to be retractable at a position that does not interfere with the substrate when the substrate transporting means transports the substrate between the liquid processing tank and the drying processing tank. apparatus.
前記液滴除去部材は、前記遮蔽扉に設けたことを特徴とする請求項1に記載の基板処理装置。 The substrate processing apparatus according to claim 1 , wherein the droplet removing member is provided on the shielding door. 前記液滴除去部材は、前記基板搬送手段によって前記基板を昇降させることで前記基板の外周縁部に接離可能に設けたことを特徴とする請求項1又は請求項2に記載の基板処理装置。 3. The substrate processing apparatus according to claim 1, wherein the droplet removing member is provided so as to be able to contact and separate from an outer peripheral edge of the substrate by moving the substrate up and down by the substrate transport unit. . 液処理槽で基板を液処理する液処理工程と、
基板搬送手段で前記基板を前記液処理槽の上方に設けられた乾燥処理槽に搬送する基板搬送工程と、
前記乾燥処理槽で前記基板を乾燥処理する乾燥処理工程と、
前記液処理工程の後に、液滴除去部材を前記基板の外周縁部に対して相対的に接離させて、前記基板から液滴を除去する液滴除去工程と、
を有し、
前記基板搬送工程において、前記液滴除去部材を前記基板と干渉しない位置に退避させることを特徴とする基板処理方法。
A liquid processing step of liquid processing a substrate in a liquid processing tank;
A substrate transfer step of transferring the substrate to a drying treatment tank provided above the liquid treatment tank by a substrate transfer means;
A drying process for drying the substrate in the drying tank;
A droplet removing step of removing the droplet from the substrate by bringing the droplet removing member into contact with and separating from the outer peripheral edge of the substrate after the liquid treatment step;
I have a,
In the substrate transporting step, the droplet removing member is retracted to a position where it does not interfere with the substrate.
前記基板搬送手段によって前記基板を昇降させることで前記液滴除去部材を前記基板の外周縁部に接離させることを特徴とする請求項4に記載の基板処理方法。 The substrate processing method according to claim 4 , wherein the droplet removing member is brought into contact with or separated from an outer peripheral edge portion of the substrate by moving the substrate up and down by the substrate transport unit. 液処理槽に、基板を液処理させる液処理工程と、
基板搬送手段に、前記基板を前記液処理槽から上方の乾燥処理槽に搬送させる基板搬送工程と、
前記乾燥処理槽に、前記基板を乾燥処理させる乾燥処理工程と、
前記液処理工程の後に、液滴除去部材を前記基板の外周縁部に対して相対的に接離させて、前記基板から液滴を除去する液滴除去工程と、
を有し、
前記基板搬送工程において、前記液滴除去部材を前記基板と干渉しない位置に退避させることを特徴とする基板処理プログラムを記憶したコンピュータ読み取り可能な記憶媒体。
A liquid processing step of liquid processing the substrate in the liquid processing tank;
A substrate transporting step for transporting the substrate from the liquid processing tank to an upper drying processing tank on a substrate transporting means;
A drying process for drying the substrate in the drying tank;
A droplet removing step of removing the droplet from the substrate by bringing the droplet removing member into contact with and separating from the outer peripheral edge of the substrate after the liquid treatment step;
I have a,
A computer-readable storage medium storing a substrate processing program, wherein in the substrate transporting step, the droplet removing member is retracted to a position where it does not interfere with the substrate.
JP2011238874A 2011-10-31 2011-10-31 Substrate processing apparatus, substrate processing method, and computer-readable storage medium storing substrate processing program Expired - Fee Related JP5715547B2 (en)

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