JP2006036994A - Electroconductive resin composition - Google Patents

Electroconductive resin composition Download PDF

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JP2006036994A
JP2006036994A JP2004221205A JP2004221205A JP2006036994A JP 2006036994 A JP2006036994 A JP 2006036994A JP 2004221205 A JP2004221205 A JP 2004221205A JP 2004221205 A JP2004221205 A JP 2004221205A JP 2006036994 A JP2006036994 A JP 2006036994A
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resin composition
conductive
conductive resin
electroconductive resin
fiber
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JP4679849B2 (en
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Kunihiro Hisatsune
邦裕 久恒
Masahiro Uchida
昌宏 内田
Takahiro Asakura
孝宏 朝倉
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Aica Kogyo Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide an electroconductive resin composition holding a stable static-prevention property, having less sedimentation of electroconductive filler in the coating even in its storage and excellent in working property. <P>SOLUTION: This electroconductive resin composition is characterized by containing stainless steel fibers having 80-150 μm fiber length and 10-15 μm fiber diameter, a sedimentation-preventing agent, a resin and a blended material. By using the electroconductive resin composition as a floor-finishing material, it is possible to impart excellent sedimentation preventing property to the electroconductive resin composition and form the film layer of the finish coating material capable of exhibiting the stable electroconductivity as coated film physical properties. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は安定した帯電防止性能を保持し、貯蔵中においても塗料中の導電性フィラーの沈降が少なく、作業性に優れた導電性樹脂組成物を提供することにある。
An object of the present invention is to provide a conductive resin composition that maintains stable antistatic performance, has little sedimentation of the conductive filler in the paint even during storage, and has excellent workability.

従来、電気不良導体の表面に導電性を付与するための導電性樹脂組成物には、導電性フィラーとして、金属、酸化亜鉛などの電気良導体の粉末、導電性カーボンブラック、炭素繊維が配合されている。（特許文献1、特許文献2、特許文献3参照）さらに、安定した帯電防止性能を保持し、耐久性に優れる導電性フィラーとして、繊維長が80μｍから150μｍ、繊維径が10〜15μｍの範囲にあるステンレスファイバーを配合した導電性樹脂組成物が提案されている。（特許文献4参照）しかし、これらの導電性フィラーは粒子径が大きく、比重も大きいために塗料中で容易に沈降が生じるといった問題があった。そのため、親水性コロイダルシリカとフッ素を含有する水溶解可能な又は水に分散可能なエチレンオキシドリンケージ及び非イオンフッ化炭化水素重合体である界面活性剤を用いることにより、メタリック塗料の顔料の沈降を遅らせ、塗料の安定性及び性能を改善できることが開示されている。（特許文献5参照）しかし、無機シリカを用いていることから、粉塵の問題があった。さらに、炭素数２〜１２を有するプライマリージアミンと、前記ジアミンに対し過剰の、不飽和脂肪酸を重合して得られる二量体ジカルボン酸（一般名ダイマー酸）、又はダイマー酸と炭素数３〜２１を有する他のジカルボン酸及び／又は炭素数２〜２２を有するモノカルボン酸の混合物とを反応して得られるポリアマイドを、中和用塩基を用いて中和後に水を主体とする媒体中に分散させる、沈降防止方法が提供されている。（特許文献6）しかし、この沈降防止剤では水系塗料にしか添加することができないといった問題がある。
特開平４−298536 特開平５‐43823 特開平10−195406 特願2004‐037817 特開平４−２３４４６１ 特開平１０−３１０７２６ Conventionally, a conductive resin composition for imparting conductivity to the surface of an electrically defective conductor has been blended with a conductive filler such as metal, zinc oxide or the like, conductive carbon black, and carbon fiber as a conductive filler. Yes. (Refer to Patent Document 1, Patent Document 2, and Patent Document 3) Furthermore, as a conductive filler that maintains stable antistatic performance and has excellent durability, the fiber length is in the range of 80 μm to 150 μm, and the fiber diameter is in the range of 10 to 15 μm. A conductive resin composition containing a certain stainless fiber has been proposed. However, since these conductive fillers have a large particle diameter and a large specific gravity, there is a problem that sedimentation easily occurs in the paint. Therefore, by using hydrophilic colloidal silica and fluorine-containing water-soluble or water-dispersible ethylene oxide linkage and a surfactant that is a non-ionic fluorohydrocarbon polymer, the settling of the pigment of the metallic paint is delayed, It is disclosed that the stability and performance of paints can be improved. However, since inorganic silica is used, there is a problem of dust. Further, a primary diamine having 2 to 12 carbon atoms and a dimer dicarboxylic acid (generic name dimer acid) obtained by polymerizing an unsaturated fatty acid in excess of the diamine, or a dimer acid and 3 to 21 carbon atoms. Disperse in a medium mainly composed of water after neutralization with a neutralizing base using a neutralizing base and reacting with a mixture of another dicarboxylic acid having a C and / or a monocarboxylic acid mixture having 2 to 22 carbon atoms An anti-settling method is provided. However, there is a problem that this anti-settling agent can only be added to water-based paints.
JP-A-4-298536 JP-A-5-43823 JP-A-10-195406 Japanese Patent Application 2004-037817 JP-A-4-234461 JP 10-310726 A

従来より沈降防止剤として多種のものが提案されているにもかかわらず、導電性樹脂組成物に用いられる導電性フィラーとして、金属、酸化亜鉛などの電気良導体の粉末、導電性カーボンブラック、炭素繊維、あるいはステンレスファイバーなどは、粒子径が大きく、比重も大きいため沈降を防止するには効果が不十分であるといった問題を抱えていた。 Despite various types of anti-settling agents that have been proposed in the past, as conductive fillers used in conductive resin compositions, powders of good electrical conductors such as metals and zinc oxide, conductive carbon black, and carbon fibers Alternatively, stainless steel fiber has a problem that its effect is insufficient to prevent sedimentation because of its large particle size and large specific gravity.

本発明者は、このような問題を解決するため新しい導電性樹脂組成物中に配合する沈降防止剤を探索する中で、顔料や導電性フィラーの沈降を防止して、施工後の導電性を均一に発現することができる導電性樹脂組成物を見いだすことに成功し、本発明を完成するに至った。すなわち本発明は、導電性樹脂組成物に対し優れた沈降防止性を付与し、塗膜物性に対し安定した導電性の発現を可能とする導電性硬質ウレタン樹脂組成物を提供することを目的とするものである。
In order to solve such problems, the present inventor searched for an anti-settling agent to be blended in a new conductive resin composition, and prevented the settling of pigments and conductive fillers, thereby improving the conductivity after construction. The present inventors have succeeded in finding a conductive resin composition that can be expressed uniformly, and have completed the present invention. That is, an object of the present invention is to provide a conductive hard urethane resin composition that imparts excellent anti-settling property to a conductive resin composition and enables stable expression of coating film properties. To do.

請求項１の発明は、繊維長が80μｍから150μｍ、繊維径が10〜15μｍの範囲にあるステンレスファイバー、沈降防止剤、樹脂及び配合材を含む導電性樹脂組成物を特徴とする。本発明の導電性樹脂組成物を床用上塗り材として用いることで、背景技術に記載した上記の問題点を解決することができる。つまり、導電性樹脂組成物に対し優れた沈降防止性を付与し、塗膜物性に対し安定した導電性の発現を可能とする床用上塗り材の成膜層を形成することができる。 The invention of claim 1 is characterized by a conductive resin composition including a stainless fiber having a fiber length of 80 to 150 μm and a fiber diameter of 10 to 15 μm, an anti-settling agent, a resin and a compounding material. By using the conductive resin composition of the present invention as a floor top coating material, the above-mentioned problems described in the background art can be solved. That is, it is possible to form a film-forming layer of a floor top coating material that imparts excellent anti-settling properties to the conductive resin composition and enables stable expression of the coating film properties.

本発明の導電性樹脂組成物中に含まれるステンレスファイバーは繊維状のため樹脂内部でネットワークを形成し高い導電性を付与できる。さらに、繊維長が80μm以下だと導電性が得られず、150μmより長いと仕上がり外観が悪くなるため、繊維長は80μmから150μmの範囲が望ましい。また、繊維径は、塗膜の均一性、作業性を損なわない限り特に制限されないが、電気導電性、作業性を低下させない範囲として、10〜15μｍの範囲が好ましい。ステンレスファイバーとしては、具体的には、川崎テクノリサーチ株式会社製、不定形微細繊維状ＳＭＦ（ステンレス・スチール・マイクロ・ファイバー）等が挙げられる。 Since the stainless steel fiber contained in the conductive resin composition of the present invention is fibrous, it can form a network inside the resin and impart high conductivity. Furthermore, if the fiber length is 80 μm or less, conductivity cannot be obtained, and if it is longer than 150 μm, the finished appearance is deteriorated. Therefore, the fiber length is preferably in the range of 80 μm to 150 μm. Further, the fiber diameter is not particularly limited as long as the uniformity and workability of the coating film are not impaired, but a range of 10 to 15 μm is preferable as a range in which the electrical conductivity and workability are not deteriorated. Specific examples of the stainless steel fiber include Kawasaki Techno Research Co., Ltd., amorphous fine fiber SMF (stainless steel, microfiber, etc.).

本発明の導電性樹脂組成物中に含まれる、ステンレスファイバーの配合量は、1.5重量％以下の配合量では安定した導電性が得られず、5重量％よりも多く配合したときは、仕上がり外観が悪くなるため、導電性樹脂組成物100重量部に対して1.5重量％から5重量％の範囲が望ましい。
本発明の導電性樹脂組成物は、仕上がりに影響の無い範囲で導電性無機質材料とステンレスファイバーの併用も可能である。導電性無機質材料としてはカーボングラファイトや炭素繊維、導電性マイカ、錫、アルミニウム、銅、ニッケル、亜鉛、アンチモン、チタン等の金属酸化物、及びこれらの中から選ばれる２種以上の組み合わせが用いられる。 The amount of stainless steel contained in the conductive resin composition of the present invention is such that stable conductivity cannot be obtained at a blending amount of 1.5% by weight or less. Therefore, the range of 1.5% by weight to 5% by weight with respect to 100 parts by weight of the conductive resin composition is desirable.
The conductive resin composition of the present invention can be used in combination with a conductive inorganic material and stainless steel fiber as long as the finish is not affected. As the conductive inorganic material, carbon graphite, carbon fiber, conductive mica, tin, aluminum, copper, nickel, zinc, antimony, titanium and other metal oxides, and combinations of two or more selected from these are used. .

本発明の導電性樹脂組成物中に含まれる、沈降防止剤はウレアウレタン、Ｎ−メチル-2-
ピロリドン、リチウムクロライドの非水溶性混合物から構成される。具体的にはビック
ケミ−・ジャパン株式会社製、BYK-410(登録商標)等が挙げられる。 Anti-settling agents contained in the conductive resin composition of the present invention are urea urethane, N-methyl-2-
It is composed of a water-insoluble mixture of pyrrolidone and lithium chloride. Specific examples include BYK-410 (registered trademark) manufactured by Big Chemi Japan Co., Ltd.

本発明の導電性樹脂組成物中に含まれる、沈降防止剤の配合量は導電性樹脂組成物に対
して、0.1重量部以下ではその効果が得られず、1.0重量部より多いと塗料の粘度が急激に上がり後の作業性が悪くなるため、0.1〜1.0重量部が望ましい。 The blending amount of the anti-settling agent contained in the conductive resin composition of the present invention is less than 0.1 part by weight with respect to the conductive resin composition, and the effect cannot be obtained. 0.1 to 1.0 part by weight is desirable because the workability after abruptly rising becomes worse.

本発明の導電性樹脂組成物に含まれる樹脂としては、例えばエポキシ樹脂、ポリウレタン樹脂、アクリル樹脂、ポリアミド樹脂、塩化ビニル樹脂、塩ビ酢ビ共重合樹脂、ポリエステル樹脂、フェノール樹脂、アルキド樹脂、アクリルエマルジョンなど、通常塗り床材に使われる汎用樹脂が利用でき、必要により組み合わせて用いられる。また、添加剤としては分散剤、可塑剤、顔料、表面調整剤、レベリング剤、消泡剤等が必要に応じて用いられる。配合材は、樹脂１００重量部に対して、1.0〜20重量部、さらに好ましくは5.0〜10重量部の範囲で用いることが好ましい。本発明の導電性樹脂組成物は、上記の成分を溶剤と共に混合して導電性樹脂組成物とする。溶剤としては、例えば、ブタノール、キシレン、ケトン、トルエン、メチルエチルケトン等が用いられる。 Examples of the resin contained in the conductive resin composition of the present invention include epoxy resins, polyurethane resins, acrylic resins, polyamide resins, vinyl chloride resins, polyvinyl chloride copolymer resins, polyester resins, phenol resins, alkyd resins, and acrylic emulsions. For example, general-purpose resins usually used for coating floor materials can be used and used in combination as necessary. Further, as the additive, a dispersant, a plasticizer, a pigment, a surface conditioner, a leveling agent, an antifoaming agent and the like are used as necessary. The compounding material is preferably used in the range of 1.0 to 20 parts by weight, more preferably 5.0 to 10 parts by weight with respect to 100 parts by weight of the resin. In the conductive resin composition of the present invention, the above components are mixed with a solvent to obtain a conductive resin composition. Examples of the solvent include butanol, xylene, ketone, toluene, methyl ethyl ketone, and the like.

本発明の導電性樹脂組成物は、最終的に塗膜とした場合に、表面抵抗率が5×104〜1×10８Ωとなるよう調整することが好ましい。 The conductive resin composition of the present invention is preferably adjusted to have a surface resistivity of 5 × 10 4 to 1 × 10 8 Ω when finally formed into a coating film.

請求項２、及び3の発明は、請求項1に記載の導電性樹脂組成物中に配合される沈降防止剤を要旨とする。沈降防止剤が、ウレアウレタン、Ｎ−メチル-2-ピロリドン、リチウムクロライドの混合物から成ることを特徴とする。すなわち、この沈降防止剤を本発明の導電性樹脂組成物として用いることで、背景技術に記載した上記の問題点を解決することができる。つまり、導電性樹脂組成物に対し優れた沈降防止性を付与し、塗膜物性に対し安定した導電性の発現を可能とする床用上塗り材の成膜層を形成することができる。 The gist of inventions of claims 2 and 3 is an anti-settling agent blended in the conductive resin composition of claim 1. The anti-settling agent is characterized by comprising a mixture of urea urethane, N-methyl-2-pyrrolidone and lithium chloride. That is, by using this anti-settling agent as the conductive resin composition of the present invention, the above-mentioned problems described in the background art can be solved. That is, it is possible to form a film-forming layer of a floor top coating material that imparts excellent anti-settling properties to the conductive resin composition and enables stable expression of the coating film properties.

本発明の導電性塗り床は、導電性上塗りの成膜層以外の構成は、任意のものとすることができる。例えば、導電性中塗りの成膜層よりも下層に、下地調整材から成る層を備えていてもよい。更に、本発明の導電性塗り床は、導電性中塗りの成膜層よりも下層に下地調整材から成る層を備えると同時に、導電性中塗りから成る成膜層よりも上層に、上塗り材から成る層を備えていてもよい。
また、上記中塗り材は、例えば、導電性上塗りと同様に、請求項１記載の導電性樹脂組成物であってもよい。上記上塗り材は、塗膜とした場合に表面電気抵抗値が5×104〜1×10８Ωとなるように調整することが好ましい。また、上記上塗り材の施工塗布量は、例えば0.8〜2.0Kg/ m2の範囲が好ましい。 The conductive coated floor of the present invention may have any configuration other than the conductive overcoating film-forming layer. For example, a layer made of a base conditioner may be provided below the conductive intermediate coating layer. Furthermore, the conductive coating floor of the present invention comprises a layer made of a base conditioning material in a lower layer than the film-forming layer of the conductive intermediate coating, and at the same time, a top-coating material in an upper layer than the film-forming layer made of the conductive intermediate coating. You may provide the layer which consists of.
Moreover, the said intermediate coating material may be the conductive resin composition of Claim 1 like a conductive top coat, for example. It is preferable that the top coating material is adjusted so that the surface electrical resistance value is 5 × 10 4 to 1 × 10 8 Ω when a coating film is formed. Moreover, the application amount of the top coating material is preferably in the range of 0.8 to 2.0 kg / m 2 , for example.

本発明の導電性塗り床では、床用上塗り材の成膜層以外の構成は任意のものとすることができる。例えば、床用上塗り材から成る成膜層よりも下層に、下地調整材から成る層、または導電性中塗りから成る層を備えていても良い。また、本発明の導電性塗り床は、上塗り材から成る成膜層よりも下層に、下地調整材から成る層と、導電性中塗りから成る層との両方を備えていても良い。
上記導電性中塗りは、例えば、床用上塗り材と同様に、請求項１記載の導電性樹脂組成物であってもよい。導電性中塗りの施工塗布量は、例えば、０．１〜０．３Ｋｇ／ｍ２の範囲が好ましい。上記導電性中塗りは、最終的に塗膜とした場合に表面抵抗率が1.2×105Ω以下となるよう調整することが好ましい。
In the conductive coating floor of the present invention, the configuration other than the film forming layer of the floor top coating material can be arbitrary. For example, a layer made of an undercoat conditioning material or a layer made of a conductive intermediate coating may be provided below the film-forming layer made of a floor top coating material. In addition, the conductive coating floor of the present invention may include both a layer made of an undercoat conditioning material and a layer made of a conductive intermediate coating in a lower layer than a film-forming layer made of a top coating material.
The conductive intermediate coating may be, for example, the conductive resin composition according to claim 1, similarly to the floor top coat material. The applied amount of the conductive intermediate coating is preferably, for example, in the range of 0.1 to 0.3 Kg / m 2 . The conductive intermediate coating is preferably adjusted so that the surface resistivity is 1.2 × 10 5 Ω or less when finally formed as a coating film.

本発明の導電性樹脂組成物は、繊維長が80μｍから150μｍ、繊維径が10〜15μｍの範囲にあるステンレスファイバー、沈降防止剤、樹脂及び配合材を含む導電性樹脂組成物から成り、貯蔵中においても塗料中の導電性フィラーの沈降が少なく、作業性に優れた導電性樹脂組成物を得ることができる。さらに、導電性樹脂組成物に対し優れた沈降防止性を付与し、塗膜物性に対し安定した導電性の発現を可能とする床用上塗り材の成膜層を形成することができる。 The conductive resin composition of the present invention comprises a conductive resin composition comprising a stainless fiber having a fiber length of 80 to 150 μm and a fiber diameter of 10 to 15 μm, an anti-settling agent, a resin and a compounding material. The conductive resin composition excellent in workability can be obtained with less sedimentation of the conductive filler in the coating. Furthermore, it is possible to form a film-forming layer of a floor top coat material that imparts excellent anti-settling property to the conductive resin composition and enables stable expression of the coating film properties.

以下、実施例により本発明をさらに詳述する。尚、実施例における、％配合量は重量％
である。

保存安定性試験
内径3ｃｍ、高さ30ｃｍの透明チューブに、下記表1の主剤に示す配合で、実施例1、比較例1用の導電性樹脂組成物を充填し、５０℃の恒温槽に１４日間静置後、両者の比較を行った。
評価の項目は○、×で示した。結果は表2に示した。
○：外見に変化は無く、導電性樹脂組成物中の顔料、導電フィラー等の沈降も確認されなかった。
×：導電組成物中の導電フィラーが透明チューブの底に約10ｃｍ沈殿していた。





Hereinafter, the present invention will be described in more detail by way of examples. In the examples, the amount of% blended is weight%
It is.

Storage stability test A transparent tube having an inner diameter of 3 cm and a height of 30 cm was filled with the conductive resin composition for Example 1 and Comparative Example 1 in the composition shown in the main agent of Table 1 below. After standing for one day, both were compared.
Items for evaluation are indicated by ○ and ×. The results are shown in Table 2.
◯: There was no change in appearance, and precipitation of pigments, conductive fillers, etc. in the conductive resin composition was not confirmed.
X: About 10 cm of conductive filler in the conductive composition was precipitated at the bottom of the transparent tube.





表１

Table 1

2週間保存（50℃）後の上塗り電気抵抗試験
上塗り電気抵抗試験はNFPA99に規定する試験方法により行った。90ｃｍ×90ｃｍ×0.4ｃｍのスレート板上に、まず、下地調整材を0.6 kg/m2コテを用いて塗装した後、導電性中塗り（アイカ工業(株)製、商品名：ＪＪ-160）を0.2 kg/m2ローラーを用いて重ねて塗装した。その後、25℃で3日間養生後、上記方法により保存安定性試験を実施した後、表１に記載の、導電性上塗りの成膜層の特性を測定した。測定方法は、500Ｖテスターを使用し、測定間隔91.4ｃｍで、床用上塗り材の成膜層の表面電気抵抗値を測定した。結果は表2に示した。 Topcoat electrical resistance test after storage for 2 weeks (50 ° C.) The topcoat electrical resistance test was conducted according to the test method specified in NFPA99. On the 90cm × 90cm × 0.4cm slate plate, first, the base material was coated with 0.6 kg / m 2 iron, and then conductive intermediate coating (trade name: JJ-160, manufactured by Aika Industry Co., Ltd.) Was applied in layers using a 0.2 kg / m 2 roller. Thereafter, after curing at 25 ° C. for 3 days, a storage stability test was carried out by the above-mentioned method, and the properties of the conductive overcoat film-forming layer described in Table 1 were measured. As a measuring method, a surface electric resistance value of a film forming layer of the floor top coat was measured using a 500V tester at a measurement interval of 91.4 cm. The results are shown in Table 2.

実施例1
基材上に、下地調整材（アイカ工業（株）製、商品名：ＪＪ-100）をコテにて、0.6ｋｇ/ｍ２の密度で２回塗布した後、導電性中塗り（アイカ工業(株)製、商品名：ＪＪ-160）をローラーにて0.2ｋｇ/ｍ２塗布した。その後、25℃で3日間養生後、上記方法により保存安定性試験を実施した後、表１に示す床用上塗り材（アイカ工業(株)製、商品名：ＪＪ-165）として、主剤、硬化剤を4/1の割合で配合し、コテにて1.2ｋｇ/ｍ２塗布し、本発明の導電性塗り床を得た。尚、上記表１における各成分の配合量は、溶剤、不揮発分を含む。 Example 1
On the base material, a base material (manufactured by Aika Industry Co., Ltd., trade name: JJ-100) was applied twice at a density of 0.6 kg / m 2 with a trowel, and then a conductive intermediate coating (Aika Industry ( Co., Ltd., trade name: JJ-160) was applied with a roller at 0.2 kg / m 2 . Thereafter, after curing at 25 ° C. for 3 days, the storage stability test was carried out by the above method, and then the main coating and curing as a floor covering material (trade name: JJ-165, manufactured by Aika Kogyo Co., Ltd.) shown in Table 1. The agent was blended at a ratio of 4/1, and 1.2 kg / m 2 was applied with a trowel to obtain the conductive coated floor of the present invention. In addition, the compounding quantity of each component in the said Table 1 contains a solvent and a non volatile matter.

比較例1
比較例1として、従来品の配合例を説明する。実施例1と同様な手段にて、基材上に下地調整材を２回塗布した後、導電性中塗り（アイカ工業(株)製、商品名：ＪＪ-160）をローラーにて0.2ｋｇ/ｍ２塗布した。その後、25℃で3日間養生後、上記方法により保存安定性試験を実施した後、床用上塗り材として、表1に示す導電性上塗り組成物の主剤、硬化剤を4/1の割合で配合し、コテにて1.2ｋｇ/ｍ２塗布し、導電性塗り床を得た。この比較例１における上塗り材は、沈降防止剤を含まないため、本発明の範囲外である。尚、上記表１における各成分の配合量は、溶剤、不揮発分を含む。 Comparative Example 1
As Comparative Example 1, an example of blending a conventional product will be described. In the same manner as in Example 1, after applying the substrate conditioning material twice on the substrate, a conductive intermediate coat (trade name: JJ-160, manufactured by Aika Kogyo Co., Ltd.) was 0.2 kg / m 2 was applied. Then, after curing at 25 ° C for 3 days, the storage stability test was carried out by the above method, and then the main component and curing agent of the conductive overcoating composition shown in Table 1 were blended at a ratio of 4/1 as a floor top coating material. Then, 1.2 kg / m 2 was applied with a trowel to obtain a conductive coated floor. Since the topcoat material in Comparative Example 1 does not contain an anti-settling agent, it is out of the scope of the present invention. In addition, the compounding quantity of each component in the said Table 1 contains a solvent and a non volatile matter.

表2

Table 2

Claims (3)

繊維長が80μｍから150μｍ、繊維径が10〜15μｍの範囲にあるステンレスファイバー、沈降防止剤、樹脂及び配合材を含む導電性樹脂組成物。 A conductive resin composition comprising stainless fiber having a fiber length of 80 to 150 μm and a fiber diameter of 10 to 15 μm, an anti-settling agent, a resin and a compounding material. 請求項１に記載の沈降防止剤が、ウレアウレタン、Ｎ−メチル-2-ピロリドン、リチウムクロライドの非水溶性混合物から成ることを特徴とする導電性樹脂組成物。 A conductive resin composition, wherein the anti-settling agent according to claim 1 comprises a water-insoluble mixture of urea urethane, N-methyl-2-pyrrolidone, and lithium chloride. 請求項１、2に記載の沈降防止剤が導電性樹脂組成物に対して、0.1〜1.0重量部含まれていることを特徴とする導電性組成物。 An electroconductive composition comprising 0.1 to 1.0 part by weight of the anti-settling agent according to claim 1 or 2 with respect to the electroconductive resin composition.
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US11001729B2 (en) 2016-06-20 2021-05-11 Mitsubishi Electric Corporation Coating material, coating film, and gas insulated switchgear

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WO2013120719A1 (en) 2012-02-17 2013-08-22 Construction Research & Technology Gmbh Antistatic flooring composition
US11001729B2 (en) 2016-06-20 2021-05-11 Mitsubishi Electric Corporation Coating material, coating film, and gas insulated switchgear

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