JP2005226025A - Conductive hard urethane-based composition - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a conductive hard urethane-based composition and a conductive coated floor that maintain a stable antistatic property and are excellent in durability, and to provide a method for applying the same. <P>SOLUTION: The conductive composition comprises a stainless steel fiber, whose length is 80-150 μm and diameter is 10-15 μm, a resin and a compounding agent. The above-mentioned problem can be solved by using the conductive composition as a coating material of a conductive coated floor, and also a film forming layer of a top-coat material for a conductive coated floor excellent in adhesiveness can be formed by using the conductive composition. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

The present invention relates to a conductive composition that retains stable antistatic performance and is excellent in durability, a conductive coating floor, and a method for applying the same. That is, the present invention relates to a conductive composition that imparts conductivity to the surface of an electrically defective conductor, or imparts antistatic performance to an environment in which the generation of static electricity should be avoided, a conductive coating floor, and a construction method thereof. is there.

Conventionally, as a conductive top coating composition for imparting conductivity to the surface of an electrically defective conductor, that is, an antistatic coating material, a powder of a good electric conductor such as metal and zinc oxide, conductive carbon black, and carbon fiber are blended. Those are known (see Patent Document 1, Patent Document 2, and Patent Document 3). Such a technique is widely used industrially. For example, as a specification of the conductive coating floor, a method of forming from three layers of undercoat, intermediate coat, and topcoat has been proposed. In addition, an undercoat material is used for the undercoating, a conductive intermediate coating material containing carbon graphite is used for the intermediate coating, and a conductive top coating material containing a conductive substance such as zinc oxide is used for the top coating (Patent Document 4). reference).
Furthermore, a method of curing by microwave irradiation has been proposed in order to include a conductive filler in the coating composition and increase the drying speed of the coating film (see Patent Document 4).
JP-A-4-298536 JP-A-5-43823 JP-A-10-195406 JP-A-8-143793 JP2003-64314

However, the anti-static coating material, which contains metal, good electrical conductor powder such as zinc oxide, conductive carbon black, and carbon fiber, has a low conductivity of the coating film. Requires a large amount of conductive carbon black to be added.
However, when conductive carbon black is added to the resin solution, the viscosity of the coating solution increases significantly, and uniform coating by a method such as spraying or dipping is difficult.
Accordingly, not only the workability is lowered, but the coating strength is lowered by adding a large amount of carbon black, cracks are easily generated in the coating film, and the adhesion between the top coat layer and the intermediate coat layer is lowered. There was a problem.
In addition, since the coating composition includes a conductive filler and increases the drying speed of the coating film, the method of curing by microwave irradiation requires a separate microwave irradiation apparatus, which increases costs.
The present invention has been made in view of the above points, and provides a conductive composition having excellent adhesion by natural curing, a conductive coating floor, and a method for its construction without the need for adding a large amount of carbon black. To do.

The gist of the invention of claim 1 is a conductive composition containing stainless fiber, resin and compounding material having a fiber length in the range of 80 to 150 μm and a fiber diameter of 10 to 15 μm. By using the conductive composition of the present invention as a conductive floor, the above-mentioned problems described in the background art can be solved. Moreover, said problem described in background art can be solved by using the electrically conductive composition of this invention as a floor coating material for an electrically conductive floor. That is, it is possible to form a film layer of a floor top coating material having excellent adhesion.

Since the stainless steel fiber contained in the conductive composition of the present invention is fibrous, it can form a network inside the resin and impart high conductivity. Furthermore, if the fiber length is 80 μm or less, conductivity cannot be obtained, and if it is longer than 150 μm, the finished appearance is deteriorated. Therefore, the fiber length is preferably in the range of 80 μm to 150 μm. Further, the fiber diameter is not particularly limited as long as the uniformity and workability of the coating film are not impaired, but a range of 10 to 15 μm is preferable as a range in which the electrical conductivity and workability are not deteriorated.
Specific examples of the stainless steel fiber include Kawasaki Techno Research Co., Ltd., amorphous fine fiber SMF (stainless steel, microfiber, etc.).

The blending amount of the stainless fiber contained in the conductive composition of the present invention is not stable when the blending amount is 1.5% by weight or less, and when the blending amount is more than 5% by weight, a finished appearance is obtained. Therefore, the range of 1.5% by weight to 5% by weight with respect to 100 parts by weight of the conductive composition is desirable.
The conductive composition of the present invention can be used in combination with a conductive inorganic material and a stainless fiber within a range that does not affect the finish. As the conductive inorganic material, carbon graphite, carbon fiber, mica, tin, aluminum, copper, nickel, zinc, antimony, titanium and other metal oxides, and combinations of two or more selected from these are used.

Examples of the resin contained in the conductive composition of the present invention include epoxy resin, polyurethane resin, acrylic resin, polyamide resin, vinyl chloride resin, polyvinyl chloride copolymer resin, polyester resin, phenol resin, alkyd resin, acrylic emulsion, and the like. In general, general-purpose resins used for coating floor materials can be used and used in combination if necessary. Further, as additives, a dispersant, a plasticizer, a pigment, a surface conditioner, a leveling agent, an antifoaming agent, and the like are used as necessary. The compounding material is preferably used in the range of 1.0 to 20 parts by weight, more preferably 5.0 to 10 parts by weight with respect to 100 parts by weight of the resin. In the conductive composition of the present invention, the above components are mixed with a solvent to form a conductive composition. Examples of the solvent include butanol, xylene, ketone, toluene, methyl ethyl ketone, and the like.

The conductive composition of the present invention is preferably adjusted so that the surface resistivity is 5 × 10 ⁴ to 1 × 10 ⁸ Ω when finally formed into a coating film.

The gist of the invention of claim 2 is a top coat comprising the conductive composition of claim 1. By using the conductive composition of the present invention as a top coat of a conductive coating floor, a film-forming layer of a top coat layer having excellent adhesion can be formed.

The conductive coated floor of the present invention may have any configuration other than the conductive overcoating film-forming layer. For example, a layer made of a base conditioner may be provided below the conductive intermediate coating layer. Furthermore, the conductive coating floor of the present invention comprises a layer made of a base conditioning material in a lower layer than the film-forming layer of the conductive intermediate coating, and at the same time, a top-coating material in an upper layer than the film-forming layer made of the conductive intermediate coating You may provide the layer which consists of.
Moreover, the said intermediate coating material may be the electroconductive composition of Claim 1 similarly to electroconductive top coat, for example. It is preferable that the top coating material is adjusted so that the surface electrical resistance value is 5 × 10 ⁴ to 1 × 10 ⁸ Ω when a coating film is formed. Moreover, the application amount of the top coating material is preferably in the range of 0.8 to 2.0 kg / m ² , for example.

In the conductive coating floor of the present invention, the configuration other than the film forming layer of the floor top coating material can be arbitrary. For example, a layer made of an undercoat conditioning material or a layer made of a conductive intermediate coating may be provided below the film-forming layer made of a floor top coating material. In addition, the conductive coating floor of the present invention may include both a layer made of an undercoat conditioning material and a layer made of a conductive intermediate coating in a lower layer than a film-forming layer made of a top coating material.
The conductive intermediate coating may be the conductive composition according to claim 1, for example, in the same manner as a floor top coating material. The applied amount of the conductive intermediate coating is preferably, for example, in the range of 0.1 to 0.3 Kg / m ² . The conductive intermediate coating is preferably adjusted so that the surface resistivity is 120 KΩ or less when finally formed as a coating film.

The conductive composition of the present invention is composed of a conductive composition containing stainless fiber, resin and compounding material having a fiber length of 80 μm to 150 μm and a fiber diameter of 10 to 15 μm. A conductive flooring having excellent properties can be formed. Moreover, the conductive coating floor which is excellent in antistatic performance and adhesiveness can be formed using the floor coating material.

Hereinafter, the present invention will be described in more detail by way of examples. In the examples, the% compounding amount is% by weight.
Example 1
After applying a ground preparation material (product name: JJ-100, manufactured by Aika Kogyo Co., Ltd.) on a substrate with a trowel at a density of 0.6 kg / m ² , a conductive intermediate coating (Aika Industry Co., Ltd.) (Product name: JJ-160) was applied with a roller at 0.2 kg / m ² . Further, as a floor top coat material, a main agent and a curing agent shown in Table 1 below were blended at a ratio of 4/1, and 1.2 kg / m ^{2 was} applied with a trowel to obtain a conductive coated floor of the present invention. In the floor top coat shown in Table 1, the anti-settling agent included in “Others” corresponds to the compounding agent.

Comparative Example 1
As Comparative Example 1, an example of blending a conventional product will be described. After applying the substrate conditioning material on the substrate by the same means as in Example 1, a conductive intermediate coat (manufactured by Aika Industry Co., Ltd., trade name: JJ-160) was 0.2 kg / m ² with a roller. Applied. Further, as the floor top coat material, the main component and curing agent of the conductive top coat composition shown in Table 1 below were blended at a ratio of 4/1, and applied with 1.2 kg / m ² with a trowel to obtain a conductive coat floor. It was. Since the top coat material in Comparative Example 1 does not contain a hard porous carbon material, it is outside the scope of the invention of claim 1. In addition, the compounding quantity of each component in following Table 1 contains a solvent and a non volatile matter.

Next, the characteristics of the conductive coated floors formed in Example 1 and Comparative Example 1 were measured from the following experiments, and the results are shown in Table 2.
Forced Peel Test A force was applied to the layered film of the conductive intermediate coat in the conductive coated floor formed in Example 1 to forcibly peel and evaluate the adhesion.
Items for evaluation are indicated by ○ and ×.
○: Destruction of the substrate.
X: There is almost no sense of resistance in the film-forming layer, and the coating is easily peeled off.

Electrical resistance test
On the 90cm x 90cm x 0.4cm slate plate, first apply the base material with 0.6 kg / m ² iron, then conductive intermediate coat (trade name: JJ-, manufactured by Aika Kogyo Co., Ltd.). 160) was coated with 0.2 kg / m ² roller. Then, after curing at 25 ° C. for 3 days, the characteristics of the conductive overcoat film-forming layer were measured. As a measuring method, a surface electric resistance value of a film forming layer of the floor top coat was measured using a 500V tester at a measurement interval of 91.4 cm.

As shown in Table 2 above, in the forced peel test, the film formation layer of the floor top coating material prepared in Example 1 was much higher in adhesion than the film formation layer prepared in Comparative Example 1. This is because Example 1 includes a stainless steel fiber having a fiber length in the range of 80 μm to 150 μm and a fiber diameter of 10 to 15 μm in the floor top coat. On the other hand, in the electrical resistance test, the film-forming layer of the floor top coating material prepared in Example 1 exhibited a conductive performance lower than the top coating electrical resistance value prepared in Comparative Example 1. From this result, the floor top coating material of Example 1 can solve the problems shown in Comparative Example 1, has excellent adhesion to the intermediate coating layer, and can provide stable antistatic performance. It could be confirmed.
Needless to say, the present invention is not limited to the above-described embodiments, and can be implemented in various modes without departing from the scope of the present invention.

Claims (2)

A conductive composition comprising a stainless fiber having a fiber length of 80 μm to 150 μm and a fiber diameter of 10 to 15 μm, a resin and a compounding material. The electroconductive coating floor which uses the electroconductive composition of Claim 1 as topcoat material.