JP2006019633A - Structure for mounting photoelectric conversion element - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a structure for mounting a photoelectric conversion element which can be inexpensively manufactured efficiently with less optical defect. <P>SOLUTION: In the package of the structure for mounting the photoelectric conversion element having a recess for accommodating a light receiving element and/or a light emitting element, the element is fixedly bonded on the bottom of the recess of the package, and a transparent lid is fixedly bonded to the step of the package to seal and protect the element. Since the package is provided with a spring, the transparent lid can be removably held temporarily. The spring is molded with a resin having an elasticity to be integral with the package. Further, the package is molded with a ceramic or a resin, and the spring is molded to be integral with a lead frame. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a mounting structure of a light receiving / emitting element such as an optical pickup used for reading / writing of an optical disk such as a solid-state imaging element CD or DVD used for imaging of a digital camera, a video camera or the like.

  Since the characteristics of a semiconductor element generally change when exposed to water vapor in the air for a long period of time, it is necessary to store and seal the semiconductor element in a container (package) molded of ceramic, resin, metal, or the like. Among them, in an imaging element and a light emitting element, for the purpose of transmitting light, glass, crystal, or other transparent plate is used as a lid, and it is widely performed to be bonded and sealed to the aforementioned package.

  FIG. 5 illustrates an example of the process.

  5a: First, the solid-state imaging device chip 3 is bonded and fixed to the recess 1a of the package 1, and wiring is performed using a known wire bonding technique (not shown).

  Thereafter, the surface of the chip 3, the package recess 1a, and the like are inspected using a microscope or the like to confirm that there are no foreign matters or scratches that adversely affect the image. If foreign matter is attached, it is removed.

  FIG. 5b: The adhesive 5 for adhering the transparent lid is applied to the package that is confirmed to be non-defective.

  FIG. 5c: Mount the transparent lid 4 and cure the adhesive.

  For the adhesive 5, a thermosetting epoxy resin or an ultraviolet curable epoxy resin is often used in order to increase the processing efficiency while preventing moisture permeation.

  If the thermal expansion coefficients of the transparent lid 4 and the package 1 are greatly different, the shear stress applied to the adhesive 5 is increased depending on the temperature environment to be used, which may cause inconveniences such as peeling or cracking of the transparent lid. For this reason, the adhesive is required to have low moisture permeability and flexibility.

  In recent years, with the rapid spread of video information equipment such as digital cameras, there is a further demand for lowering the cost of image sensors that occupy a large cost ratio.

  When the individual pixels of the image sensor become a minimum size of 2 to 3 micrometers square, the allowable defect size is about the same or less, and thus the appearance inspection becomes extremely difficult. Furthermore, in the above assembling method, there is a high probability that foreign matter floating in the air will adhere even during application of the adhesive, and it has become difficult to reduce the defective rate of the assembling process.

  The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a mounting structure for a photoelectric conversion element that can efficiently and inexpensively manufacture a photoelectric conversion element with few optical defects.

  In order to achieve the above object, the invention according to claim 1 is a package having a recess for receiving a light receiving element and / or a light emitting element, and the element is bonded and fixed to the bottom of the recess of the package. In the mounting structure of the photoelectric conversion element that is adhesively fixed to the step portion of the package and hermetically protects the element, the package is provided with a spring, and the transparent lid can be temporarily detachably held. And

  According to a second aspect of the present invention, in the first aspect of the present invention, the spring portion is formed integrally with the package by an elastic resin.

  According to a third aspect of the present invention, in the first or second aspect of the present invention, the package is formed of ceramic or resin, and the spring portion is formed integrally with the lead frame.

  According to a fourth aspect of the present invention, in the first aspect of the present invention, the package and the spring are formed of a metal plate or a part obtained by drawing and bending a metal plate.

  The invention according to claim 5 is the invention according to any one of claims 1 to 4, wherein the transparent lid is a single piece of plate glass, a crystal plate, a lithium niobate plate, a resin plate, an infrared ray absorbing plate glass, and / or the like. It is the member which laminated | stacked.

  The invention according to claim 6 is the invention according to claim 5, characterized in that the end surface of the transparent lid is chamfered obliquely.

  The invention according to claim 7 is the invention according to any one of claims 1 to 4, wherein the light receiving element is a solid-state imaging element such as a CCD or CMOS, and the light emitting element is an LED, a semiconductor laser, an organic EL, or the like. It is characterized by being a semiconductor light emitting element.

  ADVANTAGE OF THE INVENTION According to this invention, a photoelectric conversion element with few optical defects can be manufactured efficiently and cheaply.

  Embodiments of the present invention will be described below with reference to the accompanying drawings.

<Embodiment 1>
FIG. 1A is a perspective view of a photoelectric conversion element according to Embodiment 1 of the present invention, and FIG. 1B is a cross-sectional view of the photoelectric conversion element.

  In FIG. 1, 1 is a resin package and 1a is a spring part of the package. A resin thin lead frame 2 is insert molded into the resin.

  A solid-state imaging device chip 3 such as a CCD or CMOS is bonded and fixed to the bottom surface of the recess 1b, and is wired to the lead frame 2 by a known wire bonding technique (not shown).

  As described above, in this state, the transparent lid 4 is placed so as to close the package recess, and temporarily fixed using the elasticity of the spring portion 1a. Even if the package is transported between processes, the transparent lid 4 does not come off and does not rub against the package 1 to generate dust.

<Embodiment 2>
FIG. 2 shows a cross section of the photoelectric conversion element according to Embodiment 2.

  The ceramic plate 1c and the lead frame 2 bent in advance by press working are laminated using an adhesive 1d. For the adhesive 1d, an inorganic material such as low-melting glass is often used. The spring portion 1 a is configured by a part of the lead frame 2.

<Embodiment 3>
FIG. 3 shows a photoelectric conversion element according to Embodiment 3.

  The package is a metal base package in which a conductor layer 1g is formed on a metal plate 1e via an insulating layer 1f, and a chip housing recess 1b is formed by drawing. As for the terminal for external connection, the lead pin 2a is press-fitted into the metal plate 1e. The spring portion 1a is formed by cutting and bending a part of the metal plate 1e.

<Embodiment 4>
FIG. 4 shows a photoelectric conversion element according to Embodiment 4.

  The end surface of the transparent lid 4 is processed into a slope 4a. Thereby, temporary fixing by the spring part 1a becomes more reliable, and the filling operation of the adhesive 5 becomes easier. Slope processing may be performed on the four sides of the transparent lid 4 or only two opposing sides.

It is the perspective view and sectional drawing of a photoelectric conversion element which concern on Embodiment 1 of this invention. It is sectional drawing of the photoelectric conversion element which concerns on Embodiment 2 of this invention. It is sectional drawing and the cross-sectional enlarged view of the photoelectric conversion element which concerns on Embodiment 3 of this invention. It is sectional drawing of the photoelectric conversion element which concerns on Embodiment 4 of this invention. It is sectional drawing which shows the prior art.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Package 1a Spring part 1b Recessed part 1c Ceramic laminated board 1d Adhesive 1e Metal plate 1f Insulating layer 1g Conductive layer 2 Lead frame 2a Lead pin 3 Solid-state image sensor chip 4 Transparent lid 4a Slope 5 Adhesive

Claims (7)

A package having a recess for receiving a light receiving element and / or a light emitting element, wherein the element is bonded and fixed to a bottom surface of the concave portion of the package, and a transparent lid is bonded and fixed to a step portion of the package to seal the element In the mounting structure of the photoelectric conversion element to protect,
A mounting structure for a photoelectric conversion element, wherein a spring is formed in the package, and the transparent lid can be temporarily detachably held.   The mounting structure for a photoelectric conversion element according to claim 1, wherein the spring part is molded integrally with the package by an elastic resin.   3. The mounting structure for a photoelectric conversion element according to claim 1, wherein the package is formed of ceramic or resin, and the spring portion is formed integrally with the lead frame.   2. The mounting structure for a photoelectric conversion element according to claim 1, wherein the package and the spring are formed of a metal plate or a component obtained by drawing and bending the metal plate.   The said transparent lid | cover is single-piece | units and / or the member which laminated | stacked these, such as plate glass, a crystal plate, a lithium niobate plate, a resin plate, an infrared rays absorption plate glass, The any one of Claims 1-4 characterized by the above-mentioned. Mounting structure of photoelectric conversion element.   6. The photoelectric conversion element mounting structure according to claim 5, wherein an end surface of the transparent lid is obliquely chamfered.   The light receiving element is a solid-state imaging element such as a CCD or CMOS, and the light emitting element is a semiconductor light emitting element such as an LED, a semiconductor laser, or an organic EL. Mounting structure of photoelectric conversion element.

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