JP2006018095A5 - - Google Patents

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Publication number
JP2006018095A5
JP2006018095A5 JP2004196880A JP2004196880A JP2006018095A5 JP 2006018095 A5 JP2006018095 A5 JP 2006018095A5 JP 2004196880 A JP2004196880 A JP 2004196880A JP 2004196880 A JP2004196880 A JP 2004196880A JP 2006018095 A5 JP2006018095 A5 JP 2006018095A5
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JP
Japan
Prior art keywords
resist
resist pattern
organic compound
water
unit
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Application number
JP2004196880A
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English (en)
Japanese (ja)
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JP4731135B2 (ja
JP2006018095A (ja
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Priority to JP2004196880A priority Critical patent/JP4731135B2/ja
Priority claimed from JP2004196880A external-priority patent/JP4731135B2/ja
Publication of JP2006018095A publication Critical patent/JP2006018095A/ja
Publication of JP2006018095A5 publication Critical patent/JP2006018095A5/ja
Application granted granted Critical
Publication of JP4731135B2 publication Critical patent/JP4731135B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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JP2004196880A 2004-07-02 2004-07-02 微細パターン形成材料を用いた電子デバイス装置の製造方法 Expired - Lifetime JP4731135B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004196880A JP4731135B2 (ja) 2004-07-02 2004-07-02 微細パターン形成材料を用いた電子デバイス装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004196880A JP4731135B2 (ja) 2004-07-02 2004-07-02 微細パターン形成材料を用いた電子デバイス装置の製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2011061215A Division JP2011170360A (ja) 2011-03-18 2011-03-18 パターン形成材料およびそれを用いて製造した電子デバイス装置

Publications (3)

Publication Number Publication Date
JP2006018095A JP2006018095A (ja) 2006-01-19
JP2006018095A5 true JP2006018095A5 (https=) 2007-11-08
JP4731135B2 JP4731135B2 (ja) 2011-07-20

Family

ID=35792423

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004196880A Expired - Lifetime JP4731135B2 (ja) 2004-07-02 2004-07-02 微細パターン形成材料を用いた電子デバイス装置の製造方法

Country Status (1)

Country Link
JP (1) JP4731135B2 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5194521B2 (ja) * 2007-03-30 2013-05-08 富士通セミコンダクター株式会社 半導体装置の製造方法、パターン形成方法及びパターン補正装置
KR102787541B1 (ko) 2015-06-04 2025-03-26 카티바, 인크. 금속 표면 상에서 에치 레지스트 패턴의 제조 방법
JP6975463B2 (ja) 2015-08-13 2021-12-01 カティーバ， インコーポレイテッド 金属表面上のエッチレジストパターンの製造方法
US10398034B2 (en) * 2016-12-12 2019-08-27 Kateeva, Inc. Methods of etching conductive features, and related devices and systems
CN114945804A (zh) * 2020-01-13 2022-08-26 科迪华公司 喷墨印刷电路板

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000347414A (ja) * 1999-06-01 2000-12-15 Tokyo Ohka Kogyo Co Ltd レジストパターン微細化用塗膜形成剤及びそれを用いた微細パターン形成方法
JP4104117B2 (ja) * 2002-08-21 2008-06-18 東京応化工業株式会社 微細パターンの形成方法
JP2004093832A (ja) * 2002-08-30 2004-03-25 Renesas Technology Corp 微細パターン形成材料、微細パターン形成方法および半導体装置の製造方法
KR100585138B1 (ko) * 2004-04-08 2006-05-30 삼성전자주식회사 반도체 소자 제조용 마스크 패턴 및 그 형성 방법과 미세패턴을 가지는 반도체 소자의 제조 방법

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