JP2006016289A - Method for sealing mating faces of glass and the like - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an effective method for adhering glass and the like using a lead-free metal since a solder and a filler containing lead are difficult to be used because of an environmental problem. <P>SOLUTION: The sealing part of glass is plated with gold, silver or nickel by vapor deposition or coated with a silver paste by screen printing for its undercoating and then heat-treated. The undercoated two sheets of glass are superposed and heated to a melting point of silver-tin solder of 280-300°C and then the undercoated surfaces are sealed with a rod silver-tin solder. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

Detailed Description of the Invention

  The present invention performs pre-treatment by vapor deposition plating or screen printing on the glass sealing portion, and seals the periphery of the so-called glass using a metal that does not contain lead in the glass, so that the cathode ray tube, vacuum vessel or gas seal of the television is sealed. It relates to the technical field of manufacturing containers.

In the prior art, solder and lead / glass frit using lead are mainly used for bonding and sealing at around 300 ° C. However, lead cannot be used due to environmental problems.

Recently, indium has been used as a metal sealing material as a metal material. However, its use is limited due to scarce and expensive resources.

A method of bonding and sealing using resin as an alternative to metallic materials is being developed, but when used for sealing, gas is generated due to overheating, and there is no sealing effect for bonds that require high vacuum, It has not yet replaced a highly reliable metal seal.

There is also a method of sealing with a plating, but since the product to be plated is immersed in the plating solution, it is not adopted because the product is affected by moisture and plating solution.

Problems to be solved by the invention

a. Although it has become difficult to use solder and filler containing lead, which is an environmental problem, an effective bonding method using lead-free metal for bonding glass or the like has not been developed.
b. Bonding using an organic adhesive causes problems in electronic components due to the generation of moisture and the like.
c. In bonding using a silicon system, bubbles are likely to be generated on the sealing surface, and an advanced bonding technique is required and is not generalized.
d. For the bonding and sealing by plating, if a material such as nickel is selected, the glass is damaged due to the thickness of the plating and cannot be used for the frame.
e. When sealing by plating, since electroplating is performed using an electrolytic cell, it is not possible to seal in a state where water is mixed inside the container and parts are incorporated inside the container.
When the electroless plating is heated and cooled, the glass is damaged during cooling due to the difference in thermal expansion coefficient of the material.
f. If glass and metal are joined with something other than lead, the glass will be damaged during cooling due to the difference in the coefficient of thermal expansion of the material.
The present invention has been made to solve the above drawbacks.

Means to solve the problem

Either a gold paste, a silver paste, or a nickel paste is applied to the glass sealing portion as a base treatment by vapor deposition plating, or silver paste is applied by screen printing and heat-treated. In vapor deposition plating and screen printing, the thickness of the plating is less than a few microns so that it does not adversely affect the glass and is thick enough to pass the current required for electroplating. A glass in which two sheets of ground-treated glass are superposed, heated to 280 to 300 ° C., which is the melting point of silver and tin solder, and the ground-treated surface is sealed using rod-shaped silver and tin solder.

Example 1
FIG. 1 is a cross-sectional view showing the first embodiment.
Silver plating (3, 4) is applied to the sealing part of the two glasses (1, 2) as a base treatment by vapor deposition plating. The thickness of the surface-treated film is not particularly limited, but it is sufficient if the thickness is uniform and a current of 1 ampere flows. As for the type of plating, it has been confirmed that gold, silver and nickel can be used as a base treatment. Screen printing was performed using silver. The two glass sheets (1, 2) that have been ground-treated are superposed and heated to 280 to 300 ° C., which is the melting point of silver tin solder. Other than this temperature range, if the temperature is too low, the solder is difficult to melt, If the surface is too high, the surface may be oxidized and bubbles may be generated, and the surface subjected to the ground treatment is soldered (5) using bar-shaped silver or tin solder. The solder used was composed of 96.5% tin and 3.5% silver. Adhesion is possible even if the blending ratio is changed, and any material containing silver or tin as a main component can be used.
Silver brazing was performed as a sealing method, but the glass was broken.

Example 2
FIG. 2 is a cross-sectional view showing the second embodiment.
Without using an air diffuser to seal the container (7), a hole of 3 mm or less is made in the container, and silver plating (3) is performed by vapor deposition plating as a base treatment in the sealing portion. Alternatively, silver is applied by screen printing. Silver plating (4) is performed on the disk-shaped glass or metal (8) having a size capable of closing a hole of 3 mm or less by vapor deposition plating as a base treatment. Alternatively, silver is applied by screen printing. The surface of the disk-shaped glass or metal (8) that has been ground is preliminarily soldered (6) with silver or tin solder. The disc (8) overcoated on the container (7) is stacked and heated and bonded at 280 to 300 ° C. The solder used was composed of 96.5% tin and 3.5% silver. Adhesion is possible even if the blending ratio is changed, and any material containing silver or tin as a main component can be used.

Example 3
FIG. 3 is a cross-sectional view showing the third embodiment. When the product is exposed to heat of 300 ° C. or higher, silver plating (3, 4) is performed on both surfaces of the sealing portion of the glass (1, 2) by vapor deposition plating as a base treatment. Alternatively, silver is applied by screen printing. The glass (1, 2) subjected to the ground treatment is overlapped and electroplating (9) is performed on the ground treatment film without using an electrolytic cell. The metal to be plated is formed by winding a water-absorbing cloth such as absorbent cotton around the electrode, containing a high concentration electrolytic solution in the cloth, and passing a current from the electrode through the cloth to the conductive base surface to deposit the metal on the base surface. The current used is direct current, the voltage is 7-16 volts, and the current is 0.5-2.5 amps. By adopting this plating method, plating (9) can be performed without putting a plating solution into the container. Silver and nickel-cobalt were confirmed as materials that do not affect the effects of thermal expansion and the surface treatment.

Example 4
FIG. 4 is a cross-sectional view showing the fourth embodiment. Silver (3) is plated with gold, silver, nickel, or an alloy thereof by vapor deposition plating as a base treatment on the frame forming portion of glass (1). Alternatively, silver is applied by screen printing. Electroplating (10) is performed on the surface-treated film. The material of the plating is a glass with a metal frame made of silver and having a thickness of 0.02 to 2 mm.

The invention's effect

As a pretreatment for soldering or electroplating, either gold, silver, nickel, or an alloy thereof is plated by vapor deposition plating, or silver is applied by screen printing,
a. The lead-free metal by soldering has made it possible to bond glass, thus solving environmental problems.
b. Since there is no need to use organic adhesives or silicon adhesives, the problems caused by moisture and bubbles have been solved.
c. Since the electroplating can be performed without using an electrolytic cell, the plating can be sealed in a state in which components are incorporated inside the container. Further, the use of silver or nickel-cobalt as the plating material can prevent the glass from being damaged due to the difference in thermal expansion coefficient.
d. Silver plating with a thickness of 2 mm or more is possible, and it can be used as a part of structural members.

  1 is a cross-sectional view showing Example 1. FIG.   6 is a cross-sectional view showing Example 2. FIG.   6 is a cross-sectional view showing Example 3. FIG.   6 is a cross-sectional view showing Example 4. FIG.

Explanation of symbols

1, 2 Sheet glass 3, 4 Silver plating 5, 6 Solder 7 Container 8 Glass or metal 9 Metal plating 10 Electric plating

Claims (5)

Gold, silver, nickel, or an alloy thereof is plated by vapor deposition plating as a base treatment on both sealing portions such as glass. Alternatively, silver is applied by screen printing. The surface treated with the ground is superposed and heated to 280 to 300 ° C., and then sealed with solder using silver or tin alloy. Gold, silver, nickel, or an alloy thereof is plated by vapor deposition plating as a base treatment on both sealing portions such as glass. Alternatively, silver is applied by screen printing. One side or both sides of the ground glass were heated to 280-300 ° C, overcoated with silver and tin alloy, and the glass was overlaid and heated to 280-300 ° C, the melting point of silver and tin solder, and sealed Glass related to item 1. A silver film is formed by vapor deposition plating as a base treatment on a sealing portion around a hole of a glass container or the like that requires vacuum sealing or gas filling. Alternatively, silver is applied by screen printing. Another glass or metal capable of closing the opening is formed with a silver film by vapor deposition as a base treatment. Alternatively, silver is applied by screen printing. The surface of the ground surface is pre-coated with silver or tin solder on the ground glass or metal. The overcoated glass opening and another glass or metal are stacked and heated and sealed at 280-300 ° C. Gold, silver, nickel, or an alloy thereof is plated by vapor deposition plating as a base treatment on a sealing portion such as glass. Alternatively, silver is applied by screen printing. Electroplating is performed on the ground film without using an electrolytic cell. The metal to be plated is silver, nickel, or an alloy thereof. The electrode is deposited on a conductive base surface from a high-concentration electrolyte contained in a water-absorbent cloth such as absorbent cotton, and is sealed with a metal film. Gold, silver, nickel, or an alloy thereof is plated by vapor deposition plating as a base treatment on a frame creation portion such as glass. Alternatively, silver is applied by screen printing. Electroplating the surface-treated film. The plating material is silver or nickel-cobalt glass with a thickness of 0.02 to 2 mm.

Images