JP2006104043A - Sealing method of glass or the like using metal - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a lead-free coating material which can bond glass. <P>SOLUTION: The coating material contains one-component hot-setting type alkali silicate glass of 12-28 mass%, aluminum of 52-60 mass%, and silver of 16-22 mass%. The sealing is carried out by the steps of: applying the coating material (3, 3) on the surface of substrates and drying them; placing the aluminum (4, 4) on them and piling them and heating them to 400-450°C, or placing silver-tin solder (4, 4) on them and piling them and heating them to 220-300°C. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

The present invention is a cathode ray tube, a pair glass, a glass sealing part which is treated with a metal mainly composed of aluminum, and further adhered and sealed with a silver-tin solder or aluminum containing no lead on the film. The present invention relates to the technical field of manufacturing vacuum containers or gas sealed containers.

In the prior art, solder and lead / glass frit using lead are mainly used for bonding and sealing at around 300 ° C. However, lead cannot be used due to environmental problems.

Recently, indium has been used as a metal sealing material as a metal material. However, its use is limited due to scarce and expensive resources.

A method of bonding and sealing using a resin as an alternative to a metal material is being developed, but when used for sealing, gas is generated due to overheating, and it has not been replaced by a highly reliable metal seal.

a. Although it has become difficult to use lead-containing solder and lead frit, which are environmental problems, an effective bonding method using lead-free metal for bonding glass or the like has not been developed.
b. Bonding using an organic adhesive causes problems in electronic components due to the generation of moisture and the like.
c. There is also a method of soldering using a silver coating by screen printing, but the coating is destroyed by the solder pretreatment material and soldering is not possible.
d. If the silver coating material prepared by screen printing on glass exceeds a thickness of 15 μm, the glass is damaged and cannot be used for a frame or the like.
e. When sealing by plating, since electroplating is performed using an electrolytic cell, it is not possible to seal in a state where water is mixed inside the container and parts are incorporated inside the container.
The present invention has been made to solve the above drawbacks.

Means to solve the problem

It is characterized in that the content of aluminum is 52 to 60% by mass and the content of silver is 16 to 22% by mass in 12 to 28% by mass of one-component heat-curable alkali-silicate glass in the glass sealing part. Invented a material that can be brazed or plated with silver-tin solder or aluminum directly on the coating substrate by using the coated material.

The coating material described in 0006 was used as a solder base treatment for both sealing parts such as glass, and the flux used for the soldering work was not used. The objects are stacked and heated to 250 to 300 ° C. to melt and seal the metal.

The coating material described in 0006 is used as a base treatment for brazing aluminum on both sealing parts such as glass, and the aluminum is made to a thickness of about 2 to 5 μm on the both ground surfaces without using the flux used for brazing. Are stacked and heated to 400-450 ° C. to melt and seal the metal.

When flux is used for soldering, nickel strike plating is applied to the ground surface to prevent NaCl generated by curing of one-component heat-curable alkali-silicate glass from being decomposed by acid and corroded in a porous form. 1 to 3 μm, and silver plating or copper plating is performed 10 μm or more in thickness.

Two plated glasses are superposed, heated to 250 to 300 ° C., and bonded and sealed using silver-tin solder.

When reinforcing the mechanical strength of the joint material or preventing corrosion, electroplating is performed without using an electrolytic cell on the sealing surface of the soldered glass. The metal to be plated is formed by winding a water-absorbing cloth such as absorbent cotton around the electrode, containing a high-concentration electrolytic solution in the cloth, and passing a current from the electrode through the cloth to the conductive base surface to deposit the metal on the base surface. The current used is direct current, the voltage is 7 to 16 volts, and the current is 0.5 to 3.0A. By adopting this plating method, plating can be performed without putting the plating solution into the container. Silver, copper, and zinc were selected as the plating materials as materials that do not affect the effects of thermal expansion and surface treatment.

The invention's effect

a. At about 250 ° C or less, lead-free metal made of silver-tin solder can be used to bond glass, thus solving environmental problems.
b. The brazing operation of aluminum has made the product use temperature range around 400 ° C, and the aluminum sealing has reduced the weight and the glass can be bonded with lead-free metal, thus solving the environmental problem.
c. Since it is no longer necessary to use organic adhesives such as resins or silicone adhesives, the problems caused by moisture and bubbles have been solved.
d. Since the electroplating can be performed without using an electrolytic cell, the plating can be sealed in a state in which components are incorporated inside the container. Further, the use of silver or copper as the plating material can prevent the glass from being damaged due to the difference in thermal expansion coefficient.
e. A metal frame having a thickness of 0.5 mm or more can be formed and can be used as a part of a structural member.

FIG. 1 is a sectional view showing the best mode for carrying out the invention.
In the sealing part of the glass (1,2), the one-component heat-curable alkali-silicate glass 12 to 28% by mass, the aluminum content is 52 to 60% by mass, and the silver content is 16 to 22% by mass. Coating material (3, 3) is applied and dried at 220 ° C.

In the case of a product with a heat resistance of about 400 ° C. or lower, a laminate of aluminum (4, 4) with a thickness of about 1 to 3 μm is placed on both bases (3, 3) and heated to 400-450 ° C. Both materials are melted with heat and sealed.

In the case of a product having a heat resistance of about 250 ° C. or lower, a laminate of silver and tin solder (4, 4) with a thickness of about 1 to 3 μm is placed on both the ground surfaces (3, 3), Until both materials are melted with heat and sealed.

FIG. 2 is a cross-sectional view showing the first embodiment.
When using the base frame thickness correction or soldering flux, to prevent NaCl generated by the curing of one-component heat-curable alkali-silicate glass from being decomposed by the acid of the flux and corroded in a porous form. Then, 1 to 3 μm of nickel plating (5, 5) and 10 μg of silver plating or copper plating (6, 6) were applied to the ground surface (3, 3).

Two plated glasses (1, 2) are superposed, heated to 250-300 ° C, and sealed with silver-tin solder (7) using a flux.

If further reinforcement or corrosion protection is required, electroplating (8) is performed without using an electrolytic cell on the sealing surface of the soldered glass. The metal to be plated is formed by winding a water-absorbing cloth such as absorbent cotton around the electrode, containing a high-concentration electrolytic solution in the cloth, and passing a current from the electrode through the cloth to the conductive base surface to deposit the metal on the base surface. The current used is direct current, the voltage is 7 to 16 volts, and the current is 0.5 to 3.0A. By adopting this plating method, plating can be performed without putting the plating solution into the container. Silver, copper, and zinc were selected as the plating materials as materials that do not affect the effects of thermal expansion and surface treatment.

FIG. 3 is a cross-sectional view showing the second embodiment.
In the sealing part of the exhaust hole of the container (9), the content of pure aluminum is 52 to 60% by mass and the content of pure silver is 16 to 28% by mass of one-component heat-curable alkali-silicate glass 12 to 28% by mass. A coating material (3) of 22% by mass is applied and dried at 220 ° C. The coating thickness is not particularly limited, but a uniform thickness of 5 to 100 μm is sufficient.
A coating material (3) is applied to a disk-shaped glass or metal (10) having a size capable of closing the hole, if necessary, and dried at 220 ° C.
Silver-tin solder (7) is placed in a container (9) and disc-like glass or metal (10). The soldered disks (10) are stacked and heated to 220 to 300 ° C. and bonded to dissolve the silver-tin solder. Although it may be outside this temperature range, if the temperature is too low, the solder is not easily melted.
Silver brazing was also performed as a sealing method, but the glass was broken because the temperature had to be raised to 800 ° C.
The solder used was composed of 96.5% tin and 3.5% silver. Adhesion is possible even if the blending ratio is changed, and any material containing silver or tin as a main component can be used.

FIG. 4 is a cross-sectional view showing the third embodiment.
The coating material (3) is applied to the frame forming part of the glass (1) and dried at 220 ° C. A glass with a metal frame formed by electroplating (8) so that the final frame height is 500 μm. About the kind of plating (8) performed on a coating surface, it has confirmed that silver or copper can be used as a plating material on nickel as a base.

  It is sectional drawing which shows the best form for inventing.   1 is a cross-sectional view showing Example 1. FIG.   6 is a cross-sectional view showing Example 2. FIG.   6 is a cross-sectional view showing Example 3. FIG.

Explanation of symbols

1, 2 Sheet glass 3 Coating 4 Aluminum or silver-tin solder 5 Nickel plating 6 Silver or tin plating 7 Silver-tin solder 8 Electric plating 9 Container 10 Disc

Claims (7)

A coating material characterized by adding aluminum and silver to one-component heat-curable alkali-silicate glass. A container characterized in that the coating material according to claim 1 is used for a sealing part such as glass and the like, and a silver-tin soldered material is superposed, heated and sealed. A container characterized in that the coating material according to claim 1 is used for a sealing part such as glass and the like, which is brazed with aluminum on the ground surface, heated and sealed. A coating material for solder, wherein the coating material according to claim 1 is used for a sealing part of glass or the like, nickel strike plating is performed on the surface of the surface, and silver plating or copper plating is further applied to the surface thereof. Metal frame material. A container characterized in that a surface-treated base material according to claim 4 is superposed on a sealing part such as glass and is metal-sealed with silver-tin solder. 6. A container according to claim 5, which is plated on a surface sealed with silver-tin solder. A container characterized by using the coating material according to claim 1 for a sealing part such as glass, and soldering or brazing a frame or plate of metal or the like to a portion where the metal according to claim 2 or 3 is placed.

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