JP2006015276A - Substrate treatment apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent adhesion of particles to a substrate or precipitation of a crystal even if a liquid recovery type nozzle apparatus is employed for treating a substrate. <P>SOLUTION: The substrate treatment apparatus 10 is for carrying out a prescribed treatment (washing treatment in this embodiment) for a substrate B which is being transported in an approximately horizontal posture along a transportation path 171 by supplying a treatment liquid to the substrate B and comprises a liquid recovery type nozzle apparatus 20 (a liquid recovery type nozzle apparatus 20 installed in a third washing chamber 14 in this embodiment) so composed as to recover the treatment liquid (washing water in this embodiment) supplied to the substrate B upstream of the transportation path 171; an air knife 30 for blowing out the washing water on the substrate B toward the downstream; and a liquid-holding nozzle apparatus 40 for supplying washing water for preventing the substrate B from drying between the liquid recovery type nozzle apparatus 20 and the air knife 30. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a substrate processing apparatus that performs predetermined processing on a substrate including a glass substrate on which a liquid crystal, various electronic components, and the like are mounted.

  Substrates used for liquid crystal displays or the like are manufactured by sequentially loading the substrates into a plurality of processing tanks provided for each type of processing liquid, and a predetermined processing liquid is supplied in each processing tank. In general, each of them has its own processing. In order to perform such a process on the substrate, a conveyance path that passes through each processing tank is provided, and conveyance means such as a plurality of conveyance rollers are arranged along the conveyance path, and the substrate is conveyed to the conveyance means. However, it will be sent in order into each processing tank.

  The processing liquid supplied to the substrate in each processing tank is temporarily stored at the bottom of the processing tank, and after being subjected to a predetermined detoxification process, it is discharged out of the system, or is recycled after being recycled. To do.

In such a substrate processing method, a liquid supply nozzle that supplies a processing liquid to a substrate introduced into each processing tank plays an important role. There has been proposed a liquid recovery type nozzle device that recovers the processing liquid supplied to the substrate on the downstream side in the transport direction from the substrate on the upstream side.
JP 2002-280340 A

  By the way, even when the liquid recovery type nozzle device as described in Patent Document 1 is adopted, an air knife for blowing the air flow and drying the substrate is disposed on the downstream side in order to surely drain the liquid. However, since the processing liquid is substantially recovered within the range of the liquid recovery nozzle device on the substrate, the substrate reaches an air knife provided on the downstream side of the liquid recovery nozzle device. In some cases, drying may occur partially, resulting in uneven drying, and particles may partially adhere to the substrate surface, or components of the processing solution may be partially precipitated as crystals. Thus, there is a problem that a so-called watermark may occur.

  In order to eliminate such an inconvenience, it is conceivable to bring the air knife as close as possible to the liquid discharge port of the liquid recovery type nozzle device. However, an air knife that is long in the width direction perpendicular to the substrate transport direction is usually used for liquid cutting. Since it is provided obliquely with respect to the substrate transport direction in order to increase the efficiency, it is inevitable that the other end will be in a separated state even if one end thereof is brought close to the liquid recovery type nozzle device. In addition, it is difficult to bring the discharge ports close to each other because of the installation space between the liquid recovery type nozzle device and the air knife. Furthermore, when an air knife is used for drying a substrate, a partition wall is provided at the boundary between both spaces so that the atmosphere in the space for supplying the processing liquid to the substrate does not move to the space for drying the substrate. However, when such a partition wall is provided, it becomes extremely difficult to bring the air knife close to the liquid discharge port of the liquid recovery type nozzle device.

  Conventionally, for these reasons, the substrate dries before reaching the air knife from the liquid recovery type nozzle device, and particles partially adhere to the surface, or components of the processing liquid are partially precipitated as crystals. The actual situation is that the problem of the problem cannot be solved.

  The present invention has been made in view of such a situation, and does not cause sticking of particles, precipitation of crystals, and adhesion of watermarks to a substrate after processing, and a liquid recovery type nozzle device for substrate processing is provided. An object of the present invention is to provide a substrate processing apparatus capable of extracting the characteristics to the maximum.

  The invention according to claim 1 is a substrate processing apparatus for performing a predetermined process on the substrate by supplying a processing liquid to the substrate being transferred in a substantially horizontal posture along the transfer path, the substrate being transferred A liquid recovery type nozzle unit for supplying a processing liquid toward the substrate and recovering the processed processing liquid from the substrate, and a processing liquid on the substrate downstream of the substrate transport path of the liquid recovery type nozzle unit A process for holding the substrate in a wet state until it is transported to at least the liquid draining part, which is disposed between the liquid recovery nozzle part and the liquid draining part. And a retentate supply section for supplying the liquid.

  By adopting such a configuration, the substrate introduced into the substrate processing apparatus is first transported and processed by the processing liquid supplied from the liquid recovery type nozzle unit, and then the processing liquid is supplied from the retentate supply unit. Since the liquid draining part reaches the liquid draining part and the liquid draining process is performed by the liquid draining part, the substrate is made to be a liquid draining nozzle by supplying only the minimum necessary processing liquid from the liquid recovery type nozzle part. Thus, it is possible to prevent the occurrence of inconvenience such that the particles are partially fixed on the substrate and the components in the processing liquid are partially crystallized and deposited.

  According to a second aspect of the present invention, in the first aspect of the present invention, the liquid draining portion is arranged to be inclined at a predetermined angle on a surface parallel to the substrate transport surface in the substrate transport direction. It is a feature.

  By adopting such a configuration, the air discharged from the liquid draining part acts as a component force in the substrate width direction with respect to the processing liquid adhering to the substrate. As compared with the case of being orthogonal to the substrate, the treatment liquid adhering to the substrate is efficiently removed.

  According to a third aspect of the present invention, in the first aspect of the present invention, the retentate supply part is provided at a substantially intermediate position between the liquid recovery type nozzle part and the liquid draining part. It is.

  By adopting such a configuration, the substrate processed by the liquid recovery type nozzle unit is in a state where the drying is suppressed as much as possible while ensuring the ease of installing the retentate supply unit.

  According to a fourth aspect of the present invention, in the invention according to any one of the first to third aspects, the liquid recovery nozzle unit, the liquid draining unit, and the retentate supply unit are provided on a substrate carry-in / out port on a wall surface on the upstream / downstream side in the substrate transport direction The process chamber is partitioned by a partition wall with respect to the substrate transport direction except for the substrate transport path, and the process chamber is separated into a downstream space surrounded by the partition wall. A liquid draining part is provided, and the retentate supply part is provided in the upstream space.

  According to such a configuration, the substrate introduced into the processing chamber main body through the substrate carry-in port is arranged such that the liquid recovery type nozzle unit, the liquid draining unit, and the holding liquid supply unit provided in the processing chamber main body along the transfer path. Are sequentially discharged, and after being subjected to a predetermined process by each nozzle device, they are discharged out of the system from the substrate discharge port. A partition wall is provided in the processing chamber, and a retentate supply unit is provided on the upstream side. On the other hand, a liquid draining unit is provided on the downstream side. Even when liquid splashes occur, these floating particles are prevented from moving to the space (dry space) where the liquid drainage is provided by the partition wall, thereby maintaining a clean atmosphere in the dry space. Is done.

  According to a fifth aspect of the invention, in the invention according to any one of the first to fourth aspects, the processing liquid is cleaning water for cleaning the substrate.

  According to such a configuration, the substrate processing apparatus can be used as a substrate cleaning apparatus, and the substrate is cleaned by the cleaning water.

  According to the first aspect of the present invention, even if the substrate is partially dried before reaching the liquid draining nozzle because only the necessary minimum processing liquid is supplied from the liquid recovery type nozzle portion, Therefore, it is possible to reliably prevent the occurrence of inconveniences such as particles partially adhering to each other and components in the processing liquid being partially crystallized and precipitated.

  Therefore, in spite of adopting the liquid recovery type nozzle unit for downsizing the substrate processing apparatus and reducing the running cost, the defect rate of the product increases due to particles or the like partially sticking on the substrate. Such a situation can be avoided, and the substrate processing apparatus can be made to the maximum with the advantages of the liquid recovery nozzle unit.

  According to the second aspect of the present invention, the liquid draining portion is disposed in an inclined direction by a predetermined angle on the surface parallel to the substrate transport surface in the substrate transport direction, and is thus discharged from the liquid drain portion. The air acts as a component force toward the substrate width direction with respect to the processing liquid adhering to the substrate, and thereby the liquid draining portion is applied to the substrate as compared with the case where the liquid draining portion is orthogonal to the substrate transport direction. The attached treatment liquid can be efficiently removed.

  According to the third aspect of the present invention, the retentive liquid supply unit is provided at a position closer to the liquid recovery type nozzle unit than the center position in the substrate transport direction between the liquid recovery type nozzle unit and the liquid draining unit. In addition, it is possible to suppress the drying of the substrate processed by the liquid recovery nozzle unit as much as possible while ensuring the ease of installation of the retentate supply unit.

  According to the fourth aspect of the present invention, since the partition wall is provided in the processing chamber and the retentate supplying part is provided on the upstream side, the liquid draining part is provided on the downstream side. Even if suspended particles or splashes of processing liquid occur in the liquid supply unit, these floating particles are prevented from moving to the space (dry space) where the liquid draining unit is provided by the partition wall. A clean atmosphere in the dry space can be maintained.

  According to the invention described in claim 5, since the cleaning water for cleaning the substrate is employed as the processing liquid, the substrate processing apparatus can be used as a cleaning apparatus, and contaminants such as particles adhering to the substrate are cleaned. The substrate can be cleaned by being washed away with water.

  FIG. 1 is a cross-sectional explanatory view showing an embodiment of a substrate processing apparatus according to the present invention. In this embodiment, a substrate cleaning apparatus disposed at the final stage of substrate processing is exemplified as the substrate processing apparatus 10. As shown in FIG. 1, a substrate processing apparatus 10 includes a first cleaning chamber 12 that performs a preliminary cleaning process on a substrate B in a processing chamber body 11 (that is, a processing chamber) having a rectangular parallelepiped shape, A second cleaning chamber 13 that performs an intermediate cleaning process on the substrate B from the first cleaning chamber 12 and a third cleaning chamber 14 that performs final cleaning on the substrate B from the second cleaning chamber 13. And a drying chamber 15 that performs a drying process on the substrate B that has been subjected to a final cleaning process in the third cleaning chamber 14.

  A substrate carry-in port 16 is opened on the upstream side wall 111 (right side in FIG. 1) of the processing chamber body 11, and the substrate carry-out port 16 is located on the downstream side wall 112 at a position facing the substrate carry-in port 16. 'Is opened. Between the substrate carry-in port 16 and the substrate carry-out port 16 ′, a plurality of carry rollers 17 are arranged in parallel at an equal pitch in the substrate carrying direction (the direction toward the left in FIG. 1). A transport path 171 for transporting the substrate B in the processing chamber body 11 is formed on the roller 17. Each transport roller 17 is driven to rotate counterclockwise in FIG. 1 by driving of a drive motor (not shown).

  Therefore, the substrate B introduced into the processing chamber body 11 from the outside through the substrate carry-in port 16 is transported toward the downstream side through the transport path 171 by the driving rotation of the transport rollers 17, while the first to the first. Each of the three cleaning chambers 12, 13, and 14 is subjected to a predetermined cleaning process, and after the drying process is subsequently performed in the drying chamber 15, it is discharged out of the system through the substrate carry-out port 16 ′. .

  A first hopper 121, a second hopper 131, a third hopper 141, and a fourth hopper 151 are provided at positions below the transfer path 171 of the first to third cleaning chambers 12, 13, 14 and the drying chamber 15, respectively. After the cleaning water dripped from the substrate B being transported along the transport path 171 is received by the first to fourth hoppers 121, 131, 141, 151, a gas-liquid separator 181 to be described later from the opening at the bottom. It is temporarily stored in the bottom of the processing chamber body 11 through the water and drained as appropriate.

  Further, in the first to third cleaning chambers 12, 13, and 14, a space above the transfer path 171 is not provided with a partition wall that partitions the chambers, whereas the third cleaning chamber 14 and the drying chamber 15 A partition wall 114 is provided between the top plate 113 of the processing chamber body 11 and a position directly above the conveyance path 171, so that water droplets or the like generated in the third cleaning chamber 14 enter the drying chamber 15. It is made to prevent it.

  The length of the third cleaning chamber 14 in the substrate transport direction is set to be longer than that of the first and second cleaning chambers 12 and 13. The reason for this is to secure a space for performing a particle formation prevention treatment by the liquid holding nozzle device (holding liquid supply unit) 40 described later on the substrate B after the final cleaning process. It is to do.

  Then, the substrate B introduced into the processing chamber main body 11 is subjected to a cleaning process with ozone water in the first cleaning chamber 12 and an intermediate cleaning process with alkaline hydrogen water in the second cleaning chamber 13. After the finishing cleaning process is performed with so-called ultrapure water that has been highly purified in the third cleaning chamber 14, the drying process is performed on the substrate B that has been cleaned in the drying chamber 15. It has become.

  For the cleaning process, in the first to third cleaning chambers 12, 13, and 14, a pair of liquid recovery type nozzle devices (liquid recovery type nozzle units) 20 that are opposed to each other so as to sandwich the transport path 171 are provided. In addition, a pair of upper and lower air knives (liquid cutting portions) 30 are provided in the first and second cleaning chambers 12 and 13 on the downstream side of the liquid recovery nozzle device 20 with the conveyance path 171 interposed therebetween. ing. In contrast, in the third cleaning chamber 14, a pair of upper and lower liquid holding nozzle devices 40 are provided on the downstream side of the liquid recovery nozzle device 20 with the conveyance path 171 interposed therebetween.

  The reason why the liquid holding nozzle device 40 is provided in the third cleaning chamber 14 instead of the air knife 30 is that the full drying process by the air knife 30 is performed in the drying chamber 15. It is not necessary to dry the substrate B, in particular, it is not necessary to perform a drying process with the air knife 30, and the substrate B that has been subjected to the final cleaning process by the liquid recovery nozzle device 20 in the third cleaning chamber 14 is: In some cases, it may dry before reaching the drying chamber 15, and in such a case, particles may adhere to the front and back surfaces of the substrate B or may have a watermark. As a final cleaning process, ultrapure water is discharged from the liquid holding nozzle device 40 toward the front and back surfaces of the substrate B. By doing so, particles and watermarks can be prevented from being generated on the substrate B by the drying process in the drying chamber 15.

A cleaning water supply source 50 for supplying cleaning water to the liquid recovery type nozzle device 20 and the liquid holding nozzle device 40 is installed in the vicinity of the substrate processing apparatus 10. The cleaning water supply source 50 includes a first cleaning water supply source 51 that supplies cleaning water (so-called ozone water) containing ozone (O ₃ ) to the liquid recovery nozzle device 20 of the first cleaning chamber 12, and a second cleaning water. A second cleaning water supply source 52 for supplying cleaning water (so-called alkaline hydrogen water) in which ammonia (NH ₃ ) and hydrogen (H ₂ ) are dissolved to the liquid recovery type nozzle device 20 in the chamber 13; The liquid recovery type nozzle device 20 includes a third cleaning water supply source 53 that supplies a cleaning water (so-called ultrapure water) containing hydrogen (H ₂ ).

  In the drying chamber 15, a pair of upper and lower air knives 30 disposed so as to sandwich the conveyance path 171 are provided on the upstream side and the downstream side, respectively. Each of the air knives 30 is disposed obliquely toward the upstream side so that the discharge port faces the transport path 171. An air supply device 60 that supplies the compressed air to the air knife 30 is provided in the vicinity of the apparatus main body 11. The pressurized air from the air supply device 60 is also supplied to the air knives 30 of the first and second cleaning chambers 12 and 13.

  Then, the substrate B introduced into the drying chamber 15 is first drained by the upstream air knife 30 and then sufficiently dried by the downstream air knife 30. The substrate B that has been dried in the drying chamber 15 is discharged out of the system through the substrate carry-out port 16 'and is sent to the next step.

  FIG. 2 is a perspective view for explaining the liquid recovery type nozzle device 20, the air knife 30, and the liquid holding nozzle device 40. The liquid recovery type nozzle device 20 and the liquid holding nozzle device 40 are provided in the third cleaning chamber 14. The state where the air knife 30 is provided in the drying unit 15 is shown. As shown in FIG. 2, the liquid recovery nozzle device 20 includes an upper nozzle device 201 provided on the upper side of the conveyance path 171 and a lower nozzle device 202 disposed on the lower side of the liquid recovery type nozzle device 20 so as to face the upper nozzle device 201. ing.

  As shown in FIG. 3, the liquid recovery type nozzle device 20 includes a pair of upper and lower nozzle bodies 21 having a rectangular parallelepiped shape that is long in the width direction orthogonal to the substrate transport direction (direction orthogonal to the paper surface of FIG. 3). The inlet tube 22 connected to the downstream end of the nozzle body 21 in the substrate transport direction, the outlet tube 23 connected to the upstream end of the substrate transport direction, and the pair of upper and lower nozzle bodies 21 facing each other. A liquid introduction port 24 that is formed on the surface so as to communicate with the introduction tube 22 and that is elongated in the width direction of the substrate perpendicular to the substrate conveyance direction, and a liquid disposed opposite to the liquid introduction port 24 so as to communicate with the discharge tube 23. The lead-out port 25 is provided.

  On the other hand, on the downstream side of the second cleaning water supply source 53, as shown in FIG. 2, a delivery pump 531 for sending the ultrapure water of the second cleaning water supply source 53 is provided. The delivery pump 531 is connected to the introduction pipes 22, and the outlet pipes 23 are connected to a suction pump 532 provided in the vicinity of the processing apparatus main body 11. Therefore, when the ultrapure water from the second cleaning water supply source 53 is introduced into each introduction pipe 22 by driving the delivery pump 531, the ultrapure water is sandwiched between the upper and lower nozzle devices 201 and 202. The liquid lead-out port is supplied between the front and back surfaces of the substrate B and the opposing surfaces of the upper and lower nozzle bodies 21 via the liquid introduction port 24 and does not leak outside through the gap between the substrate B and the nozzle body 21 due to capillary action. It will move in the direction of 25. Then, the ultrapure water that has reached the liquid outlet 25 is sucked through the outlet pipe 23 by the driving of the suction pump 532 and discharged out of the system.

  As shown in FIG. 3, a plurality of support rollers 26 that support the substrate B are provided on the upper surface side of the lower nozzle body 21, and the substrate B is supported by these support rollers 26. A passage through which ultrapure water passes is formed between the substrate B and the upper surface of the lower nozzle body 21.

  As described above, by adopting the liquid recovery type nozzle device 20, since the substrate B is supplied with the minimum necessary amount of ultrapure water, a reliable cleaning process is realized. Therefore, the substrate using expensive ultrapure water is used. This can contribute to reducing the running cost of the cleaning process.

  The air knife 30 has a pentagonal shape in a side view and is elongated in the width direction of the substrate, a tapered nozzle portion 32 formed on the distal end side of the air knife body 31, and a proximal end side of the air knife body 31. And an air introduction pipe 33 connected to the. An air blowing slit 321 that is long in the substrate width direction is provided at the tip of the nozzle portion 32. Therefore, the pressurized air delivered by driving the air supply device 60 is introduced into the air knife body 31 through the air introduction pipe 33 and then blown toward the substrate B from the air blowing slit 321. The ultrapure water adhering to the front and back surfaces of the substrate B is blown off by the pressurized airflow.

  As shown in FIG. 2, the air knife 30 is set to be inclined with respect to the substrate B transport direction. By doing so, the blowing air discharged from the air blowing slit 321 acts as a component force of the pressing force on the cleaning water adhering to the substrate B in the substrate width direction. Compared to the case where the direction is perpendicular to the transport direction, the cleaning water adhering to the substrate B is efficiently removed.

  The liquid holding nozzle device 40 is provided between the liquid recovery type nozzle device 20 and the air knife 30, and is provided in a pair of upper and lower sides so as to sandwich the transport path 171. A cylindrical nozzle tube 41 and the nozzle tube 41 are provided. And an introduction pipe 42 into which ultrapure water from the third washing water supply source 53 is introduced by driving the delivery pump 531 and a surface of each nozzle pipe 41 facing the substrate B in the longitudinal direction. A plurality of nozzle holes 43 drilled at an equal pitch over substantially the entire length.

  Ultrapure water is sprayed on the front and back surfaces of the substrate B from the nozzle holes 43 of the liquid holding nozzle device 40 provided in a pair of upper and lower sides with the transport path 171 interposed therebetween, so that the liquid recovery nozzle device 20 performs the cleaning process. The substrate B is prevented from drying before reaching the air knife 30 and is further subjected to a final cleaning process by the spray water from the liquid holding nozzle device 40. In the state where the drying process is performed, it is possible to reliably prevent the occurrence of inconvenience that particles adhere to the front and back surfaces of the substrate B.

  In the present embodiment, the liquid holding nozzle device 40 is located closer to the liquid recovery type nozzle device 20 than the intermediate position between the liquid recovery type nozzle device 20 and the air knife 30, and as much as possible. It is provided at a position close to the recovery type nozzle device 20. The reason for this is that the liquid recovery type nozzle device 20 has only a minimum amount of ultrapure water coming into contact with the substrate B, so that the amount of adhering water is small. Therefore, the cleaned part of the substrate B is the liquid recovery type. Since natural drying proceeds immediately from the moment when the nozzle device 20 is detached, the liquid holding nozzle device 40 is installed as close to the liquid recovery type nozzle device 20 as possible to avoid this.

  On the other hand, as shown in FIG. 1, a guide tube 18 that guides the derivation of gas-liquid in the processing apparatus main body 11 is provided in the lower part of the first to fourth hoppers 121, 131, 141, 151. Each guide tube 18 has its lower end opened to face the bottom of the processing apparatus body 11, and an exhaust tube 19 is branched in the middle of the guide tube 18. A predetermined gas-liquid separator 181 is provided at a branching position of the guide pipe 18 with respect to the exhaust pipe 19, and the clean air and the processing liquid collected in the guide pipe 18 are separated by the gas-liquid separator 181. The processing liquid is led out from the lower end opening of the guide tube 18 to the bottom of the processing apparatus main body 11, while used air that has passed through the first cleaning chamber 12, the second cleaning chamber 13, the third cleaning chamber 14, and the drying chamber 15. Is directed to the exhaust pipe 19.

  Each exhaust pipe 19 is connected at its downstream end to a central exhaust pipe (exhaust means) 74 disposed in the vicinity of the substrate processing apparatus 10 for sucking exhaust from various places in the factory. Therefore, the spent air in the exhaust pipe 19 separated by the gas-liquid separator 181 is collected in the centralized exhaust pipe 74 and subjected to a predetermined dust collection process by a dust collector (not shown) installed in the factory. Later, it will be discharged out of the system.

  Each exhaust pipe 19 is provided with an adjustment damper 191 for adjusting the amount of suction air. The adjustment damper 191 adjusts the opening degree when the pressurized air is discharged from the air knife 30 provided in the first cleaning chamber 12, the second cleaning chamber 13 and the drying chamber 15 and when it is not discharged. As a result, the pressure in the processing apparatus main body 11 can always be set to a preset negative pressure environment. Although the air knife 30 is not provided in the third cleaning chamber 14, the third cleaning chamber 14 communicates with the first cleaning chamber 12, the second cleaning chamber 13, and the drying chamber 15. The pressure in the cleaning chamber 14 is affected by whether or not the air knife 30 provided in the first cleaning chamber 12, the second cleaning chamber 13, and the drying chamber 15 is operating. Also for 191, the opening degree is adjusted depending on whether pressurized air is discharged from the air knife 30 or not.

  That is, when pressurized air is discharged from the air knife 30, this is detected by a predetermined sensor, and this detection signal is input to a control device (not shown), whereby a control signal from the control device is received. The amount of used air sucked into the adjustment damper 191 is increased by increasing the opening of the adjustment damper 191 based on this control signal, and the discharge of pressurized air from the air knife 30 is stopped. Then, this is detected by a predetermined sensor, and the opening degree of the adjustment damper 191 is reduced by a control signal from the control device based on this detection signal, and the amount of suction of used air is reduced. Yes.

  By controlling the opening degree of the adjustment damper 191, the pressures in the first to third cleaning chambers 12 to 14 and the drying chamber 15 are always kept constant regardless of the discharge and stoppage of pressurized air from the air knife 30. ing.

  As described above in detail, the substrate processing apparatus 10 according to the present invention supplies a processing liquid to the substrate B being transported in a substantially horizontal posture along the transport path 171, thereby performing predetermined processing ( In the present embodiment, a cleaning process is performed, and the processing liquid (cleaning water in the present embodiment) supplied toward the substrate B on the upstream side of the transport path 171 can be recovered from the substrate B. A liquid recovery nozzle device 20 (in this embodiment, a liquid recovery nozzle device 20 provided in the third cleaning chamber 14) is provided, and an air knife 30 that blows off the cleaning water on the substrate B on the downstream side. Between the liquid recovery type nozzle device 20 and the air knife 30, a liquid holding nozzle device 40 for supplying cleaning water for preventing drying to the substrate B is provided.

  According to such a configuration, the substrate B introduced into the substrate processing apparatus is first cleaned with the cleaning water supplied from the liquid recovery type nozzle device 20 while being transported, and subsequently cleaned from the liquid holding nozzle device 40. Since water is supplied and reaches the air knife 30 in a liquid wet state, and a liquid draining process is performed by the air knife 30, the substrate B becomes liquid by supplying only the minimum necessary cleaning water from the liquid recovery type nozzle device 20. It is possible to reliably prevent the particles from being dried by the time they reach the cutting nozzle, and thereby the particles are fixed on the substrate B.

  Therefore, in spite of adopting the liquid recovery type nozzle device 20 for downsizing the substrate processing apparatus and reducing the running cost, the defect rate of the product increases due to the particles or the like adhering to the substrate B. Therefore, the substrate processing apparatus 10 can maximize the advantages of the liquid recovery type nozzle apparatus 20.

  Further, since the liquid holding nozzle device 40 is provided at a position closer to the liquid recovery type nozzle device 20 than the central position in the substrate transport direction between the liquid recovery type nozzle device 20 and the air knife 30, the liquid recovery type nozzle device 40 is provided. Drying of the substrate B cleaned by the apparatus 20 can be suppressed as much as possible.

  Further, a clean air blower 61 for introducing clean air into the processing chamber main body 11 is provided, and air in the processing chamber main body 11 is exhausted through a centralized exhaust pipe 74 disposed in the factory. Therefore, the clean air from the clean air blower 61 is always introduced into the processing chamber main body 11 and the air in the processing chamber main body 11 is always exhausted through the concentrated exhaust pipe 74. Therefore, even if floating particles exist in the processing chamber main body 11, they are accompanied by exhaust and discharged out of the system, whereby the atmosphere in the processing chamber main body 11 can always be kept clean and the substrate B is processed. Inconveniences such as contamination by particles due to the contaminated atmosphere in the chamber body 11 can be reliably prevented.

  Furthermore, since ultrapure water is used as the cleaning water used in the third cleaning chamber 14, the substrate B can be made extremely clean at the final stage of the cleaning process.

  The present invention is not limited to the above embodiment, and includes the following contents.

  (1) In the above embodiment, the substrate processing apparatus 10 is described as performing the cleaning process on the substrate B, but the present invention is limited to the substrate processing apparatus 10 being for cleaning process. It may be for chemical processing using a chemical solution such as an etching solution as a processing solution.

  (2) In the above embodiment, the liquid holding nozzle device 40 is not provided in the first and second cleaning chambers 12 and 13, but in the present invention, the liquid is not added to the first and second cleaning chambers 12 and 13. It is not limited to not providing the holding nozzle device 40, and the liquid holding nozzle device 40 may also be provided in these chambers. In this case, the liquid holding nozzle device 40 provided in the first cleaning chamber 12 is supplied with the cleaning water from the first cleaning water supply source 51 and the liquid holding nozzle device provided in the second cleaning chamber 13. 40 is supplied with wash water from the second wash water supply source 52. By doing so, the cleaning process in the first and second cleaning chambers 12 and 13 becomes a two-stage process of the liquid recovery type nozzle device 20 and the liquid holding nozzle device 40, and therefore the first and second cleaning chambers. A more effective cleaning process in steps 12 and 13 can be realized.

  (3) In the above-described embodiment, after the cleaning process, the substrate B is discharged from the liquid recovery type nozzle device 20 in the cleaning process of the substrate B with ultrapure water using the liquid recovery type nozzle device 20 in the third cleaning chamber 14. The pure water is discharged out of the system, but instead of this, the ultrapure water after the cleaning treatment may be returned to the second cleaning water supply source 52 or the first cleaning water supply source 51 and reused. Good.

  (4) In the above embodiment, the circular nozzle hole 43 for discharging the cleaning water to the liquid holding nozzle device 40 is formed in the nozzle tube 41, but the present invention discharges the cleaning water. The portion is not limited to the circular nozzle hole 43, but may be a square hole, a polygonal hole, a star hole, or the like, or a slit may be employed instead of the hole. A predetermined nozzle member may be attached.

  (5) In the above embodiment, in the third cleaning chamber 14, the liquid holding nozzle device 40 is provided at a substantially intermediate position between the liquid recovery type nozzle device 20 and the air knife 30. The holding nozzle device 40 is not limited to being provided at the intermediate position, and the installation position may be set as appropriate based on various situations relating to substrate processing such as the type of substrate B and operating conditions.

It is explanatory drawing of the cross sectional view which shows one Embodiment of the substrate processing apparatus which concerns on this invention. It is a perspective view for demonstrating the installation state of the liquid collection | recovery type nozzle apparatus, an air knife, and the liquid holding nozzle apparatus in a 3rd washing chamber and a drying chamber. It is sectional drawing of the side view of the liquid collection | recovery type nozzle apparatus shown in FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Substrate processing apparatus 11 Processing chamber main body 111 Upstream side wall 112 Downstream side wall 113 Top plate 114 Partition wall 12 1st cleaning chamber 121 1st hopper 13 2nd cleaning chamber 131 2nd hopper 14 3rd cleaning chamber 141 3rd hopper 15 Drying chamber 151 Fourth hopper 16 Substrate carry-in port 16 ′ Substrate carry-out port 17 Transport roller 171 Transport path 18 Guide tube 181 Gas-liquid separator 19 Exhaust tube 191 Adjustment damper 20 Liquid recovery nozzle device (liquid recovery nozzle unit)
201 Upper Nozzle Device 202 Lower Nozzle Device 21 Nozzle Body 22 Introducing Pipe 23 Outlet Pipe 24 Liquid Inlet 25 Liquid Outlet 30 Air Knife (Liquid Cutting Section)
31 Air knife body 32 Nozzle part 321 Air blowing slit 33 Air introduction tube 40 Liquid holding nozzle device (liquid holding nozzle part)
41 Nozzle pipe 42 Introduction pipe 43 Nozzle hole 50 Washing water supply source 51 First washing water supply source 52 Second washing water supply source 53 Third washing water supply source 531 Delivery pump 532 Suction pump 60 Air supply device 61 Clean air blower (Air introduction means)
74 Central exhaust pipe (exhaust means) B Substrate

Claims (5)

  A substrate processing apparatus for performing a predetermined process on the substrate by supplying the processing liquid to the substrate being transferred in a substantially horizontal posture along the transfer path, and supplying the processing liquid toward the substrate being transferred. The substrate is subjected to substrate processing and the processing liquid after processing is recovered from the substrate, and the processing liquid on the substrate is blown to the downstream side of the substrate transport path of the liquid recovery type nozzle portion to cut off the liquid. A liquid draining unit to be performed, and a liquid holding unit that is disposed between the liquid recovery type nozzle unit and the liquid draining unit and supplies a processing liquid that holds the substrate in a wet state until it is conveyed to at least the liquid draining unit. A substrate processing apparatus comprising:   The substrate processing apparatus according to claim 1, wherein the liquid draining portion is disposed at an angle of a predetermined angle on a surface parallel to the substrate transport surface in the substrate transport direction.   The substrate processing apparatus according to claim 1, wherein the holding liquid supply unit is provided at a substantially intermediate position between the liquid recovery nozzle unit and the liquid draining unit.   The liquid recovery type nozzle unit, the liquid draining unit, and the retentate supply unit are provided in a single processing chamber having a substrate loading / unloading port on the wall surface on the upstream and downstream sides in the substrate transport direction, and the processing chamber excludes the substrate transport path. It is partitioned by a partition wall with respect to the substrate transport direction, the liquid draining section is provided in a downstream space surrounded by the partition wall, and the retentate supply section is provided in an upstream space. 4. The substrate processing apparatus according to claim 1, wherein the substrate processing apparatus is characterized in that:   The substrate processing apparatus according to claim 1, wherein the processing liquid is cleaning water for cleaning the substrate.

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