JP2006004963A - Manufacturing method of electronic component package - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of an electronic component package by which precise sealing can be performed by inexpensively and precisely forming a sealing material. <P>SOLUTION: In a plating process, first plating work including plating for a base is performed on a component wiring pattern and a sealing pattern by using a terminal. Second plating work for completing the sealing pattern by using the terminal is performed after a work connection is disconnected. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a method for manufacturing an electronic component package, and more particularly, to an improvement in a sealing plating process performed in that process.

  In recent years, in electronic parts and communication parts such as mobile phones and television receivers, a large number of electronic parts such as piezoelectric devices containing piezoelectric vibrating reeds in packages and surface acoustic wave devices used as resonators and band-pass filters have been used. Has been.

FIG. 9 is a schematic cross-sectional view showing a general piezoelectric device 1.
In the figure, a piezoelectric device 1 includes a piezoelectric vibrating reed 5 accommodated and bonded in a package 4 in which a second substrate 3 for forming a wall is laminated on a first insulating substrate 2 that forms a bottom. Is.
The package 4 is hermetically sealed by joining a lid 6 with a brazing material 7.
In such a piezoelectric device 1, when the brazing material 7 for joining the lid body 6 described above is provided, the preformed brazing material 7 is attached to a sealing portion which is the upper end portion of the package 4, and the lid body 6 is attached. It was placed and heat-sealed.

However, when such a method is used, there is a defect that the shape and thickness of the brazing material 7 vary, and a method of attaching a sealing material by plating has also been proposed (see Patent Document 1).
In such a plating method, by controlling the plating time, the thickness of the sealing material can be precisely controlled, and there is no waste in the sealing material, so that low cost can be realized. In comparison, it has various advantages such as no need for a preform die.

JP 2003-229504 A

However, in the case of the above-described method for forming a sealing material using plating, there is the following problem if this is formed by electrolytic plating.
The package is made of tungsten metallization required for piezoelectric chips, surface acoustic wave (SAW) elements, or IC chips that function as oscillation circuit elements (hereinafter collectively referred to as “circuit components”). Gold-nickel is electroplated on the wiring pattern. In this case, in the subsequent manufacturing process, in the sealing material plating step, the wiring pattern portion is also plated with the sealing material, for example, “AuSn (gold tin)”.

In order to avoid this, masking is applied to the unnecessary parts of the sealing material to perform plating, but if the package is downsized or the number of circuit parts to be mounted increases, the wiring pattern becomes finer. As a result, it becomes difficult to apply a mask.
Therefore, a method of electroless plating of the wiring pattern is also conceivable, but the electroless plating requires high cost and leads to an increase in the cost of the package.

  SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned problems and to provide a package pattern structure that can be accurately sealed by forming a sealing material precisely while being low-cost, and uses the same. An electronic component package, a manufacturing method thereof, and an electronic component using the electronic component package are provided.

  According to the first aspect of the present invention, in the first invention, the first insulating substrate having a product unit size and the second insulating substrate stacked on the first insulating substrate are vertically and horizontally arranged in a matrix. The first sheet body and the second sheet body, which are in a continuous state, are separately formed, and a forming step for forming a necessary through hole is required for each of the sheet bodies. Forming a conductive pattern including a component wiring pattern and a sealing pattern, laminating and firing the first sheet body and the second sheet body, and the first And a plating step of plating a component wiring pattern and a sealing pattern for sealing, using the conductive pattern formed in the pattern forming step, and the second sheet body. The first and second sheets In the pattern forming step, the surface of the second sheet body corresponds to the size of the second insulating substrate in the product unit. Then, along each peripheral edge, the sealing pattern provided without breaks and the back side of the second sheet body and / or the front side of the first sheet body were systematically separated from each other. The remaining part of the component wiring pattern and the sealing pattern, and the patterns formed by dividing these patterns are arranged on the back surface side of the second sheet body and / or the front surface side of the first sheet body. Bus bars connected respectively at different edge portions, terminal portions formed by drawing at least the sealing pattern side bus bars to the side surface of the sheet body, and the bus bars connected to different systems A connection portion for working for connection is formed, and in the plating step, the terminal portion is used to simultaneously include a base plating for the component wiring pattern and the sealing pattern. By the method of manufacturing an electronic component package for performing a second plating operation for completing the sealing pattern using the terminal portion, after disconnecting the working connection portion, Achieved.

According to the configuration of the first invention, a component wiring pattern for wiring circuit components on the package and a sealing pattern for providing a plating pattern on the sealing portion along the periphery of the package are precisely provided. The process of forming is provided.
Each of the sheet bodies is for forming a plurality of insulating substrates for each product at the same time, and is particularly characterized by a pattern forming process on each sheet body. In principle, the wiring pattern and the sealing pattern formed in the pattern forming step are systematically divided and connected by a work connection portion. In addition, when a common plating material is applied in the first and second plating operations performed on these patterns, the wiring pattern and the sealing pattern are connected to each other by the operation connection portion. The material can be deposited all at once. The second plating operation is performed after the working connection portion is disconnected, so that when the sealing material is electroplated on the sealing pattern, the component wiring pattern is sealed. It can prevent effectively that the sealing material for plating the pattern for use adheres.
Thus, since the sealing pattern can be independently electroplated, it is not necessary to use an electroless plating method to distinguish the plating location, so the cost can be kept low, and the wiring pattern Even if the pattern is miniaturized, it is not necessary to use a method of selecting the plating part with the mask. A sealing structure can be realized.

According to a second aspect of the present invention, in the configuration of the first aspect of the present invention, the working connection portion is a conductive through-hole for routing each of the work bars from the bus bars connected to different systems to the surface side of the second sheet body, A connection pattern for connecting each through hole on the surface side of the sheet body, and the second plating operation is performed after the connection pattern is cut after the first plating operation. Features.
According to the configuration of the second invention, between the first plating step and the second plating step, the connection on the surface side of the second sheet body that is a part of the working connection portion. Since the component wiring pattern can be separated from the terminal portion by performing an easy operation of simply cutting the pattern for use, the operation of precisely plating only the sealing portion is ensured by an easy procedure. Can be done. In particular, since the connection pattern is exposed on the surface of the second sheet body located on the upper side when the first and second sheet bodies are laminated, the cutting operation is easy.

According to a third aspect of the present invention, in the configuration of the first aspect, the working connection portion extends the bus bars connected to different systems, and the extension portion connects on the first sheet body. A cutting guide portion formed so as to cross the connection pattern, and after the first sheet body is cut by the cutting guide portion, the second plating is performed. It is characterized by performing work.
According to the configuration of the third invention, each bus bar is extended, and the extension portion includes a connection pattern for connection on the first sheet body. The pattern is located at the edge of the first sheet body. Then, by cutting the cutting guide portion formed so as to cross the connection pattern, the connection between the component wiring pattern and the terminal portion is cut off, and then the second portion is used by using the terminal portion. Since the plating operation is performed, the plating necessary only for the sealing pattern can be performed precisely. In this case, the position where the sheet body is cut after the first plating operation is separated from the conductive pattern to be left as necessary, and the operation is reliable and easy.

FIG. 1 is a schematic plan view showing an example of a SAW device as an embodiment of an electronic component of the present invention. FIG. 2 is a schematic cross-sectional view taken along the line AA of FIG. The internal structure is shown.
The SAW device 30 includes a package 31, a surface acoustic wave element 33 as a circuit component housed in the package 31, and an IC chip 34. The surface acoustic wave element 33 is formed by forming an interdigital electrode IDT (comb electrode) and a necessary reflector on a piezoelectric substrate. The IC chip 34 is connected to the surface acoustic wave element 33 to form an oscillator.

Next, the structure of the package 31 will be described.
As shown in FIG. 2, the package 31 is formed by laminating the first insulating substrate 10 and the second insulating substrate 20, and a lid 32 is bonded to this to accommodate the circuit components described above. An internal space is formed and hermetically sealed. In this case, the lid body 32 has a cap shape so that the internal space can be formed inside the peripheral wall portion. For example, a lid 32 made of Kovar, which is an alloy of iron, nickel, and cobalt, or a gold alloy plated on 42 alloy, which is an alloy of iron, nickel, is suitable.
The package is not limited to such a configuration, and as shown in FIG. 9, the insulating substrate side may be box-shaped and the lid may be sealed using a flat plate.

The first insulating substrate 10 and the second insulating substrate 20 are formed, for example, by forming a ceramic green sheet made of aluminum oxide as an insulating material, for example, in a rectangular shape as shown in the drawing, as will be described later. After being made into a laminated state, it is formed by sintering.
Next, an example of a wiring pattern formed on each insulating substrate will be described.

FIG. 3 is a plan view of the second insulating substrate 20 which is the upper insulating substrate in the package 31 of FIG. 2, and the surface 21 side thereof is shown.
A sealing pattern 22 is formed on the surface 21 of the second insulating substrate 20 along the periphery thereof. Since the sealing pattern 22 is a sealing material, it has a width having a predetermined sealing margin along the periphery, and is formed without a break. Moreover, the sealing pattern 22 is for joining the metal lid 32, and a metal that is appropriately joined to the material of the lid 32 is attached by electrolytic plating. In this embodiment, the sealing pattern 22 is formed by performing nickel (Ni) plating and gold tin (AuSn) plating on tungsten metallization as a conductive pattern of the underlying layer. The lid 32 is brought into contact with the sealing pattern 22 which is the sealing portion as shown in FIG. 2, and the sealing portion is fused by seam welding or the like, so that the inside of the package is hermetically sealed. Conductive through holes 24 penetrating in the thickness direction of the substrate are formed at predetermined positions of the sealing pattern 22 and are electrically connected to the back surface (not shown) of the second insulating substrate 20.

On the surface 21 of the second insulating substrate 20, a component wiring pattern 23 is formed inside the sealing pattern 22. The component wiring pattern 23 is a wiring pattern for circuit components such as the surface acoustic wave element 33 and the IC chip 34 described with reference to FIG. 1, and nickel (Ni) is formed on the tungsten metallization as a conductive pattern of the underlayer. It is formed by plating and gold (Au) plating. Conductive through holes 25 penetrating in the thickness direction of the substrate are formed at predetermined positions of the component wiring pattern 23 and are electrically connected to the back surface (not shown) of the second insulating substrate 20.
As described above, in the second insulating substrate 20, the component wiring pattern 23 and the sealing pattern 22 are completely separated by dividing the area to be provided.

4 shows the first insulating substrate 10 which is the lower insulating substrate in the package 31 of FIG. 2. FIG. 4 (a) is a plan view thereof, FIG. 4 (b) is a side view thereof, and FIG. c) is a bottom view thereof.
The pattern shown in FIG. 4A is formed by selecting either the back surface (not shown) of the second insulating substrate 20 described in FIG. 3 or the front surface 11 of the first insulating substrate 10. FIG. 4A shows an example formed on the surface 11.
FIG. 4A shows an example formed on the surface 11 of the first insulating substrate 10, and in this case, the sealing patterns 22-1 2-2 and 22-3 are respectively the first insulating substrate. 10 is formed so as to be connected to the second insulating substrate 20 side at a position corresponding to each conductive through hole 24 described with reference to FIG.

  In particular, the sealing pattern 22-1 in FIG. 4A is routed so as to connect adjacent sides of the rectangular first insulating substrate 10 (in the illustrated case, adjacent long sides and short sides). Yes. In addition, as shown in FIG. 8, in the manufacturing process to be described later, the locations indicated by reference numerals 22-2 and 22-3 which are sealing patterns are before the first insulating substrate 10 having a product unit size is separated. In the sheet body, the sealing patterns 22-1 of the adjacent insulating substrates are connected to each other in a state where they are continuous in a matrix in the vertical and horizontal directions. By drawing around in this way, the sealing pattern avoids the central area of the first insulating substrate 10 as much as possible, and secures the area occupied by the component wiring pattern while maintaining the vertical and horizontal directions in the state of a sheet body to be described later. Out of the directions, the drawing is performed in the direction in which the short side is located (the Y direction in the drawing), and the drawing portions 91, 42, and 43 are made continuous with each other between the adjacent first insulating substrates 10. This point will be described in more detail later.

Component wiring patterns 23-1 are formed in the remaining region including the central region of the first insulating substrate 10. The component wiring pattern 23-1 is formed at a position corresponding to each conductive through hole 25 of the second insulating substrate 20 described in FIG. 3, and is electrically connected to the second insulating substrate 20 side in a stacked state. Have been to.
The wiring patterns separated from each other of the component wiring pattern 23-1 are routed in the vertical direction of FIG. 4A, and side terminals are provided as shown in FIG. 4B. As shown in FIG. 4C, mounting terminals 13, 14, 15, 16 are formed on the bottom surface 12 of the first insulating substrate 10 at positions slightly inside the four corners. Reference numerals 13, 14, 15, and 16 are integrated with the side terminals 13a, 14a, 15a, and 16a shown in FIGS. 4 (a) and 4 (b). For example, these side terminals 13a, 14a, 15a, 16a are formed in the sheet body before the first insulating substrate 10 having a product unit size is separated as shown in FIG. In the state where the matrix wiring is continued vertically and horizontally, it becomes a lead-out portion for connecting the component wiring patterns 23-1 of adjacent insulating substrates along the Y direction in the drawing. This drawer part is not limited to each of the side terminals 13a, 14a, 15a, and 16a in FIG. 4A. For example, the drawer parts 91 and 42 in FIG. Can also be connected.
The present embodiment is configured as described above. In the manufacturing process described later, the side terminals 13a, 14a, 15a, and 16a serving as the lead portions provided on the one-side side surface of the first insulating substrate of the package 31 are provided. The component wiring pattern 23 can be selectively electroplated, and only the sealing pattern 22 is selected using the lead-out portion 43 provided on the side surface in the other direction of the first insulating substrate. Electrolytic plating is possible.

(Package manufacturing method)
Next, an embodiment of a method for manufacturing the package 31 will be described with reference to the flowchart of FIG.
(Molding process)
First, for example, a ceramic powder is dispersed in a predetermined solution, and a kneaded product formed by adding a binder is formed into a sheet-like long tape shape (ST1), which is obtained by cutting it into a predetermined length. A so-called green sheet is prepared.
The green sheet can be used in common to form the first insulating substrate 10 and the second insulating substrate 20 described above as a sheet body.

(Pattern formation process)
Next, steps of forming each substrate, printing a conductive pattern, and forming through holes (through holes and castellations) will be described.
Each sheet body is prepared using the green sheet described above.
FIG. 6 shows a second sheet body 41 in which the product-unit second insulating substrate 20 is continuous vertically and horizontally in a matrix. In the figure, the region of the insulating substrate in product units is indicated by cutting lines C1 and C2.
First, the through hole 25, the side terminal hole 44, and the castellation 45 are punched (ST2), the region to be the component wiring pattern 23 and the region to be the sealing pattern 22 in FIG. Next, tungsten metallization is printed (ST3).

  FIG. 7 shows the first sheet body 51, in which a region for providing the sealing patterns 22-1, 22-2, and 22-3 and a region for providing the component wiring pattern 23-1 are shown. . Also in the 1st sheet | seat body 51, what becomes the 1st insulating substrate 10 of a product unit is continued in the matrix form vertically and horizontally. And since it is the same as the case of the 2nd sheet | seat body 41 about a through-hole and a cutting line, the same code | symbol is attached | subjected and the overlapping description is abbreviate | omitted.

As can be understood with reference to FIG. 7, in the first sheet body 51, in the illustrated state, the first insulating substrates 10 arranged vertically and horizontally adjacent to each other include the sealing patterns 22-1, 22-2 and 22-3 and the sealing pattern 22 of the second sheet body 41 shown in FIG. 6 stacked through the conductive through holes are in contact with each other, and are electrically connected. Yes.
As a result, all the first insulating substrates 10 are electrically connected in the Y direction shown in the figure, and are electrically connected to the plating work patterns 60 and 60 respectively provided on the left end and right end shown in the figure of the first sheet body 51. Has been.
That is, the plating pattern 60 has a bus bar (connecting portion) 61 for connecting the sealing patterns of the first insulating substrate 10 aligned in parallel, a lead portion 62, and a terminal portion 63. ing.

Similarly, as shown in FIG. 7, in the component wiring pattern 23-1, in the illustrated state, the first insulating substrates 10 arranged vertically and horizontally are adjacent to each other in the component wiring pattern 23-. 1 are connected to each other, drawn in the X direction shown in the figure, and are electrically connected to the plating work patterns 70 and 70 provided on the upper and lower ends of the first sheet 51 shown in the figure, respectively.
The plating pattern 70 includes a bus bar (connecting portion) 71 for connecting the component wiring patterns of the first insulating substrate 10 arranged in parallel, a lead portion 72, and a terminal portion 73. Yes. In the plating pattern 70, only the bus bar (connecting portion) 71 is provided, and the routing portion 72 and the terminal portion 73 that are not used in the following steps are not necessarily formed. However, by forming this, it is preferable to provide the mark because the vertical direction of the package can be easily determined when each side surface of the package is visually recognized.

Further, a work connection portion is provided in association with each bus bar 61, 71.
Specifically, as shown in FIG. 7, the working connection portion includes an extension portion 81 obtained by extending one bus bar 71 of the first sheet body 51 in one length direction, and a bus bar that is the extension target. The other one bus bar 61 adjacent to 71 has an extension 82 extending in the length direction.
On the other hand, as shown in FIG. 6, each of the extension portions 81, 82 described above is provided as a part of the working connection portion on the second sheet body 41 that overlaps the first sheet body 51. A linear connection pattern 85 and a connection pattern 86 are provided in a region that overlaps with the connection pattern 86.

The connection patterns 85 and 86 are orthogonal to each other and are integrated. Further, the second sheet body 41 is provided with conductive through holes 83 and 84 in the connection patterns 85 and 86, respectively. As shown in FIG. The first sheet body 51 is in contact with the vicinity of the ends of the extension portions 81 and 82.
Thus, the bus bars 61 and 71 are electrically connected to each other on the second sheet body 41 side by the above-described working connection portion.
Even if the extension portions 81 and 82 are not provided on the first sheet body 51, the connection patterns 85 and 86 of the second sheet body 41 are lengthened, and the conductive through-holes 83 and 84 respectively Of course, the bus bars 61 and 71 may be connected.
After the above pattern is formed, the second sheet body 41 is laminated on the first sheet body 51 (ST4), and then fired in the laminated state (firing step) (ST5).

(Plating process)
In the subsequent plating step, an electric field is applied to each terminal portion 63, 63 exposed on the vertical side surface of the first sheet body 51 described in FIG. Nickel (Ni) plating as a base is applied on the conductive pattern of tongue ten metallization. This operation is performed in a state where the first sheet body and the second sheet body are laminated.
As a result, a nickel layer as a base layer is simultaneously formed on the component wiring pattern and the sealing pattern (ST6).
Next, an electric field is applied to each of the terminal portions 63 and 63, and gold (Au) plating is subsequently performed (ST7). As a result, the component wiring pattern is completed by electrolytic plating, but the sealing pattern is not yet completed.

  Next, in order to separate the connection patterns 85 and 86 with respect to the second sheet body 41 on the upper side of the laminated substrate, for example, a position indicated by reference numeral 87 in FIG. 6 is cut. Such separation of the connection patterns 85 and 86 can be performed by a method of physically scraping the portion 87, or by irradiating a laser beam or the like and removing the conductive pattern by trimming. ST8).

As a result, the electrical connection between the bus bar 61 and the bus bar 71 is cut, and subsequently, as a second plating step, an electric field is applied to the terminal portions 63 and 63, and plating for sealing with gold tin (AuSn) is performed. (ST9).
Thereby, since the terminal parts 63 and 63 are conducted only to the sealing pattern 22 (22-1) side, the gold tin is not plated on the component wiring pattern 23 side, and the sealing pattern 22 Is precisely formed.
Finally, the first sheet body 51 and the second sheet body 41 are cut along cutting lines C1 and C2 to complete the package 31 as individual product units (ST10).

  Thus, according to the method of the above-described embodiment, the sealing pattern 22 (22-1) can be independently electroplated, and therefore, the electroless plating method may not be used to distinguish the plating locations. As a result, the cost can be kept low, and even if the wiring pattern is miniaturized, it is not necessary to use a method of selecting the plating part with a mask. A sealing portion with a sufficient thickness can be formed with high accuracy, and a reliable sealing structure can be realized.

FIG. 8 shows a first sheet body 51-1 used in another embodiment.
In the first sheet body 51-1, the extended portions extending from the bus bar 61 and the bus bar 71 are made larger than the case of FIG. By being connected, a connection pattern is obtained.
Further, for example, a cutting guide portion 95 is formed so as to obliquely cross the connection patterns 81-1 and 82-1. As shown in the figure, the cutting guide portion 95 can be formed by, for example, a groove, an emboss, a perforation, or the like cut in the thickness direction of the sheet body, and cut along the cutting guide portion 95 after sintering the sheet body. It is made easy to separate. In this case, the second sheet body overlapped with the first sheet body 51-1 is similarly provided with the cutting guide portion at the same position.

  Thus, the connection pattern of the present embodiment is located at the edge of the first sheet body 51-1. Then, the cutting guide portion 95 formed so as to cross the connection pattern is cut to disconnect the component wiring pattern from the terminal portion, and thereafter, the second portion is utilized using the terminal portion. Perform plating work. Thereby, plating required only for the sealing pattern can be performed precisely. In this case, the position where the sheet body is cut after the first plating operation is separated from the conductive pattern to be left as necessary, and the operation is reliable and easy.

The present invention is not limited to the above-described embodiment. Each configuration of the embodiment may be omitted as appropriate, or may be combined with other configurations not shown.
In the above-described embodiment, the SAW device that is an oscillator using a surface acoustic wave chip has been described as the electronic component. However, in addition to various electronic component packages such as a piezoelectric device that joins a piezoelectric vibrating piece in a package. The present invention can be applied.

1 is a schematic plan view showing an embodiment of an electronic component of the present invention. The AA line schematic sectional drawing of FIG. The schematic plan view of a 2nd insulated substrate. The figure of a 1st insulated substrate. The flowchart which shows embodiment of the manufacturing method of the package for electronic components of FIG. The schematic plan view of a 2nd sheet | seat body. The schematic plan view of a 1st sheet | seat body. The schematic plan view of the 1st sheet | seat body used for 2nd Embodiment. FIG. 6 is a schematic cross-sectional view of a conventional electronic component.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 ... 1st insulating substrate, 20 ... 2nd insulating substrate, 22 ... Sealing pattern (sealing part), 23 ... Component wiring pattern, 30 ... SAW device ( Electronic component), 41 ... second sheet body, 51 ... first sheet body.

Claims (3)

A first sheet body in which a first insulating substrate having a size of a product unit and a second insulating substrate stacked on the first insulating substrate are continuously arranged in a matrix in the vertical and horizontal directions; Forming the second sheet separately and forming a necessary through hole;
A pattern forming step of forming a conductive pattern including a required component wiring pattern and a sealing pattern for each of the sheet bodies,
Laminating and firing the first sheet body and the second sheet body;
A plating step of plating a component wiring pattern and a sealing pattern for sealing on the first sheet body and the second sheet body using a conductive pattern formed by the pattern forming step; ,
Dividing the laminated first and second sheet bodies into individual pieces each having a product unit size,
In the pattern forming step,
Corresponding to the size of the second insulating substrate of the product unit on the surface side of the second sheet body, along the respective peripheral edges, the sealing pattern provided without breaks;
With respect to the back surface side of the second sheet body and / or the front surface side of the first sheet body, the remaining part of the component wiring pattern and the sealing pattern that are systematically separated from each other;
Each of the patterns formed by dividing these lines, bus bars respectively connected at different edge portions on the back surface side of the second sheet body and / or the front surface side of the first sheet body,
A terminal part formed by drawing at least the bus bar on the sealing pattern side to the side surface of the sheet body;
Forming a working connection for connecting the bus bars connected to different systems;
In the plating step, using the terminal portion, the component wiring pattern and the sealing pattern are simultaneously subjected to a first plating operation including base plating,
Then, after disconnecting the work connection portion, a second plating operation for completing the sealing pattern is performed using the terminal portion. A method for manufacturing an electronic component package, comprising:   The work connection portion connects the through holes on the surface side of the second sheet body with conductive through holes for routing from the bus bars connected to different systems to the surface side of the second sheet body. 2. The electronic component package according to claim 1, wherein the second plating operation is performed after the connection pattern is cut after the first plating operation. Production method.   The working connection portion extends each bus bar connected to a different system, and the extension portion includes a connection pattern to be connected on the first sheet body, so as to cross the connection pattern. The cutting guide part formed in the above is formed, and after the first sheet body is cut by the cutting guide part, the second plating operation is performed. Manufacturing method of package for electronic components.

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