JP2005532902A5 - - Google Patents

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Publication number
JP2005532902A5
JP2005532902A5 JP2004521884A JP2004521884A JP2005532902A5 JP 2005532902 A5 JP2005532902 A5 JP 2005532902A5 JP 2004521884 A JP2004521884 A JP 2004521884A JP 2004521884 A JP2004521884 A JP 2004521884A JP 2005532902 A5 JP2005532902 A5 JP 2005532902A5
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JP
Japan
Prior art keywords
container
outlet port
disposed
inlet
primary
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Pending
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JP2004521884A
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English (en)
Japanese (ja)
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JP2005532902A (ja
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Publication date
Priority claimed from US10/295,302 external-priority patent/US7252714B2/en
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Publication of JP2005532902A publication Critical patent/JP2005532902A/ja
Publication of JP2005532902A5 publication Critical patent/JP2005532902A5/ja
Pending legal-status Critical Current

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JP2004521884A 2002-07-16 2003-07-15 超小型電子品加工片を熱的に制御して処理する装置及び方法 Pending JP2005532902A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US39647802P 2002-07-16 2002-07-16
US10/295,302 US7252714B2 (en) 2002-07-16 2002-11-15 Apparatus and method for thermally controlled processing of microelectronic workpieces
PCT/US2003/022174 WO2004007090A1 (en) 2002-07-16 2003-07-15 Apparatus and method for thermally controlled processing of microelectronic workpieces

Publications (2)

Publication Number Publication Date
JP2005532902A JP2005532902A (ja) 2005-11-04
JP2005532902A5 true JP2005532902A5 (https=) 2006-08-31

Family

ID=30117976

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004521884A Pending JP2005532902A (ja) 2002-07-16 2003-07-15 超小型電子品加工片を熱的に制御して処理する装置及び方法

Country Status (6)

Country Link
US (2) US7252714B2 (https=)
EP (1) EP1539371A4 (https=)
JP (1) JP2005532902A (https=)
AU (1) AU2003249286A1 (https=)
TW (1) TWI307943B (https=)
WO (1) WO2004007090A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060043750A1 (en) * 2004-07-09 2006-03-02 Paul Wirth End-effectors for handling microfeature workpieces
US20070020080A1 (en) * 2004-07-09 2007-01-25 Paul Wirth Transfer devices and methods for handling microfeature workpieces within an environment of a processing machine
US7531060B2 (en) * 2004-07-09 2009-05-12 Semitool, Inc. Integrated tool assemblies with intermediate processing modules for processing of microfeature workpieces
US20060045666A1 (en) * 2004-07-09 2006-03-02 Harris Randy A Modular tool unit for processing of microfeature workpieces
US20060281310A1 (en) * 2005-06-08 2006-12-14 Applied Materials, Inc. Rotating substrate support and methods of use
JP2010034283A (ja) * 2008-07-29 2010-02-12 Hitachi Kokusai Electric Inc 基板処理装置

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2658839A (en) * 1951-04-21 1953-11-10 Gen Am Transport Process of chemical nickel plating
US2791516A (en) * 1953-09-17 1957-05-07 Gen Motors Corp Electroless plating
GB1052647A (https=) * 1964-03-23
US3876434A (en) * 1972-12-07 1975-04-08 Shipley Co Replenishment of electroless nickel solutions
US4183799A (en) * 1978-08-31 1980-01-15 Production Machinery Corporation Apparatus for plating a layer onto a metal strip
US4448684A (en) * 1983-01-28 1984-05-15 The Perkin-Elmer Corporation Solvent pressurization system
JPH0669019B2 (ja) * 1984-03-12 1994-08-31 株式会社ニコン 半導体製造装置
US4594273A (en) * 1984-11-19 1986-06-10 International Business Machines Corporation High-rate electroless deposition process
US4616596A (en) * 1985-10-21 1986-10-14 Hughes Aircraft Company Electroless plating apparatus
JPH0622201B2 (ja) * 1986-05-19 1994-03-23 黒谷 巌 半導体材料の現像処理装置
US5235995A (en) * 1989-03-27 1993-08-17 Semitool, Inc. Semiconductor processor apparatus with dynamic wafer vapor treatment and particulate volatilization
EP0703604B1 (en) * 1994-09-20 2001-12-05 Consorzio per la Ricerca sulla Microelettronica nel Mezzogiorno Apparatus for the controlled cooling of chemical tanks
JP2655098B2 (ja) * 1994-10-18 1997-09-17 日本電気株式会社 薬液を用いたウエハ表面処理装置
US6042712A (en) * 1995-05-26 2000-03-28 Formfactor, Inc. Apparatus for controlling plating over a face of a substrate
US5938845A (en) * 1995-10-20 1999-08-17 Aiwa Co., Ltd. Uniform heat distribution apparatus and method for electroless nickel plating in fabrication of thin film head gaps
US5830805A (en) * 1996-11-18 1998-11-03 Cornell Research Foundation Electroless deposition equipment or apparatus and method of performing electroless deposition
TW405158B (en) * 1997-09-17 2000-09-11 Ebara Corp Plating apparatus for semiconductor wafer processing
US6555298B1 (en) * 2000-08-22 2003-04-29 Micron Technology, Inc. Method and apparatus for uniformly baking substrates such as photomasks
EP1335038A4 (en) * 2000-10-26 2008-05-14 Ebara Corp DEVICE AND METHOD FOR AUTOCATALYTIC DEPOSITION
US6551412B1 (en) * 2001-07-16 2003-04-22 Taiwan Semiconductor Manufacturing Company Non-tubular type recycle system of wet bench tank

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