JP2005532025A - 一体化オルタノ−スタータ用コントロール・パワー・モジュール - Google Patents
一体化オルタノ−スタータ用コントロール・パワー・モジュール Download PDFInfo
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- JP2005532025A JP2005532025A JP2004518879A JP2004518879A JP2005532025A JP 2005532025 A JP2005532025 A JP 2005532025A JP 2004518879 A JP2004518879 A JP 2004518879A JP 2004518879 A JP2004518879 A JP 2004518879A JP 2005532025 A JP2005532025 A JP 2005532025A
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F02—COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
- F02N—STARTING OF COMBUSTION ENGINES; STARTING AIDS FOR SUCH ENGINES, NOT OTHERWISE PROVIDED FOR
- F02N11/00—Starting of engines by means of electric motors
- F02N11/08—Circuits or control means specially adapted for starting of engines
- F02N11/0859—Circuits or control means specially adapted for starting of engines specially adapted to the type of the starter motor or integrated into it
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02P—CONTROL OR REGULATION OF ELECTRIC MOTORS, ELECTRIC GENERATORS OR DYNAMO-ELECTRIC CONVERTERS; CONTROLLING TRANSFORMERS, REACTORS OR CHOKE COILS
- H02P9/00—Arrangements for controlling electric generators for the purpose of obtaining a desired output
- H02P9/14—Arrangements for controlling electric generators for the purpose of obtaining a desired output by variation of field
- H02P9/26—Arrangements for controlling electric generators for the purpose of obtaining a desired output by variation of field using discharge tubes or semiconductor devices
- H02P9/30—Arrangements for controlling electric generators for the purpose of obtaining a desired output by variation of field using discharge tubes or semiconductor devices using semiconductor devices
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F02—COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
- F02N—STARTING OF COMBUSTION ENGINES; STARTING AIDS FOR SUCH ENGINES, NOT OTHERWISE PROVIDED FOR
- F02N11/00—Starting of engines by means of electric motors
- F02N11/04—Starting of engines by means of electric motors the motors being associated with current generators
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K11/00—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection
- H02K11/04—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection for rectification
- H02K11/049—Rectifiers associated with stationary parts, e.g. stator cores
- H02K11/05—Rectifiers associated with casings, enclosures or brackets
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02P—CONTROL OR REGULATION OF ELECTRIC MOTORS, ELECTRIC GENERATORS OR DYNAMO-ELECTRIC CONVERTERS; CONTROLLING TRANSFORMERS, REACTORS OR CHOKE COILS
- H02P9/00—Arrangements for controlling electric generators for the purpose of obtaining a desired output
- H02P9/08—Control of generator circuit during starting or stopping of driving means, e.g. for initiating excitation
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F02—COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
- F02D—CONTROLLING COMBUSTION ENGINES
- F02D2400/00—Control systems adapted for specific engine types; Special features of engine control systems not otherwise provided for; Power supply, connectors or cabling for engine control systems
- F02D2400/18—Packaging of the electronic circuit in a casing
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F02—COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
- F02N—STARTING OF COMBUSTION ENGINES; STARTING AIDS FOR SUCH ENGINES, NOT OTHERWISE PROVIDED FOR
- F02N11/00—Starting of engines by means of electric motors
- F02N11/08—Circuits or control means specially adapted for starting of engines
- F02N2011/0881—Components of the circuit not provided for by previous groups
- F02N2011/0896—Inverters for electric machines, e.g. starter-generators
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
- H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
- H01L2224/48229—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad protruding from the surface of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Control Of Eletrric Generators (AREA)
- Lighting Device Outwards From Vehicle And Optical Signal (AREA)
- Power Conversion In General (AREA)
Abstract
Description
−伝統的に二つのスリップ・リング706、707に結合されたインダクタを構成する、巻かれた構造のロータ743と、励磁電流をもたらす二つのブラシ。
−複数のコイルまたは巻回体を担持し、電機子507を構成する多相のステータ503であり、該多相のステータは、三相構造の最も多くの場合にはスター結線あるいはデルタ結線され、オルタネータとして作動するときには整流ブリッジに向けて、変換された電力を送り込むもの。
−複数の枝路の付いたトランジスタのブリッジを含むパワー・ユニットと、
−オルタネータ−スタータの相の電圧を基準電圧と比較し、比較結果の値にしたがってパワー・ユニットのトランジスタを指令制御するためのコントロール・ユニットを具備しており、
該コントロール・ユニットが、
−パワー・ユニットの枝路のトランジスタの近傍に接続さている、パワー・ユニットのトランジスタのブリッジの各枝路用のドライバ回路と、
−ドライバ回路を指令制御するための管理回路を含んでいることを特徴としている。
−ドライバ回路の左側に指示された信号で、これは管理回路から発せられた信号であり、そして、
−ドライバ回路の右側に指示された信号で、パワー・ユニットで受信した、またはそのパワー・ユニットへ送信された、つまりドライバ回路が操作するトランジスタへ送信された信号である。
2 管理回路 コントロール回路
3 オルタノ−スタータ オルタネータ−スタータ
10 ドライバ回路
11、12 スイッチング素子 パワートランジスタ
20 ドライバ回路
21、22 スイッチング素子 パワートランジスタ
30 ドライバ回路
31、32 スイッチング素子 パワートランジスタ
50 コントロール・ユニット
100 コントロール・パワー・モジュール
113 放熱器
200 パワー・サブ・モジュール
504 後部軸受体
506 軸受
511 カバー
515 送風ファン
600 トラック
630 コネクタ
Claims (9)
- 自動車用オルタネータ−スタータのコントロール・パワー・モジュール(100)であり、該モジュールは、自動車のオルタネータ−スタータ(3)、車載電源網(Ua)およびアース線(GND)の間に接続され、
−複数の枝路(B1〜B3)の付いたトランジスタのブリッジを含むパワー・ユニット(1)と、
−オルタネータ−スタータの相(φ)の電圧を基準電圧(Ua、GND)と比較し、比較結果の値に応じてトランジスタを指令制御するためのコントロール・ユニット(50)を具備するものであって、
コントロール・ユニット(50)が、
−枝路のトランジスタの近傍に接続されている、パワー・ユニット(1)のトランジスタのブリッジの各枝路用のドライバ回路(10、20、30)と、
−ドライバ回路を指令制御するための管理回路(2)を含んでいることを特徴とする、コントロール・パワー・モジュール。 - ドライバ回路(10、20、30)とパワー・ユニット(1)がモジュールの第一ステージを形成し、管理回路(2)がモジュールの第二ステージを形成することを特徴とする、請求項1に記載のコントロール・パワー・モジュール。
- 管理回路(2)がドライバ回路から離されていることを特徴とする、請求項1に記載のコントロール・パワー・モジュール。
- ドライバ回路が、第一の側部には管理回路(2)への接続を、第二の側部にはパワー・ユニット(1)への接続を具備することを特徴とする、請求項1〜3のいずれか一つに記載にコントロール・パワー・モジュール。
- オルタネータ−スタータのケースの内部に一体化されることを特徴とする、請求項1〜4のいずれか一つに記載のコントロール・パワー・モジュール。
- 第一ステージがオルタネータ−スタータの後部に一体化され、第二ステージがオルタネータ−スタータのケースの外部にあることを特徴とする、請求項2〜4のいずれか一つに記載のコントロール・パワー・モジュール。
- 各枝路と、該枝路を操作するドライバ回路がオルタネータ−スタータの相の出力の近傍に接続されていることを特徴とする、請求項5または請求項6に記載のコントロール・パワー・モジュール。
- 管理回路(2)の指令制御が、すべてのドライバ回路に共通であることを特徴とする、請求項1〜7のいずれか一つに記載のコントロール・パワー・モジュール。
- 各トランジスタが、並列に接続されたトランジスタの集合であることを特徴とする、請求項1〜8のいずれか一つに記載のコントロール・パワー・モジュール。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0208420A FR2842041B1 (fr) | 2002-07-04 | 2002-07-04 | Module de controle et de puissance d'un alterno-demarreur integrable |
FR0307378A FR2842042A1 (fr) | 2002-07-04 | 2003-06-18 | Module de controle et de puissance d'un alterno-demarreur integrale |
PCT/FR2003/002092 WO2004006423A2 (fr) | 2002-07-04 | 2003-07-04 | Module de controle et de puissance d'une alterno-demarreur integrable |
Publications (2)
Publication Number | Publication Date |
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JP2005532025A true JP2005532025A (ja) | 2005-10-20 |
JP4369991B2 JP4369991B2 (ja) | 2009-11-25 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2004518879A Expired - Fee Related JP4369991B2 (ja) | 2002-07-04 | 2003-07-04 | 一体化オルタノ−スタータ用コントロール・パワー・モジュール |
Country Status (11)
Country | Link |
---|---|
US (1) | US7224145B2 (ja) |
EP (1) | EP1523803B1 (ja) |
JP (1) | JP4369991B2 (ja) |
KR (1) | KR20050012892A (ja) |
CN (1) | CN100347948C (ja) |
AT (1) | ATE487269T1 (ja) |
DE (1) | DE60334800D1 (ja) |
FR (1) | FR2842042A1 (ja) |
MX (1) | MXPA05000189A (ja) |
PL (1) | PL210932B1 (ja) |
WO (1) | WO2004006423A2 (ja) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008241188A (ja) * | 2007-03-28 | 2008-10-09 | Mitsubishi Electric Corp | 貫流送風機および空気調和機 |
JP2009532892A (ja) * | 2006-04-06 | 2009-09-10 | バレオ・エチユード・エレクトロニク | 特にパワーエレクトロニクス部品用のスタンド、そのようなスタンドを備える電力モジュール、モジュールを備えるアセンブリ、及び、上記モジュールによって制御される電気部材 |
JP2012503464A (ja) * | 2008-09-18 | 2012-02-02 | コントロールド パワー テクノロジーズ リミテッド | 電気機械 |
JP2016034203A (ja) * | 2014-07-31 | 2016-03-10 | 株式会社デンソー | 電子装置 |
JP2019041110A (ja) * | 2014-11-20 | 2019-03-14 | 日本精工株式会社 | 電子部品搭載用放熱基板 |
JP2019161923A (ja) * | 2018-03-15 | 2019-09-19 | 三菱電機株式会社 | 回転電機 |
JP2021529501A (ja) * | 2018-06-28 | 2021-10-28 | ヴァレオ エキプマン エレクトリク モトゥール | スイッチ、スイッチングアーム、及び電気設備を制御するためのシステム |
Families Citing this family (50)
Publication number | Priority date | Publication date | Assignee | Title |
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AU2003237652A1 (en) * | 2002-06-07 | 2003-12-22 | Autoliv Development Ab | Electrically insulated fixing device for an airbag module |
JP2005328690A (ja) * | 2004-04-12 | 2005-11-24 | Hitachi Ltd | 車両用回転電機 |
FR2873869B1 (fr) * | 2004-07-29 | 2006-10-06 | Valeo Equip Electr Moteur | Dispositif de controle et de puissance pour une machine electrique tournante |
FR2874764B1 (fr) * | 2004-08-31 | 2007-09-21 | Valeo Equip Electr Moteur | Module de commande et de puissance pour une machine electrique tournante |
FR2879048B1 (fr) * | 2004-12-02 | 2007-02-09 | Valeo Equip Electr Moteur | Gestion de fonctionnement d'un alterno-demarreur de vehicule automobile |
JP4583191B2 (ja) * | 2005-01-28 | 2010-11-17 | 三菱電機株式会社 | 回転電機 |
FR2886506B1 (fr) * | 2005-05-31 | 2011-02-25 | Valeo Equip Electr Moteur | Module electronique pour machine electrique tournante |
FR2886482B1 (fr) | 2005-05-31 | 2011-03-25 | Valeo Equip Electr Moteur | Dissipateur pour composants electroniques d'une machine electrique tournante |
FR2886505B1 (fr) * | 2005-05-31 | 2007-07-06 | Valeo Equip Electr Moteur | Assemblage de composants electroniques pour machine electrique tournante |
FR2886476B1 (fr) | 2005-05-31 | 2007-07-06 | Valeo Equip Electr Moteur | Piece d'interconnexion de puissance pour machine electrique tournante |
FR2886477B1 (fr) | 2005-05-31 | 2007-07-06 | Valeo Equip Electr Moteur | Piece d'interconnexion de signal pour machine electrique tournante |
WO2006131415A1 (de) * | 2005-06-10 | 2006-12-14 | Siemens Vdo Automotive Ag | Elektronische steuerungseinheit zur ansteuerung externer halbbrücken-leistungsendstufen und elektromotorischer antrieb mit elektronischer steuerungseinheit |
JP4402057B2 (ja) * | 2006-02-21 | 2010-01-20 | 三菱電機株式会社 | 制御装置一体型回転電機 |
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2003
- 2003-06-18 FR FR0307378A patent/FR2842042A1/fr not_active Withdrawn
- 2003-07-04 CN CNB038155575A patent/CN100347948C/zh not_active Expired - Lifetime
- 2003-07-04 JP JP2004518879A patent/JP4369991B2/ja not_active Expired - Fee Related
- 2003-07-04 MX MXPA05000189A patent/MXPA05000189A/es active IP Right Grant
- 2003-07-04 PL PL375199A patent/PL210932B1/pl unknown
- 2003-07-04 KR KR10-2005-7000176A patent/KR20050012892A/ko not_active Application Discontinuation
- 2003-07-04 US US10/519,081 patent/US7224145B2/en active Active
- 2003-07-04 WO PCT/FR2003/002092 patent/WO2004006423A2/fr active Application Filing
- 2003-07-04 DE DE60334800T patent/DE60334800D1/de not_active Expired - Lifetime
- 2003-07-04 AT AT03748202T patent/ATE487269T1/de not_active IP Right Cessation
- 2003-07-04 EP EP03748202A patent/EP1523803B1/fr not_active Expired - Lifetime
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JP2008241188A (ja) * | 2007-03-28 | 2008-10-09 | Mitsubishi Electric Corp | 貫流送風機および空気調和機 |
JP4687675B2 (ja) * | 2007-03-28 | 2011-05-25 | 三菱電機株式会社 | 貫流送風機および空気調和機 |
JP2012503464A (ja) * | 2008-09-18 | 2012-02-02 | コントロールド パワー テクノロジーズ リミテッド | 電気機械 |
JP2016034203A (ja) * | 2014-07-31 | 2016-03-10 | 株式会社デンソー | 電子装置 |
JP2019041110A (ja) * | 2014-11-20 | 2019-03-14 | 日本精工株式会社 | 電子部品搭載用放熱基板 |
JP2019161923A (ja) * | 2018-03-15 | 2019-09-19 | 三菱電機株式会社 | 回転電機 |
US11128200B2 (en) | 2018-03-15 | 2021-09-21 | Mitsubishi Electric Corporation | Rotating electric machine |
JP2021529501A (ja) * | 2018-06-28 | 2021-10-28 | ヴァレオ エキプマン エレクトリク モトゥール | スイッチ、スイッチングアーム、及び電気設備を制御するためのシステム |
US11451184B2 (en) | 2018-06-28 | 2022-09-20 | Valeo Equipements Electriques Moteur | System for controlling a switch, switching arm and electrical installation |
JP7182650B2 (ja) | 2018-06-28 | 2022-12-02 | ヴァレオ エキプマン エレクトリク モトゥール | スイッチ、スイッチングアーム、及び電気設備を制御するためのシステム |
Also Published As
Publication number | Publication date |
---|---|
JP4369991B2 (ja) | 2009-11-25 |
MXPA05000189A (es) | 2005-04-08 |
US20050253457A1 (en) | 2005-11-17 |
US7224145B2 (en) | 2007-05-29 |
DE60334800D1 (de) | 2010-12-16 |
ATE487269T1 (de) | 2010-11-15 |
PL210932B1 (pl) | 2012-03-30 |
CN1666405A (zh) | 2005-09-07 |
WO2004006423A2 (fr) | 2004-01-15 |
CN100347948C (zh) | 2007-11-07 |
EP1523803A2 (fr) | 2005-04-20 |
KR20050012892A (ko) | 2005-02-02 |
WO2004006423A3 (fr) | 2004-04-15 |
FR2842042A1 (fr) | 2004-01-09 |
PL375199A1 (en) | 2005-11-28 |
EP1523803B1 (fr) | 2010-11-03 |
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