JP2005521268A - 真空中の平面パネル取扱い装置 - Google Patents

真空中の平面パネル取扱い装置 Download PDF

Info

Publication number
JP2005521268A
JP2005521268A JP2003581335A JP2003581335A JP2005521268A JP 2005521268 A JP2005521268 A JP 2005521268A JP 2003581335 A JP2003581335 A JP 2003581335A JP 2003581335 A JP2003581335 A JP 2003581335A JP 2005521268 A JP2005521268 A JP 2005521268A
Authority
JP
Japan
Prior art keywords
linear motion
vacuum chamber
motion assembly
substrate
linear
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003581335A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005521268A5 (https=
Inventor
デニス ピー プール
Original Assignee
ブルックス オートメーション インコーポレイテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ブルックス オートメーション インコーポレイテッド filed Critical ブルックス オートメーション インコーポレイテッド
Publication of JP2005521268A publication Critical patent/JP2005521268A/ja
Publication of JP2005521268A5 publication Critical patent/JP2005521268A5/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J18/00—Arms
    • B25J18/02—Arms extensible
    • B25J18/04—Arms extensible rotatable
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/02—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B25J9/041—Cylindrical coordinate type
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Manipulator (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2003581335A 2002-03-22 2003-02-21 真空中の平面パネル取扱い装置 Pending JP2005521268A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/104,846 US6779962B2 (en) 2002-03-22 2002-03-22 Device for handling flat panels in a vacuum
PCT/US2003/005191 WO2003084043A2 (en) 2002-03-22 2003-02-21 Device for handling flat panels in a vacuum

Publications (2)

Publication Number Publication Date
JP2005521268A true JP2005521268A (ja) 2005-07-14
JP2005521268A5 JP2005521268A5 (https=) 2008-08-14

Family

ID=28040712

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003581335A Pending JP2005521268A (ja) 2002-03-22 2003-02-21 真空中の平面パネル取扱い装置

Country Status (8)

Country Link
US (1) US6779962B2 (https=)
EP (1) EP1513962A4 (https=)
JP (1) JP2005521268A (https=)
KR (1) KR100738592B1 (https=)
CN (1) CN100346943C (https=)
AU (1) AU2003219828A1 (https=)
TW (1) TWI251288B (https=)
WO (1) WO2003084043A2 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013540361A (ja) * 2010-10-08 2013-10-31 ブルックス オートメーション インコーポレイテッド 同軸駆動真空ロボット

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050223837A1 (en) * 2003-11-10 2005-10-13 Blueshift Technologies, Inc. Methods and systems for driving robotic components of a semiconductor handling system
US7458763B2 (en) 2003-11-10 2008-12-02 Blueshift Technologies, Inc. Mid-entry load lock for semiconductor handling system
US10086511B2 (en) 2003-11-10 2018-10-02 Brooks Automation, Inc. Semiconductor manufacturing systems
US20070269297A1 (en) 2003-11-10 2007-11-22 Meulen Peter V D Semiconductor wafer handling and transport
US9099506B2 (en) * 2005-03-30 2015-08-04 Brooks Automation, Inc. Transfer chamber between workstations
US20060251499A1 (en) * 2005-05-09 2006-11-09 Lunday Andrew P Linear substrate delivery system with intermediate carousel
US20070048451A1 (en) * 2005-08-26 2007-03-01 Applied Materials, Inc. Substrate movement and process chamber scheduling
US7432184B2 (en) * 2005-08-26 2008-10-07 Applied Materials, Inc. Integrated PVD system using designated PVD chambers
NL1036794A1 (nl) * 2008-04-25 2009-10-27 Asml Netherlands Bv Robot for in-vacuum use.
KR20090130559A (ko) * 2008-06-16 2009-12-24 삼성모바일디스플레이주식회사 이송 장치 및 이를 구비하는 유기물 증착 장치
RU2481057C1 (ru) * 2011-12-20 2013-05-10 Юрий Иванович Русанов Устройство горизонтального возвратно-поступательного разворота аппаратов диагностики после подъема многофункциональной диагностико-хирургической робототехнической системы для операционного стола с возможностью информационно-компьютерного управления им. ю.и. русанова
US10363665B2 (en) * 2012-07-10 2019-07-30 Persimmon Technologies Corporation Linear robot arm with multiple end effectors
US9293317B2 (en) * 2012-09-12 2016-03-22 Lam Research Corporation Method and system related to semiconductor processing equipment
US10134621B2 (en) 2013-12-17 2018-11-20 Brooks Automation, Inc. Substrate transport apparatus
ES2926698T3 (es) * 2015-03-30 2022-10-27 Azenta Inc Sistema de almacenamiento criogénico automatizado
GB201900478D0 (en) 2019-01-14 2019-02-27 Rolls Royce Plc Turbomachine
JP6677366B1 (ja) * 2019-03-12 2020-04-08 日本精工株式会社 ワークチェンジャ、ワーク搬送装置、加工装置、及び、リング軸受の製造方法、機械の製造方法、車両の製造方法
US12046499B2 (en) 2020-02-05 2024-07-23 Brooks Automation Us, Llc Substrate processing apparatus
CN113043253B (zh) * 2021-02-08 2022-05-17 珞石（北京）科技有限公司 单驱动直线运动机器人
CN114014018B (zh) * 2021-11-16 2023-05-26 仪晟科学仪器(嘉兴)有限公司 一种超高真空样品传递装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4820109A (en) 1986-04-11 1989-04-11 Ampex Corporation Bidirectional transfer mechanism
US4787813A (en) * 1987-08-26 1988-11-29 Watkins-Johnson Company Industrial robot for use in clean room environment
US5102373A (en) * 1989-12-01 1992-04-07 Martinsound Technologies, Inc. Automated fader system
US5135349A (en) * 1990-05-17 1992-08-04 Cybeq Systems, Inc. Robotic handling system
DE4302794A1 (de) 1993-02-02 1994-08-04 Leybold Ag Vorrichtung zum Ein- und/oder Ausschleusen einer Maske in die bzw. aus der Kammer einer Vakuum-Beschichtungsanlage
JPH07115120A (ja) * 1993-10-18 1995-05-02 Hitachi Ltd 基板搬送装置およびその方法
US5794487A (en) * 1995-07-10 1998-08-18 Smart Machines Drive system for a robotic arm
JPH09267289A (ja) * 1996-03-29 1997-10-14 Mitsubishi Electric Corp 産業用ロボット
US6318951B1 (en) 1999-07-09 2001-11-20 Semitool, Inc. Robots for microelectronic workpiece handling
TW589391B (en) 1997-07-08 2004-06-01 Unaxis Trading Ag Process for vacuum treating workpieces, and corresponding process equipment
US6585478B1 (en) * 2000-11-07 2003-07-01 Asm America, Inc. Semiconductor handling robot with improved paddle-type end effector
KR20190000980A (ko) * 2017-06-26 2019-01-04 이동원 퍼스널 헬스케어 시스템

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013540361A (ja) * 2010-10-08 2013-10-31 ブルックス オートメーション インコーポレイテッド 同軸駆動真空ロボット
US9656386B2 (en) 2010-10-08 2017-05-23 Brooks Automation, Inc. Coaxial drive vacuum robot
JP2017123461A (ja) * 2010-10-08 2017-07-13 ブルックス オートメーション インコーポレイテッド 同軸駆動真空ロボット
KR101917335B1 (ko) * 2010-10-08 2018-11-09 브룩스 오토메이션 인코퍼레이티드 동일축 구동 진공 로봇

Also Published As

Publication number Publication date
TW200305968A (en) 2003-11-01
US20030180126A1 (en) 2003-09-25
EP1513962A2 (en) 2005-03-16
WO2003084043A3 (en) 2004-12-29
WO2003084043A2 (en) 2003-10-09
AU2003219828A8 (en) 2003-10-13
AU2003219828A1 (en) 2003-10-13
CN100346943C (zh) 2007-11-07
CN1643177A (zh) 2005-07-20
KR100738592B1 (ko) 2007-07-11
US6779962B2 (en) 2004-08-24
TWI251288B (en) 2006-03-11
KR20040099259A (ko) 2004-11-26
EP1513962A4 (en) 2008-05-14

Similar Documents

Publication Publication Date Title
JP2005521268A (ja) 真空中の平面パネル取扱い装置
US8007218B2 (en) Unit and method for transferring substrates and apparatus and method for treating substrates with the unit
KR101406623B1 (ko) 워크 반송 시스템
JP4583461B2 (ja) 基板の搬送方法、基板処理方法、半導体装置の製造方法および基板処理装置
EP3734651B1 (en) Thin plate-shaped substrate holding device, and holding device equipped transport robot
JP4493955B2 (ja) 基板処理装置及び搬送ケース
JP4999487B2 (ja) 基板処理装置
TWI881983B (zh) 基板處理裝置
US20190096702A1 (en) Substrate processing apparatus, substrate processing method, and computer storage medium
JPH08213446A (ja) 処理装置
JP2020013814A (ja) 局所パージ機能を有する搬送装置
JP2009260252A (ja) 基板処理装置およびその方法ならびに基板搬送装置
TWI417978B (zh) A substrate processing device, a loading lock chamber unit, and a transporting device
JPH10256346A (ja) カセット搬出入機構及び半導体製造装置
TW201725099A (zh) 用於在進行電子設備製造時輸送基板的機械手組件、基板處理裝置及方法
KR100757142B1 (ko) 웨이퍼 처리 시스템
CN108695202B (zh) 处理系统
TWI750501B (zh) 基板處理裝置以及基板處理方法
KR102139613B1 (ko) 기판 반송 장치 및 기판 처리 장치
JPWO2020252476A5 (https=)
US20030194299A1 (en) Processing system for semiconductor wafers
JP5385965B2 (ja) 基板処理装置
WO2022070952A1 (ja) 基板処理装置、搬送機構及び基板処理方法
JPH09107015A (ja) 基板処理装置
JP2007281491A (ja) 基板洗浄装置

Legal Events

Date Code Title Description
A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20071225

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20080324

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20080331

A524 Written submission of copy of amendment under article 19 pct

Free format text: JAPANESE INTERMEDIATE CODE: A524

Effective date: 20080624

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20080722

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20081014

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20081021

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20090122

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20090407

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20090807

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20090928

A912 Re-examination (zenchi) completed and case transferred to appeal board

Free format text: JAPANESE INTERMEDIATE CODE: A912

Effective date: 20091113

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20100922

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20100928

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20110209

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20110215

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110516