JP2005517290A5 - - Google Patents
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- Publication number
- JP2005517290A5 JP2005517290A5 JP2003565693A JP2003565693A JP2005517290A5 JP 2005517290 A5 JP2005517290 A5 JP 2005517290A5 JP 2003565693 A JP2003565693 A JP 2003565693A JP 2003565693 A JP2003565693 A JP 2003565693A JP 2005517290 A5 JP2005517290 A5 JP 2005517290A5
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- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US35341902P | 2002-02-06 | 2002-02-06 | |
| US10/123,917 US7374477B2 (en) | 2002-02-06 | 2002-04-16 | Polishing pads useful for endpoint detection in chemical mechanical polishing |
| US10/124,507 US7001242B2 (en) | 2002-02-06 | 2002-04-16 | Method and apparatus of eddy current monitoring for chemical mechanical polishing |
| PCT/US2003/003666 WO2003066284A1 (en) | 2002-02-06 | 2003-02-06 | Method and apparatus for chemical mechanical polishing with an eddy current monitoring system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2005517290A JP2005517290A (ja) | 2005-06-09 |
| JP2005517290A5 true JP2005517290A5 (ja) | 2009-10-01 |
Family
ID=27739025
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003565693A Pending JP2005517290A (ja) | 2002-02-06 | 2003-02-06 | 渦電流モニタリングシステムを備えた化学機械的研磨の為の方法及び装置 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2005517290A (ja) |
| TW (1) | TWI273947B (ja) |
| WO (1) | WO2003066284A1 (ja) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7205166B2 (en) * | 2002-06-28 | 2007-04-17 | Lam Research Corporation | Method and apparatus of arrayed, clustered or coupled eddy current sensor configuration for measuring conductive film properties |
| US6929531B2 (en) * | 2002-09-19 | 2005-08-16 | Lam Research Corporation | System and method for metal residue detection and mapping within a multi-step sequence |
| DE102004027846B4 (de) * | 2004-06-08 | 2007-06-06 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Schleifvorrichtung mit integrierten mikromagnetischen Sensoren |
| DE102007015502A1 (de) * | 2007-03-30 | 2008-10-02 | Advanced Micro Devices, Inc., Sunnyvale | CMP-System mit einem Wirbelstromsensor mit geringerer Höhe |
| US9205527B2 (en) * | 2012-11-08 | 2015-12-08 | Applied Materials, Inc. | In-situ monitoring system with monitoring of elongated region |
| US20150038066A1 (en) * | 2013-07-31 | 2015-02-05 | Nexplanar Corporation | Low density polishing pad |
| JP2016087780A (ja) * | 2014-10-31 | 2016-05-23 | 株式会社荏原製作所 | 研磨装置および研磨方法 |
| JP2017064899A (ja) * | 2015-10-01 | 2017-04-06 | 株式会社荏原製作所 | 研磨装置 |
| JP6779633B2 (ja) * | 2016-02-23 | 2020-11-04 | 株式会社荏原製作所 | 研磨装置 |
| US20220040612A1 (en) * | 2018-09-21 | 2022-02-10 | Pyrotek, Inc. | Electromagnetic priming of molten metal filters |
| JP7472111B2 (ja) * | 2018-09-24 | 2024-04-22 | アプライド マテリアルズ インコーポレイテッド | Ｃｍｐプロセス制御アルゴリズムへの入力としてのマシンビジョン |
| JP2021053754A (ja) * | 2019-09-30 | 2021-04-08 | 富士紡ホールディングス株式会社 | 研磨パッド及び研磨加工物の製造方法 |
| JP2021053747A (ja) * | 2019-09-30 | 2021-04-08 | 富士紡ホールディングス株式会社 | 研磨パッド及び研磨加工物の製造方法 |
| JP2021053753A (ja) * | 2019-09-30 | 2021-04-08 | 富士紡ホールディングス株式会社 | 研磨パッド及び研磨加工物の製造方法 |
| JP2021053748A (ja) * | 2019-09-30 | 2021-04-08 | 富士紡ホールディングス株式会社 | 研磨パッド及び研磨加工物の製造方法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10202514A (ja) * | 1997-01-20 | 1998-08-04 | Speedfam Co Ltd | 自動定寸装置 |
| JP3303963B2 (ja) * | 1997-01-20 | 2002-07-22 | 株式会社東京精密 | ウェーハの厚み加工量測定装置 |
| US6068539A (en) * | 1998-03-10 | 2000-05-30 | Lam Research Corporation | Wafer polishing device with movable window |
| KR100718737B1 (ko) * | 2000-01-17 | 2007-05-15 | 가부시키가이샤 에바라 세이사꾸쇼 | 폴리싱 장치 |
| KR100827871B1 (ko) * | 2000-05-19 | 2008-05-07 | 어플라이드 머티어리얼스, 인코포레이티드 | 화학 기계 폴리싱을 위한 인시츄 방식의 엔드포인트 검출및 공정 모니터링 방법 및 장치 |
| US6966816B2 (en) * | 2001-05-02 | 2005-11-22 | Applied Materials, Inc. | Integrated endpoint detection system with optical and eddy current monitoring |
-
2003
- 2003-02-06 JP JP2003565693A patent/JP2005517290A/ja active Pending
- 2003-02-06 WO PCT/US2003/003666 patent/WO2003066284A1/en active Application Filing
- 2003-02-06 TW TW92102460A patent/TWI273947B/zh not_active IP Right Cessation