JP2004157121A5 - - Google Patents
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- Publication number
- JP2004157121A5 JP2004157121A5 JP2003374619A JP2003374619A JP2004157121A5 JP 2004157121 A5 JP2004157121 A5 JP 2004157121A5 JP 2003374619 A JP2003374619 A JP 2003374619A JP 2003374619 A JP2003374619 A JP 2003374619A JP 2004157121 A5 JP2004157121 A5 JP 2004157121A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE10251377 | 2002-11-01 | ||
| DE10258375A DE10258375A1 (de) | 2002-11-01 | 2002-12-12 | Verfahren zur Haltevorrichtung zum Testen von bewegungssensitiven Substraten |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2004157121A JP2004157121A (ja) | 2004-06-03 |
| JP2004157121A5 true JP2004157121A5 (ja) | 2006-12-07 |
Family
ID=32231874
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003374619A Pending JP2004157121A (ja) | 2002-11-01 | 2003-11-04 | 運動感知基板を検査する方法と装置 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20040119492A1 (ja) |
| JP (1) | JP2004157121A (ja) |
| FR (1) | FR2847384B1 (ja) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4387987B2 (ja) * | 2004-06-11 | 2009-12-24 | 株式会社オクテック | 微小構造体の検査装置、微小構造体の検査方法および微小構造体の検査プログラム |
| US20090128171A1 (en) * | 2005-03-31 | 2009-05-21 | Katsuya Okumura | Microstructure Probe Card, and Microstructure Inspecting Device, Method, and Computer Program |
| JP5121202B2 (ja) * | 2006-09-29 | 2013-01-16 | 東京エレクトロン株式会社 | プローブカードおよび微小構造体の検査装置 |
| JP2009139172A (ja) * | 2007-12-05 | 2009-06-25 | Tokyo Electron Ltd | 微小構造体の変位量検出装置 |
| CN104377101B (zh) | 2013-08-14 | 2017-08-08 | Fei 公司 | 用于带电粒子束系统的电路探头 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0196804B1 (en) * | 1985-03-11 | 1991-01-23 | Nippon Telegraph And Telephone Corporation | Method and apparatus for testing integrated electronic device |
| JPH01235139A (ja) * | 1988-03-16 | 1989-09-20 | Fujitsu Ltd | 電子ビームプローバにおける試料装着方法 |
| JPH0933567A (ja) * | 1995-07-21 | 1997-02-07 | Akebono Brake Ind Co Ltd | 半導体加速度センサのセンサチップ検査方法及び検査装置 |
| US5600257A (en) * | 1995-08-09 | 1997-02-04 | International Business Machines Corporation | Semiconductor wafer test and burn-in |
| JPH0972939A (ja) * | 1995-09-05 | 1997-03-18 | Fujitsu Ten Ltd | 基板測定装置 |
| JPH0982771A (ja) * | 1995-09-19 | 1997-03-28 | Toshiba Corp | 半導体材料の評価方法およびその装置 |
| JPH0989912A (ja) * | 1995-09-25 | 1997-04-04 | Olympus Optical Co Ltd | テーブル機構 |
| US5814733A (en) * | 1996-09-12 | 1998-09-29 | Motorola, Inc. | Method of characterizing dynamics of a workpiece handling system |
| US5777484A (en) * | 1996-09-30 | 1998-07-07 | Packard Hughes Interconnect Company | Device for testing integrated circuit chips during vibration |
| JPH11163066A (ja) * | 1997-11-29 | 1999-06-18 | Tokyo Electron Ltd | ウエハ試験装置 |
| FR2790833B1 (fr) * | 1999-03-08 | 2001-04-20 | St Microelectronics Sa | Procede de test statistique de circuits integres |
| US6232790B1 (en) * | 1999-03-08 | 2001-05-15 | Honeywell Inc. | Method and apparatus for amplifying electrical test signals from a micromechanical device |
| JP2001004379A (ja) * | 1999-06-23 | 2001-01-12 | Denso Corp | 慣性センサの感度調整方法 |
| DE10139443A1 (de) * | 2001-08-10 | 2003-03-06 | Eads Deutschland Gmbh | Verfahren und Vorrichtung zum Trimmen von Sensoren mit schwingenden Strukturen |
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2003
- 2003-10-31 FR FR0312784A patent/FR2847384B1/fr not_active Expired - Fee Related
- 2003-10-31 US US10/699,121 patent/US20040119492A1/en not_active Abandoned
- 2003-11-04 JP JP2003374619A patent/JP2004157121A/ja active Pending