JP2005353986A5 - - Google Patents

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Publication number
JP2005353986A5
JP2005353986A5 JP2004175586A JP2004175586A JP2005353986A5 JP 2005353986 A5 JP2005353986 A5 JP 2005353986A5 JP 2004175586 A JP2004175586 A JP 2004175586A JP 2004175586 A JP2004175586 A JP 2004175586A JP 2005353986 A5 JP2005353986 A5 JP 2005353986A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2004175586A
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Japanese (ja)
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JP2005353986A (ja
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Publication date
Application filed filed Critical
Priority to JP2004175586A priority Critical patent/JP2005353986A/ja
Priority claimed from JP2004175586A external-priority patent/JP2005353986A/ja
Priority to US11/149,532 priority patent/US7196769B2/en
Publication of JP2005353986A publication Critical patent/JP2005353986A/ja
Publication of JP2005353986A5 publication Critical patent/JP2005353986A5/ja
Withdrawn legal-status Critical Current

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JP2004175586A 2004-06-14 2004-06-14 露光装置 Withdrawn JP2005353986A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2004175586A JP2005353986A (ja) 2004-06-14 2004-06-14 露光装置
US11/149,532 US7196769B2 (en) 2004-06-14 2005-06-10 Exposure apparatus and device manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004175586A JP2005353986A (ja) 2004-06-14 2004-06-14 露光装置

Publications (2)

Publication Number Publication Date
JP2005353986A JP2005353986A (ja) 2005-12-22
JP2005353986A5 true JP2005353986A5 (https=) 2007-08-02

Family

ID=35460161

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004175586A Withdrawn JP2005353986A (ja) 2004-06-14 2004-06-14 露光装置

Country Status (2)

Country Link
US (1) US7196769B2 (https=)
JP (1) JP2005353986A (https=)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4383911B2 (ja) * 2004-02-03 2009-12-16 キヤノン株式会社 露光装置及び半導体デバイスの製造方法
JP2005295762A (ja) * 2004-04-05 2005-10-20 Canon Inc ステージ装置および露光装置
US7245350B2 (en) * 2005-11-11 2007-07-17 Canon Kabushiki Kaisha Exposure apparatus
DE102006044591A1 (de) 2006-09-19 2008-04-03 Carl Zeiss Smt Ag Optische Anordnung, insbesondere Projektionsbelichtungsanlage für die EUV-Lithographie, sowie reflektives optisches Element mit verminderter Kontamination
JP2008300806A (ja) 2007-06-04 2008-12-11 Canon Inc 基板処理装置、露光装置及びデバイス製造方法
KR100901024B1 (ko) * 2007-09-21 2009-06-04 엘지전자 주식회사 냉장고의 탈기 저장장치
WO2009059614A1 (en) 2007-11-06 2009-05-14 Carl Zeiss Smt Ag Method for removing a contamination layer from an optical surface, method for generating a cleaning gas, and corresponding cleaning and cleaning...
JP5171482B2 (ja) 2008-08-27 2013-03-27 キヤノン株式会社 露光装置およびデバイス製造方法
DE102009029282A1 (de) * 2009-09-08 2011-03-24 Carl Zeiss Smt Gmbh Optische Anordnung, insbesondere in einer Projektionsbelichtungsanlage für die EUV-Lithographie
NL2005208A (en) * 2009-09-28 2011-03-29 Asml Netherlands Bv Heat pipe, lithographic apparatus and device manufacturing method.
NL2005207A (en) * 2009-09-28 2011-03-29 Asml Netherlands Bv Heat pipe, lithographic apparatus and device manufacturing method.
KR102099880B1 (ko) * 2013-05-06 2020-04-10 삼성전자 주식회사 유효 열 전자 강화 유닛을 갖는 리소그래피 장치 및 패턴 형성 방법
US10527956B2 (en) 2017-03-24 2020-01-07 Nikon Corporation Temperature controlled heat transfer frame for pellicle
CN111736432A (zh) * 2020-06-15 2020-10-02 上海集成电路研发中心有限公司 一种阻隔光阻放气污染的装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2691865B2 (ja) 1994-03-18 1997-12-17 株式会社ソルテック 極紫外線縮小投影露光装置
EP1039510A4 (en) 1997-11-14 2003-11-12 Nikon Corp EXPOSURE DEVICE, MANUFACTURING METHOD THEREOF, AND EXPOSURE METHOD
US6153044A (en) * 1998-04-30 2000-11-28 Euv Llc Protection of lithographic components from particle contamination
US6459472B1 (en) * 1998-05-15 2002-10-01 Asml Netherlands B.V. Lithographic device
US6727980B2 (en) 1998-09-17 2004-04-27 Nikon Corporation Apparatus and method for pattern exposure and method for adjusting the apparatus
JP2000268756A (ja) 1999-03-12 2000-09-29 Toshiba Corp 荷電ビーム装置および荷電ビームの制御方法
US20010016302A1 (en) 1999-12-28 2001-08-23 Nikon Corporation Wafer chucks allowing controlled reduction of substrate heating and rapid substrate exchange
JP2002050568A (ja) 2000-08-04 2002-02-15 Nikon Corp 露光方法とこれを用いたデバイスの製造方法、および露光装置とこれを用いたデバイスの製造方法
DE60118669T2 (de) * 2000-08-25 2007-01-11 Asml Netherlands B.V. Lithographischer Projektionsapparat
US6614505B2 (en) * 2001-01-10 2003-09-02 Asml Netherlands B.V. Lithographic projection apparatus, device manufacturing method, and device manufactured thereby
JP2005175187A (ja) 2003-12-11 2005-06-30 Canon Inc 光学部材、冷却方法、冷却装置、露光装置、デバイス製造方法、及びデバイス
JP4666908B2 (ja) 2003-12-12 2011-04-06 キヤノン株式会社 露光装置、計測方法及びデバイス製造方法
JP4383911B2 (ja) 2004-02-03 2009-12-16 キヤノン株式会社 露光装置及び半導体デバイスの製造方法

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