JP2005347552A - Method of determining position of reference point - Google Patents

Method of determining position of reference point Download PDF

Info

Publication number
JP2005347552A
JP2005347552A JP2004165918A JP2004165918A JP2005347552A JP 2005347552 A JP2005347552 A JP 2005347552A JP 2004165918 A JP2004165918 A JP 2004165918A JP 2004165918 A JP2004165918 A JP 2004165918A JP 2005347552 A JP2005347552 A JP 2005347552A
Authority
JP
Japan
Prior art keywords
reference point
processing
alignment mark
center
centers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2004165918A
Other languages
Japanese (ja)
Other versions
JP4351955B2 (en
Inventor
Hiroyuki Sugawara
弘之 菅原
Takeshi Goto
健 後藤
Konosuke Kitamura
幸之助 北村
Hiroshi Aoyama
博志 青山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Via Mechanics Ltd
Original Assignee
Hitachi Via Mechanics Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Via Mechanics Ltd filed Critical Hitachi Via Mechanics Ltd
Priority to JP2004165918A priority Critical patent/JP4351955B2/en
Priority to US11/141,393 priority patent/US7522262B2/en
Priority to DE102005025474.8A priority patent/DE102005025474B4/en
Publication of JP2005347552A publication Critical patent/JP2005347552A/en
Application granted granted Critical
Publication of JP4351955B2 publication Critical patent/JP4351955B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B27/00—Photographic printing apparatus
    • G03B27/32—Projection printing apparatus, e.g. enlarger, copying camera
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laser Beam Processing (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of determining the position of reference point that will not be affected by aberrations or the like of a camera lens and is capable of reducing errors caused by the defective shape of alignment mark. <P>SOLUTION: The alignment mark 1, comprising a plurality of patterns 1b, 1d (background parts 1a, 1c) around a design reference point O1, is provided, the positions of centers G2 to G5 of contours 2 to 5 of the patterns 1b, 1d are obtained; and coordinates obtained by averaging coordinates of the obtained centers G2 to G5 in an axial direction are used for the coordinates of a processing reference point G1. Thus, even when a defect takes place in the pattern parts 1b, 1d, since the error accompanied with the defect is decreased, the processing accuracy can be enhanced. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、プリント基板等を加工をする際に使用する基準点の位置決定方法に関するものである。   The present invention relates to a reference point position determination method used when processing a printed circuit board or the like.

電子機器の小型化、高密度実装化に伴い、プリント基板は複数の基板を積層した多層配線基板が主流となっている。多層配線基板では、上下に積層された基板間の導電層を電気的に接続する必要がある。そこで、多層配線基板の絶縁層に下層の導電層に達するビアホール（穴）を形成し、ビアホールの内部に導電性メッキを施すことにより、上下に積層された基板間の導電層を電気的に接続している。   Along with the downsizing and high-density mounting of electronic devices, printed circuit boards are mainly multilayer wiring boards in which a plurality of boards are stacked. In a multilayer wiring board, it is necessary to electrically connect conductive layers between substrates stacked one above the other. Therefore, a via hole (hole) reaching the lower conductive layer is formed in the insulating layer of the multilayer wiring board, and conductive plating is applied to the inside of the via hole to electrically connect the conductive layers between the substrates stacked vertically. doing.

ビアホールの形成には、ビアホールの微細化に伴い、高出力のＣＯ2レーザやＹＡＧの高調波を利用したＵＶレーザが使用される。また、ガルバノミラーとｆθレンズを組み合せたビームスキャン光学系を用いてレーザ光を走査させることにより、高速加工を実現している。しかしながら、穴の小径化や小ピッチ化が進むにつれて加工位置精度に対する要求が厳しくなっている。プリント基板の位置合わせは基板の四隅に設けられたアライメントマークを基準とすることが多い。具体的にはプリント基板をＸＹテーブルに搭載して、その上方からカメラ等でアライメントマークを撮像し、画像処理によりアライメントマークの中心を求める。そして、基板上の各点のずれ量を算出し、ずれ量を補正しながら加工をしていた。しかし、アライメントマークはエッチング不良や塵埃等により予め定めた形状と相違することがある。   For the formation of the via hole, a high-power CO2 laser or a UV laser using a harmonic of YAG is used with the miniaturization of the via hole. Further, high-speed processing is realized by scanning a laser beam using a beam scanning optical system in which a galvanometer mirror and an fθ lens are combined. However, the demand for machining position accuracy has become stricter as the hole diameter and pitch decrease. The alignment of the printed circuit board is often based on alignment marks provided at the four corners of the circuit board. Specifically, a printed circuit board is mounted on an XY table, an alignment mark is imaged with a camera or the like from above, and the center of the alignment mark is obtained by image processing. Then, the displacement amount of each point on the substrate is calculated, and processing is performed while correcting the displacement amount. However, the alignment mark may be different from a predetermined shape due to defective etching or dust.

アライメントマークの形状不良による位置誤差を低減させるため、ひとつのアライメントマークを複数の小マークで構成するものが提案されている（特許文献１）。   In order to reduce a position error due to a defective shape of the alignment mark, one in which one alignment mark is composed of a plurality of small marks has been proposed (Patent Document 1).

また、孔マークを同心円状に配置したものもある（特許文献２）。
特開２００１−２９１０９５号（第３頁，図１） 特開昭６１−１２５７１２号（第８図） In addition, there is also one in which hole marks are arranged concentrically (Patent Document 2).
Japanese Patent Laid-Open No. 2001-291095 (page 3, FIG. 1) JP 61-125712 (Fig. 8)

しかし、特許文献１の場合、各小マークの中心位置が異なるため、カメラレンズの収差等の影響を受け、安価なカメラとカメラレンズを組み合わせた場合、基準点の位置誤差を例えば５μｍ未満にすることが困難であった。   However, in the case of Patent Document 1, since the center position of each small mark is different, the position error of the reference point is set to less than 5 μm, for example, when an inexpensive camera and camera lens are combined due to the influence of camera lens aberrations and the like It was difficult.

また、特許文献２の場合、カメラレンズの収差等の影響はほとんど受けないが、同心円状に配置された孔マークの一部を用いて孔マークの中心位置を求めるので、エッチング不良や塵埃等の影響を受け、基準点の位置誤差を例えば５μｍ未満にすることは困難であった。   Further, in the case of Patent Document 2, although it is hardly affected by the aberration of the camera lens or the like, the center position of the hole mark is obtained using a part of the hole mark arranged concentrically. Due to the influence, it has been difficult to make the position error of the reference point less than 5 μm, for example.

本発明の目的は、上記した課題を解決し、カメラレンズの収差等の影響を受けることがなく、また、アライメントマークの形状不良に起因する誤差を低減させることができる基準点の位置決定方法を提供することにある。   SUMMARY OF THE INVENTION An object of the present invention is to solve the above-described problems, and to provide a reference point position determination method that is not affected by camera lens aberrations and the like and that can reduce errors caused by alignment mark shape defects. It is to provide.

上記課題を解決するため、本発明は、基準点の位置決定方法として、設計上の基準点に当該基準点を中心とする複数のパターンからなるアライメントマークを設けておき、前記パターンの輪郭線によって囲まれる図形の中心の座標値（Ｘ座標値およびＹ座標値）を求め、得られた複数の中心の各座標値をＸ，Ｙの各方向毎に平均し、得られた各方向の平均値を加工上の基準点の座標値とすることを特徴とする。   In order to solve the above problems, the present invention provides a reference point position determination method by providing an alignment mark consisting of a plurality of patterns centered on the reference point at a design reference point, and by using the contour line of the pattern. The coordinate values (X coordinate value and Y coordinate value) of the center of the enclosed figure are obtained, and the obtained coordinate values of the plurality of centers are averaged in each of the X and Y directions, and the obtained average value in each direction Is a coordinate value of a reference point on processing.

各基準点の位置を精度よく決定することができるので、加工精度を向上させることができる。   Since the position of each reference point can be determined with high accuracy, machining accuracy can be improved.

図１は本発明に係るアライメントマークの平面図、図２は本発明に係る加工上の基準点の位置決定方法を説明する図である。   FIG. 1 is a plan view of an alignment mark according to the present invention, and FIG. 2 is a diagram for explaining a method for determining a position of a processing reference point according to the present invention.

図１において点線で囲んで示すアライメントマーク１は円形パターンが設計上の基準点Ｏ１を中心として、地の部分１ａ、１ｃ（白色部）とパターン部１ｂ、１ｄ（斜線部）が交互になるようにして同心円状に形成されている。このアライメントマーク１の基準点Ｏ１が、カメラレンズの光軸と概略一致するように位置決めした後、アライメントマーク１を撮像する。カメラレンズの光軸とアライメントマーク１の基準点Ｏ１を一致させると、カメラレンズの収差の影響を最も受けないので、画像検出系の誤差を低減することができる。なお、検出された設計上の基準点Ｏ１の位置とカメラレンズの光軸のずれが大きい場合は、ずれ量の分を補正して再度位置決めし、アライメントマーク１を検出する。   The alignment mark 1 surrounded by a dotted line in FIG. 1 has a circular pattern with the design reference point O1 as the center, and the ground portions 1a and 1c (white portions) and the pattern portions 1b and 1d (shaded portions) alternate. Are formed concentrically. The alignment mark 1 is imaged after being positioned so that the reference point O1 of the alignment mark 1 substantially coincides with the optical axis of the camera lens. When the optical axis of the camera lens and the reference point O1 of the alignment mark 1 are matched, the influence of the aberration of the camera lens is least affected, so that the error of the image detection system can be reduced. If the deviation between the detected position of the reference point O1 on the design and the optical axis of the camera lens is large, the deviation is corrected and the positioning is performed again, and the alignment mark 1 is detected.

検出したアライメントマーク１の画像を２値化処理等の画像処理を施すことにより、図２に示すように、パターン部１ｂ、１ｄの輪郭線２、３、４、５が抽出される。   By performing image processing such as binarization processing on the detected image of the alignment mark 1, the contour lines 2, 3, 4, 5 of the pattern portions 1b, 1d are extracted as shown in FIG.

次に、抽出された輪郭線２〜５によって囲まれる図形の中心Ｇ２、Ｇ３、Ｇ４、Ｇ５の各座標値（Ｘ座標値とＹ座標値）を求め、中心Ｇ２、Ｇ３、Ｇ４、Ｇ５の各座標値をＸ，Ｙの各方向毎に平均し、得られた各方向の平均値を加工上の基準点Ｇ１の座標値とする。なお、画像処理により図形の中心座標を求める方法としては、輪郭線によって囲まれる図形の面積重心を求める方法や輪郭情報から指定形状の最適フィット位置を求め、求めた位置から当該図形の中心を求める方法などがあるが、ここでは、図形の面積重心を図形の中心という。   Next, each coordinate value (X coordinate value and Y coordinate value) of the centers G2, G3, G4, and G5 of the figure surrounded by the extracted contour lines 2 to 5 is obtained, and each of the centers G2, G3, G4, and G5 is obtained. The coordinate values are averaged in each of the X and Y directions, and the obtained average value in each direction is used as the coordinate value of the processing reference point G1. In addition, as a method for obtaining the center coordinates of a figure by image processing, a method for obtaining the center of gravity of the area of the figure surrounded by the contour line, an optimum fit position of the specified shape is obtained from the outline information, and the center of the figure is obtained from the obtained position. There are methods, but here, the center of gravity of the area of the figure is called the center of the figure.

パターン部に変形が無く、かつ画像処理が理想的に行われた場合、中心Ｇ２〜Ｇ５は総て設計上の基準点Ｏ１に一致するので、加工上の基準点Ｇ１は設計上の基準点Ｏ１に一致する。   When the pattern portion is not deformed and image processing is ideally performed, the centers G2 to G5 all coincide with the design reference point O1, so the processing reference point G1 is the design reference point O1. Matches.

次に、アライメントマーク１に形状不良が発生している場合について説明する。   Next, a case where a shape defect has occurred in the alignment mark 1 will be described.

図３は形状不良が発生したアライメントマーク１の平面図、図４は本発明に係る加工上の基準点の位置決定方法を説明する図であり、図１と同じものまたは同一機能のものは同一の符号を付して説明を省略する。   FIG. 3 is a plan view of the alignment mark 1 in which a shape defect has occurred, and FIG. 4 is a diagram for explaining a method for determining the position of a processing reference point according to the present invention. The description will be omitted.

図３に示すように、アライメントマーク１に不良箇所６が発生していると、図４（ｄ）に示すように、輪郭線５で囲まれる図形の中心はＧ５からＧ５１へずれるが、輪郭線２、３、４は不良箇所６の影響を受けないので、図示の場合、中心Ｇ２、Ｇ３、Ｇ４、Ｇ５１の各座標値を各方向毎に平均した座標値と中心とする加工上の基準点Ｇ１は、線分Ｏ１Ｇ５１上の中心Ｏ１から（Ｏ１Ｇ５１）／４の位置になる。   As shown in FIG. 3, when a defective portion 6 occurs in the alignment mark 1, the center of the figure surrounded by the contour line 5 is shifted from G5 to G51 as shown in FIG. 2, 3, and 4 are not affected by the defective portion 6, and in the illustrated case, the coordinate values obtained by averaging the coordinate values of the centers G 2, G 3, G 4, and G 51 in each direction and the processing reference point that is the center G1 is at a position of (O1G51) / 4 from the center O1 on the line segment O1G51.

このようにすると、アライメントマーク１を１つのパターン（マーク）で構成する場合に比べて誤差が平均化されるので、検出誤差を低減することができる。   In this case, since the errors are averaged as compared with the case where the alignment mark 1 is composed of one pattern (mark), the detection error can be reduced.

なお、ずれ量の大きい中心Ｇ５１を除いて、中心Ｇ２、Ｇ３、Ｇ４の各座標値を平均することにより、更に検出誤差を低減することができる。平均値を計算する際に除く中心の判定方法としては、いったん総ての中心の座標値を演算し、求められた中心から最も遠い中心を除外してもよいし、座標値の分布の平均値からの誤差量が予め定めた許容値を超える中心を除外してもよい。また、中心の座標値の分布の平均値±標準偏差の範囲から外れる中心を除外す等、予め規則を定めておけばよい。   Note that the detection error can be further reduced by averaging the coordinate values of the centers G2, G3, and G4 except for the center G51 having a large deviation amount. As a method of determining the center to be excluded when calculating the average value, the coordinate values of all the centers may be calculated once, and the center farthest from the obtained center may be excluded, or the average value of the distribution of coordinate values The center where the amount of error from the value exceeds a predetermined allowable value may be excluded. Further, a rule may be determined in advance, such as excluding a center that is out of the range of the average value ± standard deviation of the distribution of coordinate values of the center.

図５は、アライメントマークを構成するパターンの形状の例を示す図である。   FIG. 5 is a diagram showing an example of the shape of a pattern constituting the alignment mark.

アライメントマークを構成するパターンの形状は、パターンの輪郭線で囲まれる図形の中心が一致していればよいので、（ａ）に示す正方形マーク、（ｂ）に示す長方形マーク、（ｃ）に示す十字マーク等のように相似形の形状を組み合わせてもよいし、（ｄ）に示す形状の異なるパターンの組合せでもよい。   Since the shape of the pattern constituting the alignment mark only needs to coincide with the center of the figure surrounded by the outline of the pattern, the square mark shown in (a), the rectangular mark shown in (b), and the shape shown in (c) Similar shapes such as a cross mark may be combined, or a combination of patterns having different shapes shown in (d) may be used.

次に、本発明を用いたレーザ加工機の動作を説明する。   Next, the operation of the laser beam machine using the present invention will be described.

図６は、本発明に係るレーザ加工装置の概略構成図である。   FIG. 6 is a schematic configuration diagram of a laser processing apparatus according to the present invention.

ＮＣ装置１６は、レーザ制御ユニット１７、ガルバノ制御ユニット１８、テーブル制御ユニット１９、画像処理ユニット２０を制御する。   The NC device 16 controls the laser control unit 17, the galvano control unit 18, the table control unit 19, and the image processing unit 20.

レーザ制御ユニット１７はレーザ発振器８にレーザ光９を出力させる。ガルバノ制御ユニット１８はガルバノミラー１０，１１の回転角度を制御する。テーブル制御ユニット１９はＸＹテーブル１３を介してプリント基板７を位置決めする。画像処理ユニット２０はカメラ１４で撮像されたアライメントマーク１を構成する各パターンの画像を処理し、パターンの輪郭線によって囲まれる図形の中心の座標を求めた後、得られた複数の中心の各座標値を各軸方向に平均して、加工上の基準点の座標とする。   The laser control unit 17 causes the laser oscillator 8 to output the laser light 9. The galvano control unit 18 controls the rotation angle of the galvanometer mirrors 10 and 11. The table control unit 19 positions the printed circuit board 7 via the XY table 13. The image processing unit 20 processes the image of each pattern constituting the alignment mark 1 imaged by the camera 14, obtains the coordinates of the center of the figure surrounded by the outline of the pattern, and then obtains each of the obtained plurality of centers. The coordinate values are averaged in the direction of each axis to obtain the coordinates of the processing reference point.

プリント基板７の四隅には加工位置の基準となるアライメントマーク１が描画されている。プリント基板７はＸＹテーブル１３に載置されている。   On the four corners of the printed circuit board 7, alignment marks 1 serving as a reference for the processing position are drawn. The printed circuit board 7 is placed on the XY table 13.

レーザ発振器８の光路上にはガルバノミラー１０，１１、ｆθレンズ１２が配置されている。   Galvano mirrors 10 and 11 and an fθ lens 12 are disposed on the optical path of the laser oscillator 8.

ｆθレンズ１２は、入射角度θで入射する光の基板７の上の位置が、光軸からｆ×θ（ただし、ｆはｆθレンズ１２の焦点距離）の位置になるように設計されたレンズであり、レーザ光９をプリント基板上に集光する機能も有する。   The fθ lens 12 is a lens designed so that the position of light incident at an incident angle θ on the substrate 7 is f × θ (where f is the focal length of the fθ lens 12) from the optical axis. There is also a function of condensing the laser beam 9 on the printed circuit board.

カメラ１４は、カメラレンズ１５の光軸が鉛直方向になるようにして、ＸＹテーブル１３と対向する位置に配置されている。   The camera 14 is disposed at a position facing the XY table 13 so that the optical axis of the camera lens 15 is in the vertical direction.

つぎに動作について説明する。   Next, the operation will be described.

加工に先立ち、ＸＹテーブル１３を移動させ、カメラ１４によりアライメントマーク１を撮像し、上述した手順により各基準点（図示の場合は４個）の位置を決定する。そして、決定された各基準点の位置に基づき、例えば、プリント基板７のＸＹテーブル１３上の位置や、Ｘ、Ｙ軸に対する傾き等を求める。   Prior to processing, the XY table 13 is moved, the alignment mark 1 is imaged by the camera 14, and the position of each reference point (four in the illustrated case) is determined by the above-described procedure. Based on the determined position of each reference point, for example, the position of the printed circuit board 7 on the XY table 13, the inclination with respect to the X and Y axes, and the like are obtained.

以下、予めＮＣ装置１６に組み込まれた所定の加工プログラムによりレーザ加工を行う。   Thereafter, laser processing is performed by a predetermined processing program incorporated in the NC device 16 in advance.

レーザ光９は加工する穴の種類によって予め求められた加工条件（ピーク出力、繰返し周波数、パルスショット数等）に応じてレーザ制御ユニット１７の指令によりレーザ発振器８から発振され、ガルバノミラー１０，１１に入射してｆθレンズ１２に入射する角度を制御される。   The laser light 9 is oscillated from the laser oscillator 8 according to a command from the laser control unit 17 in accordance with processing conditions (peak output, repetition frequency, number of pulse shots, etc.) determined in advance according to the type of hole to be processed. The angle at which the light enters the fθ lens 12 is controlled.

ｆθレンズ１２の大きさで定まる領域（通常、５０×５０ｍｍ角程度）の加工が終了すると、プリント基板７を次の被加工領域に移動させる。このような動作を繰り返すことにより、レーザ光９を用いてプリント基板７の全面を加工する。   When the processing of the region determined by the size of the fθ lens 12 (usually about 50 × 50 mm square) is completed, the printed circuit board 7 is moved to the next processing region. By repeating such an operation, the entire surface of the printed circuit board 7 is processed using the laser light 9.

以上、説明したように本発明によれば、アライメントマークの不良等により発生する検出誤差およびカメラレンズ収差による誤差を低減できるので高精度且つ高信頼性な加工できる。   As described above, according to the present invention, detection errors caused by defective alignment marks and errors due to camera lens aberrations can be reduced, so that highly accurate and highly reliable processing can be performed.

本発明に係るアライメントマークの平面図である。It is a top view of the alignment mark which concerns on this invention. 本発明に係る加工上の基準点の位置決定方法を説明する図である。It is a figure explaining the position determination method of the reference point on the process which concerns on this invention. 形状不良が発生したアライメントマークの平面図である。It is a top view of the alignment mark in which the shape defect generate | occur | produced. 本発明に係る加工上の基準点の位置決定方法を説明する図である。It is a figure explaining the position determination method of the reference point on the process which concerns on this invention. アライメントマークを構成するパターンの形状例を示す図である。It is a figure which shows the example of the shape of the pattern which comprises an alignment mark. 本発明に係るレーザ加工装置の概略構成図である。It is a schematic block diagram of the laser processing apparatus which concerns on this invention.

符号の説明Explanation of symbols

１ アライメントマーク
１ａ、１ｂ、１ｃ、１ｄ パターン部
２〜５ パターン１ｂ、１ｄの輪郭線
Ｇ１ 中心Ｇ２〜Ｇ５の各座標値を平均した位置（加工上の基準点）
Ｇ２〜Ｇ５ 輪郭線２〜５で囲まれる図形の中心
Ｏ１ 設計上の基準点 DESCRIPTION OF SYMBOLS 1 Alignment mark 1a, 1b, 1c, 1d Pattern part 2-5 Contour line of pattern 1b, 1d G1 The position which averaged each coordinate value of center G2-G5 (reference point on processing)
G2 to G5 Center of figure surrounded by outlines 2 to 5 O1 Design reference point

Claims (3)

設計上の基準点に当該基準点を中心とする複数のパターンからなるアライメントマークを設けておき、
前記パターンの輪郭線によって囲まれる図形の中心の座標値（Ｘ座標値およびＹ座標値）を求め、得られた複数の中心の各座標値をＸ，Ｙの各方向毎に平均し、得られた各方向の平均値を加工上の基準点の座標値とすることを特徴とする基準点の位置決定方法。 An alignment mark consisting of a plurality of patterns centered on the reference point is provided at the design reference point,
A coordinate value (X coordinate value and Y coordinate value) of the center of the figure surrounded by the contour line of the pattern is obtained, and the obtained coordinate values of a plurality of centers are averaged for each of the X and Y directions. A method for determining the position of a reference point, wherein an average value in each direction is used as a coordinate value of a reference point on processing. 予め定める規則に基づき、得られた複数の中心のうちのいくつかの中心を除外し、残りの中心の座標値により加工上の基準点の位置を求めることを特徴とする請求項１に記載の基準点の位置決定方法。   2. The position of a reference point on processing is obtained based on a predetermined rule by excluding some of the obtained plurality of centers and using coordinate values of the remaining centers. Reference point location method. 前記予め定める規則は、除外する中心を当該中心が前記加工上の基準点から最も遠い中心とする、ものであることを特徴とする請求項２に記載の基準点の位置決定方法。


3. The reference point position determining method according to claim 2, wherein the predetermined rule is that a center to be excluded is a center farthest from the processing reference point.


JP2004165918A 2004-06-03 2004-06-03 Reference point position determination method Expired - Fee Related JP4351955B2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2004165918A JP4351955B2 (en) 2004-06-03 2004-06-03 Reference point position determination method
US11/141,393 US7522262B2 (en) 2004-06-03 2005-06-01 Method for determining position of reference point
DE102005025474.8A DE102005025474B4 (en) 2004-06-03 2005-06-02 Method for determining a position of a reference point

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004165918A JP4351955B2 (en) 2004-06-03 2004-06-03 Reference point position determination method

Publications (2)

Publication Number Publication Date
JP2005347552A true JP2005347552A (en) 2005-12-15
JP4351955B2 JP4351955B2 (en) 2009-10-28

Family

ID=35448521

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004165918A Expired - Fee Related JP4351955B2 (en) 2004-06-03 2004-06-03 Reference point position determination method

Country Status (3)

Country Link
US (1) US7522262B2 (en)
JP (1) JP4351955B2 (en)
DE (1) DE102005025474B4 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008268132A (en) * 2007-04-24 2008-11-06 Seiko Precision Inc Reference scale, manufacturing method thereof, and machining device
JP2014027164A (en) * 2012-07-27 2014-02-06 Kyocer Slc Technologies Corp Wiring board
CN112839447A (en) * 2021-01-25 2021-05-25 福立旺精密机电（中国）股份有限公司 Method for preparing multilayer flexible plate for improving interlayer alignment precision

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8594983B2 (en) * 2006-03-20 2013-11-26 Duetto Integrated Systems, Inc. System for manufacturing laminated circuit boards
AT504382B1 (en) * 2006-11-13 2008-07-15 Great Computer Corp Automatic positioning-/engraving method for laser engraving machine, by creating patterns to be used for engraving/cutting, framing pattern with four-sided frame and obtaining coordinate positions of opposite ends of diagonal of the frame
CN102662313B (en) * 2012-05-09 2016-03-23 上海华虹宏力半导体制造有限公司 Lithography alignment parameter prediction method and photoetching method
KR101857414B1 (en) * 2016-02-25 2018-05-15 주식회사 이오테크닉스 Apparatus and method for calibrating a marking position
DE102020103008A1 (en) * 2020-02-06 2021-08-12 HELLA GmbH & Co. KGaA Circuit board

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61125712A (en) * 1984-11-26 1986-06-13 Matsushita Electric Works Ltd Method for drilling hole of multi-layer printing wiring board
JPS62229831A (en) * 1985-10-25 1987-10-08 Hitachi Ltd Pattern detector
US20010049589A1 (en) * 1993-01-21 2001-12-06 Nikon Corporation Alignment method and apparatus therefor
US5907405A (en) * 1995-09-01 1999-05-25 Nikon Corporation Alignment method and exposure system
JP3548428B2 (en) * 1998-07-03 2004-07-28 キヤノン株式会社 Position measuring apparatus and device manufacturing method using the same
WO2000049367A1 (en) * 1999-02-17 2000-08-24 Nikon Corporation Position sensing method and position sensor, exposing method and exposing apparatus, and device and device manufacturing method
JP4112759B2 (en) * 1999-09-24 2008-07-02 株式会社東芝 Pattern measurement method
JP2001110697A (en) * 1999-10-04 2001-04-20 Ushio Inc Method of aligning mask and work in aligner
JP2001291095A (en) * 2000-04-04 2001-10-19 Matsushita Electric Ind Co Ltd Position recognition mark detection method
JP4095391B2 (en) * 2002-09-24 2008-06-04 キヤノン株式会社 Position detection method
US6888260B2 (en) * 2003-04-17 2005-05-03 Infineon Technologies Aktiengesellschaft Alignment or overlay marks for semiconductor processing

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008268132A (en) * 2007-04-24 2008-11-06 Seiko Precision Inc Reference scale, manufacturing method thereof, and machining device
JP4671988B2 (en) * 2007-04-24 2011-04-20 セイコープレシジョン株式会社 Reference scale, manufacturing method thereof, and processing apparatus
JP2014027164A (en) * 2012-07-27 2014-02-06 Kyocer Slc Technologies Corp Wiring board
CN112839447A (en) * 2021-01-25 2021-05-25 福立旺精密机电（中国）股份有限公司 Method for preparing multilayer flexible plate for improving interlayer alignment precision
CN112839447B (en) * 2021-01-25 2022-03-08 福立旺精密机电（中国）股份有限公司 Method for preparing multilayer flexible plate for improving interlayer alignment precision

Also Published As

Publication number Publication date
JP4351955B2 (en) 2009-10-28
DE102005025474A1 (en) 2006-01-26
US7522262B2 (en) 2009-04-21
DE102005025474B4 (en) 2017-06-22
US20050270518A1 (en) 2005-12-08

Similar Documents

Publication Publication Date Title
KR101058160B1 (en) Solder Print Inspection Device and Component Mounting System
JP2010162559A (en) Laser processing method, processing device and workpiece
US20080223839A1 (en) Laser Machining Apparatus
US7522262B2 (en) Method for determining position of reference point
CN111299842B (en) Method for high-precision laser engraving of solder mask
JP6553940B2 (en) Laser processing equipment
KR101015410B1 (en) Soldering-print inspection apparatus
KR20040045404A (en) Method for the calibration of the optical system on a laser machine for machining electrical circuit substrates
WO2021161367A1 (en) Laser processing method and laser processing device
JPH10301052A (en) Method of correcting machining position deviation of laser beam machine
JP4840559B2 (en) Printed wiring board, manufacturing apparatus and manufacturing method thereof
JP2015006674A (en) Laser processing apparatus, laser irradiation point correction method, drilling processing method, and wiring substrate manufacturing method
JP4048873B2 (en) Positioning method
JP2004358550A (en) Laser beam machining method and laser beam machining apparatus
JP4901077B2 (en) Method for determining position of reference point on processing and laser processing machine
JP3643104B2 (en) Processing position correction method in laser processing apparatus
JPH07236989A (en) Device for laser beam processing
KR101665764B1 (en) Drawing apparatus, substrate processing system and drawing method
JP2010240694A (en) Laser beam machining method and laser beam machining device
JP2005088045A (en) Method and apparatus for laser drilling
JP7451049B2 (en) Laser processing equipment and laser processing method
JP2004322149A (en) Laser beam machining mechanism, and control method and production facility for the same
JP4432037B2 (en) Exposure system with data correction function
WO2023032962A1 (en) Direct-drawing device and method for controlling the same
JP2009170586A (en) Method and apparatus for recognizing electronic component

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20060828

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20090106

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20090309

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20090714

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20090727

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120731

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Ref document number: 4351955

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130731

Year of fee payment: 4

S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R313533

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313532

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

LAPS Cancellation because of no payment of annual fees