JP2005340753A - Packaging method of video image sensor and adhesive tape used for it - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a packaging method of a video image sensor which can perform solder reflow in the state that an adhesive tape is left to be pasted in a light receiving side of the video image sensor, and enables the light receiving side of the video image sensor during the solder reflow to be protected in a packaging process of the video image sensor using a solid image pickup device, and to provide the adhesive tape for protection used for it. <P>SOLUTION: In the packaging process of the video image sensor using the solid image pickup device, the packaging method is characterized in that a polyimide film is used as a substrate, in that at least one part of the outer periphery has a projection 3a for lifting, and in that a terminal of the video image sensor is connected with a substrate side in the solder reflow by heating at 170 °C or more in the state that an adhesive tape 3 having an adhesion layer in at least one side is pasted with a light-receiving section 2 of the above-mentioned video image sensor. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a mounting process of a video sensor using a solid-state imaging device.

  In recent years, image sensors using solid-state imaging devices have been widely used in digital cameras, video cameras, and the like. In the manufacturing process including mounting of the image sensor on the substrate side, scratches on the surface of the image sensor and adhesion of dust are highly likely to directly affect imaging. In view of this, a technique is adopted in which an adhesive tape is used as a surface protection tape and is attached to the light receiving portion side of the image sensor to avoid scratches and dust from being attached in the mounting and manufacturing process.

  On the other hand, when mounting an image sensor on a substrate or the like, a technique has been used so far in which a terminal portion is soldered and mounted using a soldering iron. In recent years, with the increase in image quality and functionality of video sensors, the number of terminals has also increased dramatically. Therefore, soldering and mounting each terminal using a soldering iron requires a considerable amount of time and is a reality. Not right. In view of this, a method of connecting and mounting at a time by putting the terminal portion of the image sensor and the mounting substrate into a solder reflow furnace in an aligned state is often used.

  However, the solder reflow furnace needs to be heated to a high temperature at least equal to or higher than the melting point of the solder. If the heat reflow is performed with the adhesive tape for the above protection attached, the displacement of the adhesive tape base material due to thermal deformation and shrinkage, or degradation due to the thermal deterioration of the adhesive tape material may appear on the surface of the image sensor. Conversely, it can cause contamination. In addition, since the color filter used inside the solid-state imaging device may be denatured or damaged by heat, the reflow process itself at a high temperature of 170 ° C. or higher is particularly difficult.

  Therefore, conventionally, the protective tape was once peeled off immediately before being put into the solder reflow furnace, the solder reflow was performed at about 160 ° C., and the protective tape was reapplied after the completion. Thus, it has been difficult to go through a high heating process for solder reflow with the adhesive tape still attached.

  Accordingly, an object of the present invention is to enable solder reflow in a mounting process of a video sensor using a solid-state imaging device while the adhesive tape is stuck on the light receiving side of the video sensor, and also during the solder reflow. It is in providing the mounting method of the image sensor which can protect the light-receiving side, and the protective adhesive tape used therefor. In addition, an object of the present invention is to provide a protective pressure-sensitive adhesive tape having a small heat shrinkability, an appropriate adhesive strength, and an excellent peelability when the video sensor is mounted.

  As a result of intensive studies to solve the above problems, the present inventors have found that the object can be achieved by using a mounting method or an adhesive tape described below, and have completed the present invention.

  The present invention is a video sensor mounting method, in the video sensor mounting process using a solid-state imaging device, using a polyimide film as a base material, and having a peeling protrusion on at least a part of the outer periphery thereof, and The adhesive tape having an adhesive layer on at least one surface is bonded to the light receiving portion of the video sensor, and the terminal portion of the video sensor is solder-reflowed to the substrate side by heating to 170 ° C. or higher. To do.

  According to the present invention, the high heat resistance of polyimide makes it possible not only to suppress significant thermal deformation and shrinkage of the adhesive tape in the high temperature process during solder reflow, but also to provide high light shielding and low thermal conductivity specific to polyimide films. Depending on the degree, it is possible to suppress the conduction of heat to the color filter used in the solid-state imaging device. Therefore, since it has not only a function and effect as a simple heat-resistant protective tape by the polyimide base material but also a specific function and effect for suppressing the thermal deterioration of the color filter inside the solid-state imaging device, heating at a sufficiently high temperature of 170 ° C. or higher. The process can be performed. Further, by having a peeling projection on at least a part of the outer periphery, the tape can be peeled off very easily after the production process such as inspection or just before use. At this time, it is preferable that the adhesive tape does not interfere with the mounting or soldering of adjacent components in the mounted state of the video sensor.

  The present invention is the mounting method of the video sensor, wherein the adhesive tape covers the entire light receiving portion of the video sensor, and at least a part of the outer peripheral portion has a predetermined distance from the end surface of the video sensor to the center side. It is characterized by being bonded to the light receiving part.

  In order to protect the image sensor, it is necessary to have the shape of a tape that covers the entire surface of the light receiving unit. On the other hand, when the outer periphery of the tape protrudes greatly from the end surface of the image sensor, the adhesive tape is mounted on the adjacent component or This will hinder soldering. That is, the adhesive tape needs to cover the entire light receiving portion and is preferably as small as possible. Therefore, the outer peripheral portion of the adhesive tape other than the protrusions may be bonded to the light receiving portion so that at least a part thereof, preferably a large portion thereof, has a predetermined distance from the end face of the image sensor to the center side. preferable.

  The present invention is the mounting method of the video sensor, wherein the adhesive tape has a side parallel to the end face of the video sensor and connected to the terminal bottom of the protrusion, and is connected from the tip of the protrusion to the terminal bottom. The side portion has a shape of one of a diagonal line shape, a polygonal line shape, a curved line shape, or a combination thereof.

  As described above, it is preferable that the adhesive tape can be easily peeled off after the production process such as inspection or just before use. However, fixing the adhesive tape requires a predetermined adhesive strength, but if the adhesive strength is too strong, the adhesive may remain when the adhesive tape is peeled off. Limited to range. In particular, in the peeling of the adhesive tape provided with the protruding portion, the protruding portion is sandwiched and pulled up, and the adhesive tape is liable to crack at that time, and in the present invention, the leading end of the protruding portion is connected to the bottom. It has been found that the tape can be smoothly peeled off from the image sensor by having the side portion having any one of a diagonal line shape, a broken line shape, a curved line shape, or a combination thereof.

  Also, since the distance between the end face of the image sensor and the outer periphery of the light receiving unit is usually a very short distance, the mounting position of the adhesive tape is important in mounting the image sensor and is automatically applied. Even in such a case, it is necessary to confirm the pasting position. Therefore, the tape attachment position can be clarified by an adhesive tape having a side part that is parallel to the end face of the image sensor and connected to the bottom of the projection, thus ensuring accurate and efficient image sensor mounting. can do.

  In the present invention, at least a silicone-based material is used as the pressure-sensitive adhesive constituent material of the pressure-sensitive adhesive tape.

  With such a configuration, it is possible to increase heat resistance and to easily control the peel adhesive strength.

  The present invention is the above video sensor mounting method, wherein an adhesive layer is not provided on a portion of the adhesive tape that covers a light receiving portion of the video sensor.

  In the present invention, the adhesive tape for protecting the image sensor is intended to perform an integrated process in a state in which the adhesive tape is bonded by devising the base material and the adhesive layer, and further to the light receiving portion of the adhesive tape. By not providing the adhesive layer in the corresponding part, it has been devised that the working efficiency is increased without the adhesive remaining on the surface of the adherend when the tape is peeled after the component mounting. In other words, in the mounting process of the image sensor, at least a heat-resistant film is used as the base material constituting the light receiving part side of the image sensor, and an adhesive tape having a structure in which an adhesive layer is not provided on the light receiving part is attached. By passing through a heating process at 170 ° C. or higher, it is possible to provide a mounting method of a video sensor with high workability, safety, and productivity.

Furthermore, in the mounting method of the image sensor, the thermal conductivity of the base material at 170 ° C. is 5 × 10 ⁻⁴ cal / cm · sec · ° C. or less.

  Many image sensors used as solid-state imaging devices have a built-in color filter, and often cannot withstand high temperatures during mounting. The polyimide film constituting the substrate of the pressure-sensitive adhesive tape of the present invention has low heat conductivity as well as heat resistance, and has a heat conduction suppressing effect, so that not only physical protection of the image sensor itself but also protection of the color filter Useful.

  The present invention is the above video sensor mounting method, characterized in that the heat shrinkage rate of the adhesive tape after heating at 180 ° C. for 1 hour is 1.0% or less.

  In other words, as described above, in the mounting of the image sensor, it is preferable that the shrinkage rate of the base material is small, and in particular, since it includes a process in a high temperature region such as soldering, the shrinkage rate of the base material under high temperature conditions is reduced. The knowledge that it is suitable to be in the above range has been obtained, and by clarifying such additional conditions, the working efficiency is further increased.

  The present invention is the mounting method of the image sensor, wherein the adhesive strength of the adhesive tape after heating at 180 ° C. for 1 hour is 0.1 to 8.0 N / 19 mm width. .

  That is, in order to prevent peeling of the adhesive tape, an adhesive force of a predetermined level or more is required. On the other hand, in order to prevent the adhesive layer from remaining after the tape is peeled from the adherend, it is necessary to have an adhesive force of a predetermined level or less. is there. In particular, in the case of including a mounting process in a high temperature region, it has been found that the adhesive strength of the adhesive tape under heating conditions is preferably within the above range. The work efficiency is increased without deteriorating the function of the tape and without leaving the adhesive on the surface of the adherend when the tape is peeled off after mounting the components.

  The present invention is an adhesive tape using a polyimide film as a constituent material of a base material, and is characterized by being used in any one of the above-described video sensor mounting methods.

  The mounting method described above requires an adhesive tape that protects the surface of the image sensor from contamination and scratches due to foreign matter, and that can be used without removing the tape in the component mounting process under heating conditions such as soldering. Is done. In this invention, it becomes possible to satisfy | fill such a request | requirement by providing the adhesive tape for surface protection which has the outstanding heat resistance, heat shrinkability, and adhesiveness which uses a polyimide film as a base material.

  As described above, according to the present invention, in the mounting process or the inspection process of the components of the solid-state imaging device, the integrated process can be performed in a state where the adhesive tape is bonded, thereby protecting the surface of the video sensor. Therefore, it is possible to provide a method for mounting a video sensor with high workability and high productivity. In addition, it is possible to provide a protective pressure-sensitive adhesive tape that can be used when mounting such a video sensor, has low heat shrinkability, has an appropriate adhesive force, and has excellent visibility and peelability as a whole. It becomes possible.

  Hereinafter, embodiments of the present invention will be described.

  The mounting method of the image sensor of the present invention is a state in which an adhesive tape using a polyimide film as a constituent material of the base material is bonded to the light receiving part side of the image sensor in the mounting process of the image sensor using the solid-state imaging device. Then, the terminal portion of the video sensor is reflowed by solder connection with the substrate side. The image sensor using the solid-state imaging device here is an image sensor obtained by packaging a solid-state imaging device generally called CCD (Charge Coupled Device) or CMOS (Complementary MOS) using a transparent resin or a glass material. is there.

  The light receiving part side of the image sensor means the surface side of the sensor that receives the image, and a general image sensor may be covered with a transparent resin or a glass cover to protect the imaging device. Since it is almost all, it includes substantially adhering an adhesive tape to the surface of these transparent resins or cover glass. Moreover, as for the surface, at least a portion corresponding to the light receiving portion may be protected, but other portions may be covered for protection.

  The pressure-sensitive adhesive tape of the present invention is basically formed from a tape base material and a pressure-sensitive adhesive layer provided on one side of the base material, but a release film may be bonded to the base material of the pressure-sensitive adhesive tape. That is, by attaching a release film having a release treatment on at least one surface to a base material of an adhesive tape via an adhesive layer, the adhesive layer can be protected and the image sensor surface can be protected. It is desirable that the adhesive tape is peeled off at any stage from the video sensor mounted in this way.

  At this time, it is preferable to have a protrusion for peeling on at least a part of the outer periphery of the adhesive tape. Specifically, as illustrated in FIG. 1, in a state where the adhesive tape 3 is bonded to the light receiving portion 2 of the video sensor 1, the protrusion 3 a that forms a part of the adhesive tape 3 is the end surface 1 a of the video sensor 1. It has a form that protrudes. In such a form, the video sensor 1 is attached to the board, and after passing through high-temperature solder reflow and mounting processing, the operation of the video sensor 1 or the function of the mounting board is inspected. The adhesive tape 3 can be peeled off very easily automatically or manually after the production process is completed or immediately before use.

  It is preferable that a part of the outer peripheral part of the adhesive tape 3 is attached between the end face of the image sensor 1 and the light receiving part 2. That is, the width of the adhesive tape 3 is preferably larger than the width of the light receiving unit 2 and smaller than the width of the image sensor 1. Furthermore, as shown in FIG. 1, it is preferable that the outer peripheral portion of the adhesive tape 3 except the side portion 1 b of the video sensor 1 covered by the protruding portion 3 a is intermediate between the end face of the video sensor 1 and the light receiving portion 2. . The light receiving unit 2 can be covered entirely with the adhesive tape 3, and the cover of the adhesive tape on the peripheral members can be prevented when the image sensor 1 is mounted. However, in the mounted state of the image sensor 1 such as the substrate, when there is a space around the substrate that does not require other mounting and does not require soldering, a part of the outer peripheral portion is the end surface of the image sensor 1 and the light receiving portion. It is sufficient if it is in the middle of 2 and is not necessarily required for the entire circumference.

  Moreover, the shape of the adhesive tape 3 is illustrated in FIG. From the above conditions, basically, a shape in which a protrusion 3a is added to a main part of a tape that is substantially similar to the image sensor 1 or the light receiving unit 2 or a tape including the image sensor 1 or the light receiving unit 2 is used. Although it will not specifically limit if it is the shape which added the projection part 3a to the main part, For example, the projection part 3a is provided in one side, such as a substantially square like FIG. 2 (A) and a substantially rectangular shape like FIG. 2 (B). Shape. In addition, a shape suitable for the shape of the image sensor 1 or the light receiving portion 2, such as a shape in which a protruding portion 3a is provided on a part of a main part of a circular or elliptical tape, can be applied.

  The shape of the protrusion 3a is not particularly limited, but a shape that can be clamped regardless of whether it is automatic or manual is preferable. Further, a shape that can be easily processed is preferable. For example, squares such as those shown in FIGS. 2A and 2B can be cited, but a semicircular shape, a trapezoidal shape such as FIG. 2C, or a square and a trapezoidal shape such as FIG. Combination shapes are also possible.

  At this time, the vicinity of the protruding portion 3a is connected to the bottom of the protruding portion 3a so as to be parallel to the end surface 1a of the image sensor 1 as shown in FIG. 1, more precisely, the side portion 1b constituting the end surface 1a. It is preferable to have the side 3b. A clear pasting position can be secured, and confirmation of adhesion becomes easy. In addition, when the image sensor 1 is not a square as illustrated in FIG. 1 but a square shape without an angular portion, an oval shape, or an oval shape, the image sensor 1 has a similar shape parallel to the side portion constituting the end face. It is preferable to have a side part.

  Furthermore, in the protrusion 3a, it is preferable that the side part 3c connected from the front-end | tip 3d to a terminal bottom has any shape of diagonal line shape, broken line shape, curve shape, or these combination. When the pressure-sensitive adhesive tape 3 is peeled off, the strongest force acts on the center line of the protrusion 3a. Therefore, in the shape 3e as shown by the broken line in FIG. There is a risk of causing the adhesive to remain in No. 2. Therefore, it is preferable that the side portion 3c has a shape that can achieve the dispersion of force during peeling.

  The specific shape is not particularly limited as long as it has a force distribution function, and examples thereof include the shape of the side portion 3c as shown in FIGS. That is, the shape of the side portion 3c is a slanted line shape (FIG. 2C), a broken line shape (FIG. 2D), a curved line shape (FIGS. 2A and 2B), or a combination thereof (not shown). ), The side portion 3c can be smoothly peeled off when the pressure-sensitive adhesive tape 3 is peeled off, and then the entire protruding portion 3a can be peeled off with a substantially uniform force. Furthermore, the main part of the tape covering the light receiving portion 2 can be peeled off with a substantially uniform force in the in-plane vertical direction of the peeling direction X. The inclination angle of the oblique line or the broken line, the curvature of the curve, and the like can be arbitrarily set depending on the shape of the video sensor 1, the entire adhesive tape 3, the shape of the protruding portion 3a, and the like.

  Moreover, it is preferable that the adhesive tape 3 does not provide an adhesive layer in the part which covers the light-receiving part 2 of the video sensor 1. This is because the pressure-sensitive adhesive does not remain on the surface of the adherend when the tape is peeled after component mounting, and the work efficiency is increased.

  Specifically, as illustrated in FIG. 3, when the adhesive layer 5 is formed on the base material 4, an uncoated portion having a width a is formed at a portion of the adhesive tape that covers the light receiving portion of the video sensor. In addition, a method of forming a pressure-sensitive adhesive layer 5 having a width b at both ends and producing a pressure-sensitive adhesive tape can be exemplified. However, the shape of the adhesive layer 5 is not particularly limited as long as an uncoated portion can be formed in a portion that is applied to the light receiving portion of the image sensor. For example, as illustrated in FIG. A) a method of providing a hollow shape of an arbitrary shape such as a circular shape, (B) a square shape, (C) a method of forming the adhesive layer 5 at the four corners of the base material 4, and (D) a slanted shape having a predetermined width. Various methods such as a method of forming a coated portion can be applied. The shaded part in FIG. 4 shows the adhesive application part.

  By the above method, the adhesive layer 2 is formed so as not to be biased with respect to the surface of the image sensor and to secure a deposition area. Can be prevented.

  As an adhesive tape to be bonded to these, it is necessary to use a polyimide film as a constituent material of the substrate. By forming an adhesive tape for surface protection that has excellent heat resistance, heat shrinkability, and adhesiveness, it is possible to work without peeling the tape in the component mounting process under heating conditions. is there.

  The polyimide film here is not particularly limited, but it is desirable that the polyimide film has a certain thickness in order to sufficiently exhibit the rigidity as a tape and the brown shading effect of the polyimide film. Specifically, the thickness may be 10 μm or more, more preferably 20 μm or more.

  The base material may be a polyimide film alone, but may be a base material having at least one polyimide film layer and laminated, or a film containing a polyimide material as a raw material. Moreover, arbitrary surface treatment, extending | stretching treatment, or a plasticizer and an additive may be contained.

However, in order to have a sufficient effect of suppressing heat conduction to the color filter, it is desirable that the substrate has a heat conductivity of, for example, 170 ° C. of 5 × 10 ⁻⁴ cal / cm · sec · ° C. or less. Polyimide film has low heat conductivity as well as heat resistance, and in addition to physical protection of the image sensor itself, it is possible to protect the color filter against high temperatures during mounting.

  In addition, although the material of an adhesive etc. is not specifically limited, Acrylic adhesive or a silicone adhesive etc. are mentioned specifically ,. In particular, silicone adhesives are not only excellent in heat resistance, but also easy to adjust the adhesive strength, so by arbitrarily adjusting the adhesive strength when peeling the tape after the mounting is finally completed, It is possible to design an adhesive tape excellent in handling, and it can be said that it is a particularly suitable adhesive material.

  Further, the present invention is characterized in that the terminal portion of the image sensor is soldered and reflowed to the substrate side by heating to 170 ° C. or higher. This indicates mounting by solder bonding using a reflow furnace. Specifically, it is only necessary that the maximum temperature during processing in the reflow furnace exceeds 170 ° C.

  The thickness of the adhesive layer of the adhesive tape is 1 μm or more and 100 μm or less, preferably 3 μm or more and 50 μm or less, more preferably 5 μm or more and 30 μm or less. In order to secure the adhesive layer, it is effective if even a slight level difference is generated on the surface of the base material. Also decreases. Further, the adhesive tape may be peeled off due to heat shrinkage of the film being heated. If the thickness exceeds 100 μm, the adhesive will be deformed during slitting and punching of the tape, or the adhesive will be deformed by pressure applied to the tape, pressure applied to the tape during transportation, and heating during mounting. This may cause the adhesive to be applied to the light receiving portion.

  In other words, in order to protect the image sensor, it is necessary to have a predetermined mounting strength as an adhesive tape, and it is necessary to maintain a bonded state in harmony with the image sensor, and workability is also in demand. Accordingly, the pressure-sensitive adhesive tape of the present invention has been found that the above range is the optimum range as a result of actual measurement. Therefore, it is possible to provide a video sensor mounting method with high workability, safety, and productivity by using an adhesive tape having such a thickness of the adhesive layer.

  Furthermore, in the present invention, the heat shrinkage rate of the adhesive tape after heating at 180 ° C. for 1 hour is 1.0% or less, more preferably 0.5% or less, and further preferably 0.3% or less. It is desirable. This is to further improve the working efficiency by clarifying additional conditions regarding the shrinkage ratio of the base material under high temperature conditions. The heat shrinkage referred to here is based on the value after bonding to a BA plate in the form of an adhesive tape and leaving it at 180 ° C. for 1 hour. Specifically, the heat shrinkage rate is measured by cutting an adhesive tape into 20 mm square, sticking it to a BA plate, heating it at a temperature of 180 ° C., and measuring the size of the tape before and after the heating by a projector (Mitutoyo: Both MD direction and TD direction were measured using PROFILE PROJECTOR PJ-H3000F). The BA plate refers to a SUS304 plate (BA5 finish SUS304 manufactured by Nippon Metal Co., Ltd.) surface-finished to BA5 in accordance with JIS “BA finish”.

  Moreover, in this invention, it is preferable that the adhesive force of the adhesive tape after implementing a heating at 180 degreeC for 1 hour is 0.1-8.0N / 19mm width, Moreover, 0.2N-5.0N / A width of 19 mm is more preferable, and a width of 0.3 N to 4.0 N / 19 mm is even more preferable. With an adhesive strength exceeding 8.0 N / 19 mm width, tape peeling from the adherend is difficult in the process, and the adhesive layer may remain on the adherend surface. During heating below 0.1 N / 19 mm width, This is because the adhesive tape may peel off due to the heat shrinkage of the film. The adhesive force here is based on a value measured according to JIS Z0237.

  Moreover, when using a release film for an adhesive tape, you may use any well-known thing as a release film. Specifically, a release coating layer, for example, a silicone layer formed on the bonding surface of the release film with the adhesive layer of the base material can be used. Examples of the substrate for the release film include paper materials such as glassine paper and resin films made of polyethylene, polypropylene, polyester, and the like.

  Moreover, this adhesive tape may be processed according to the use, for example, the size of the target solid-state imaging device. The processing method is not particularly limited as long as it is a method that maintains a uniform shape and does not leave a pressure-sensitive adhesive in the processed cross section, but punching is preferable in view of productivity.

  Examples and the like specifically showing the configuration and effects of the present invention will be described below. Moreover, the evaluation method in an Example etc. was performed as follows. In addition, it cannot be overemphasized that this invention is not limited to this Example and evaluation method.

<Evaluation method>
About the tape produced on the said conditions, the following item was evaluated.
(1) Shape of the tape after heating The shape of the tape after the samples of the above-mentioned Examples and Comparative Examples were bonded to the glass surface and left for 1 hour at a temperature of 180 ° C.
(2) The state of the glass surface after tape peeling The state of the glass surface after tape peeling was confirmed visually.
(3) Peelability After pasting samples of the following examples and comparative examples on the surface glass of the CCD package, the maximum temperature was 180 ° C. × 5 seconds (the reflow furnace was charged for about 90 seconds including residual heat) Easiness of peeling after putting it in the solder reflow oven and mounting it on the board.

<Example 1>
Polyimide film (Kapton 100H manufactured by Toray DuPont Co., Ltd .: thickness 25 μm, thermal conductivity at 170 ° C. is about 4.1 × 10 ⁻⁴ cal / cm · sec · ° C.) and silicone adhesive (SD manufactured by Toray Dow Corning) -4580) was applied to a thickness of 10 μm, and was bonded to the surface glass of the CCD package. This was put into a solder reflow furnace having a maximum temperature of 180 ° C. × 5 seconds (the reflow furnace was charged for about 90 seconds including residual heat) and mounted on the substrate. Note that the tape was peeled off after mounting was completed.
As a result, the surface after peeling the tape was not confirmed such as scratches or adhering foreign matter, and normal operation as a CCD was confirmed.

<Example 2>
As shown in FIG. 2A described above, the adhesive tape is a tape having a protruding portion with a protruding length of 4 mm from a covered portion of 11 mm × 12 mm square, passing through an arc-shaped side portion of R = 2 (mm). An adhesive tape similar to that of Example 1 was produced except that the shape was changed. This tape was attached to the surface glass of the CCD package, and was put into a 180 ° C. solder reflow furnace in the same manner as in Example 1 and mounted on the substrate.
Thereafter, when the tape was peeled off from the protruding portion of the tape, it could be easily peeled off from the protruding portion without breaking the tape. The surface of the CCD package after the tape was peeled was not confirmed to be scratched or adhered foreign matter, and normal operation as a CCD was confirmed.

<Example 3>
As shown in FIG. 2 (C) described above, the adhesive tape is opened from the 6 mm × 7 mm square covering portion by 1 mm to the outer sides of both ends (3b and 3f in FIG. 2 (C) are 1 mm). A pressure-sensitive adhesive tape similar to that of Example 2 was produced, except that a tape-like shape having a protruding portion with a protrusion length of 2.5 mm was passed through the inclined side portion. This tape was attached to the surface glass of the CCD package, and was put into a 180 ° C. solder reflow furnace in the same manner as in Example 1 and mounted on the substrate.
Thereafter, when the tape was peeled off from the protruding portion of the tape, it could be easily peeled off from the protruding portion without breaking the tape. The surface of the CCD package after the tape was peeled was not confirmed to be scratched or adhered foreign matter, and normal operation as a CCD was confirmed.

<Comparative Example 1>
A nylon film having a thickness of 25 μm (6 nylon manufactured by Toray Industries Inc .: thermal conductivity of about 5.5 × 10 ⁻⁴ cal / cm · sec · ° C.) and a storage elastic modulus of 2.0 × 10 ³ N / cm ² The same procedure as in Example 1 was performed except that a pressure-sensitive adhesive tape coated with a rubber pressure-sensitive adhesive having a thickness of 10 μm was used.
As a result, the positional deviation occurred in the bonded portion due to the thermal contraction of the tape, and the heat-degraded adhesive remained on the surface and was contaminated on the peeled surface. Also, the CCD itself did not operate normally because the color filter inside the CCD was damaged due to the reflow temperature.

<Comparative example 2>
An adhesive tape similar to that of Example 4 was produced, except that the side portion of the protrusion had a right-angled terminal shape (shape 3e as shown by the broken line in FIG. 2A). This tape was attached to the surface glass of the CCD package, and was put into a 180 ° C. solder reflow furnace in the same manner as in Example 1 and mounted on the substrate.
Thereafter, when the tape was peeled off from the protruding portion of the tape, a crack was generated from the corner portion at the bottom of the protruding portion, the tape was cut, and the entire tape could not be easily peeled off from the protruding portion.

<Reference Example 1>
On a base material made of polyethylene naphthalate having a thickness of 2 μm, an acrylic adhesive solution is applied in a stripe shape alternately with a 10 mm wide coated part and a 10 mm wide uncoated part, and dried to a thickness of 5 μm. A pressure-sensitive adhesive sheet having a pressure-sensitive adhesive layer was prepared. This pressure-sensitive adhesive sheet was slit with a width of 20 mm so that the uncoated portion was at the center of the tape to obtain a pressure-sensitive adhesive tape. The adhesive tape has a = 10 mm and b = 5 mm in FIG. After the adhesive tape was heated at 180 ° C. for about 1 hour, the adhesive strength measured according to JIS Z0237 was 1.0 N / 19 mm and the thermal shrinkage was 0.15%.
The shape of the tape after heating was not confirmed to float or peel from the glass surface of the tape.

<Reference Example 2>
An adhesive tape produced in the same manner as in Reference Example 1 was obtained except that the acrylic adhesive solution was not applied in a stripe shape. After the adhesive tape was heated at 180 ° C. for about 1 hour, the adhesive strength measured according to JIS Z0237 was 2.0 N / 19 mm, and the thermal shrinkage was 0.15%. As for the tape after a heating, the foreign material derived from an adhesive was confirmed on the glass surface after tape peeling.

<Summary of results>
From the above results, it was possible to provide a surface protective adhesive tape used in molding a CCD package having excellent heat resistance, workability, and peelability.

Explanatory drawing which shows the bonding state to the video sensor of the adhesive tape which concerns on this invention. Explanatory drawing which illustrates the shape of the adhesive tape which concerns on this invention. Explanatory drawing which shows the fundamental structure of the adhesive tape which has an adhesive non-application part of this invention. Explanatory drawing which shows the other structure of the adhesive tape which has an adhesive non-application part in this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Image sensor 2 Light-receiving part 3 Adhesive tape 3a Protrusion part 3b Side part 3c Side part 3d Tip 4 Base material 5 Adhesive layer X Center line

Claims (9)

  In the mounting step of the image sensor using the solid-state imaging device, the pressure-sensitive adhesive tape having a polyimide film as a base material, a protrusion for peeling on at least a part of the outer periphery thereof, and an adhesive layer on at least one side, A method for mounting a video sensor, comprising: reflowing the terminal portion of the video sensor to the board side by soldering by heating to 170 ° C. or higher while being attached to the light receiving portion of the video sensor.   The adhesive tape covers the entire light receiving part of the video sensor, and is bonded to the light receiving part so that at least a part of the outer peripheral part has a predetermined distance from the end surface of the video sensor to the center side. The video sensor mounting method according to claim 1.   The adhesive tape has a side parallel to the end face of the image sensor and connected to the terminal bottom of the protrusion, and the side connected from the tip of the protrusion to the terminal bottom is an oblique line, a polygonal line, a curve, or these The video sensor mounting method according to claim 1, wherein the video sensor has a shape of any one of the combinations.   The video sensor mounting method according to claim 1, wherein at least a silicone-based material is used as an adhesive component of the adhesive tape.   5. The video sensor mounting method according to claim 1, wherein an adhesive layer is not provided on a portion of the adhesive tape that covers the light receiving portion of the video sensor. The method of mounting a video sensor according to claim 1, wherein a thermal conductivity of the base material at 170 ° C. is 5 × 10 ⁻⁴ cal / cm · sec · ° C. or less.   The method for mounting a video sensor according to claim 1, wherein a heat shrinkage rate of the adhesive tape after heating at 180 ° C. for 1 hour is 1.0% or less.   8. The image sensor according to claim 1, wherein the adhesive force of the adhesive tape after heating at 180 ° C. for 1 hour is 0.1 to 8.0 N / 19 mm width. Implementation method. It is the adhesive tape which used the polyimide film for the constituent material of a base material, Comprising: It uses for the mounting method of the image sensor in any one of Claims 1-8, The adhesive tape characterized by the above-mentioned.

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