JP4671744B2 - Image pickup device storage package and image pickup apparatus - Google Patents

Description

  The present invention relates to an image sensor housing package that has lead terminals for housing an image sensor such as a CCD or C-MOS, and has a crystal low-pass filter directly attached to the upper surface of a frame.

  In recent years, there has been a growing need for using digital imaging cameras such as CCDs and C-MOSs as imaging devices for single-lens reflex cameras. Furthermore, in order to make it possible to use conventional interchangeable lenses for silver salt single-lens reflex cameras in the digital camera, the imaging device is thinned and the imaging device is enlarged to improve the image quality of the imaging device. There is a growing demand to get closer to size.

In order to reduce the thickness of such an image pickup device , the cover glass attached to the upper surface of a conventional image pickup device storage package (hereinafter also simply referred to as a package) is omitted, and a crystal plate having an optical low-pass filter function is directly used. This technology is being put into practical use.

  In addition, in order to increase the size of the image sensor, it is an essential task to optimize the structure of the package in which the image sensor is stored in order to obtain high reliability.

  A package for housing an image sensor such as a CCD or C-MOS used in a conventional camera or the like is an insulating substrate made of a square plate-like alumina ceramic in which an image sensor mounting portion is formed at the center of the upper surface, and this substrate. A plurality of lead terminals made of metal respectively attached to a pair of opposing side portions of the outer peripheral portion of the upper surface of the substrate, and a resin or low melting point glass over the entire periphery of the outer peripheral portion of the upper surface of the substrate via the plurality of lead terminals A package comprising an insulator frame made of alumina ceramic and a quartz plate having an optical low-pass filter function bonded to the upper surface of the frame with a resin has been used.

  A cross-sectional view and a plan view of an imaging apparatus using this conventional package are shown in FIGS. 3 (a) and 3 (b), respectively. In FIG. 3, 11 is a frame made of ceramics, 15 is a bonding material made of thermosetting resin or low melting glass, 13 is a substrate made of ceramics, 14 is an image sensor, 12 is a lead terminal, and 17 is an optical low-pass filter function. The quartz plate 16 has a resin for bonding the quartz plate 17 and the frame body 16 together.

The quartz plate 17 used as a lid is manufactured by cutting a quartz crystal having an optically birefringent property at an angle of 45 degrees or 0 degrees with respect to the crystal direction. By attaching the quartz plate 17 to the frame 11 with the resin 16, it is possible to seal the quartz plate 17 with the minimum thickness. Therefore, the moire effect generated in the image sensor 14 can be prevented by the birefringent optical low-pass filter function of the crystal plate 17.
Japanese Unexamined Patent Publication No. 2000-114502 JP 2003-17607

However, in an imaging apparatus using a conventional package, the package becomes larger as the imaging element becomes larger. Therefore, after the crystal plate 17 is bonded with a thermosetting epoxy resin, the linear thermal expansion coefficient is 11 × 10 ^−6. The amount of bending of the substrate increases due to the internal stress generated by the difference in linear thermal expansion between the crystal plate 17 at / ° C. and the coefficient of linear thermal expansion 6.5 × 10 ⁻⁶ / ° C. 11 and the frame 11. The element 14 also has a problem that the main surface (imaging surface) opposite to the bonding surface with the substrate is curved in a convex shape following the curvature of the substrate, thereby degrading the optical positional accuracy of the imaging device.

  In addition, the internal stress generated by the difference in linear thermal expansion between the crystal plate 17 and the frame 11 is generated, so that the interface between the crystal plate 17 and the frame 11 is easily caused by thermal stress or mechanical stress. There is a problem in that peeling or crystal plate 17 breaks, resulting in a decrease in airtightness in the package.

  The present invention has been completed in view of the above problems, and an object of the present invention is to provide an image sensor housing package and an image pickup apparatus that are excellent in optical positional accuracy of the image sensor and have high airtight reliability. is there.

The image pickup device storage package of the present invention comprises a substrate made of a rectangular flat plate-like insulator having an image pickup device mounting portion formed in the center of the upper surface, and a metal attached to the outer peripheral portion of the upper surface of the substrate. A plurality of lead terminals, a frame body joined via a joining material over the entire circumference of the outer peripheral portion of the upper surface of the substrate via the plurality of lead terminals, and the inside of the frame body is blocked by the upper surface of the frame body in adhered imaging element storage package and a quartz plate as the frame and linear thermal expansion coefficient of the substrate is composed of 8 × 10 ^-6 to 10 × 10 ^{-6 /} ℃ a is an insulator The frame body is projected outward from the side surface of the substrate, and the bonding material is formed from the side surface of the substrate to the lower surface of the projecting frame body, and is positioned on the lower surface of the lead terminal and the lower surface side. The line of intersection with the side surface of the bonding material and the upper surface of the lead terminal It is characterized in that it is positioned on the substrate side with respect to the line of intersection with the side surface of the bonding material positioned on the upper surface side .

  In the image pickup device storage package of the present invention, preferably, the frame and the substrate are formed of steatite ceramics.

  In the image pickup device storage package of the present invention, preferably, the image pickup device is made of silicon having a long side of 20 to 37 mm and a short side of 13 to 24 mm in plan view.

  An image pickup apparatus according to the present invention includes the image pickup element storage package according to the present invention, and an image pickup element mounted on the mounting portion and electrically connected to the plurality of lead terminals. To do.

In the image pickup device storage package according to the present invention, in the image pickup device storage package, the frame and the substrate are formed of an insulator having a linear thermal expansion coefficient of 8 × 10 ^{−6 to} 10 × 10 ⁻⁶ / ° C. The linear thermal expansion coefficient of the substrate and the frame can be approximated to the linear thermal expansion coefficient of the quartz plate, and the bonding stress after bonding the quartz plate can be made extremely small, resulting in extremely high airtight reliability. In addition, the optical position accuracy of the image sensor can be made very good by suppressing the stress applied to the image sensor.

  In the image pickup device storage package of the present invention, since the frame body and the substrate are preferably formed of steatite ceramics, the familiarity with the resin adhesive is good and the image pickup device is firmly bonded to the substrate with the resin adhesive. And the reliability of the imaging apparatus is improved.

  The image pickup device storage package according to the present invention is preferably made of silicon having a long side of 20 to 37 mm and a short side of 13 to 24 mm in plan view. The image quality of the image sensor can be improved by approaching the size, and mutual linear thermal expansion between the image sensor, the substrate, the lead terminal, the frame, and the crystal plate even if such a large image sensor is accommodated. By suppressing the internal stress caused by the difference very well, it is possible to improve the flatness of the surface of the image sensor, and there is an effect of improving the optical positional accuracy of the image sensor.

The image pickup device storage package of the present invention has a frame projecting outward from the side surface of the substrate, and a bonding material is formed from the side surface of the substrate to the lower surface of the projecting portion of the frame, and the lower surface of the lead terminal and the bonding material Because the line of intersection with the side surface of the image sensor is positioned closer to the substrate side than the line of intersection between the upper surface of the lead terminal and the side surface of the bonding material, the mutual linear heat between the image sensor, the substrate, the lead terminal, the frame, and the quartz plate It is possible to effectively suppress the internal stress caused by the expansion difference from concentrating on the mounting portion of the lead terminal of the image sensor housing package, and to improve the reliability of the image sensor housing package without impairing airtightness from the periphery of the lead terminal. effective.

  That is, in the cooling step after the image sensor is mounted and bonded to the mounting portion of the substrate, the substrate warps in a convex shape with the mounting portion facing upward due to the difference in linear thermal expansion between the image sensor and the substrate. A stress is generated that pulls the bonding material located on the lower side of the terminal toward the image sensor. By reducing the bonding surface with the bonding material on the lower surface side of the lead terminal where tensile stress is easily applied and releasing the lower surface of the lead terminal from the bonding material, it is possible to effectively relieve the tensile stress. It is possible to effectively prevent the airtightness from being lost around the terminals.

  The image pickup apparatus of the present invention includes the image pickup element storage package of the present invention and the image pickup element mounted on the mounting portion and electrically connected to the plurality of lead terminals. It is possible to provide an image pickup apparatus that has the effect of the image pickup device storage package and that has excellent optical positional accuracy and high hermetic reliability.

  Next, an image pickup device storage package and an image pickup apparatus according to the present invention will be described in detail with reference to the accompanying drawings.

1 (a) is a sectional view showing a reference example of the imaging apparatus using the package of the present invention, FIG. 1 (b), croton a quartz plate of an imaging device using a package of FIGS. 1 (a) FIG.

  In FIG. 1, 1 is a frame, 2 is a lead terminal, 3 is a substrate, 4 is an image sensor, 5 is a bonding material, 7 is a crystal plate having an optical low-pass filter function, and 6 is a crystal plate 7 and the frame 1. Indicates the adhesive to be bonded.

  As shown in FIG. 1, the package of the present invention has a rectangular plate-like insulator substrate 3 in which the mounting portion of the image sensor 4 is formed at the center of the upper surface, and is attached to the outer peripheral portion of the upper surface of the substrate 3. It is mainly formed from a plurality of lead terminals 2 made of a metal and an insulator frame 1 bonded by a bonding material 5 over the entire outer periphery of the upper surface of the substrate 3 via the plurality of lead terminals 2. Has been.

  Then, the image pickup device 4 is mounted on the mounting portion of the package, and the crystal plate 7 having an optical low-pass filter function is bonded to the upper surface of the frame 1 with an adhesive 6 made of a resin adhesive or the like. It becomes.

The frame 1 and the substrate 3 are made of an insulator having a linear thermal expansion coefficient of 8 × 10 ^{−6 to} 10 × 10 ⁻⁶ / ° C., and preferably made of steatite ceramics. Such a frame 1 and the substrate 3 are made by mixing an appropriate organic binder, a solvent, a plasticizer, and a dispersant with raw material powders such as magnesium oxide and silicon oxide to make a mud, and this mud is conventionally known. The granules are granulated using the spray drying method, and the granules are press-molded with a press mold having a predetermined shape and then fired at a high temperature of about 1500 ° C. Note that the surface of the frame 1 or the substrate 3 may be flatly polished by a known lapping process and processed to a flatness of 20 μm or less.

  The lead terminal 2 is subjected to, for example, a metal such as Fe—Ni—Co alloy, 42 alloy, copper (Cu), copper alloy, or wire bonding (not shown) for electrically connecting the image sensor 4. It consists of a thin metal plate such as an Fe-Ni-Co alloy or 42 alloy with an aluminum foil bonded to the region.

  The lead terminal 2 is formed by punching a plate material made of these metals by using a conventionally known stamping mold so that the lead terminal 2 has a frame on the outer peripheral portion and extends inward from the inner periphery of the frame. After forming the developed lead frame, the developed lead terminal 2 may be bent into a desired L-shape by bending using a bending die. Thereafter, a nickel plating layer and a gold plating layer may be applied to the surface of a metal such as an Fe—Ni—Co alloy, 42 alloy, Cu, or copper alloy by electroplating.

  The bonding material 5 is, for example, a thermosetting epoxy resin, for example, a main material made of bisphenol A type liquid epoxy resin, bisphenol F type liquid epoxy resin, phenol novolac type liquid resin, etc., and a filler made of spherical silicon oxide, etc. Add carbon powder as a curing agent mainly composed of acid anhydrides such as tetrahydromethylphthalic anhydride and the like, and mix and knead using a centrifugal stirrer to make a paste. Next, the paste-like thermosetting resin is applied to a necessary portion of the frame 1 or the substrate 3 by a screen printing method, a dispensing method or the like and dried in a tunnel type atmosphere furnace or oven, and then the lead terminal 2 is attached to the substrate. 3 and the frame 1 are sandwiched between a tunnel-type atmosphere furnace or oven and heated at 150 ° C. for about 90 minutes to completely cure the bonding material 5, and the substrate 3, frame 1 and lead The terminal 2 is firmly bonded to produce a package.

  Other bonding materials 5 include, for example, bisphenol A type epoxy resin, bisphenol A modified epoxy resin, bisphenol F type epoxy resin, phenol novolac type epoxy resin, cresol novolac type epoxy resin, special novolac type epoxy resin, phenol derivative epoxy. Resin, epoxy resin such as bisphenol skeleton type epoxy resin, etc. with imidazole, amine, phosphorus, hydrazine, imidazole adduct, amine adduct, cationic polymerization, dicyandiamide, etc. added. be able to.

  In addition to the resin, the bonding material 5 can be a low melting point glass. In this case, for example, a zirconium oxide silica-based compound as a filler is added to a glass component containing 56 to 66% by mass of lead oxide, 4 to 14% by mass of boron oxide, 1 to 6% by mass of silicon oxide, and 1 to 11% by mass of zinc oxide. A glass paste obtained by adding 4 to 15% by mass and adding and mixing an appropriate organic solvent and solvent to the above glass composition powder is used for the lower surface of the frame 1 and the substrate 3 by a conventionally known screen printing method. Laminate printing is applied to the upper surface to a predetermined thickness, and this is baked at a temperature of about 430 ° C. to adhere to the substrate 3 and the frame 1 described above. After that, the lead terminal 2 is sandwiched between the substrate 3 and the frame 1 and passed through a tunnel type atmosphere furnace or oven and heated to about 470 ° C. to melt the bonding material 5. 1 and the lead terminal 2 are firmly bonded to produce a package.

  The imaging device 4 is an image sensor such as a charge coupled device (CCD) or a complementary metal oxide semiconductor (C-MOS). The image pickup element 4 is bonded to the image pickup element mounting portion in the center of the substrate 3 with, for example, a silver epoxy adhesive, and then electrically connected to the lead terminal 2 by wire bonding using a gold wire or an aluminum wire. In this case, the substrate 3 is preferably made of steatite ceramics. Steatite ceramics have good paintability with silver epoxy adhesive and provide a strong bond.

  The quartz plate 7 is manufactured by cutting a quartz crystal having an optically birefringent property by using a slicing method at angles of 45 degrees and 0 degrees with respect to the crystal direction. By superimposing two crystal plates having different crystal orientation angles, it is possible to prevent a moire phenomenon that occurs in an image captured by the image pickup device 4 using the birefringence characteristics of the crystal plates.

  The adhesive 6 is, for example, an ultraviolet curable epoxy resin, and is applied to the upper surface of the frame 1 over the entire circumference using a dispensing method. After that, a quartz plate having a crystal orientation angle of 45 degrees or 0 degrees is placed on the quartz plate 7 and irradiated with ultraviolet rays, whereby the adhesive 6 is cured and sealing is completed. Then, by placing a quartz plate having the other azimuth angle on the quartz plate (not shown), the image sensor housing device is completed.

  The image pickup device 4 is preferably made of silicon having a long side of 20 to 37 mm and a short side of 13 to 24 mm in plan view. Therefore, the image pickup device 4 is enlarged and brought close to the size of the silver salt film. Image quality can be improved, and even if such a large image sensor 4 is housed, the linear thermal expansion difference between the image sensor 4, the substrate 3, the lead terminal 2, the frame body 1, and the crystal plate 7. It is possible to improve the flatness of the surface of the image pickup device 4 by suppressing the internal stress generated by the above very well, and there is an effect of improving the optical positional accuracy of the image pickup device 4.

Also, as shown in FIG. 2, the frame 1 not overhang outside the side surface of the substrate 3, the bonding material 5 is formed over the lower surface of a portion projecting from a side surface of the substrate 3 of the frame 1, the lead terminal Since the intersection line between the lower surface of 2 and the side surface of the bonding material 5 is positioned closer to the substrate 3 than the intersection line between the upper surface of the lead terminal 2 and the side surface of the bonding material 5, the imaging device 4, the substrate 3, and the lead terminal 2. It is possible to effectively suppress the internal stress caused by the mutual linear thermal expansion difference between the frame body 1 and the crystal plate 7 from being concentrated on the mounting portion of the lead terminal 2 of the image sensor housing package. There is an effect of improving the reliability of the image pickup device storage package without impairing the performance.

  That is, in the cooling step after the image pickup device 4 is mounted and bonded to the mounting portion of the substrate 3, the substrate 3 warps in a convex shape with the mounting portion up due to a difference in linear thermal expansion between the image pickup device 4 and the substrate 3. At this time, in particular, a stress is generated that pulls the bonding material 5 positioned below the lead terminal 2 toward the image sensor 4. It is possible to effectively relieve the tensile stress by reducing the bonding surface with the bonding material 5 on the lower surface side of the lead terminal 2 to which such tensile stress is easily applied and releasing the lower surface of the lead terminal 2 from the bonding material 5. It becomes possible, and it can prevent effectively that airtightness is impaired from the lead terminal 2 periphery.

  Furthermore, the outer peripheral edge of the bonding surface of the substrate 3 and the bonding material 5 where stress tends to concentrate can be shifted without overlapping the outer peripheral edge of the bonding surface of the frame 1 and the bonding material 5. In addition, it is possible to disperse the concentration of internal stress generated due to the difference in linear thermal expansion coefficient when the image pickup device 4 is bonded to the substrate 3 or the crystal plate 7 is bonded. Package and an imaging device can be provided.

  Examples of the package of the present invention are described below.

  The package of the present invention shown in FIG. 1 was produced as follows.

  A substrate 3 made of steatite ceramics is mixed with raw material powders of silicon oxide and magnesium oxide by adding an organic binder, a solvent, a plasticizer, and a dispersant to make a slurry, and this slurry is granulated using a spray drying method. This granule was press-molded with a press mold having a predetermined shape and then fired at about 1300 ° C.

  The frame 1 made of steatite ceramics is mixed with raw material powders of silicon oxide and magnesium oxide, and an organic binder, solvent, plasticizer, and dispersing agent are added and mixed to make a slurry, and this slurry is spray-dried. The granules were granulated and the granules were press-molded with a press mold having a predetermined shape, and then fired at about 1300 ° C. The fired frame 1 was finished to an average flatness of 8 μm and a maximum of 15 μm or less on the bonding surface to which the crystal plate 7 was bonded by a lapping method.

  The substrate 3 as the sample 1 has a rectangular parallelepiped shape of 46.6 mm in length, 31.2 mm in width, and 1.0 mm in thickness, and the frame 1 has an external dimension of 46.6 mm in length, 33.9 mm in width, and 0.59 mm in thickness, 34.2 mm × 27.3. The opening size was set to mm, and the frame body 1 was projected outward from the side surface of the substrate 3.

  The substrate 3 as the sample 2 has a rectangular parallelepiped shape of 46.6 mm in length, 31.2 mm in width, and 1.0 mm in thickness, and the frame 1 has external dimensions of 46.6 mm in length, 31.2 mm in width, and 0.59 mm in thickness, 38.0 mm × 27.3 mm. The outer periphery of the frame 1 and the outer periphery of the substrate 3 overlap each other in plan view.

  The lead terminal 2 has a 0.25 mm 42 alloy thin plate clad with aluminum 29 mm wide and 7 μm thick at the center and has a frame on the outer periphery using a conventionally known stamping continuous mold, and from the inner periphery to the inner side of the frame. A total of 80 lead terminals 2 were punched into a developed shape so as to extend.

  As a bonding material 5, a glass component containing 56 to 66% by mass of lead oxide, 4 to 14% by mass of boron oxide, 1 to 6% by mass of silicon oxide and 1 to 11% by mass of zinc oxide, and 4 of zirconium oxide silica compound as a filler A glass paste obtained by adding and mixing an appropriate organic solvent and solvent to the glass composition powder using a material added with ˜15% by mass is applied to the lower surface of the frame 1 or the upper surface of the substrate 3 by a conventionally known screen printing method. Lamination printing was applied to a predetermined thickness, and this was baked at a temperature of about 430 ° C. to adhere to the substrate 3 and the frame 1 described above.

  After that, the lead terminal 2 is sandwiched between the substrate 3 and the frame 1 and passed through a tunnel type atmosphere furnace or oven and heated to about 470 ° C. to melt the bonding material 5. 1 and the lead terminal 2 were firmly bonded to produce a package.

  For comparison, a package using the prior art was manufactured in the same manner as Samples 1 and 2 except that the frame 11 and the substrate 13 were formed of alumina ceramics. The sample for comparison is the same as sample 2 with the same dimensions of substrate 13 and frame 11 as sample 1 (frame 11 projecting outward from the side surface of substrate 13), and the same as sample 2 (frame body) Sample 4 in which the outer periphery of 11 overlaps the outer periphery of substrate 13 in plan view).

  In each of the image sensor housing packages thus fabricated, a silicon piece having a thickness of 0.4 mm, a surface flatness of 1 μm or less, and an outer diameter of 22.1 mm × 31.6 mm is thermosetting silver. Bonded with epoxy resin.

  Thereafter, the crystal plates 7 and 17 were crystal plates having a size of 33.5 mm × 27.5 mm × 8 mm cut out at a crystal orientation angle of 45 degrees and a rotation angle of 0 degrees. The surfaces of the quartz plates 7 and 17 were smoothed by polishing for the purpose of removing optical defects and had a flatness within 3 Newton rings. Further, the end face was chamfered with a 0.2 mm chamfer on the edge of the side to prevent chipping off, and the corner was chamfered with 1 mm.

  An ultraviolet curable epoxy resin was led out from the nozzle of φ (diameter) 1.4 mm along the outer periphery using a dispenser method on the upper surfaces of the package-shaped frames 1 and 11 completed by the above procedure and applied in an annular shape. The quartz plates 7 and 17 are placed at predetermined positions thereon, and the quartz plates 7 and 17 are horizontally pressed against the frames 1 and 11 with a weight of about 10 grams, and then ultraviolet rays are emitted from the upper surfaces of the quartz plates 7 and 17. The imaging was completed by irradiating the lamp and completely curing the adhesives 6 and 16 to complete the sealing.

The temperature cycle test method of MIL Standard 883E, Method 1010.6-55 was applied to Samples 1 and 2 of the present invention and Samples 3 and 4 as comparative examples thus obtained, under the conditions of -40 degrees / 125 degrees. 200 cycles and 300 cycles of stress were applied, and the presence or absence of cracks in the quartz plates 7 and 17 and the hermeticity of the package were compared. The results are shown in Table 1.

From Table 1, samples 1 and 2 made of steatite ceramics having a linear thermal expansion coefficient of 8 × 10 ⁻⁶ / ° C. to 10 × 10 ⁻⁶ / ° C. of the frame 1 and the substrate 3 according to the present invention are Even if the cycle is 200 cycles, no defect occurs and the bonding stress after bonding the quartz plate 7 can be minimized. As a result, the quartz plate is directly attached to the image sensor housing package without impairing the airtight reliability. It turns out that is possible.

  Further, it was found that the sample 1 in which the frame body 1 is projected outward from the side surface of the substrate 3 does not cause a defect even when the temperature cycle is 300 cycles, and is excellent in hermetic reliability.

Next, Table 2 shows the mounting portions of the packages used in Sample 1 (frame 1 and substrate 3 are made of steatite ceramics) and Sample 3 (frame 11 and substrate 13 are made of alumina ceramics). An image pickup device as a sample was manufactured by bonding silicon pieces as image pickup elements having various outer diameters with thermosetting silver epoxy resin (samples 5 to 14). This was put into the temperature cycle test, and the flatness of the silicon piece after 300 cycles was compared and evaluated with a non-contact three-dimensional measuring device. As an evaluation guideline, the maximum degree of warpage on the image sensor surface was set to 20 μm. The results are shown in Table 2.

  From Table 2, the sample made of alumina ceramics for the frame 11 and the substrate 13 exceeds the evaluation guideline when the outer diameter of the silicon piece is 31.6 × 22.1 mm or more (samples 7 to 9). It turned out to be difficult to install.

  On the other hand, the sample in which the frame 1 and the substrate 3 of the present invention are made of steatite ceramics is equipped with a large image sensor made of silicon (samples 11 to 13) having a long side of 20 to 37 mm and a short side of 13 to 24 mm. However, it was found that the flatness of the surface of the image sensor can be maintained satisfactorily and the optical positional accuracy can be improved.

(A) is sectional drawing which shows the reference example of the imaging device using the package for image pick-up element accommodation of this invention, (b) is a top view of the imaging device of (a). It is sectional drawing which shows an example of embodiment of the imaging device using the package for image pick-up element accommodation of this invention. Sectional drawing of the imaging device using the conventional package for image pick-up element accommodation, (b) is a top view of the imaging device of (a).

Explanation of symbols

1: Frame 2: Lead terminal 3: Substrate 4: Image sensor 5: Bonding material 7: Crystal plate

Claims (4)

A substrate made of a rectangular flat plate-like insulator having an image sensor mounting portion formed at the center of the upper surface, a plurality of lead terminals made of metal attached to the outer periphery of the upper surface of the substrate, and the plurality of leads A frame body bonded via a bonding material over the entire periphery of the outer peripheral portion of the upper surface of the substrate via a terminal, and a crystal plate bonded to the upper surface of the frame body so as to close the inside of the frame body an image sensor package for housing the linear thermal expansion coefficient of the frame body and the substrate is constituted by 8 × 10 ^-6 to 10 × 10 -6 ^/ ℃ a is an insulator, the frame body from the side of the substrate The bonding material is formed from the side surface of the substrate to the lower surface of the protruding frame body, and the line of intersection between the lower surface of the lead terminal and the side surface of the bonding material located on the lower surface side is formed. The upper surface of the lead terminal and the bonding material located on the upper surface side An image pickup device storage package, wherein the image pickup device storage package is positioned closer to the substrate than the line of intersection with the side surface of the image pickup device.   2. The image sensor housing package according to claim 1, wherein the frame and the substrate are made of steatite ceramics.   3. The image sensor housing package according to claim 1, wherein the image sensor is made of silicon having a long side of 20 to 37 mm and a short side of 13 to 24 mm in plan view. An image sensor housing package according to any one of claims 1 to 3 , and an image sensor mounted on the mounting portion and electrically connected to the plurality of lead terminals. An imaging device that is characterized.

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