JP2005340322A - Substrate treatment apparatus and method of manufacturing substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To effectively reduce bubbles contained in a treatment liquid using simple equipment. <P>SOLUTION: The treatment liquid stored in a treatment liquid tank 20 is supplied to a treatment chamber 50 via a supply pipe 40 by means of a pump 30. The treatment chamber 50 is located higher than the treatment liquid tank 20, and the treatment liquid accumulated on the floor of the treatment chamber 50 is caused to flow into the treatment liquid tank 20 via a vertical pipe 11 and a horizontal pipe 12 by gravitational force. While the treatment liquid is flowing in the horizontal pipe 12, the bubbles in the treatment liquid are caused to flow into a bypass pipe 13 from a branch point 14 of the horizontal pipe 12. Since the bubbles flowing into the bypass pipe 13 are pushed by bubbles coming into the bypass pipe 13 one after another, they ascend rapidly in a vertical part of the bypass pipe 13. After the highest point of the bypass pipe 13, the bubbles start to descend slowly in a sloped part of the bypass pipe 13. During descending the pipe, the bubbles begin to liquefy and become a liquid by the time they reach the juncture 15 and then are caused to flow into the horizontal pipe 12. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a substrate processing apparatus that performs processing of a substrate such as development, etching, and peeling using a processing solution such as a developing solution, an etching solution, and a peeling solution, and a method for manufacturing a substrate using the same, and in particular, a processing solution The present invention relates to a substrate processing apparatus that is circulated between a processing chamber and a processing liquid tank and reused, and a substrate manufacturing method using the same.

  For example, in a manufacturing process of a TFT (Thin Film Transistor) substrate, a color filter substrate, a plasma display panel substrate, an organic EL (Electroluminescence) display panel substrate, or the like of a liquid crystal display device used as a display panel, a circuit pattern is formed on the substrate. In order to form a color filter or the like, a substrate such as development, etching, or peeling is performed using a processing liquid such as a developing solution, an etching solution, or a peeling solution. In general, a process for performing these processes is called a wet process.

  In many cases, the wet process is performed by spraying the processing liquid onto the surface of the substrate from a spray or the like while moving the substrate using a moving means such as a roller conveyor in the processing chamber. In general, the processing liquid is supplied from an external processing liquid tank to the processing chamber by a pump, and after processing the substrate, the processing liquid is recovered from the processing chamber and returned to the processing liquid tank. As described above, the processing liquid is circulated between the processing chamber and the processing liquid tank and reused, thereby reducing the consumption of expensive processing liquid and reducing the manufacturing cost of the substrate.

  In the processing liquid used in the wet process, bubbles are generated when the pump is circulated between the processing chamber and the processing liquid tank. In particular, an alkaline processing solution used for development and peeling and an organic acid processing solution used for etching generate a large amount of fine bubbles. Bubbles in the processing liquid cause problems such as poor spray discharge, leakage of bubbles from the processing liquid tank or the processing chamber, and poor conveyance of the substrate due to bubbles in the processing chamber. For this reason, conventionally, measures have been taken such as adding an antifoaming agent to the processing liquid, stopping the apparatus until the bubbles disappear, or replacing the processing liquid. However, there has been a problem that the addition of an antifoaming agent causes deterioration of the processing liquid, the stoppage of the apparatus causes a reduction in operating rate, and the replacement of the processing liquid causes an increase in running cost.

On the other hand, Patent Document 1 describes a technique for eliminating bubbles of a chemical solution (processing solution) using an antifoaming tank. Patent Document 2 describes a technique for eliminating bubbles of a chemical solution (processing solution) using an antifoaming spray. Furthermore, Patent Document 3 describes a technique for preventing bubbles from flowing into the processing liquid tank using a manual valve or an air vent pipe.
JP-A-8-17787 JP 2000-98319 A JP 2001-332528 A

  The technology described in Patent Document 1 or Patent Document 2 requires special equipment such as an antifoaming tank or an antifoaming spray. On the other hand, the technique described in Patent Document 3 requires simple equipment such as a manual valve and air vent piping, but cannot remove bubbles as in Patent Document 1 and Patent Document 2. For this reason, bubbles still remain in the processing chamber, and there are problems of bubble leakage from the processing chamber and poor substrate transport due to bubbles in the processing chamber.

  An object of the present invention is to effectively reduce bubbles in the processing liquid using simple equipment.

  Another object of the present invention is to efficiently and inexpensively manufacture a high-quality substrate with little processing unevenness.

  The substrate processing apparatus of the present invention includes a processing liquid tank for storing a processing liquid, a processing chamber for processing a substrate using the processing liquid, a supply pipe for supplying the processing liquid from the processing liquid tank to the processing chamber, and a supply A substrate processing apparatus having a pump provided in a pipe for recovery and a recovery pipe for recovering the processing liquid from the processing chamber to the processing liquid tank, wherein the processing chamber is provided at a position higher than the processing liquid tank. The piping has a vertical piping that goes downward from the processing chamber, a substantially horizontal horizontal piping that follows the vertical piping, and a bypass piping that branches from the horizontal piping and goes upward, and merges with the horizontal piping downward from the middle. Is.

  The processing liquid collected on the floor of the processing chamber flows into the processing liquid tank through the vertical piping and the horizontal piping due to gravity drop. Since bubbles in the processing liquid contain light and are light, when the processing liquid flows in the horizontal pipe, it flows into the bypass pipe from the horizontal pipe. The foam that has flowed into the bypass pipe is pushed by the foam that flows into the bypass pipe later, and rises at a high speed in a portion directed upward of the bypass pipe. After passing the uppermost part of the bypass pipe, the bubbles begin to descend at a slow speed in the downward direction of the bypass pipe. When descending, the bubbles start to liquefy and become liquid before joining the horizontal pipe and flow into the horizontal pipe.

  Furthermore, in the substrate processing apparatus of the present invention, the height of the uppermost part of the bypass pipe is higher than the height of the liquid level of the processing liquid in the vertical pipe. If the liquid level of the processing liquid in the vertical pipe is higher than the height of the uppermost part of the bypass pipe, bubbles in the processing liquid do not easily flow from the vertical pipe to the horizontal pipe. On the other hand, if the level of the processing liquid in the vertical pipe is not higher than the position of the horizontal pipe, the horizontal pipe is not filled with the processing liquid, and bubbles do not flow from the horizontal pipe into the bypass pipe. By making the height of the uppermost part of the bypass pipe higher than the liquid level of the treatment liquid in the vertical pipe, the liquid level of the treatment liquid is intermediate between the height of the uppermost part of the bypass pipe and the position of the horizontal pipe. Thus, bubbles easily flow into the bypass pipe.

  Furthermore, the substrate processing apparatus of the present invention is provided with a flow rate adjusting means in a horizontal pipe. The flow rate adjusting means can be used to adjust the speed of the processing liquid flowing in the horizontal pipe so that bubbles can easily flow into the bypass pipe. The flow rate adjusting means may be a valve or may be a partial change in the thickness of the horizontal pipe itself.

  Furthermore, the substrate processing apparatus of the present invention is provided with a flow rate adjusting means in a bypass pipe. Using the flow rate adjusting means, the bubble lowering speed can be adjusted so that the bubbles are easily liquefied. The flow rate adjusting means may be a valve, or may be a partial change in the thickness of the bypass pipe itself.

  In the substrate processing apparatus of the present invention, the outlet of the recovery pipe is provided at a position lower than the liquid level of the processing liquid in the processing liquid tank. Thereby, it can prevent that a process liquid falls into the process liquid tank from the exit of piping for collection | recovery, and a bubble generate | occur | produces.

  Further, in the substrate processing apparatus of the present invention, the processing liquid tank temporarily has the processing liquid recovered by the recovery pipe, and has a partition wall where the overflowing processing liquid flows along a gentle slope. Even if bubbles remain in the collected processing liquid, when the overflowing processing liquid flows along the gentle slope, the bubbles in the processing liquid are liquefied and further reduced.

  Furthermore, in the substrate processing apparatus of the present invention, the processing liquid tank has a blocking plate that blocks bubbles in the processing liquid accumulated in the processing liquid tank from the inlet of the supply pipe. Even if fine bubbles that do not float to the liquid level remain in the processing liquid accumulated in the processing liquid tank, they are blocked by the blocking plate and do not reach the inlet of the supply pipe.

  The substrate manufacturing method of the present invention performs a wet process using any one of the above-described substrate processing apparatuses.

  According to the substrate processing apparatus of the present invention, bubbles in the processing liquid can be effectively reduced using simple equipment by liquefying the bubbles in the processing liquid using the bypass pipe. Accordingly, it is possible to prevent spray discharge defects, bubble leakage from the processing liquid tank or the processing chamber, and substrate conveyance defects due to bubbles in the processing chamber.

  According to the substrate manufacturing method of the present invention, the processing liquid is less deteriorated by suppressing the deterioration of the processing liquid due to the addition of the antifoaming agent, the reduction in the operating rate due to the stoppage of the apparatus, and the increase in running cost due to the replacement of the processing liquid. A high-quality substrate can be manufactured efficiently and inexpensively.

  FIG. 1 is a diagram showing a schematic configuration of a substrate processing apparatus according to an embodiment of the present invention. The substrate processing apparatus includes a recovery pipe 10, a processing liquid tank 20, a pump 30, a supply pipe 40, and a processing chamber 50.

  The processing liquid stored in the processing liquid tank 20 is supplied to the processing chamber 50 by the pump 30 via the supply pipe 40. The processing chamber 50 processes the substrate 1 by spraying a processing liquid onto the surface of the substrate 1 from the spray 51 while moving the substrate 1 using a moving means (not shown). The processing liquid sprayed on the surface of the substrate 1 flows down from the surface of the substrate 1 and accumulates on the floor surface of the processing chamber 50. The processing chamber 50 is provided at a position higher than the processing liquid tank 20, and the processing liquid collected on the floor surface of the processing chamber 50 is recovered to the processing liquid tank 20 via the recovery pipe 10.

  The recovery pipe 10 includes a vertical pipe 11, a horizontal pipe 12, and a bypass pipe 13. The vertical pipe 11 is connected to the floor surface of the processing chamber 50 and extends downward from the processing chamber 50. On the other hand, the horizontal pipe 12 is provided horizontally or with a slight inclination following the vertical pipe 11. A bypass pipe 13 is connected to the horizontal pipe 12. The bypass pipe 13 once goes upward from the branch point 14 of the horizontal pipe 12 and then joins the horizontal pipe 12 at the junction 15 from the middle to the lower side.

  Although the vertical pipe 11 is shown as being vertical in the figure, the vertical pipe 11 is not necessarily vertical, and may be directed downward with a predetermined angle with respect to the vertical. Similarly, the portion of the bypass pipe 13 that branches off from the horizontal pipe 12 and goes upward is not necessarily vertical, and may be upward with a predetermined angle with respect to the vertical.

  The processing liquid collected on the floor surface of the processing chamber 50 flows into the processing liquid tank 20 through the vertical pipe 11 and the horizontal pipe 12 due to gravity drop. Since the bubbles in the processing liquid contain light and are light, when the processing liquid flows in the horizontal pipe 12, it flows into the bypass pipe 13 from the branch point 14 of the horizontal pipe 12. The foam that has flowed into the bypass pipe 13 is pushed by the foam that flows into the bypass pipe 13 later, and rises at a high speed in the portion of the bypass pipe 13 that goes upward. When the uppermost part of the bypass pipe 13 is passed, the bubbles begin to descend at a slow speed in the downward direction of the bypass pipe 13. When descending, the bubbles start to liquefy and become liquid before reaching the junction 15 and flow into the horizontal pipe 12 from the junction 15.

  In this embodiment, when the height of the liquid surface of the processing liquid in the vertical pipe 11 is A, the position of the horizontal pipe 12 is B, and the height of the uppermost portion of the bypass pipe 13 is C, in the present embodiment, the bypass pipe 13 is used. Is made higher than the height A of the liquid level of the processing liquid in the vertical pipe 11. If the height A of the liquid level of the processing liquid in the vertical pipe 11 is higher than the height C of the uppermost part of the bypass pipe 13, bubbles in the processing liquid will not easily flow from the vertical pipe 11 into the horizontal pipe 12. On the other hand, if the height A of the liquid level of the processing liquid in the vertical pipe 11 is not higher than the position B of the horizontal pipe, the horizontal pipe 12 is not filled with the processing liquid, and bubbles do not flow from the horizontal pipe 12 into the bypass pipe 13. . In the present embodiment, the height A of the uppermost portion of the bypass pipe 13 is made higher than the height A of the liquid level of the processing liquid in the vertical pipe 11 so that the liquid surface height A of the processing liquid is equal to that of the bypass pipe. It becomes an intermediate between the height C of the uppermost part and the position B of the horizontal pipe (C> A> B), and the bubbles easily flow into the bypass pipe 13.

  FIG. 2 is a diagram showing a schematic configuration of a substrate processing apparatus according to another embodiment of the present invention. In the present embodiment, a valve 16 is provided as a flow rate adjusting means in the horizontal pipe 12, and a valve 17 is provided as a flow rate adjusting means in a portion going downward of the bypass pipe 13. Other components are the same as those of the embodiment shown in FIG.

  In the present embodiment, the valve 16 is used to adjust the flow rate of the processing liquid flowing in the horizontal pipe 12. Thereby, the speed of the processing liquid flowing in the horizontal pipe 12 can be adjusted so that bubbles easily flow into the bypass pipe 13. The means for adjusting the flow rate is not limited to the valve, and the thickness of the horizontal pipe 12 itself may be partially changed.

  Further, the flow rate of bubbles flowing through the bypass pipe 13 is adjusted using the valve 17. Thereby, the descent | fall speed | rate of a bubble can be adjusted so that a bubble may become easy to liquefy. The means for adjusting the flow rate is not limited to the valve, and the thickness of the bypass pipe 13 itself may be partially changed.

  FIG. 3 is a cross-sectional view of a processing liquid tank according to an embodiment of the present invention. The inside of the processing liquid tank 20 is divided into two sections 20 a and 20 b by a partition wall 21. The recovered processing liquid flows into the processing liquid tank 20 from the outlet 18 of the recovery pipe and temporarily accumulates in the compartment 20a. The outlet 18 of the recovery pipe is provided at a position lower than the liquid level of the processing liquid 2a accumulated in the section 20a. Thereby, it can prevent that a process liquid falls into the process liquid tank 20 from the exit 18 of collection | recovery piping, and a bubble generate | occur | produces.

  The upper surface of the partition wall 21 is a gentle slope with the section 20a side slightly higher than the section 20b side. The treatment liquid 2a accumulated in the section 20a overflows from the section 20a, travels along the gentle slope of the partition wall 21, and flows into the section 20b. Even if bubbles remain in the collected processing liquid 2a, when the processing liquid 2a overflowing from the section 20a flows along the gentle slope of the partition wall 21, the bubbles in the processing liquid 2a are liquefied and further reduced.

  A supply pipe inlet 41 is connected to the section 20b, and a blocking plate 22 is provided in front of the supply pipe inlet 41. The blocking plate 22 is lower than the liquid level of the processing liquid 2b accumulated in the section 20b, and the processing liquid 2b passes above the blocking plate 22 and reaches the inlet 41 of the supply pipe. For this reason, even if fine bubbles that do not float to the liquid level remain in the processing liquid 2b, they are blocked by the blocking plate 22 and do not reach the inlet 41 of the supply pipe.

  According to the embodiment described above, the bubbles in the processing liquid can be effectively reduced using simple equipment by liquefying the bubbles in the processing liquid using the bypass pipe 13. Therefore, defective discharge of the spray 51, bubble leakage from the processing liquid tank 20 or the processing chamber 50, and substrate conveyance failure due to bubbles in the processing chamber 50 can be prevented.

    By performing a wet process using the present invention, the processing liquid is prevented from deteriorating due to the addition of the antifoaming agent, the operating rate is reduced due to the stoppage of the apparatus, and the running cost is increased due to the replacement of the processing liquid. A small number of high-quality substrates can be manufactured efficiently and inexpensively.

  The present invention is not limited to a substrate for a display panel, and is applied to various types of substrate processing using a processing solution in which generation of bubbles is a problem.

It is a figure which shows schematic structure of the substrate processing apparatus by one embodiment of this invention. It is a figure which shows schematic structure of the substrate processing apparatus by other embodiment of this invention. It is sectional drawing of the process liquid tank by one embodiment of this invention.

Explanation of symbols

1 Substrate 2a, 2b Treatment liquid 10 Recovery pipe 11 Vertical pipe 12 Horizontal pipe 13 Bypass pipe 14 Branch point 15 Junction point 16, 17 Valve 18 Recovery pipe outlet 20 Treatment liquid tank 21 Bulkhead 22 Shut-off plate 30 Pump 40 Supply Piping 41 Supply piping inlet 50 Processing chamber 51 Spray

Claims (8)

A processing liquid tank for storing the processing liquid;
A processing chamber for processing a substrate using a processing liquid;
A supply pipe for supplying a processing liquid from the processing liquid tank to the processing chamber;
A pump provided in the supply pipe;
A substrate processing apparatus comprising a recovery pipe for recovering a processing liquid from the processing chamber to the processing liquid tank,
The processing chamber is provided at a position higher than the processing liquid tank,
The recovery pipe includes a vertical pipe that extends downward from the processing chamber, a substantially horizontal horizontal pipe that follows the vertical pipe, a branch from the horizontal pipe, and the upward direction. A substrate processing apparatus comprising a bypass pipe that merges.   The substrate processing apparatus according to claim 1, wherein a height of an uppermost portion of the bypass pipe is higher than a height of a liquid surface of the processing liquid in the vertical pipe.   The substrate processing apparatus according to claim 1, wherein a flow rate adjusting unit is provided in the horizontal pipe.   The substrate processing apparatus according to claim 1, wherein a flow rate adjusting unit is provided in the bypass pipe.   5. The substrate processing apparatus according to claim 1, wherein an outlet of the recovery pipe is provided at a position lower than a liquid level of the processing liquid in the processing liquid tank.   6. The process liquid tank according to claim 1, wherein the process liquid tank temporarily stores the process liquid recovered by the recovery pipe, and has a partition wall where the overflow process liquid flows along a gentle slope. The substrate processing apparatus according to item.   The said process liquid tank has a shielding board which interrupts | blocks the bubble inside the process liquid collected in the process liquid tank from the inlet_port | entrance of supply piping. Substrate processing equipment.   A method for manufacturing a substrate, comprising performing a wet process using the substrate processing apparatus according to claim 1.

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