JP2005337959A5 - - Google Patents

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Publication number
JP2005337959A5
JP2005337959A5 JP2004159089A JP2004159089A JP2005337959A5 JP 2005337959 A5 JP2005337959 A5 JP 2005337959A5 JP 2004159089 A JP2004159089 A JP 2004159089A JP 2004159089 A JP2004159089 A JP 2004159089A JP 2005337959 A5 JP2005337959 A5 JP 2005337959A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2004159089A
Other versions
JP2005337959A (ja
JP4256300B2 (ja
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Publication date
Application filed filed Critical
Priority to JP2004159089A priority Critical patent/JP4256300B2/ja
Priority claimed from JP2004159089A external-priority patent/JP4256300B2/ja
Priority to US11/137,473 priority patent/US7645988B2/en
Publication of JP2005337959A publication Critical patent/JP2005337959A/ja
Publication of JP2005337959A5 publication Critical patent/JP2005337959A5/ja
Application granted granted Critical
Publication of JP4256300B2 publication Critical patent/JP4256300B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2004159089A 2004-05-28 2004-05-28 基板検査方法および基板検査装置 Expired - Fee Related JP4256300B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2004159089A JP4256300B2 (ja) 2004-05-28 2004-05-28 基板検査方法および基板検査装置
US11/137,473 US7645988B2 (en) 2004-05-28 2005-05-26 Substrate inspection method, method of manufacturing semiconductor device, and substrate inspection apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004159089A JP4256300B2 (ja) 2004-05-28 2004-05-28 基板検査方法および基板検査装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2008277011A Division JP4792074B2 (ja) 2008-10-28 2008-10-28 基板検査方法および基板検査装置

Publications (3)

Publication Number Publication Date
JP2005337959A JP2005337959A (ja) 2005-12-08
JP2005337959A5 true JP2005337959A5 (ja) 2006-11-24
JP4256300B2 JP4256300B2 (ja) 2009-04-22

Family

ID=35424161

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004159089A Expired - Fee Related JP4256300B2 (ja) 2004-05-28 2004-05-28 基板検査方法および基板検査装置

Country Status (2)

Country Link
US (1) US7645988B2 (ja)
JP (1) JP4256300B2 (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4578875B2 (ja) * 2004-07-16 2010-11-10 株式会社荏原製作所 写像型電子顕微鏡
JP4498185B2 (ja) * 2005-03-23 2010-07-07 株式会社東芝 基板検査方法、半導体装置の製造方法および基板検査装置
US20090050802A1 (en) * 2006-01-25 2009-02-26 Ebara Corporation Method and apparatus for inspecting sample surface
EP2333808A1 (en) * 2009-12-11 2011-06-15 ICT Integrated Circuit Testing Gesellschaft für Halbleiterprüftechnik mbH Charged particle beam device, method of operating a charged particle beam device
WO2016125864A1 (ja) * 2015-02-05 2016-08-11 株式会社荏原製作所 検査装置
JP7017437B2 (ja) * 2018-03-06 2022-02-08 Ｔａｓｍｉｔ株式会社 反射電子のエネルギースペクトルを測定する装置および方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2810797B2 (ja) 1991-01-11 1998-10-15 日本電子株式会社 反射電子顕微鏡
JP3409909B2 (ja) 1994-03-11 2003-05-26 株式会社東芝 ウェーハパターンの欠陥検出方法及び同装置
JPH11132975A (ja) 1997-10-31 1999-05-21 Toshiba Corp 電子ビームを用いた検査方法及びその装置
JPH11345585A (ja) 1998-06-03 1999-12-14 Nikon Corp 電子ビームによる検査装置および検査方法
EP1271605A4 (en) * 2000-11-02 2009-09-02 Ebara Corp ELECTRON BEAM APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE COMPRISING SAID APPARATUS

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