JP2005335385A - Cutting tool for glass or wafer - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a cutting tool having a long service life and good cutting quality to be applied to cutting of glass or a wafer. <P>SOLUTION: The cutting tool of the invention is a disk-type tool having thickness, which comprises two circular annular faces, the outer circumferential edges of which are connected outward to concave cutting faces which mutually intersect to form an annular cutting edge. The annular cutting edge performs cutting of glass, a wafer, etc., thereby affording the cutting tool relatively long service life and good cutting quality. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a kind of tool structure, and more particularly to a cutting tool that can be applied to glass and wafer cutting and can increase cutting quality and service life due to its internal concave curvature.

  In general, glass or wafers made of silicon dioxide are cut with special tools, and the wafer production process is expensive. This prevents wear caused by cutting during cutting and prevents an increase in production costs. The crack area of the wafer or glass surface formed by cutting is an important factor that needs to be controlled, because an excessive crack area makes the surrounding wafer or glass unusable and reduces the wear caused by cutting. This is because the longitudinal cracks that are formed and generated during cutting are very related to the cutting tool.

  Known glass or wafer cutting tools are used to form cutting lines in the glass, after which the glass is cut along the cutting lines. There exists a thing of patent document 1 in the technique relevant to such a cutting tool, for example. FIGS. 6 and 7 show such a cutting tool 90 of known technology, this cutting tool 90 being in the form of a disk, comprising a shaft hole 91 and two front and rear circular ring surfaces 92, 93, with front and rear rings. The outer peripheral edges of the surfaces 92 and 93 are chamfered radially outward by θ angles, and the front and rear ring surfaces 92 and 93 are combined to form a cutting ring end 94 that forms a 2θ angle, and two cut surfaces before and after the cutting ring end 94 95 and 96 are formed, and the cutting ring end 94 is provided with concave and convex portions 97 and 98 which are interchanged with each other at a fixed pitch, which is convenient for cutting glass.

  The cutting ring end 94 of the above-described cutting tool 90 has a relatively large 2θ angle and two radial planar cut surfaces that jointly form a 2θ angle, and this relatively large angle extends the service life of the cutting tool 90. On the contrary, the problem of horizontal cracking of the glass occurs at the time of cutting, because the problem that the material is pressed against this plane cut surface becomes large, which forms a defect of poor cutting quality, and this defect is used for cutting of the wafer. If it appears, the loss it forms becomes even more severe. For this reason, the known glass or wafer cutting tools are not the best design and solution for the cutting method, but need further research and development. In view of the disadvantage that the cutting life angle formed by the cutting angle for the glass or wafer described above collides with the cutting quality and the fact that the structural design is not yet ideal, it has a relatively long working life and cutting quality. There is a need for cutting tools that are good.

Taiwan Patent Publication No. 308581 Specification

  It is an object of the present invention to provide a kind of glass or wafer cutting tool, which has a relatively long service life, as well as a material when cutting. It is assumed that the phenomenon of pressing occurring in the case is relieved, and thereby good cutting quality can be obtained.

  Another object of the present invention is to provide a kind of cutting tool for glass or wafer, in which the cutting tool has an internal concave curvature, thereby reducing the lateral pressure during cutting and reducing the level of horizontal cracks. It is assumed that both the service life and cutting quality are taken into account.

  As technical means employed to achieve the above-mentioned object, the present invention comprises a cutting tool, which is a disc-shaped tool having a thickness, which includes two circular annulus front and rear, The outer peripheral edge of the surface is connected outwardly to the inner concave cut surface, the inner concave curvature has a curvature radius R, and the curvature radius R is between 2 and 200 mm. The cut surfaces cross each other to form a cutting ring end, and the cutting ring end is used for cutting glass, a wafer, and the like.

The invention of claim 1 includes a cutting tool for a glass or wafer, the cutting tool being a disc-shaped tool having a thickness, including two front and rear circular annular surfaces, The outer peripheral edge is connected outwardly to the inner concave cut surface, the inner concave cut surfaces cross each other to form a cutting ring end, and the cutting ring end is subjected to cutting on glass, wafer, etc., It is a cutting tool for glass or wafer.
The invention according to claim 2 is the glass or wafer cutting tool according to claim 1, wherein the cutting tool has a shaft hole for insertion of the tool shaft. .
According to a third aspect of the present invention, there is provided the glass or wafer cutting tool according to the first aspect, wherein the inner concave cut surface has a radius of curvature R.
A fourth aspect of the present invention is the glass or wafer cutting tool according to the third aspect, wherein the radius of curvature R is between 2 and 200 mm.
The invention according to claim 5 is the glass or wafer cutting tool according to claim 1, wherein the cutting ring end is provided with a regular or irregular end face. .
A sixth aspect of the present invention is the glass or wafer cutting tool according to the fifth aspect, wherein the end face includes a plurality of concave portions and convex portions.
The glass or wafer cutting tool according to claim 6, wherein the end surfaces are combined so that the concave portion and the convex portion continuously intersect with each other. It is said.
The invention according to claim 8 is the glass or wafer cutting tool according to claim 6, wherein the end face is combined so that two concave portions and one convex portion are continuously crossed. It is a wafer cutting tool.
The invention according to claim 9 is the glass or wafer cutting tool according to claim 6, wherein the convex portion is selected from a plane convex portion and a triangular surface convex portion. .
A tenth aspect of the present invention is the glass or wafer cutting tool according to the sixth aspect, wherein the concave portion is selected from a U-row concave portion and a V-shaped concave portion.
The invention of claim 11 is the glass or wafer cutting tool according to claim 2, wherein the cutting tool is formed integrally with the tool shaft.

  The present invention solves the problem of forming longitudinal and transverse fracture surfaces formed by known glass or wafer cutting tools during cutting. When the angle of the cutting tool is increased, its service life is extended, but the problem of material pressing during cutting is increased and a horizontal crack is formed, which increases the production cost. Therefore, the present invention provides a cutting tool with an indented curvature, reduces the problem of cutting material pressing, reduces the lateral pressure compared to known cutting tools of the same angle, reduces the degree of horizontal cracks, This achieves good cutting quality.

  Please refer to FIG. 1 and FIG. The glass or wafer cutting tool of the present invention comprises a cutting tool 10, which is a disc tool having a thickness T, which includes a shaft hole 12 and front and rear circular annular surfaces 14,16. . The shaft hole 12 is used for insertion of a tool shaft (not shown), and the tool shaft can also be integrally formed with the cutting tool 10. The outer peripheral edges 141 and 161 of the front and rear ring surfaces 14 and 16 are connected outwardly to the inner concave cut surfaces 18 and 20, and the inner concave cut surfaces 18 and 20 have an inner concave curvature radius R, and the inner concave curvature radius R is between 2 and 200 mm, and the inner concave cut surfaces 18 and 20 cross each other to form a cutting ring end 22, which cuts the glass and wafer.

  As shown in FIG. 3, when the present invention cuts by the cutting ring end 22, the inner concave cut surfaces 18, 20 have an inner concave arcuate slope, so that the material presses against the inner concave cut surfaces 18, 20 during cutting. Phenomenon is reduced, and its lateral pressure is smaller than that of the plane type cut surface with the known θ angle, which can greatly reduce the extent of expansion of horizontal cracks due to material pressing during cutting. With it, you can get precise cutting quality. As a result, the present invention has a life similar to known glass or wafer cutting tools of the same angle, but has the advantages of a small angle cutting tool, extending the service life of the cutting tool and improving the cutting quality. Can do.

  Please refer to FIG. The cutting ring end 22 is further provided with a regular or irregular end surface 221, and the end surface 221 includes a plurality of concave portions 222 and convex portions 223. As shown in FIG. 4, the end surface 221 is combined so that the concave portion 222 and the convex portion 223 are continuously crossed or, as shown in FIG. 5, two concave portions 222 and one convex portion. 223, the concave portion 222 and the convex portion 223 can be installed in an unspecified shape (for example, a plane convex portion, a triangular surface convex portion, a U-row concave portion, a V-shaped concave portion, etc.) Increase cutting force.

  Therefore, the cutting tool for glass or wafer according to the present invention is a plane having the above-described structural design that reduces the pressure phenomenon of the material during cutting, and the lateral pressure has a θ angle of a well-known technique. It can be made smaller than the die cut surface, greatly reducing the extent of horizontal crack expansion due to material pressing during cutting, thereby obtaining good and precise cutting quality, and well-known glass or wafer cutting at the same angle It has a life close to that of a tool and can improve cutting quality.

  The above embodiments do not limit the scope of the present invention, and any modification or alteration of details that can be made based on the present invention shall fall within the scope of the claims of the present invention.

It is a front view of the present invention. It is a top view of the present invention. It is a cutting ring end structure display figure of this invention. It is a cutting ring end combination structure display figure of this invention. It is another cutting ring end combination structure display figure of this invention. It is a front view of a known structure. It is a top view of a known structure.

Explanation of symbols

90 Cutting tool 91 Shaft hole 92, 93 Ring surface 94 Cutting ring end 95, 96 Cut surface 97 Concave portion 98 Convex portion 10 Cutting tool 12 Shaft hole 14, 16 Ring surface 141, 161 Outer peripheral edge 18, 20 Inner concave cut surface 22 Cutting ring end 221 End face 222 Concave part 223 Convex part

Claims (11)

  A cutting tool for glass or wafer, including a cutting tool, which is a disc-shaped tool having a thickness, including two circular annulus on the front and back, and an outer peripheral edge of the annulus facing outward. A cutting tool for glass or wafer, characterized in that it is connected to a concave cut surface, the inner concave cut surfaces cross each other to form a cutting ring end, and the cutting ring end is used for cutting glass, a wafer or the like.   The glass or wafer cutting tool according to claim 1, wherein the cutting tool comprises a shaft hole for insertion of a tool shaft.   The glass or wafer cutting tool according to claim 1, wherein the inner concave cut surface has a radius of curvature R.   The glass or wafer cutting tool according to claim 3, wherein the radius of curvature R is between 2 and 200 mm.   The glass or wafer cutting tool according to claim 1, wherein a regular or irregular end face is provided at a cutting ring end.   6. The glass or wafer cutting tool according to claim 5, wherein the end surface includes a plurality of concave portions and convex portions.   The glass or wafer cutting tool according to claim 6, wherein the end surfaces are combined so that the concave portion and the convex portion continuously intersect with each other.   The glass or wafer cutting tool according to claim 6, wherein the end faces are combined so that two concave portions and one convex portion are continuously crossed.   The glass or wafer cutting tool according to claim 6, wherein the convex portion is selected from a flat convex portion and a triangular convex portion.   The glass or wafer cutting tool according to claim 6, wherein the concave portion is selected from a U-row concave portion and a V-shaped concave portion. The glass or wafer cutting tool according to claim 2, wherein the cutting tool is formed integrally with a tool shaft.

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