JP2005333093A - 半導体抵抗素子及びその製造方法並びに半導体抵抗素子を用いた半導体装置 - Google Patents
半導体抵抗素子及びその製造方法並びに半導体抵抗素子を用いた半導体装置 Download PDFInfo
- Publication number
- JP2005333093A JP2005333093A JP2004152607A JP2004152607A JP2005333093A JP 2005333093 A JP2005333093 A JP 2005333093A JP 2004152607 A JP2004152607 A JP 2004152607A JP 2004152607 A JP2004152607 A JP 2004152607A JP 2005333093 A JP2005333093 A JP 2005333093A
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- Prior art keywords
- atoms
- semiconductor
- resistance element
- region
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 151
- 238000004519 manufacturing process Methods 0.000 title claims description 14
- 239000012535 impurity Substances 0.000 claims abstract description 112
- 238000009792 diffusion process Methods 0.000 claims abstract description 98
- 239000000758 substrate Substances 0.000 claims abstract description 52
- 238000000034 method Methods 0.000 claims description 18
- 238000005259 measurement Methods 0.000 claims description 6
- 239000010410 layer Substances 0.000 abstract description 58
- 239000006185 dispersion Substances 0.000 abstract description 3
- 239000002344 surface layer Substances 0.000 abstract description 3
- 150000002500 ions Chemical class 0.000 abstract 2
- 230000001133 acceleration Effects 0.000 description 66
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 28
- 229910052710 silicon Inorganic materials 0.000 description 28
- 239000010703 silicon Substances 0.000 description 28
- 238000001514 detection method Methods 0.000 description 22
- 238000000137 annealing Methods 0.000 description 14
- 238000010586 diagram Methods 0.000 description 13
- 238000005468 ion implantation Methods 0.000 description 10
- 239000013078 crystal Substances 0.000 description 9
- 230000007423 decrease Effects 0.000 description 9
- 239000011521 glass Substances 0.000 description 8
- 238000005530 etching Methods 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 230000007257 malfunction Effects 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
- H01L28/20—Resistors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/12—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by alteration of electrical resistance
- G01P15/123—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by alteration of electrical resistance by piezo-resistive elements, e.g. semiconductor strain gauges
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
- H01L27/0802—Resistors only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66083—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by variation of the electric current supplied or the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. two-terminal devices
- H01L29/66166—Resistors with PN junction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/8605—Resistors with PN junctions
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
- G01P2015/0822—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass
- G01P2015/084—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass the mass being suspended at more than one of its sides, e.g. membrane-type suspension, so as to permit multi-axis movement of the mass
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Pressure Sensors (AREA)
- Semiconductor Integrated Circuits (AREA)
- Measuring Fluid Pressure (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004152607A JP2005333093A (ja) | 2004-05-21 | 2004-05-21 | 半導体抵抗素子及びその製造方法並びに半導体抵抗素子を用いた半導体装置 |
TW094116405A TW200610155A (en) | 2004-05-21 | 2005-05-20 | Semiconductor resistance device and its manufacturing method and the use of semiconductor device with semiconductor resistance device |
PCT/JP2005/009256 WO2005114725A1 (fr) | 2004-05-21 | 2005-05-20 | Élément de résistance semi-conducteur et sa méthode de fabrication, dispositif semi-conducteur utilisant un élément de résistance semi-conducteur |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004152607A JP2005333093A (ja) | 2004-05-21 | 2004-05-21 | 半導体抵抗素子及びその製造方法並びに半導体抵抗素子を用いた半導体装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2005333093A true JP2005333093A (ja) | 2005-12-02 |
Family
ID=35428617
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004152607A Pending JP2005333093A (ja) | 2004-05-21 | 2004-05-21 | 半導体抵抗素子及びその製造方法並びに半導体抵抗素子を用いた半導体装置 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2005333093A (fr) |
TW (1) | TW200610155A (fr) |
WO (1) | WO2005114725A1 (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012169524A (ja) * | 2011-02-16 | 2012-09-06 | Mitsubishi Electric Corp | 半導体装置及びその試験方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5896761A (ja) * | 1981-12-03 | 1983-06-08 | Matsushita Electronics Corp | イオン注入抵抗およびその製造方法 |
JPH01235366A (ja) * | 1988-03-16 | 1989-09-20 | Oki Electric Ind Co Ltd | 半導体抵抗素子 |
JP2002243759A (ja) * | 2001-02-13 | 2002-08-28 | Hokuriku Electric Ind Co Ltd | 半導体加速度センサ素子 |
-
2004
- 2004-05-21 JP JP2004152607A patent/JP2005333093A/ja active Pending
-
2005
- 2005-05-20 TW TW094116405A patent/TW200610155A/zh unknown
- 2005-05-20 WO PCT/JP2005/009256 patent/WO2005114725A1/fr active Application Filing
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012169524A (ja) * | 2011-02-16 | 2012-09-06 | Mitsubishi Electric Corp | 半導体装置及びその試験方法 |
US8884383B2 (en) | 2011-02-16 | 2014-11-11 | Mitsubishi Electric Corporation | Semiconductor device and method of testing the same |
Also Published As
Publication number | Publication date |
---|---|
TW200610155A (en) | 2006-03-16 |
WO2005114725A1 (fr) | 2005-12-01 |
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