JP2005333063A5 - - Google Patents

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Publication number
JP2005333063A5
JP2005333063A5 JP2004151953A JP2004151953A JP2005333063A5 JP 2005333063 A5 JP2005333063 A5 JP 2005333063A5 JP 2004151953 A JP2004151953 A JP 2004151953A JP 2004151953 A JP2004151953 A JP 2004151953A JP 2005333063 A5 JP2005333063 A5 JP 2005333063A5
Authority
JP
Japan
Prior art keywords
rotation shaft
groove
clamp member
arranges
fitted
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2004151953A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005333063A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2004151953A priority Critical patent/JP2005333063A/ja
Priority claimed from JP2004151953A external-priority patent/JP2005333063A/ja
Priority to US11/133,452 priority patent/US20050257746A1/en
Publication of JP2005333063A publication Critical patent/JP2005333063A/ja
Publication of JP2005333063A5 publication Critical patent/JP2005333063A5/ja
Withdrawn legal-status Critical Current

Links

JP2004151953A 2004-05-21 2004-05-21 クランプ部材、成膜装置、成膜方法、半導体装置の製造方法 Withdrawn JP2005333063A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2004151953A JP2005333063A (ja) 2004-05-21 2004-05-21 クランプ部材、成膜装置、成膜方法、半導体装置の製造方法
US11/133,452 US20050257746A1 (en) 2004-05-21 2005-05-20 Clamp member, film deposition apparatus, film deposition method, and semiconductor device manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004151953A JP2005333063A (ja) 2004-05-21 2004-05-21 クランプ部材、成膜装置、成膜方法、半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JP2005333063A JP2005333063A (ja) 2005-12-02
JP2005333063A5 true JP2005333063A5 (enExample) 2007-06-21

Family

ID=35373981

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004151953A Withdrawn JP2005333063A (ja) 2004-05-21 2004-05-21 クランプ部材、成膜装置、成膜方法、半導体装置の製造方法

Country Status (2)

Country Link
US (1) US20050257746A1 (enExample)
JP (1) JP2005333063A (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010225740A (ja) * 2009-03-23 2010-10-07 Tokyo Electron Ltd 基板処理方法および基板処理装置
TWI470110B (zh) 2012-09-07 2015-01-21 Manz Taiwan Ltd 用於化學沉積設備的夾固裝置
JP6870531B2 (ja) * 2017-08-21 2021-05-12 三菱電機株式会社 パワーモジュールおよび電力変換装置
CN107937881B (zh) * 2017-11-20 2019-07-05 深圳市华星光电半导体显示技术有限公司 基板夹紧装置
JP7017420B2 (ja) 2018-01-25 2022-02-08 エイブリック株式会社 半導体製造装置および半導体装置の成膜方法
USD1038049S1 (en) 2020-11-18 2024-08-06 Applied Materials, Inc. Cover ring for use in semiconductor processing chamber
US11996315B2 (en) * 2020-11-18 2024-05-28 Applied Materials, Inc. Thin substrate handling via edge clamping
CN113903649B (zh) * 2021-09-23 2024-04-12 北京北方华创微电子装备有限公司 半导体工艺设备

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5513594A (en) * 1993-10-20 1996-05-07 Mcclanahan; Adolphus E. Clamp with wafer release for semiconductor wafer processing equipment
US5437757A (en) * 1994-01-21 1995-08-01 Applied Materials, Inc. Clamp ring for domed pedestal in wafer processing chamber
DE4420050C1 (de) * 1994-06-08 1995-08-24 Weidmueller Interface Abisoliervorrichtung
JP3471543B2 (ja) * 1996-11-07 2003-12-02 大日本スクリーン製造株式会社 回転式基板乾燥装置
US5922133A (en) * 1997-09-12 1999-07-13 Applied Materials, Inc. Multiple edge deposition exclusion rings
US6699375B1 (en) * 2000-06-29 2004-03-02 Applied Materials, Inc. Method of extending process kit consumable recycling life
JP4488646B2 (ja) * 2001-04-23 2010-06-23 株式会社トプコン ウェーハ保持装置

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