JP2005328100A - Method for manufacturing solid electrolytic capacitor - Google Patents
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- JP2005328100A JP2005328100A JP2005232716A JP2005232716A JP2005328100A JP 2005328100 A JP2005328100 A JP 2005328100A JP 2005232716 A JP2005232716 A JP 2005232716A JP 2005232716 A JP2005232716 A JP 2005232716A JP 2005328100 A JP2005328100 A JP 2005328100A
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本発明は、チップタイプの固体電解コンデンサにおいて、コンデンサ完成品に対するコンデンサ素子の体積比率を向上させたチップコンデンサに関するものである。 The present invention relates to a chip capacitor in which a volume ratio of a capacitor element to a capacitor finished product is improved in a chip type solid electrolytic capacitor.
従来の固体電解コンデンサは、図3に示すように、先ず一端に陽極リード(11)が導出されている弁作用金属からなる焼結体等(例えばタンタル焼結体)に誘電体酸化皮膜、固体電解質層、カーボン層、銀ペースト層を順次形成し、コンデンサ素子(2)を完成する。 As shown in FIG. 3, a conventional solid electrolytic capacitor has a dielectric oxide film, a solid oxide on a sintered body or the like (for example, tantalum sintered body) made of a valve metal having an anode lead (11) led to one end. An electrolyte layer, a carbon layer, and a silver paste layer are sequentially formed to complete the capacitor element (2).
次に、予め所定の寸法に折り曲げた2つのリードフレーム(21)(22)の内、一方のリードフレーム(21)を陽極リード(11)に溶接接合し、他方のリードフレーム(22)を銀接着剤(4)によって銀ペースト層に接着接続する。 Next, of the two lead frames (21) and (22) bent in advance to a predetermined dimension, one lead frame (21) is welded to the anode lead (11), and the other lead frame (22) is joined to silver. An adhesive (4) is adhesively connected to the silver paste layer.
次いで、トランスファーモールド等により、リードフレーム(21)(22)の先端側を露出させた状態にコンデンサ素子(2)を樹脂封止する。 Next, the capacitor element (2) is resin-sealed by a transfer mold or the like so that the tip ends of the lead frames (21) and (22) are exposed.
最後に、外装樹脂(6)の外側に導出されたリードフレーム(21)(22)を所定の寸法に折り曲げてプラス電極及びマイナス電極を形成してコンデンサを完成する。
斯かる従来の固体電解コンデンサにおいては、プラス電極側に陽極リード(11)とリードフレーム(21)との接続のための溶接代(23)を、マイナス電極側にリードフレーム(22)の折り曲げ代(24)をとる必要がある。例えば、長さ7.3mm、幅4.3mmのサイズ(以下、「Dケース」という)のコンデンサの場合、プラス電極側及びマイナス電極側の外装樹脂(6)の肉厚L1、L2は、夫々約1.8mmであった。 In such a conventional solid electrolytic capacitor, the welding allowance (23) for connecting the anode lead (11) and the lead frame (21) is provided on the positive electrode side, and the bending allowance for the lead frame (22) is provided on the negative electrode side. It is necessary to take (24). For example, in the case of a capacitor having a length of 7.3 mm and a width of 4.3 mm (hereinafter referred to as “D case”), the thicknesses L1 and L2 of the exterior electrode (6) on the plus electrode side and the minus electrode side are respectively It was about 1.8 mm.
また、従来は、外装樹脂(6)の外側でリードフレーム(21)(22)を折り曲げる必要があり、モールド後の外装樹脂(6)の長さは、Dケースの規格値7.3mmに対してリードフレーム(21)(22)の厚み分だけ小さく成型する必要があった(図3参照)。上記の例では、モールド後の外装樹脂(6)の長さは、7.1mmに成型されている。 Also, conventionally, it is necessary to bend the lead frames (21) and (22) outside the exterior resin (6), and the length of the exterior resin (6) after molding is 7.3 mm from the standard value of 7.3 mm for the D case. Therefore, it was necessary to mold the lead frame (21) and (22) as small as possible (see FIG. 3). In the above example, the length of the exterior resin (6) after molding is molded to 7.1 mm.
このため、従来技術においては、コンデンサ完成品に対するコンデンサ素子の体積比率(以下、単に「体積比率」という)を十分に大きくとることができず、体積比率は下記の表1のとおり約20.4%程度に止まっていた。尚、表1はDケースで高さ1.8mmのコンデンサを完成させた場合の例である。 For this reason, in the prior art, the volume ratio of the capacitor element to the finished capacitor product (hereinafter simply referred to as “volume ratio”) cannot be sufficiently large, and the volume ratio is about 20.4 as shown in Table 1 below. It stopped at about%. Table 1 shows an example in which a capacitor having a height of 1.8 mm is completed in the D case.
従って、本発明は、体積比率を向上させることによって、小型で大容量化が図れるチップコンデンサを提供するものである。 Accordingly, the present invention provides a chip capacitor that can be reduced in size and increased in capacity by improving the volume ratio.
本発明に係る固体電解コンデンサは、上記課題を解決するため、導電シート内に、該導電シートを第1導電シート領域と第2導電シート領域とに分離する開口部を形成する工程と、一端から陽極リードが導出されると共に外周面に陰極が形成された複数のコンデンサ素子を、前記導電シート上に前記開口部を跨いで配列する工程と、前記複数のコンデンサ素子の各陽極リードを前記第1導電シート領域に接続すると共に、前記複数のコンデンサ素子の各陰極を前記第2導電シート領域に接続する工程と、前記複数のコンデンサ素子を一体的に覆うように外装樹脂層を形成する工程と、前記複数のコンデンサ素子の各陽極リードの先端及び各陰極の外周面から離れた位置において、前記外装樹脂層及び前記導電シートを切断する工程とを備えることを特徴とする。
また、前記導電シート上に、前記開口部を跨いで絶縁シートを配置し、該絶縁シート上に、前記複数のコンデンサ素子を配列することを特徴とする。
また、前記導電シート内に、複数の第1導電シート領域及び複数の第2導電シート領域を設け、前記外装樹脂層を形成後、該外装樹脂層及び前記導電シートを縦横に切断する工程とを備えることを特徴とする。
In order to solve the above problems, the solid electrolytic capacitor according to the present invention includes a step of forming an opening in the conductive sheet that separates the conductive sheet into a first conductive sheet region and a second conductive sheet region, and from one end. Arranging a plurality of capacitor elements having an anode lead led out and having a cathode formed on the outer peripheral surface thereof across the opening on the conductive sheet; and each anode lead of the plurality of capacitor elements in the first Connecting to the conductive sheet region, connecting each cathode of the plurality of capacitor elements to the second conductive sheet region, and forming an exterior resin layer so as to integrally cover the plurality of capacitor elements; Cutting the exterior resin layer and the conductive sheet at positions away from the tips of the anode leads and the outer peripheral surfaces of the cathodes of the capacitor elements. And wherein the door.
In addition, an insulating sheet is disposed on the conductive sheet across the opening, and the plurality of capacitor elements are arranged on the insulating sheet.
A step of providing a plurality of first conductive sheet regions and a plurality of second conductive sheet regions in the conductive sheet, and forming the exterior resin layer and then cutting the exterior resin layer and the conductive sheet vertically and horizontally; It is characterized by providing.
以上のように、本発明によって体積比率を大きくすることが可能となり、小型で大容量の固体電解コンデンサを実現できる。
As described above, according to the present invention, the volume ratio can be increased, and a small-sized and large-capacity solid electrolytic capacitor can be realized.
また、従来のようにリードフレーム(21)(22)の折り曲げがないため、直列インダクタ成分(ESL)の小さいコンデンサを実現できる。 Further, since the lead frames (21) and (22) are not bent as in the prior art, a capacitor having a small series inductor component (ESL) can be realized.
固体電解コンデンサは、図6に示す如く、一端に陽極リード(11)を導出し、外周面に陰極を形成したコンデンサ素子(2)に対して樹脂封止を行っている。 In the solid electrolytic capacitor, as shown in FIG. 6, the anode lead (11) is led out at one end, and the capacitor element (2) having the cathode formed on the outer peripheral surface is sealed with resin.
コンデンサ素子(2)は、タンタル(Ta)、アルミニウム(Al)、ニオブ(Nb)、チタン(Ti)等の弁作用金属の表面に、陽極酸化等の方法により、誘電体酸化皮膜を生じさせ、該皮膜上にポリピロール、ポリチオフェン、ポリアニリン等の高分子有機半導体を固体電解質として形成せしめた後、カーボン層、銀ペースト層を順次形成して完成する。斯かるコンデンサ素子(2)は、例えば特開平8−148392号公報等の公知技術によって作製することができるので、コンデンサ素子そのものの製造方法については説明を省略する。 Capacitor element (2) produces a dielectric oxide film on the surface of a valve metal such as tantalum (Ta), aluminum (Al), niobium (Nb), titanium (Ti), etc. by a method such as anodic oxidation. A polymer organic semiconductor such as polypyrrole, polythiophene or polyaniline is formed as a solid electrolyte on the film, and then a carbon layer and a silver paste layer are sequentially formed to complete. Since such a capacitor element (2) can be produced by a known technique such as Japanese Patent Laid-Open No. 8-148392, description of the method for producing the capacitor element itself is omitted.
以下の実施例では、弁作用金属としてタンタル焼結体(1)を、固体電解質としてポリピロールを採用した。
(実施例1)
図1に本発明に係る固体電解コンデンサの第1の実施例を示す。
In the following examples, tantalum sintered body (1) was adopted as the valve action metal, and polypyrrole was adopted as the solid electrolyte.
(Example 1)
FIG. 1 shows a first embodiment of a solid electrolytic capacitor according to the present invention.
図1において、(2)は一端から陽極リード(11)が導出されたコンデンサ素子、(31)(32)は42アロイ(鉄ニッケル合金)表面にNiメッキ及び半田メッキを順次施した導電シートで、コンデンサ素子(2)の陰極(外周面の銀ペースト層)は導電性接着剤(4)を介して一方の導電シート(32)に接続され、陽極リードは他方の導電シート(31)に溶接あるいは導電性接着剤を介して接続される。また、(5)はコンデンサ素子(2)と導電性シート(31)(32)との間に配され、且つ導電性シート(31)(32)間を電気的に絶縁する絶縁シート、(6)はエポキシ樹脂等からなり、コンデンサ素子(2)を封止する外装樹脂である。 In FIG. 1, (2) is a capacitor element in which an anode lead (11) is led out from one end, and (31) and (32) are conductive sheets in which Ni alloy and solder plating are sequentially applied to the surface of 42 alloy (iron nickel alloy). The cathode of the capacitor element (2) (silver paste layer on the outer peripheral surface) is connected to one conductive sheet (32) via a conductive adhesive (4), and the anode lead is welded to the other conductive sheet (31). Alternatively, they are connected via a conductive adhesive. (5) is an insulating sheet disposed between the capacitor element (2) and the conductive sheets (31) and (32) and electrically insulating the conductive sheets (31) and (32); ) Is an exterior resin made of epoxy resin or the like and sealing the capacitor element (2).
次に斯かる第1の実施例の製造方法を説明する。 Next, the manufacturing method of the first embodiment will be described.
先ず、図4に示すように、開口部(33)(33)を有する導電シート(3)を準備し、この開口部(33)(33)を跨いで粘着性テープからなる絶縁シート(5) (5)を配置する。次いで、コンデンサ素子(2)(2)を絶縁シート(5)(5)上に配置し、その陰極(外周面の銀ペースト層)を導電シート(3)に導電性接着剤(4)にて接続し、陽極リード(11)(11)を適宜折り曲げた後、溶接あるいは導電性接着剤にて接続する(図1参照)。ここで、本実施例では、導電シート(3)の開口部(33)(33)の幅を3.0mm、絶縁シート(5)(5)の幅を3.5mm、コンデンサ素子(2)(2)の長さ(図4の紙面左右方向)を5.0mmとした。 First, as shown in FIG. 4, a conductive sheet (3) having openings (33) and (33) is prepared, and an insulating sheet (5) made of an adhesive tape straddling the openings (33) and (33). (5) is arranged. Next, the capacitor elements (2) and (2) are arranged on the insulating sheets (5) and (5), and the cathode (silver paste layer on the outer peripheral surface) is attached to the conductive sheet (3) with the conductive adhesive (4). After connecting, the anode leads (11) and (11) are appropriately bent, and then connected by welding or a conductive adhesive (see FIG. 1). Here, in this example, the width of the openings (33) and (33) of the conductive sheet (3) is 3.0 mm, the width of the insulating sheets (5) and (5) is 3.5 mm, and the capacitor element (2) ( The length of 2) (left and right direction in FIG. 4) was 5.0 mm.
しかる後、コンデンサ素子(2)(2)を覆うようにエポキシ樹脂等からなる外装樹脂(6)を導電性シート(3)上に塗布し、150℃の硬化炉にて30分間熱処理することによって外装樹脂(6)を硬化させる。尚、本実施例では、外装樹脂(6)の高さを1.6mmとした。 Thereafter, an exterior resin (6) made of an epoxy resin or the like is applied on the conductive sheet (3) so as to cover the capacitor elements (2) and (2), and heat-treated in a curing furnace at 150 ° C. for 30 minutes. The exterior resin (6) is cured. In this example, the height of the exterior resin (6) was 1.6 mm.
最後に、図面中の1点鎖線に沿って、前記複数のコンデンサ素子の各陽極リードの先端及び各陰極の外周面から離れた位置をダイシングすることにより、本実施例の固体電解コンデンサが完成する。本実施例では、コンデンサの寸法をDケース(7.3mm×4.3mm)とした。
(実施例2)
図2に本発明に係る固体電解コンデンサの第2の実施例を示す。図2において、第1の実施例と同じものには同番号を付し説明を省略する。
Finally, the solid electrolytic capacitor of this embodiment is completed by dicing the positions of the anode leads of the plurality of capacitor elements and the positions away from the outer peripheral surfaces of the cathodes along the one-dot chain line in the drawing. . In the present example, the dimensions of the capacitor were D case (7.3 mm × 4.3 mm).
(Example 2)
FIG. 2 shows a second embodiment of the solid electrolytic capacitor according to the present invention. In FIG. 2, the same components as those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted.
第2の実施例は、導電シート(31)の端部に切り起こし部(34)を設け、この切り起こし部(34)設けた切り欠き(図示せず)に陽極リード(11)を圧入して接続したものである。 In the second embodiment, a cut and raised portion (34) is provided at the end of the conductive sheet (31), and the anode lead (11) is press-fitted into a notch (not shown) provided with the cut and raised portion (34). Connected.
斯かる第2の実施例の製造においては、先ず、図5に示すように、開口部(33)(33)及び切り起こし部(34)(34)を形成した導電シート(3)を準備し、開口部(33)(33)上を粘着性テープからなる絶縁シート(5)で塞ぐ。次いで、コンデンサ素子(2)(2)を絶縁シート(5)(5)上に配置し、その陰極(外周面の銀ペースト層)を導電シート(3)に導電性接着剤(4)にて接続し、陽極リード(11)(11)を切り起こし部(34)(34)に設けた切り欠き(図示せず)に圧入して接続する。ここで、本実施例では、導電シート(3)の開口部(33)(33)の幅を3.0mm、絶縁シート(5)(5)の幅を3.5mm、コンデンサ素子(2)(2)の長さ(図5の紙面左右方向)を5.8mmとした。 In the manufacture of the second embodiment, first, as shown in FIG. 5, a conductive sheet (3) having openings (33) and (33) and cut and raised portions (34) and (34) is prepared. The openings (33) and (33) are closed with an insulating sheet (5) made of an adhesive tape. Next, the capacitor elements (2) and (2) are arranged on the insulating sheets (5) and (5), and the cathode (silver paste layer on the outer peripheral surface) is applied to the conductive sheet (3) with the conductive adhesive (4). Then, the anode leads (11) and (11) are press-fitted and connected to notches (not shown) provided in the cut and raised portions (34) and (34). Here, in this example, the width of the openings (33) and (33) of the conductive sheet (3) is 3.0 mm, the width of the insulating sheets (5) and (5) is 3.5 mm, and the capacitor element (2) ( The length of 2) (left and right direction in FIG. 5) was 5.8 mm.
しかる後、実施例1と同じように各コンデンサ素子(2)(2)を外装樹脂(6)にて封止し、前記複数のコンデンサ素子の各陽極リードの先端及び各陰極の外周面から離れた位置をダイシングして固体電解コンデンサを完成させた。尚、本実施例においても第1の実施例と同じく、外装樹脂(6)の高さを1.6mm、コンデンサの寸法をDケースとした。
本発明に係る実施例1、2では、図3に示す従来例のように固体電解コンデンサの長さ方向において、外装樹脂(6)の外側でリードフレーム(21)(22)を折り曲げる必要がないため、外装樹脂(6)寸法を大きくすることができ、更にリードフレーム(21)と陽極リード(11)との溶接代(23)及びリードフレーム(22)の折り曲げ
代(24)が必要ないため、外装樹脂(6)内に封止されるコンデンサ素子(2)の寸法を大きくすることができる。これらの実施例と従来例の長さ方向の具体的な寸法の関係は表2の通りである。
Thereafter, the capacitor elements (2) and (2) are sealed with the exterior resin (6) in the same manner as in Example 1, and separated from the tips of the anode leads and the outer peripheral surfaces of the cathodes of the plurality of capacitor elements. The solid electrolytic capacitor was completed by dicing at the position. In this example, as in the first example, the height of the exterior resin (6) was 1.6 mm, and the dimensions of the capacitor were D case.
In the first and second embodiments according to the present invention, it is not necessary to bend the lead frames (21) and (22) outside the exterior resin (6) in the length direction of the solid electrolytic capacitor as in the conventional example shown in FIG. Therefore, the size of the exterior resin (6) can be increased, and the welding allowance (23) between the lead frame (21) and the anode lead (11) and the bending allowance (24) of the lead frame (22) are not required. The dimension of the capacitor element (2) sealed in the exterior resin (6) can be increased. Table 2 shows the relationship between specific dimensions in the length direction of these examples and the conventional example.
表2に示すように、実施例1、2では、外装樹脂(6)の外形寸法を7.3mmと従来例に比して0.2mm長く成型することができ、コンデンサ素子(2)の長さにおいては、実施例1で1.5mm、実施例2で2.3mm夫々従来例より大きくすることができた。 As shown in Table 2, in Examples 1 and 2, the outer dimension of the exterior resin (6) was 7.3 mm, which was 0.2 mm longer than the conventional example, and the length of the capacitor element (2) In this case, 1.5 mm in Example 1 and 2.3 mm in Example 2 could be made larger than the conventional example.
次に、これら実施例及び従来例の高さ方向の具体的な寸法の関係を表3に示す。 Next, Table 3 shows the relationship between specific dimensions in the height direction of these examples and the conventional example.
表3に示すように、実施例1、2では、従来例においてコンデンサ素子(2)の上面に被さるリードフレーム(22)及び下面に接する様に折り曲げられるリードフレーム(21)(22)の厚みが不要となるため、コンデンサ素子(2)の高さは従来例に比べて0.3mm高くできた。尚、幅方向の各寸法は、これら実施例及び従来例
に変わりはない。
As shown in Table 3, in Examples 1 and 2, the thicknesses of the lead frame (22) covering the upper surface of the capacitor element (2) and the lead frames (21) and (22) bent so as to contact the lower surface in the conventional example are as follows. Since it becomes unnecessary, the height of the capacitor element (2) can be increased by 0.3 mm compared to the conventional example. In addition, each dimension of the width direction does not change in these Examples and conventional examples.
以上の如く、実施例1及び2で用いたコンデンサ素子(2)の体積及び体積比率は表4の通りである。 As described above, the volume and volume ratio of the capacitor element (2) used in Examples 1 and 2 are as shown in Table 4.
表4に示すように、実施例1では従来例に比してコンデンサ素子(2)の体積を1.86倍にすることができ、実施例2では2.15倍にすることができた。 As shown in Table 4, in Example 1, the volume of the capacitor element (2) was 1.86 times that in the conventional example, and in Example 2, it was 2.15 times.
2 コンデンサ素子
3、31、32 導電シート
4 導電性接着剤
5 絶縁材料
6 外装樹脂
2
Claims (3)
前記外装樹脂層を形成後、該外装樹脂層及び前記導電シートを縦横に切断する工程とを備えることを特徴とする固体電解コンデンサの製造方法。 A plurality of first conductive sheet regions and a plurality of second conductive sheet regions are provided in the conductive sheet,
And a step of cutting the exterior resin layer and the conductive sheet vertically and horizontally after forming the exterior resin layer.
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010165957A (en) * | 2009-01-19 | 2010-07-29 | Nichicon Corp | Chip-like solid electrolytic capacitor |
JP2019504487A (en) * | 2015-12-18 | 2019-02-14 | ケメット エレクトロニクス コーポレーション | Manufacturing method using capacitor and sealing material thickness regulating thin film |
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JP2010165957A (en) * | 2009-01-19 | 2010-07-29 | Nichicon Corp | Chip-like solid electrolytic capacitor |
JP2019504487A (en) * | 2015-12-18 | 2019-02-14 | ケメット エレクトロニクス コーポレーション | Manufacturing method using capacitor and sealing material thickness regulating thin film |
JP6991974B2 (en) | 2015-12-18 | 2022-01-13 | ケメット エレクトロニクス コーポレーション | Manufacturing method using a thin film for controlling the thickness of capacitors and encapsulants |
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